{"id":3560,"date":"2025-07-09T08:22:00","date_gmt":"2025-07-09T00:22:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=3560"},"modified":"2025-07-08T15:56:17","modified_gmt":"2025-07-08T07:56:17","slug":"how-to-perform-reflow-soldering-on-double-sided-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/da\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/","title":{"rendered":"Hvordan udf\u00f8rer man reflow-lodning p\u00e5 dobbeltsidet printkort?"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Indholdsfortegnelse<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Why_is_Double-Sided_PCB_Reflow_Soldering_a_Challenge_in_Electronics_Manufacturing\" >Hvorfor er dobbeltsidet PCB-reflowlodning en udfordring i elektronikproduktion?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#In-Depth_Comparison_of_Two_Main_Soldering_Processes\" >Dybtg\u00e5ende sammenligning af to hovedloddeprocesser<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Option_A_Double-Sided_Solder_Paste_Process_Ideal_for_High-Density_Components\" >Mulighed A: Dobbeltsidet loddepastaproces (ideel til komponenter med h\u00f8j densitet)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Option_B_Solder_Paste_Red_Glue_Hybrid_Process_Solution_for_Large_Components\" >Mulighed B: Loddepasta + r\u00f8d lim hybridproces (l\u00f8sning til store komponenter)<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#5_Golden_Rules_for_Soldering_Quality_Control\" >5 gyldne regler for kvalitetskontrol af lodning<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Common_Issues_and_Engineering_Solutions\" >Almindelige problemer og tekniske l\u00f8sninger<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Future_Process_Trends\" >Fremtidige procestendenser<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Why_is_Double-Sided_PCB_Reflow_Soldering_a_Challenge_in_Electronics_Manufacturing\"><\/span>Hvorfor er dobbeltsidet PCB-reflowlodning en udfordring i elektronikproduktion?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>I h\u00f8jtydende elektroniske produkter som f.eks. smartphones og industrielle kontrolenheder, <a href=\"https:\/\/www.topfastpcb.com\/da\/products\/double-sided-flexible-pcb\/\">dobbeltsidet PCB<\/a> design er blevet standard. Dobbeltsidet lodning giver dog to store udfordringer:<\/p><ol class=\"wp-block-list\"><li><strong>Kompleksitet i varmestyring<\/strong> - Under lodningen p\u00e5 den anden side bliver den f\u00f8rste side genopvarmet, hvilket kan medf\u00f8re, at komponenterne l\u00f8sner sig, eller at loddefugen svigter.<\/li>\n\n<li><strong>Dilemma ved valg af proces<\/strong> - Processerne med loddepasta og r\u00f8d lim har hver is\u00e6r fordele og ulemper, som kr\u00e6ver n\u00f8je overvejelser baseret p\u00e5 komponentlayout.<\/li><\/ol><p><a href=\"https:\/\/www.topfastpcb.com\/da\/contact\/\" target=\"_blank\" rel=\"noreferrer noopener\">Kontakt vores procesingeni\u00f8rer<\/a>\u00a0til skr\u00e6ddersyede l\u00f8sninger<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb.jpg\" alt=\"PCB-reflow-lodning\" class=\"wp-image-3561\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"In-Depth_Comparison_of_Two_Main_Soldering_Processes\"><\/span>Dybtg\u00e5ende sammenligning af to hovedloddeprocesser<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_A_Double-Sided_Solder_Paste_Process_Ideal_for_High-Density_Components\"><\/span>Mulighed A: Dobbeltsidet loddepastaproces (ideel til komponenter med h\u00f8j densitet)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Bedst til<\/strong>:<\/p><ul class=\"wp-block-list\"><li>PCB'er med BGA'er, QFN'er eller andre pr\u00e6cisions-IC'er p\u00e5 begge sider<\/li>\n\n<li>Letv\u00e6gtskomponenter generelt<\/li><\/ul><p><strong>Vigtige skridt<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Side A: Print loddepasta \u2192 Placer komponenter \u2192 Reflow-lodning (spidstemperatur 245 \u00b0C)<\/li>\n\n<li>Afk\u00f8l til stuetemperatur, og vend derefter PCB<\/li>\n\n<li>Side B: Print loddepasta \u2192 Placer komponenter \u2192 Brug en trinvis temperaturprofil (reducer spidstemperaturen med 5-10 \u00b0C)<\/li><\/ol><p><strong>Fordele<\/strong>:<\/p><ul class=\"wp-block-list\"><li>H\u00f8j p\u00e5lidelighed i loddefugen<\/li>\n\n<li>Velegnet til automatiseret masseproduktion<\/li><\/ul><p><strong>Risici<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Store komponenter kan l\u00f8sne sig under den anden reflow.<\/li>\n\n<li>Pr\u00e6cis temperaturstyring er n\u00f8dvendig for lodning p\u00e5 den anden side<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_B_Solder_Paste_Red_Glue_Hybrid_Process_Solution_for_Large_Components\"><\/span>Mulighed B: Loddepasta + r\u00f8d lim hybridproces (l\u00f8sning til store komponenter)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Bedst til<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Den ene side har store stik\/elektrolytiske kondensatorer<\/li>\n\n<li>Blandede layouts med betydelige v\u00e6gtforskelle<\/li><\/ul><p><strong>Innovativ proces<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Loddepastasiden (side A): Standard reflow-lodning<\/li>\n\n<li>R\u00f8d limside (side B): &#8220;Print-Place-Cure&#8221; tretrinsmetode:<\/li><\/ol><ul class=\"wp-block-list\"><li>Trykn\u00f8jagtighed for r\u00f8d lim: \u00b10,1 mm<\/li>\n\n<li>H\u00e6rdningstemperatur: 120-150\u00b0C (meget lavere end smeltepunktet for loddepasta)<\/li>\n\n<li>Valgfri b\u00f8lgelodning for \u00f8get p\u00e5lidelighed<\/li><\/ul><p><strong>Tekniske noter<\/strong>:<\/p><ul class=\"wp-block-list\"><li>R\u00f8d lim skal v\u00e6re mindst 0,3 mm v\u00e6k fra loddepuderne<\/li>\n\n<li>Forl\u00e6ng h\u00e6rdetiden med 30 % for at forhindre svag vedh\u00e6ftning<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-1.jpg\" alt=\"PCB-reflow-lodning\" class=\"wp-image-3562\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><p><a href=\"https:\/\/www.topfastpcb.com\/da\/contact\/\">F\u00e5 gratis ekspertguider til h\u00e5ndv\u00e6rk<\/a><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Golden_Rules_for_Soldering_Quality_Control\"><\/span>5 gyldne regler for kvalitetskontrol af lodning<span class=\"ez-toc-section-end\"><\/span><\/h2><ul class=\"wp-block-list\"><li><strong>Optimer temperaturprofilen<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>F\u00f8rste side: Standard Ramp-Soak-Spike (RSS)-kurve (2-3\u00b0C\/s opvarmningshastighed)<\/li>\n\n<li>Anden side:Brug Ramp-to-Spike-kurve (RTS) (forl\u00e6nget forvarmningstid)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Retningslinjer for komponentlayout<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>Placer tunge komponenter p\u00e5 samme side<\/li>\n\n<li>Forskudte dobbeltsidede BGA'er for at undg\u00e5 termisk sp\u00e6ndingskoncentration<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Kriterier for valg af loddepasta<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>Anden side: Brug loddepasta til lave temperaturer (f.eks. Sn42\/Bi58)<\/li>\n\n<li>R\u00f8d lims viskositet:&gt;50.000 cps<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Kritiske udstyrsparametre<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>H\u00e6ldning af reflow-ovnens transportb\u00e5nd: 5-7\u00b0.<\/li>\n\n<li>K\u00f8lehastighed: 4-6\u00b0C\/s<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Opgraderinger af inspektionsteknologi<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>Brug 3D SPI til inspektion af loddepastatykkelse<\/li>\n\n<li>Obligatorisk akustisk mikroskopi efter anden reflow<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_Issues_and_Engineering_Solutions\"><\/span>Almindelige problemer og tekniske l\u00f8sninger<span class=\"ez-toc-section-end\"><\/span><\/h2><p><strong>Problem 1: QFN-komponent forskydes under andet reflow<\/strong><\/p><ul class=\"wp-block-list\"><li>L\u00f8sning: P\u00e5f\u00f8r h\u00f8jtemperaturslim efter lodning p\u00e5 f\u00f8rste side<\/li>\n\n<li>Parametre:Brug kl\u00e6bemiddel med &gt;200\u00b0C h\u00e6rdningstolerance<\/li><\/ul><p><strong>Problem 2: Komponenter falder af under b\u00f8lgelodning (r\u00f8d limside)<\/strong><\/p><ul class=\"wp-block-list\"><li>Forbedringer:<\/li><\/ul><ol class=\"wp-block-list\"><li>Efterh\u00e6rdning med UV efter p\u00e5f\u00f8ring af r\u00f8d lim<\/li>\n\n<li>Forvarm til 100\u00b0C f\u00f8r b\u00f8lgelodning<\/li><\/ol><p><strong>Problem 3: Overdreven hulrum i BGA-samlinger<\/strong><\/p><ul class=\"wp-block-list\"><li>Procesoptimering:<\/li>\n\n<li>Forl\u00e6ng opt\u00f8ningstiden for loddepasta til 8 timer<\/li>\n\n<li>Brug kv\u00e6lstofassisteret reflow (O\u2082 &lt;500ppm)<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-2.jpg\" alt=\"PCB-reflow-lodning\" class=\"wp-image-3563\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Future_Process_Trends\"><\/span>Fremtidige procestendenser<span class=\"ez-toc-section-end\"><\/span><\/h2><ol class=\"wp-block-list\"><li><strong>Lodning ved lav temperatur<\/strong>: Sn-Bi loddelegeringer med pulserende opvarmning<\/li>\n\n<li><strong>Smart temperaturkontrol<\/strong>: Maskinl\u00e6ringsbaseret profiloptimering i realtid<\/li>\n\n<li><strong>Hybrid sammenf\u00f8jning<\/strong>: Kombinerede l\u00f8sninger med loddepasta + ledende kl\u00e6bemiddel<\/li><\/ol><p>Ved systematisk at anvende disse n\u00f8gleteknikker kan ingeni\u00f8rer opn\u00e5 first-pass-udbytter p\u00e5 over 99,5 %.Vi anbefaler at implementere systemer til overv\u00e5gning af procesvinduer til l\u00f8bende optimering i produktionsmilj\u00f8er.<\/p>","protected":false},"excerpt":{"rendered":"<p>Dobbeltsidet PCB-reflowlodning er en kerneproces i elektronikproduktion, der involverer valg af loddepasta og r\u00f8dlimsprocesser, temperaturkurvekontrol og dobbeltsidede loddestrategier.Denne artikel analyserer loddeprocessen for dobbeltsidede printkort, giver l\u00f8sninger p\u00e5 almindelige problemer og giver tips til procesoptimering for at forbedre loddeudbyttet og produktionseffektiviteten.<\/p>","protected":false},"author":1,"featured_media":3564,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[109],"tags":[111,320],"class_list":["post-3560","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-faq","tag-pcb","tag-pcb-reflow-soldering"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>How to perform reflow soldering on double-sided PCB? 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