{"id":4135,"date":"2025-08-20T08:34:00","date_gmt":"2025-08-20T00:34:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4135"},"modified":"2025-08-19T15:47:31","modified_gmt":"2025-08-19T07:47:31","slug":"pcb-hasl-and-lead-free-hasl-processes","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","title":{"rendered":"PCB HASL og blyfri HASL-processer"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Indholdsfortegnelse<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#HASL_process\" >HASL-processen<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#11_Differences_between_HASL_and_lead-free_HASL\" >1.1 Forskelle mellem HASL og blyfri HASL<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#12_Core_HASL_Process_Flow\" >1.2 Det centrale HASL-procesflow<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#121_Pre-Treatment_Stage\" >1.2.1 Forbehandlingstrinnet<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#122_Flux_Application\" >1.2.2 Anvendelse af flux<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#123_Hot_Air_Leveling_Key_Steps\" >1.2.3 N\u00f8gletrin for nivellering med varm luft<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#124_Quality_Inspection\" >1.2.4 Kvalitetskontrol<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#13_Process_Advantages_and_Limitations\" >1.3 Procesfordele og -begr\u00e6nsninger<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Advantages\" >Fordele<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Limitations\" >Begr\u00e6nsninger<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#ENIG_Electroless_Nickel_Immersion_Gold_Process\" >ENIG (Electroless Nickel Immersion Gold) proces<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#21_Process_Principles\" >2.1 Procesprincipper<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#22_Advantages\" >2.2 Fordele<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#23_Challenges\" >2.3 Udfordringer<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#OSP_Organic_Solderability_Preservative\" >OSP (organisk konserveringsmiddel for loddeevne)<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#31_Process_Principles\" >3.1 Procesprincipper<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#32_Advantages\" >3.2 Fordele<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#33_Limitations\" >3.3 Begr\u00e6nsninger<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Process_Selection_Guide\" >Guide til valg af proces<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#41_Comparison\" >4.1 Sammenligning<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#42_Recommendations\" >4.2 Anbefalinger<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#43_Topfast_Capabilities\" >4.3 Topfast-kapaciteter<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"HASL_process\"><\/span>HASL-processen<span class=\"ez-toc-section-end\"><\/span><\/h2><p>HASL (Hot Air Solder Leveling) er en af de mest klassiske og omkostningseffektive overfladebehandlingsprocesser inden for printkortfremstilling og spiller en vigtig rolle i elektronikindustrien. Denne proces indeb\u00e6rer, at kobberoverfladen d\u00e6kkes med et lag af tin-bly-legering for at give p\u00e5lidelig loddeevne og oxidationsbeskyttelse til printkort.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1.jpg\" alt=\"HASL-processen\" class=\"wp-image-4137\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"11_Differences_between_HASL_and_lead-free_HASL\"><\/span>1.1 Forskelle mellem HASL og blyfri HASL<span class=\"ez-toc-section-end\"><\/span><\/h3><p>HASL (Hot Air Solder Leveling) er en af de mest klassiske og omkostningseffektive overfladebehandlingsteknologier i verden. <a href=\"https:\/\/www.topfastpcb.com\/da\/\">PCB-fremstilling<\/a>. Denne proces bel\u00e6gger kobberoverflader med et lag af tin-bly-legering for at give p\u00e5lidelig loddeevne og modstandsdygtighed over for oxidation. Med stigende milj\u00f8krav er blyfri HASL blevet industristandard.<\/p><p><strong>Forskelle i materialesammens\u00e6tning<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Traditionel HASL bruger Sn63\/Pb37-legering (63 % tin + 37 % bly), smeltepunkt: 183 \u00b0C<\/li>\n\n<li>Blyfri HASL anvendes prim\u00e6rt:<\/li>\n\n<li>SAC305 (96,5 % tin + 3 % s\u00f8lv + 0,5 % kobber), smeltepunkt: 217-220 \u00b0C<\/li>\n\n<li>SnCu0,7 (99,3 % tin + 0,7 % kobber), smeltepunkt: 227 \u00b0C<\/li>\n\n<li>Ren tin (Sn100), smeltepunkt: 232 \u00b0C<\/li><\/ul><p><strong>Sammenligning af proceskarakteristika<\/strong>:<\/p><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Ejendom<\/th><th>Blyholdig HASL<\/th><th>Blyfri HASL<\/th><\/tr><\/thead><tbody><tr><td>Smeltepunkt<\/td><td>183 \u00b0C<\/td><td>217-232 \u00b0C<\/td><\/tr><tr><td>Loddepot-temperatur<\/td><td>200-210 \u00b0C<\/td><td>240-255 \u00b0C<\/td><\/tr><tr><td>Overfladefinish<\/td><td>Lys<\/td><td>Relativt kedelig<\/td><\/tr><tr><td>Mekanisk styrke<\/td><td>God duktilitet (h\u00f8j slagfasthed)<\/td><td>H\u00e5rd, men skr\u00f8belig<\/td><\/tr><tr><td>V\u00e5dhed<\/td><td>Fremragende (kontaktvinkel &lt;30\u00b0)<\/td><td>God (kontaktvinkel 35-45\u00b0)<\/td><\/tr><tr><td>Overholdelse af milj\u00f8krav<\/td><td>Indeholder bly (37%)<\/td><td>Blyindhold &lt;0,1% (RoHS-kompatibel)<\/td><\/tr><tr><td>Omkostninger<\/td><td>Lavere<\/td><td>15-20% h\u00f8jere<\/td><\/tr><tr><td>Anvendelighed<\/td><td>Generelt form\u00e5l<\/td><td>Kr\u00e6ver h\u00f8jere loddetemperaturer<\/td><\/tr><\/tbody><\/table><\/figure><p><strong>Praktiske forskelle i ydeevne<\/strong>:<\/p><ul class=\"wp-block-list\"><li><strong>Loddeevne<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Blyholdig HASL giver bedre loddeaktivitet med kortere befugtningstid (1-2 sek.)<\/li>\n\n<li>Blyfri HASL kr\u00e6ver st\u00e6rkere flux og strammere temperaturkontrol<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>P\u00e5lidelighed<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Blyholdige lodninger udviser bedre modstandsdygtighed over for termisk udmattelse (flere temperaturcyklusser)<\/li>\n\n<li>Blyfri loddeforbindelser bevarer h\u00f8jere mekanisk styrke efter langvarig \u00e6ldning<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Proces-vindue<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Blyholdig HASL har et bredere procesvindue (\u00b110 \u00b0C)<\/li>\n\n<li>Blyfri HASL kr\u00e6ver strengere temperaturkontrol (\u00b13 \u00b0C)<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Professionelt tip: Topfast optimerer parametrene for blyfri HASL for at opn\u00e5 99,5 % loddeudbytte og samtidig opfylde IPC-6012 klasse 3-standarder.<\/p><\/blockquote><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"12_Core_HASL_Process_Flow\"><\/span>1.2 Det centrale HASL-procesflow<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Som professionel PCB-producent anvender Topfast fuldautomatiske HASL-produktionslinjer med strenge standardiserede processer:<\/p><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"121_Pre-Treatment_Stage\"><\/span>1.2.1 Forbehandlingstrinnet<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Kemisk reng\u00f8ring<\/strong>:<\/li>\n\n<li>Syrerens (pH 2-3) fjerner kobberoxider<\/li>\n\n<li>Temperaturregulering: 40-50 \u00b0C, varighed: 2-3 min.<\/li>\n\n<li>Mikro\u00e6tsning sikrer en overfladeruhed p\u00e5 Ra 0,3-0,5 \u03bcm.<\/li>\n\n<li><strong>Skylning<\/strong>:<\/li>\n\n<li>Tretrins modstr\u00f8ms skylning (DI-vandresistivitet &gt;15M\u03a9\u00b7cm)<\/li>\n\n<li>T\u00f8rring med varm luft (60-80 \u00b0C)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"122_Flux_Application\"><\/span>1.2.2 Anvendelse af flux<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>Anvendelsesmetoder:<\/li>\n\n<li>Skumning (traditionel): Flux-tykkelse 0,01-0,03 mm<\/li>\n\n<li>Spray (avanceret):Mere ensartet, 30% mindre fluxforbrug<\/li>\n\n<li>Flux-typer:<\/li>\n\n<li>Ikke-ren kolofoniumbaseret (ROH)<\/li>\n\n<li>Faststofindhold: 8-12%, syrev\u00e6rdi: 35-45mgKOH\/g<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"123_Hot_Air_Leveling_Key_Steps\"><\/span>1.2.3 N\u00f8gletrin for nivellering med varm luft<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Forvarmning<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Blyholdig: 130-140 \u00b0C<\/li>\n\n<li>Blyfri: 150-160 \u00b0C<\/li>\n\n<li>Varighed: 60-90 sekunder<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Dypning af loddetin<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Temperatur p\u00e5 loddekolbe:<ul class=\"wp-block-list\"><li>Blyholdig: 210\u00b15\u00b0C<\/li>\n\n<li>Blyfri: 250\u00b15\u00b0C<\/li><\/ul><\/li>\n\n<li>Ventetid: 2-4 sek. (\u00b10,5 sek. n\u00f8jagtighed)<\/li>\n\n<li>Neds\u00e6nkningsdybde: 3-5 mm<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Nivellering med varm luft<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Parametre for luftkniven:<ul class=\"wp-block-list\"><li>Tryk: 0,3-0,5MPa<\/li>\n\n<li>Temperatur: 300-350 \u00b0C<\/li>\n\n<li>Vinkel: 4\u00b0 nedadg\u00e5ende h\u00e6ldning<\/li>\n\n<li>Lufthastighed: 20-30m\/s<\/li><\/ul><\/li>\n\n<li>Behandlingstid: 1-2 sek.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>K\u00f8ling<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Tvungen luftk\u00f8ling (hastighed: 2-3 \u00b0C\/sek.)<\/li>\n\n<li>Endelig temperatur &lt;60 \u00b0C<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"124_Quality_Inspection\"><\/span>1.2.4 Kvalitetskontrol<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>Online AOI (100 % d\u00e6kning):<\/li>\n\n<li>Inspektion af loddetykkelse (1-40 \u03bcm)<\/li>\n\n<li>Registrering af overfladefejl (loddekugler, blottet kobber osv.)<\/li>\n\n<li>Pr\u00f8veudtagningstests:<\/li>\n\n<li>Loddebarhedstest (245 \u00b0C, 3 sek.)<\/li>\n\n<li>Test af vedh\u00e6ftning (tapemetode)<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Teknologisk gennembrud: Topfasts nitrogenbeskyttede, blyfri HASL-proces reducerer loddeoxidation fra 5 % til 1,5 %, hvilket forbedrer loddeudbyttet betydeligt.<\/p><\/blockquote><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"13_Process_Advantages_and_Limitations\"><\/span>1.3 Procesfordele og -begr\u00e6nsninger<span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advantages\"><\/span>Fordele<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Omkostningseffektivitet<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Lav investering i udstyr (~1\/3 af ENIG)<\/li>\n\n<li>Betydelige besparelser p\u00e5 materialeomkostninger (40-60% billigere end ENIG)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Loddets p\u00e5lidelighed<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>T\u00e5ler &gt;3 reflow-cyklusser (spidsbelastning 260 \u00b0C)<\/li>\n\n<li>H\u00f8j f\u00e6lles tr\u00e6kstyrke (blyholdig: 50-60MPa; blyfri: 55-65MPa)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Bred anvendelse<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Velegnet til forskellige padst\u00f8rrelser (min. 0,5 mm pitch)<\/li>\n\n<li>Kompatibel med through-hole- og SMT-processer<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Opbevaringens ydeevne<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>12 m\u00e5neders holdbarhed (RH &lt;60%)<\/li>\n\n<li>Fremragende modstandsdygtighed over for oxidation (48-timers saltt\u00e5getest)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Limitations\"><\/span>Begr\u00e6nsninger<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Begr\u00e6nsninger for fine pladser<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Ikke egnet til BGA\/QFN-komponenter med 0,4 mm pitch<\/li>\n\n<li>Risiko for loddebroer ved design med fin pitch<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Problemer med planaritet<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Overfladeuj\u00e6vnhed: 15-25 \u03bcm (p\u00e5virker HDI-samling)<\/li>\n\n<li>Tykkelsevariation p\u00e5 op til 20 \u03bcm mellem store\/sm\u00e5 puder<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Termisk stress<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>H\u00f8jtemperaturprocesser (is\u00e6r blyfri) kan p\u00e5virke materialer med h\u00f8j Tg<\/li>\n\n<li>H\u00f8jere risiko for sk\u00e6vvridning ved tynde plader (&lt;0,8 mm)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Milj\u00f8m\u00e6ssige overvejelser<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Blyholdig HASL ikke-RoHS-kompatibel<\/li>\n\n<li>Blyfri HASL forbruger mere energi (30-50 \u00b0C h\u00f8jere temperaturer)<\/li><\/ul><p>Har du brug for professionel HASL-support? <a href=\"https:\/\/www.topfastpcb.com\/da\/contact\/\">Kontakt Topfasts ingeni\u00f8rer<\/a> til skr\u00e6ddersyede l\u00f8sninger<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3.jpg\" alt=\"HASL-processen\" class=\"wp-image-4139\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"ENIG_Electroless_Nickel_Immersion_Gold_Process\"><\/span>ENIG (Electroless Nickel Immersion Gold) proces<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"21_Process_Principles\"><\/span>2.1 Procesprincipper<span class=\"ez-toc-section-end\"><\/span><\/h3><p>ENIG danner et sammensat beskyttelseslag ved hj\u00e6lp af kemisk nikkelbel\u00e6gning og neds\u00e6nket guld:<\/p><ul class=\"wp-block-list\"><li>Nikkelbel\u00e6gning: 3-6 \u03bcm (7-9 % fosfor)<\/li>\n\n<li>Guldlag: 0,05-0,1 \u03bcm<\/li><\/ul><p><strong>N\u00f8gleparametre<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Nikkelbadets temperatur: 85-90 \u00b0C<\/li>\n\n<li>Plateringshastighed: 15-20 \u03bcm\/t<\/li>\n\n<li>Guldbadets temperatur: 80-85 \u00b0C<\/li>\n\n<li>pH: Nikkelbad 4,5-5,0, guldbad 5,5-6,5<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"22_Advantages\"><\/span>2.2 Fordele<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Fantastisk fladhed<\/strong> (Ra&lt;0,1 \u03bcm):<\/li><\/ul><ul class=\"wp-block-list\"><li>Ideel til BGA\/CSP med 0,3 mm pitch<\/li>\n\n<li>Pad-koplanaritet &lt;5 \u03bcm\/m<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Modstandsdygtighed over for oxidation<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>18 m\u00e5neders holdbarhed<\/li>\n\n<li>J-STD-003B klasse 3-certificeret<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Elektrisk ledningsevne<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Guldresistivitet: 2,44 \u03bc\u03a9\u00b7cm<\/li>\n\n<li>Kontaktmodstand &lt;10 m\u03a9<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"23_Challenges\"><\/span>2.3 Udfordringer<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Problemet med den sorte pude<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>\u00c5rsager: Over\u00e6tsning af nikkel eller unormalt fosforindhold<\/li>\n\n<li>L\u00f8sning:Topfasts patenterede passivering reducerer antallet af sorte pletter til 0,1 %.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Omkostningsfaktorer<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>H\u00f8je materialeomkostninger (udsving i guldprisen)<\/li>\n\n<li>Kompleks proces (8-10 trin)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Styrke af loddeforbindelse<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Sk\u00f8rt Ni-Au IMC-lag<\/li>\n\n<li>Tr\u00e6kstyrke ~40-45MPa<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Topfasts ENIG opn\u00e5r en tykkelsesuniformitet p\u00e5 \u00b110 %, hvilket overg\u00e5r branchens standard p\u00e5 \u00b115 %.<\/p><\/blockquote><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"OSP_Organic_Solderability_Preservative\"><\/span>OSP (organisk konserveringsmiddel for loddeevne) <span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"31_Process_Principles\"><\/span>3.1 Procesprincipper<span class=\"ez-toc-section-end\"><\/span><\/h3><p>OSP danner en 0,2-0,5 \u03bcm organisk beskyttelsesfilm p\u00e5 blank kobber, der indeholder:<\/p><ul class=\"wp-block-list\"><li>Benzotriazol-forbindelser<\/li>\n\n<li>Imidazol-forbindelser<\/li>\n\n<li>Carboxylsyrer<\/li><\/ul><p><strong>Procesflow<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Reng\u00f8ring med syre (5% H2SO4, 2 minutter)<\/li>\n\n<li>Mikro\u00e6tsning (Na2S2O8, fjern 1-2 \u03bcm kobber)<\/li>\n\n<li>OSP-behandling (40-50 \u00b0C, 1-2 minutter)<\/li>\n\n<li>T\u00f8rring (60-80 \u00b0C varm luft)<\/li><\/ol><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"32_Advantages\"><\/span>3.2 Fordele<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Omkostningseffektivt med h\u00f8j t\u00e6thed<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>60 % billigere end HASL<\/li>\n\n<li>Lav investering i udstyr (~1\/5 af ENIG)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Signalintegritet<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Stabil dielektrisk konstant (\u0394Dk &lt;0,02)<\/li>\n\n<li>Ideel til h\u00f8jfrekvente anvendelser (&gt;10 GHz)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Milj\u00f8venlig<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Ingen tungmetaller<\/li>\n\n<li>Forenklet spildevandsbehandling<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"33_Limitations\"><\/span>3.3 Begr\u00e6nsninger<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Vindue for lodbarhed<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Skal bruges inden for 24 timer efter \u00e5bning<\/li>\n\n<li>Kun egnet til 1 reflow-cyklus (udbyttet falder 30 % ved andet reflow)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Inspektionsvanskeligheder<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Sv\u00e6rt at m\u00e5le filmtykkelse optisk<\/li>\n\n<li>Kr\u00e6ver s\u00e6rlig ICT-behandling<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Opbevaringsforhold<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Vakuumpakning p\u00e5kr\u00e6vet (RH &lt;30%)<\/li>\n\n<li>Opbevaringstemperatur: 15-30 \u00b0C<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Topfasts forbedrede OSP forl\u00e6nger holdbarheden fra 3 til 6 m\u00e5neder og modst\u00e5r 2 reflow-cyklusser.<\/p><\/blockquote><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2.jpg\" alt=\"HASL-processen\" class=\"wp-image-4138\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Process_Selection_Guide\"><\/span>Guide til valg af proces<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"41_Comparison\"><\/span>4.1 Sammenligning<span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Parameter<\/th><th>HASL<\/th><th>ENIG<\/th><th>OSP<\/th><\/tr><\/thead><tbody><tr><td>Omkostninger<\/td><td>$<\/td><td>$$$<\/td><td>$<\/td><\/tr><tr><td>Fladhed<\/td><td>\u25b3 (15-25 \u03bcm)<\/td><td>\u25ce (&lt;5\u03bcm)<\/td><td>\u25cb (&lt;10\u03bcm)<\/td><\/tr><tr><td>Loddeevne<\/td><td>\u25ce (3 reflows)<\/td><td>\u25cb (5 reflows)<\/td><td>\u25b3 (1-2 reflows)<\/td><\/tr><tr><td>Holdbarhed<\/td><td>12mo<\/td><td>18mo<\/td><td>6 m\u00e5neder<\/td><\/tr><tr><td>Min. H\u00e6ldning<\/td><td>0,5 mm<\/td><td>0,3 mm<\/td><td>0,4 mm<\/td><\/tr><tr><td>Milj\u00f8venlig<\/td><td>Blyfri OK<\/td><td>Fremragende<\/td><td>Fremragende<\/td><\/tr><tr><td>Anvendelser<\/td><td>Forbrugerelektronik<\/td><td>IC'er med h\u00f8j densitet<\/td><td>Hurtig drejning<\/td><\/tr><\/tbody><\/table><\/figure><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"42_Recommendations\"><\/span>4.2 Anbefalinger<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Forbrugerelektronik<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Blyfri HASL (bedste omkostningseffektivitet)<\/li>\n\n<li>Styr m\u00e6ngden af loddepasta til komponenter med fin pitch<\/li><\/ul><ul class=\"wp-block-list\"><li><strong><a href=\"https:\/\/www.topfastpcb.com\/da\/products\/hdi-pcb\/\">HDI-kort<\/a><\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>ENIG (overlegen planhed)<\/li>\n\n<li>Streng kvalitetskontrol af nikkel<\/li><\/ul><ul class=\"wp-block-list\"><li><strong><a href=\"https:\/\/www.topfastpcb.com\/da\/products\/high-speed-pcb\/\">H\u00f8jhastigheds-PCB'er<\/a><\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>OSP\/ENIG (bedre signalintegritet)<\/li>\n\n<li>Undg\u00e5 HASL&amp;#8217s uj\u00e6vne overflade<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Udvikling af prototyper<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>OSP (hurtigst muligt)<\/li>\n\n<li>S\u00f8rg for rettidig montering<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"43_Topfast_Capabilities\"><\/span>4.3 Topfast-kapaciteter<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Komplette l\u00f8sninger til overfladebehandling:<\/p><ul class=\"wp-block-list\"><li>20 automatiserede HASL-linjer (500.000 m\u00b2\/m\u00e5ned)<\/li>\n\n<li>10 ENIG-linjer (\u00b18 % tykkelsesuniformitet)<\/li>\n\n<li>5 OSP-linjer (nanoforst\u00e6rket tilg\u00e6ngelig)<\/li>\n\n<li>100 % inline-inspektion (AOI+SPI)<\/li><\/ul><p><a href=\"https:\/\/www.topfastpcb.com\/da\/contact\/\">Download guide til valg af PCB-overfladefinish<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>HASL varmluftsudj\u00e6vningsprocessen, herunder legeringssammens\u00e6tning, procesflow og forskelle i ydeevne mellem blyholdig og blyfri HASL. En detaljeret analyse af karakteristika og anvendelsesscenarier for ENIG-elektroplettering og OSP-antioxidationsprocesser. Som professionel PCB-producent har Topfast omfattende overfladebehandlingsprocesser og et robust kvalitetskontrolsystem, der g\u00f8r det muligt for os at levere optimale overfladebehandlingsl\u00f8sninger til forskellige elektroniske produkter.<\/p>","protected":false},"author":1,"featured_media":4136,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[351,260],"class_list":["post-4135","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-hasl-processes","tag-pcb-manufacturing-process"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB HASL and Lead-Free HASL Processes - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Topfast provides professional and reliable PCB manufacturing services. 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