{"id":4310,"date":"2025-09-06T15:03:56","date_gmt":"2025-09-06T07:03:56","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4310"},"modified":"2025-09-06T15:03:59","modified_gmt":"2025-09-06T07:03:59","slug":"what-is-a-ceramic-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-ceramic-pcb\/","title":{"rendered":"Hvad er et keramisk printkort, og hvilke typer keramiske printkort findes der?"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Indholdsfortegnelse<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-ceramic-pcb\/#What_is_a_Ceramic_PCB\" >Hvad er et keramisk printkort?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-ceramic-pcb\/#Types_of_Ceramic_PCBs\" >Typer af keramiske printkort<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-ceramic-pcb\/#1_HTCC_High-Temperature_Co-fired_Ceramic\" >1. HTCC (h\u00f8jtemperatur co-br\u00e6ndt keramik)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-ceramic-pcb\/#2_LTCC_Low-Temperature_Co-fired_Ceramic\" >2.LTCC (Co-fyret keramik ved lav temperatur)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-ceramic-pcb\/#3_Thick-Film_Ceramic_PCB\" >3.Keramisk printkort med tyk film<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-ceramic-pcb\/#4_Thin-Film_Ceramic_PCB\" >4.Tyndfilms-keramisk printkort<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-ceramic-pcb\/#5_DBCDPC_Direct_Bonded_CopperDirect_Plated_Copper_Ceramic_Substrate\" >5.DBC\/DPC (Direct Bonded Copper\/Direct Plated Copper Ceramic Substrate)<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-ceramic-pcb\/#Advantages_of_Ceramic_PCBs\" >Fordele ved keramiske printkort<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-ceramic-pcb\/#Manufacturing_Process_of_Ceramic_PCBs\" >Fremstillingsproces af keramiske printkort<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-ceramic-pcb\/#When_to_Choose_Ceramic_PCBs\" >Hvorn\u00e5r skal man v\u00e6lge keramiske printkort?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-ceramic-pcb\/#Application_Fields\" >Anvendelsesomr\u00e5der<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_is_a_Ceramic_PCB\"><\/span>Hvad er en <a href=\"https:\/\/www.topfastpcb.com\/da\/products\/category\/ceramic-pcb\/\">Keramisk printkort<\/a>?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Keramiske printkort (PCB'er) er printkort, der bruger keramiske materialer som underlag. De fremstilles ved hj\u00e6lp af keramiske pulvere (som aluminiumoxid, aluminiumnitrid eller berylliumoxid) kombineret med organiske bindemidler.Deres varmeledningsevne ligger typisk mellem 9-20 W\/m\u00b7K, hvilket g\u00f8r dem fremragende til varmeh\u00e5ndtering. De har ogs\u00e5 en lav termisk ekspansionskoefficient(CTE) og stabile elektriske egenskaber. De fremstilles ved hj\u00e6lp af teknikker somLaser Activated Metallization (LAM), hvilket g\u00f8r dem perfekte til elektroniske enheder, der fungerer i milj\u00f8er med h\u00f8j effekt, h\u00f8j frekvens og h\u00f8j temperatur.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-2.jpg\" alt=\"Keramisk printkort\" class=\"wp-image-4312\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Types_of_Ceramic_PCBs\"><\/span>Typer af keramiske printkort<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Baseret p\u00e5 materialesystemer og fremstillingsprocesser kategoriseres keramiske printkort prim\u00e6rt i f\u00f8lgende typer:<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_HTCC_High-Temperature_Co-fired_Ceramic\"><\/span><strong>1. HTCC (h\u00f8jtemperatur co-br\u00e6ndt keramik)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Materialer<\/strong>: Aluminiumoxidbaseret keramik med wolfram\/molybd\u00e6n-metalpasta.<\/li>\n\n<li><strong>Proces<\/strong>: Sammefyring i en hydrogenatmosf\u00e6re ved 1600\u20131700 \u00b0C i op til 48 timer.<\/li>\n\n<li><strong>Funktionerapsuleringsprocesser og m\u00f8de<\/strong>H\u00f8j strukturel styrke og pr\u00e6cision, velegnet til h\u00f8j p\u00e5lidelighed inden for rumfart og milit\u00e6r.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_LTCC_Low-Temperature_Co-fired_Ceramic\"><\/span><strong>2.LTCC (Co-fyret keramik ved lav temperatur)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Materialer<\/strong>Krystalglas + keramiske kompositmaterialer med guldbaserede pastaer.<\/li>\n\n<li><strong>Proces<\/strong>: Sintring ved ca. 900 \u00b0C, efterfulgt af laminering og formning.<\/li>\n\n<li><strong>Funktionerapsuleringsprocesser og m\u00f8de<\/strong>Lav krympetolerance og h\u00f8j mekanisk styrke, meget brugt i RF-moduler og sensorer.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Thick-Film_Ceramic_PCB\"><\/span><strong>3.Keramisk printkort med tyk film<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Proces<\/strong>: Serigrafi af s\u00f8lv\/guld-palladium-pastaer p\u00e5 keramiske underlag efterfulgt af sintring ved h\u00f8j temperatur (\u22641000 \u00b0C).<\/li>\n\n<li><strong>Funktionerapsuleringsprocesser og m\u00f8de<\/strong>: Ledende lagtykkelse p\u00e5 10\u201313 \u03bcm, underst\u00f8tter integration af passive komponenter s\u00e5som modstande og kondensatorer, velegnet til komplekse kredsl\u00f8bsdesign.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Thin-Film_Ceramic_PCB\"><\/span><strong>4.Tyndfilms-keramisk printkort<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Proces<\/strong>Dannelse af metalkredsl\u00f8b p\u00e5 mikroniveau ved hj\u00e6lp af vakuumaflejring eller sputtering.<\/li>\n\n<li><strong>Funktionerapsuleringsprocesser og m\u00f8de<\/strong>H\u00f8j kredsl\u00f8bspr\u00e6cision, ideel til h\u00f8jfrekvente mikrob\u00f8lgekredsl\u00f8b.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_DBCDPC_Direct_Bonded_CopperDirect_Plated_Copper_Ceramic_Substrate\"><\/span><strong>5.DBC\/DPC (Direct Bonded Copper\/Direct Plated Copper Ceramic Substrate)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Proces<\/strong>Direkte limning af kobberfolie p\u00e5 keramiske overflader ved h\u00f8je temperaturer (DBC) eller kredsl\u00f8bsdannelse via elektroplettering (DPC).<\/li>\n\n<li><strong>Funktionerapsuleringsprocesser og m\u00f8de<\/strong>Fremragende varmeledningsevne og str\u00f8mf\u00f8ringsevne, hvilket g\u00f8r dem til det foretrukne valg til effekthalvledere (f.eks. IGBT'er) og LED-belysning.<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advantages_of_Ceramic_PCBs\"><\/span>Fordele ved keramiske printkort<span class=\"ez-toc-section-end\"><\/span><\/h2><ol class=\"wp-block-list\"><li><strong>H\u00f8j termisk ledningsevne<\/strong>:<br>Varmeledningsevnen er meget h\u00f8jere end traditionelle FR-4-substrater (f.eks. kan aluminiumnitrid n\u00e5 170-230 W\/m\u00b7K), hvilket effektivt l\u00f8ser problemet med varmeafledning i h\u00f8jtydende enheder.<\/li>\n\n<li><strong>Fremragende h\u00f8jfrekvent ydeevne<\/strong>:<br>Lavt dielektrisk tab og stabil dielektrisk konstant, velegnet til 5G-, RF- og mikrob\u00f8lgekommunikation.<\/li>\n\n<li><strong>Stabilitet ved h\u00f8je temperaturer<\/strong>:<br>Kan fungere i milj\u00f8er med temperaturer over 350 \u00b0C, hvilket g\u00f8r dem ideelle til bilelektronik, rumfart og andre h\u00f8jtemperaturanvendelser.<\/li>\n\n<li><strong>Mekanisk og kemisk holdbarhed<\/strong>:<br>H\u00f8j mekanisk styrke, modstandsdygtighed over for vibrationer, korrosion og kemisk erosion.<\/li>\n\n<li><strong>Dimensionsstabilitet og lav CTE<\/strong>:<br>Den termiske udvidelseskoefficient er t\u00e6t p\u00e5 den for siliciumchips, hvilket reducerer forbindelsesfejl for\u00e5rsaget af termisk stress.<\/li>\n\n<li><strong>Integrationskapacitet med h\u00f8j densitet<\/strong>:<br>Underst\u00f8tter fine linjebredder, mikrovias og stabling af flere lag, velegnet til miniaturiserede designs.<\/li><\/ol><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-1-1.jpg\" alt=\"Keramiske printkort\" class=\"wp-image-4314\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-1-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-1-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-1-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Process_of_Ceramic_PCBs\"><\/span>Fremstillingsproces af keramiske printkort<span class=\"ez-toc-section-end\"><\/span><\/h2><ol class=\"wp-block-list\"><li><strong>Design og layout<\/strong>:<br>Kredsl\u00f8bsdesign ved hj\u00e6lp af CAD-software, optimering af termisk styring og signalintegritet.<\/li>\n\n<li><strong>Forberedelse af substrat<\/strong>:<br>Keramiske substrater (Al\u2082O\u2083, AlN, SiC osv.) sk\u00e6res og poleres til de \u00f8nskede dimensioner.<\/li>\n\n<li><strong>Aflejring af ledende lag<\/strong>:<br>Ledende s\u00f8lv\/guld-palladium-pasta p\u00e5f\u00f8res via serigrafi eller inkjet-teknologi.<\/li>\n\n<li><strong>Via boring og p\u00e5fyldning<\/strong>:<br>Laser- eller mekanisk boring med ledende materialer, der fylder hullerne til forbindelser mellem lagene.<\/li>\n\n<li><strong>Co-firing og sintring<\/strong>:<\/li><\/ol><ul class=\"wp-block-list\"><li>HTCC: Sintret i et hydrogenmilj\u00f8 ved 1600-1700 \u00b0C.<\/li>\n\n<li>LTCC: Lavtemperatursintring ved ca. 900 \u00b0C.<br>Flerlagskredsl\u00f8b kr\u00e6ver stabling f\u00f8r sambr\u00e6nding.<\/li><\/ul><ol class=\"wp-block-list\"><li><strong>Montering og test af komponenter<\/strong>:<br>SMD-komponenter loddes, efterfulgt af elektriske, milj\u00f8m\u00e6ssige og p\u00e5lidelighedstests.<\/li>\n\n<li><strong>Beskyttende bel\u00e6gning og emballage<\/strong>:<br>Der p\u00e5f\u00f8res beskyttende lag for at forbedre milj\u00f8modstandsdygtigheden, efterfulgt af endelig funktionstest og emballering.<\/li><\/ol><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"When_to_Choose_Ceramic_PCBs\"><\/span>Hvorn\u00e5r skal man v\u00e6lge keramiske printkort?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Keramiske printkort er velegnede til f\u00f8lgende scenarier:<\/p><ul class=\"wp-block-list\"><li><strong>Enheder med h\u00f8j effekt<\/strong>: S\u00e5som IGBT-moduler, str\u00f8mstyringssystemer og LED-lamper til biler.<\/li>\n\n<li><strong>H\u00f8jfrekvente anvendelser<\/strong>5G-basestationer, radarsystemer, satellitkommunikation.<\/li>\n\n<li><strong>Omgivelser med h\u00f8j temperatur<\/strong>Kontrol af flymotorer, elektronik til biler.<\/li>\n\n<li><strong>Krav til h\u00f8j p\u00e5lidelighed<\/strong>Medicinsk udstyr (f.eks. laserkirurgiske instrumenter), milit\u00e6rt udstyr.<\/li>\n\n<li><strong>Kemisk \u00e6tsende milj\u00f8er<\/strong>: Olieefterforskning, industriel automatisering.<\/li><\/ul><p><strong>Overvejelser<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Keramiske printkort er relativt dyre, hvilket g\u00f8r dem velegnede til h\u00f8jtydende behov snarere end til forbrugerprodukter.<\/li>\n\n<li>Designet skal tage h\u00f8jde for materialets sk\u00f8rhed for at undg\u00e5 mekanisk sp\u00e6ndingskoncentration.<\/li>\n\n<li>H\u00f8j proceskompleksitet kr\u00e6ver samarbejde med leverand\u00f8rer med moden teknisk ekspertise.<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Application_Fields\"><\/span>Anvendelsesomr\u00e5der<span class=\"ez-toc-section-end\"><\/span><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Felt<\/th><th>Eksempler p\u00e5 anvendelse<\/th><\/tr><\/thead><tbody><tr><td><strong>Aerospaceapsulationsprocesser og m\u00f8der<\/strong><\/td><td>Missilkontrolsystemer, radartransceivermoduler, satellitkommunikationsudstyr.<\/td><\/tr><tr><td><strong>Elektronik til biler<\/strong><\/td><td>Str\u00f8mforsyningsmoduler til elbiler, LED-lys til biler, sensorer.<\/td><\/tr><tr><td><strong>5G og kommunikation<\/strong><\/td><td>H\u00f8jfrekvente RF-moduler, antennesystemer og effektforst\u00e6rkere til basestationer.<\/td><\/tr><tr><td><strong>Medicinsk udstyr<\/strong><\/td><td>Medicinsk laserudstyr, r\u00f8ntgenmaskiner og h\u00f8jfrekvente kirurgiske instrumenter.<\/td><\/tr><tr><td><strong>Industriel elektronik<\/strong><\/td><td>Kraftige forsyninger, industrilasere og udstyr til olieefterforskning.<\/td><\/tr><tr><td><strong>Milit\u00e6r og forsvar<\/strong><\/td><td>Radarsystemer, missilstyring og str\u00e5lingsresistent elektronisk udstyr.<\/td><\/tr><\/tbody><\/table><\/figure>","protected":false},"excerpt":{"rendered":"<p>Keramiske printkort er printkort med keramiske substrater, der tilbyder enest\u00e5ende varmeledningsevne, h\u00f8jfrekvent ydeevne og h\u00f8j temperaturstabilitet. De kategoriseres prim\u00e6rt i HTCC-, LTCC- og tykfilmskeramiske typer, der er velegnede til applikationer med h\u00f8j p\u00e5lidelighed som f.eks. rumfart, 5G-kommunikation, bilelektronik og medicinsk udstyr.<\/p>","protected":false},"author":1,"featured_media":4311,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[109],"tags":[365],"class_list":["post-4310","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-faq","tag-ceramic-pcb"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>What is a ceramic PCB, and what are the types of ceramic PCBs? - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Ceramic PCB is a high-performance circuit board utilizing an aluminum oxide\/aluminum nitride substrate, offering high thermal conductivity, high-frequency stability, and high-temperature resistance. 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