{"id":4555,"date":"2025-11-04T08:17:00","date_gmt":"2025-11-04T00:17:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4555"},"modified":"2025-11-03T20:20:03","modified_gmt":"2025-11-03T12:20:03","slug":"technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/","title":{"rendered":"Teknologisk udvikling af PCB'er i en tid med kunstig intelligens"},"content":{"rendered":"<p>Det teknologiske skift fra traditionel gennemg\u00e5ende montering til sammenkoblinger med h\u00f8j t\u00e6thed kombineret med den eksplosive v\u00e6kst i kunstig intelligens omformer fundamentalt printkortindustriens teknologiske udvikling, produktstruktur og v\u00e6rdifordeling.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB.jpg\" alt=\"AI PCB\" class=\"wp-image-4556\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Indholdsfortegnelse<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Technological_Requirements_Upgrade_of_AI_Computing_Hardware_for_PCBs\" >Teknologiske krav Opgradering af AI-computerhardware til PCB'er<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Demand_for_High_Layer_Count_and_High-Density_Interconnects\" >Eftersp\u00f8rgsel efter sammenkoblinger med h\u00f8jt lagantal og h\u00f8j densitet<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Signal_Integrity_Challenges_and_Solutions\" >Udfordringer og l\u00f8sninger for signalintegritet<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Innovations_in_Thermal_Management_Technology\" >Innovationer inden for termisk styringsteknologi<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Technological_Breakthroughs_and_Localization_Progress_of_Key_Materials\" >Teknologiske gennembrud og fremskridt med lokalisering af vigtige materialer<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Advances_in_High-Frequency_and_High-Speed_Copper-Clad_Laminates\" >Fremskridt inden for h\u00f8jfrekvens- og h\u00f8jhastighedslaminater af kobber<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Specialty_Chemical_Materials\" >Specialiserede kemiske materialer<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Technical_Bottlenecks_and_Breakthroughs_in_Manufacturing_Processes\" >Tekniske flaskehalse og gennembrud i produktionsprocesser<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Laser_Drilling_Technology\" >Teknologi til laserboring<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Innovations_in_Lamination_Processes\" >Innovationer i lamineringsprocesser<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Upgrades_in_Inspection_Technology\" >Opgraderinger i inspektionsteknologi<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Industrial_Chain_Restructuring_and_Business_Model_Transformation\" >Omstrukturering af industrik\u00e6den og transformation af forretningsmodellen<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Reshaping_of_Supply_Chain_Relationships\" >Omformning af forsyningsk\u00e6derelationer<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Increased_Concentration_Due_to_Higher_Technical_Barriers\" >\u00d8get koncentration p\u00e5 grund af h\u00f8jere tekniske barrierer<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Changes_in_Value_Distribution\" >\u00c6ndringer i v\u00e6rdifordeling<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Future_Technological_Development_Trends\" >Fremtidige teknologiske udviklingstendenser<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Integration_of_Advanced_Packaging_and_PCBs\" >Integration af avanceret emballage og printkort<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Silicon_Photonics_Co-Packaging_Technology\" >Silicon Photonics Co-Packaging-teknologi<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Sustainability_Requirements\" >Krav til b\u00e6redygtighed<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Recommendations_for_Technical_Teams\" >Anbefalinger til tekniske teams<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Transformation_of_Talent_Structure\" >Transformation af talentstruktur<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Focus_of_R_D_Investment\" >Fokus p\u00e5 investeringer i forskning og udvikling<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Patent_Layout_Strategy\" >Strategi for patentlayout<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technological_Requirements_Upgrade_of_AI_Computing_Hardware_for_PCBs\"><\/span>Teknologiske krav Opgradering af AI-computerhardware til PCB'er<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Demand_for_High_Layer_Count_and_High-Density_Interconnects\"><\/span>Eftersp\u00f8rgsel efter sammenkoblinger med h\u00f8jt lagantal og h\u00f8j densitet<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Traditionelle server-bundkort har typisk 12-16 lag, mens de nuv\u00e6rende mainstream AI-tr\u00e6ningsservere (som f.eks. NVIDIA DGX H100-serien) kr\u00e6ver PCB-lag p\u00e5 20-30 lag. S\u00e6rligt for GPU-substrater er det n\u00f8dvendigt med sammenkoblingst\u00e6theder p\u00e5 over 5.000 BGA-loddepunkter, hvor sporbredden\/afstanden er komprimeret fra de konventionelle 4\/4 mil til 2\/2 mil eller endda 1,5\/1,5 mil. Dette designkrav er en direkte \u00e5rsag til, at mSAP (Modified Semi-Additive Process) anvendes, da traditionelle subtraktive processer ikke l\u00e6ngere kan opfylde pr\u00e6cisionskravene.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Signal_Integrity_Challenges_and_Solutions\"><\/span>Udfordringer og l\u00f8sninger for signalintegritet<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Ved 112 Gbps PAM4-transmissionshastigheder skal inds\u00e6ttelsestabet kontrolleres inden for -0,6 dB\/tomme. Gennem simuleringsanalyser har vi fundet ud af, at spredningsfaktoren (Df) skal reduceres fra 0,02 for konventionel FR-4 til under 0,005. Den nuv\u00e6rende f\u00f8rende industril\u00f8sning indeb\u00e6rer brug af et kompositsystem af kulbrinteharpiks\/keramisk fyldstof (s\u00e5som Rogers RO4835\u2122), som opretholder en stabil Dk-v\u00e6rdi p\u00e5 3,5\u00b10,05 og udviser gode dielektriske egenskaber selv ved 77 GHz.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Innovations_in_Thermal_Management_Technology\"><\/span>Innovationer inden for termisk styringsteknologi<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Hvis vi tager NVIDIA H100 som eksempel, n\u00e5r det maksimale str\u00f8mforbrug for en enkelt chip op p\u00e5 700 W, hvilket g\u00f8r traditionelle termiske designl\u00f8sninger helt utilstr\u00e6kkelige. Vores udviklede indlejrede kobberblok + termisk via-array-teknologi kan reducere den termiske modstand til 0,8 \u00b0C\/W. Med hensyn til valg af substratmateriale er h\u00f8j Tg (\u2265170 \u00b0C) og h\u00f8j varmeledningsevne (\u22650,8 W\/m-K) blevet grundl\u00e6ggende krav, og nogle avancerede applikationer anvender allerede hybridstrukturer af metalsubstrater og organiske materialer.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technological_Breakthroughs_and_Localization_Progress_of_Key_Materials\"><\/span>Teknologiske gennembrud og fremskridt med lokalisering af vigtige materialer<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advances_in_High-Frequency_and_High-Speed_Copper-Clad_Laminates\"><\/span>Fremskridt inden for <a href=\"https:\/\/www.topfastpcb.com\/da\/blog\/high-frequency-pcb-design-and-layout-guide\/\">H\u00f8jfrekvent<\/a> og <a href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-a-high-speed-pcb\/\">H\u00f8j hastighed<\/a> Copper-Clad-laminater<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Shengyi Technologys S7439-serie er blevet certificeret af store OEM'er og har opn\u00e5et en Df-v\u00e6rdi p\u00e5 0,0058 ved 10 GHz, hvilket n\u00e6rmer sig internationalt f\u00f8rende standarder. Sinoma Science &amp; Technologys udvikling af elektronisk glasstof med lav Dk (Dk=4,2) bryder Nittobos teknologiske monopol, og masseproduktion forventes i 2025.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Specialty_Chemical_Materials\"><\/span>Specialiserede kemiske materialer<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Inden for lodderesistbl\u00e6k underst\u00f8tter Taiyo Inks SR-7200G-serie direkte laserafbildning med opl\u00f8sninger p\u00e5 op til 20 \u03bcm. Til pletteringsadditiver muligg\u00f8r MacDermid Enthones Circuposit 8800-serie ensartet plettering med 1:1-billedforhold, hvilket l\u00f8ser problemet med ensartet kobberplettering i gennemg\u00e5ende huller til printkort med h\u00f8jt antal lag.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3.jpg\" alt=\"AI PCB\" class=\"wp-image-4557\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technical_Bottlenecks_and_Breakthroughs_in_Manufacturing_Processes\"><\/span>Tekniske flaskehalse og gennembrud i produktionsprocesser<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Laser_Drilling_Technology\"><\/span>Teknologi til laserboring<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Til mikrovia-bearbejdning under 0,1 mm n\u00e6rmer CO2-lasere sig de fysiske gr\u00e6nser. Vi har introduceret UV-laserbearbejdningssystemer kombineret med str\u00e5leformningsteknologi for at forbedre bearbejdningspr\u00e6cisionen til 35 \u03bcm. Han's Lasers UV-laserboremaskiner, der bruger en b\u00f8lgel\u00e6ngde p\u00e5 355 nm, opn\u00e5r en mindste huldiameter p\u00e5 50 \u03bcm med en positionsn\u00f8jagtighed p\u00e5 \u00b115 \u03bcm.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Innovations_in_Lamination_Processes\"><\/span>Innovationer i lamineringsprocesser<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Til ultrah\u00f8jlagsplader med over 30 lag har vi udviklet en lamineringsproces, der involverer segmenteret opvarmning og trykp\u00e5f\u00f8ring. Ved pr\u00e6cist at styre harpiksflowet \u00f8ges fyldningsgraden mellem lagene til over 95%, mens justeringsn\u00f8jagtigheden mellem lagene opretholdes inden for \u00b125 \u03bcm.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Upgrades_in_Inspection_Technology\"><\/span>Opgraderinger i inspektionsteknologi<span class=\"ez-toc-section-end\"><\/span><\/h3><p>En omfattende l\u00f8sning, der kombinerer <a href=\"https:\/\/www.topfastpcb.com\/da\/blog\/what-is-aoi-automated-optical-inspection\/\">Automatiseret optisk inspektionapsuleringsprocesser og m\u00f8der<\/a> (AOI) og elektrisk testning anvendes. Keysights PathWave ADS-software underst\u00f8tter 3D-simulering af elektromagnetiske felter, hvilket muligg\u00f8r tidlig identifikation af problemer med signalintegriteten. Til in-circuit test underst\u00f8tter Teradynes TestStation-arkitektur test af bitfejlrate for 112 Gbps-gr\u00e6nseflader.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Industrial_Chain_Restructuring_and_Business_Model_Transformation\"><\/span>Omstrukturering af industrik\u00e6den og transformation af forretningsmodellen<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Reshaping_of_Supply_Chain_Relationships\"><\/span>Omformning af forsyningsk\u00e6derelationer<span class=\"ez-toc-section-end\"><\/span><\/h3><p>AI-serverens PCB-forsyningsk\u00e6de er opdelt i tre niveauer: GPU-korts\u00e6t ledes af chipproducenter (f.eks. NVIDIA's udpegede forsyningsk\u00e6de); CPU-bundkort f\u00f8lger den traditionelle serverforsyningsk\u00e6de; og modulproducenter anskaffer uafh\u00e6ngigt tilbeh\u00f8rsmoduler. Denne differentiering kr\u00e6ver, at PCB-producenter har differentierede kundeengagementer.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Increased_Concentration_Due_to_Higher_Technical_Barriers\"><\/span><strong>\u00d8get koncentration p\u00e5 grund af h\u00f8jere tekniske barrierer<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p>Kapitalinvesteringer i printkort med 18 eller flere lag er 3-5 gange st\u00f8rre end for traditionelle produkter, og F&amp;U-cyklusserne str\u00e6kker sig over 12-18 m\u00e5neder. Det har f\u00f8rt til en koncentration af markedsandele blandt de f\u00f8rende virksomheder, hvor de tre st\u00f8rste producenter st\u00e5r for over 60% af det indenlandske marked for printkort til AI-servere i 2024.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Changes_in_Value_Distribution\"><\/span>\u00c6ndringer i v\u00e6rdifordeling<span class=\"ez-toc-section-end\"><\/span><\/h3><p>I materialeomkostningerne for AI-servere er andelen af printkort steget fra 2-3% i traditionelle servere til 6-8%. Is\u00e6r for GPU-substrater kan bruttomargenerne p\u00e5 grund af deres h\u00f8je tekniske kompleksitet n\u00e5 op p\u00e5 35-40%, hvilket er betydeligt h\u00f8jere end 15-20% for traditionelle produkter.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2.jpg\" alt=\"AI PCB\" class=\"wp-image-4558\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Future_Technological_Development_Trends\"><\/span>Fremtidige teknologiske udviklingstendenser<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Integration_of_Advanced_Packaging_and_PCBs\"><\/span>Integration af avanceret emballage og printkort<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Chiplet-arkitekturen kr\u00e6ver, at PCB'er p\u00e5tager sig nogle interposer-funktioner, hvilket driver Substrate-Like PCB (SLP)-teknologien i retning af sporbredde\/afstand p\u00e5 10\/10 \u03bcm. Shennan Circuits' udviklede eSLP-teknologi har opn\u00e5et 8\/8 \u03bcm proceskapacitet og er i gang med pr\u00f8vevalidering hos store chipproducenter.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Silicon_Photonics_Co-Packaging_Technology\"><\/span>Silicon Photonics Co-Packaging-teknologi<span class=\"ez-toc-section-end\"><\/span><\/h3><p>For optiske moduler over 1,6T er Co-Packaged Optics (CPO) blevet et uundg\u00e5eligt valg. Det kr\u00e6ver, at PCB'er integrerer fotoniske b\u00f8lgeledere, og vi udvikler hybrid substratteknologi baseret p\u00e5 b\u00f8lgeledere af siliciumdioxid, som forventes at opn\u00e5 tekniske anvendelser inden 2026.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Sustainability_Requirements\"><\/span>Krav til b\u00e6redygtighed<span class=\"ez-toc-section-end\"><\/span><\/h3><p>EU's CE-RED-direktiv stiller nye milj\u00f8krav til printkort, herunder halogenfrie materialer og blyfrie processer. Vores udviklede biobaserede epoxyharpikssystem reducerer CO2-fodaftrykket med 40% og har opn\u00e5et UL-certificering.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Recommendations_for_Technical_Teams\"><\/span>Anbefalinger til tekniske teams<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Transformation_of_Talent_Structure\"><\/span>Transformation af talentstruktur<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Et skift fra traditionelle procesingeni\u00f8rer til \"materiale-proces-system\"-komposittalenter er n\u00f8dvendigt. I vores team er andelen af ingeni\u00f8rer med materialevidenskabelig baggrund steget fra 10% for et \u00e5rti siden til 35% i dag.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Focus_of_R_D_Investment\"><\/span>Fokus p\u00e5 investeringer i forskning og udvikling<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Det anbefales at afs\u00e6tte 60% af F&amp;U-ressourcerne til HDI med h\u00f8jt antal lag, 30% til avanceret indpakning og 10% til b\u00e6redygtige udviklingsteknologier. Der b\u00f8r l\u00e6gges s\u00e6rlig v\u00e6gt p\u00e5 tidligt samarbejde med chipproducenter og deltagelse i front-end-design.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Patent_Layout_Strategy\"><\/span>Strategi for patentlayout<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Fokus p\u00e5 patentlayout i tre retninger: h\u00f8jhastighedsmaterialer, varmeafledningsstrukturer og sammenkoblinger med h\u00f8j densitet. Blandt vores kernepatenter, der er ans\u00f8gt om i de seneste \u00e5r, udg\u00f8r de, der involverer s\u00e6rlige strukturer til varmeafledning, 40%, som vil blive en fremtidig teknologisk barriere.<\/p><p>Kunstig intelligens l\u00f8fter printkort fra hj\u00e6lpekomponenter til centrale dele af computersystemer. Denne status\u00e6ndring kr\u00e6ver, at vi omdefinerer produktudviklingsprocesser med en tankegang p\u00e5 systemniveau og g\u00e5r fra at v\u00e6re rene produktionstjenesteudbydere til at v\u00e6re udbydere af tekniske l\u00f8sninger. Fremtidens konkurrence i industrien vil v\u00e6re en omfattende konkurrence mellem materialesystemer, proceskapacitet og systemdesign.<\/p><p><\/p>","protected":false},"excerpt":{"rendered":"<p>Analyse af den dybtg\u00e5ende transformation, som AI medf\u00f8rer for printkortindustrien fra et teknisk perspektiv. AI-servere driver antallet af PCB-lag op til 20-30 lag, med krav til linjebredde og afstand, der n\u00e5r under 2\/2 mil, og signaloverf\u00f8rselshastigheder, der udvikler sig i retning af 112 Gbps.<\/p>","protected":false},"author":1,"featured_media":4559,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[382],"tags":[396,111],"class_list":["post-4555","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-guide","tag-ai-pcb","tag-pcb"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Technological Evolution of PCBs in the Era of Artificial Intelligence - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Revolutionary Demands of AI Computing Hardware on PCB Technology: From 20+ Layer High-Density Interconnect Design to 112Gbps Signal Integrity Assurance\u2014Exploring Innovations in High-Frequency Materials and Advanced Manufacturing Processes.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/\" \/>\n<meta property=\"og:locale\" content=\"da_DK\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Technological Evolution of PCBs in the Era of Artificial Intelligence - 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