{"id":5223,"date":"2026-03-15T08:32:00","date_gmt":"2026-03-15T00:32:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=5223"},"modified":"2026-03-10T17:27:50","modified_gmt":"2026-03-10T09:27:50","slug":"pcb-solder-mask-design-guidelines","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/","title":{"rendered":"Retningslinjer for design af PCB-loddemasker til p\u00e5lidelig produktion"},"content":{"rendered":"<p>Loddemasken er et af de mest synlige lag p\u00e5 et printkort. Den d\u00e6kker kobbersporene, mens den lader komponentpuderne ligge frit fremme til lodning.<\/p><p>Selv om loddemasken ser enkel ud, kan forkert design f\u00f8re til flere fremstillings- og monteringsproblemer, herunder:<\/p><ul class=\"wp-block-list\"><li>Loddebroer mellem pads<\/li>\n\n<li>d\u00e5rlige loddeforbindelser<\/li>\n\n<li>udsatte kobberomr\u00e5der<\/li>\n\n<li>Reduceret PCB-udbytte<\/li><\/ul><p>Efter korrekt <strong>Retningslinjer for design af PCB-loddemasker<\/strong> sikrer, at maskelaget underst\u00f8tter b\u00e5de fremstillings- og monteringsprocesser.<\/p><p>Denne vejledning forklarer de vigtigste designparametre, som ingeni\u00f8rer b\u00f8r overveje, n\u00e5r de skaber \u00e5bninger og afstande i loddemasken.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"437\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask.jpg\" alt=\"PCB-loddemaske\" class=\"wp-image-5224\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-300x219.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-16x12.jpg 16w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Indholdsfortegnelse<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#What_Is_PCB_Solder_Mask\" >Hvad er PCB-loddemaske?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Types_of_Solder_Mask\" >Typer af loddemasker<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Liquid_Photoimageable_Solder_Mask_LPI\" >Flydende fotobillede-loddemaske (LPI)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Dry_Film_Solder_Mask\" >T\u00f8rfilm-loddemaske<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Epoxy_Screen-Printed_Mask\" >Epoxy-screentrykt maske<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Key_PCB_Solder_Mask_Design_Rules\" >Vigtige regler for design af PCB-loddemasker<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#1_Solder_Mask_Clearance\" >1. Afstand til loddemaske<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#2_Solder_Mask_Expansion\" >2. Udvidelse af loddemaske<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#3_Solder_Mask_Dam_Width\" >3. Loddemaskens bredde<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#4_Fine-Pitch_Component_Considerations\" >4. Overvejelser om komponenter med fin pitch<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Solder_Mask_Defined_Pads_SMD\" >Loddemaskedefinerede puder (SMD)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Non-Solder_Mask_Defined_Pads_NSMD\" >Ikke-loddemaskede definerede puder (NSMD)<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#How_to_Design_PCB_Solder_Mask_Practical_Steps\" >S\u00e5dan designer du PCB-loddemaske (praktiske trin)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Common_PCB_Solder_Mask_Design_Mistakes\" >Almindelige fejl i design af PCB-loddemasker<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Mask_openings_are_too_small\" >Maske\u00e5bningerne er for sm\u00e5<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Insufficient_solder_mask_dam\" >Utilstr\u00e6kkelig loddemasked\u00e6mning<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Incorrect_pad_definitions\" >Forkerte pad-definitioner<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Ignoring_manufacturing_tolerances\" >Ignorerer produktionstolerancer<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Manufacturing_Considerations\" >Overvejelser vedr\u00f8rende fremstilling<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#Conclusion\" >Konklusion<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-solder-mask-design-guidelines\/#PCB_Solder_Mask_FAQ\" >FAQ om PCB-loddemaske<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Is_PCB_Solder_Mask\"><\/span>Hvad er PCB-loddemaske?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Loddemaske er en polymerbel\u00e6gning, der p\u00e5f\u00f8res PCB-overflader for at beskytte kobberbaner og forhindre utilsigtede loddeforbindelser.<\/p><p>Dens vigtigste funktioner omfatter:<\/p><ul class=\"wp-block-list\"><li>beskytter kobber mod oxidering<\/li>\n\n<li>forebyggelse af loddebroer<\/li>\n\n<li>forbedre isoleringen mellem lederne<\/li>\n\n<li>Forbedring af PCB-udseende<\/li><\/ul><p>Under PCB-fremstillingen p\u00e5f\u00f8res loddemaskelaget efter dannelsen af kobberm\u00f8nsteret og f\u00f8r overfladebehandlingen.<\/p><p>Den overordnede arbejdsgang for fremstilling er forklaret i: <strong><a href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-manufacturing-process-explained-step-by-step\/\">PCB-fremstillingsproces forklaret<\/a><\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Types_of_Solder_Mask\"><\/span>Typer af loddemasker<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Der bruges flere typer loddemasker til fremstilling af printkort.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Liquid_Photoimageable_Solder_Mask_LPI\"><\/span>Flydende fotobillede-loddemaske (LPI)<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Den mest almindelige type, der bruges i moderne printkort.<\/p><p>Karakteristika:<\/p><ul class=\"wp-block-list\"><li>p\u00e5f\u00f8rt som en flydende bel\u00e6gning<\/li>\n\n<li>m\u00f8nstret ved hj\u00e6lp af fotolitografi<\/li>\n\n<li>underst\u00f8tter komponenter med fin pitch<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Dry_Film_Solder_Mask\"><\/span>T\u00f8rfilm-loddemaske<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Mindre udbredt, men velegnet til specifikke anvendelser.<\/p><p>Funktioner:<\/p><ul class=\"wp-block-list\"><li>Lamineret film<\/li>\n\n<li>ensartet tykkelse<\/li>\n\n<li>God til design med h\u00f8j pr\u00e6cision<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Epoxy_Screen-Printed_Mask\"><\/span>Epoxy-screentrykt maske<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Bruges prim\u00e6rt i \u00e6ldre eller billige PCB-processer.<\/p><p>Begr\u00e6nsninger:<\/p><ul class=\"wp-block-list\"><li>lavere opl\u00f8sning<\/li>\n\n<li>ikke egnet til komponenter med fin pitch<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Key_PCB_Solder_Mask_Design_Rules\"><\/span>Vigtige regler for design af PCB-loddemasker<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Flere designparametre p\u00e5virker loddemaskens ydeevne.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Solder_Mask_Clearance\"><\/span>1. Afstand til loddemaske<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Loddemaskeafstand definerer afstanden mellem kobberpadkanten og maske\u00e5bningen.<\/p><p>Typisk retningslinje:<\/p><pre class=\"wp-block-preformatted\">Maskeafstand: 3-4 mil<\/pre><p>Tilstr\u00e6kkelig afstand sikrer, at puderne er fuldt eksponerede under monteringen.<\/p><p>Hvis afstanden er for lille:<\/p><ul class=\"wp-block-list\"><li>Masken kan d\u00e6kke pudekanterne<\/li>\n\n<li>Loddesamlinger kan v\u00e6re up\u00e5lidelige<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Solder_Mask_Expansion\"><\/span>2. Udvidelse af loddemaske<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Maskeudvidelse er den m\u00e6ngde, hvormed loddemaskens \u00e5bning udvides ud over kobberpuden.<\/p><p>Et eksempel:<\/p><pre class=\"wp-block-preformatted\">Padst\u00f8rrelse = 20 mil<br>Maske\u00e5bning = 24 mil<br>Ekspansion = 2 mil pr. side<\/pre><p>Denne udvidelse kompenserer for maskens justeringstolerancer under fremstillingen.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Solder_Mask_Dam_Width\"><\/span>3. Loddemaskens bredde<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Loddemasked\u00e6mningen er den smalle maskestrimmel mellem to pads.<\/p><p>Typisk minimumsd\u00e6mningsbredde:<\/p><pre class=\"wp-block-preformatted\">\u2265 4 mil<\/pre><p>Hvis d\u00e6mningen er for smal, kan den g\u00e5 i stykker under fremstillingen, hvilket \u00f8ger risikoen for loddebroer.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Fine-Pitch_Component_Considerations\"><\/span>4. Overvejelser om komponenter med fin pitch<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Fine-pitch IC'er og BGA'er kr\u00e6ver et s\u00e6rligt loddemaskedesign.<\/p><p>Almindelige tilgange omfatter:<\/p><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Solder_Mask_Defined_Pads_SMD\"><\/span>Loddemaskedefinerede puder (SMD)<span class=\"ez-toc-section-end\"><\/span><\/h4><p>Maske\u00e5bningen definerer padst\u00f8rrelsen.<\/p><p>Fordele:<\/p><ul class=\"wp-block-list\"><li>Strammere kontrol med sm\u00e5 komponenter<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Non-Solder_Mask_Defined_Pads_NSMD\"><\/span>Ikke-loddemaskede definerede puder (NSMD)<span class=\"ez-toc-section-end\"><\/span><\/h4><p>Kobberpuden definerer st\u00f8rrelsen, maske\u00e5bningen er st\u00f8rre.<\/p><p>Fordele:<\/p><ul class=\"wp-block-list\"><li>bedre p\u00e5lidelighed af loddefugen<\/li>\n\n<li>bruges ofte til BGA-pads<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"468\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-1.jpg\" alt=\"PCB-loddemaske\" class=\"wp-image-5225\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-1-300x234.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-1-15x12.jpg 15w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_to_Design_PCB_Solder_Mask_Practical_Steps\"><\/span>S\u00e5dan designer du PCB-loddemaske (praktiske trin)<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-how-to wp-block-yoast-how-to-block\"><p class=\"schema-how-to-description\">Ingeni\u00f8rer f\u00f8lger typisk flere trin, n\u00e5r de definerer regler for loddemasker.<\/p> <ol class=\"schema-how-to-steps\"><li class=\"schema-how-to-step\" id=\"how-to-step-1773134083798\"><strong class=\"schema-how-to-step-name\">Trin 1 - Definer regler for maskeudvidelse<\/strong> <p class=\"schema-how-to-step-text\">Indstil den globale maskeudvidelse i PCB-designsoftwaren.<br\/>Typisk omr\u00e5de: 2-4 mil<br\/><\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773134096300\"><strong class=\"schema-how-to-step-name\">Trin 2 - Tjek komponenter med fin pitch<\/strong> <p class=\"schema-how-to-step-text\">Kontroller loddemaskens \u00e5bninger rundt omkring:<br\/>QFN<br\/>BGA<br\/>stik med lille pitch<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773134129021\"><strong class=\"schema-how-to-step-name\">Trin 3 - Bekr\u00e6ft masked\u00e6mningens bredde<\/strong> <p class=\"schema-how-to-step-text\">S\u00f8rg for, at afstanden mellem tilst\u00f8dende puder kan b\u00e6re maskind\u00e6mninger.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773134139200\"><strong class=\"schema-how-to-step-name\">Trin 4 - Udf\u00f8r DFM-tjek<\/strong> <p class=\"schema-how-to-step-text\">Producenter gennemg\u00e5r loddemaskedata for at sikre, at de kan produceres.<br\/>DFM-gennemgangsprocessen er beskrevet i: <strong><a href=\"https:\/\/www.topfastpcb.com\/da\/blog\/pcb-dfm-checklist-before-sending-gerber-files\/\">PCB DFM-tjekliste f\u00f8r afsendelse af Gerber-filer<\/a><\/strong><\/p> <\/li><\/ol><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_PCB_Solder_Mask_Design_Mistakes\"><\/span>Almindelige fejl i design af PCB-loddemasker<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Flere designproblemer dukker ofte op i PCB-layouts.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Mask_openings_are_too_small\"><\/span>Maske\u00e5bningerne er for sm\u00e5<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Kan delvist d\u00e6kke puderne.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Insufficient_solder_mask_dam\"><\/span>Utilstr\u00e6kkelig loddemasked\u00e6mning<span class=\"ez-toc-section-end\"><\/span><\/h3><p>F\u00f8rer til loddebroer.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Incorrect_pad_definitions\"><\/span>Forkerte pad-definitioner<span class=\"ez-toc-section-end\"><\/span><\/h3><p>En uoverensstemmelse mellem masken og kobberpuderne kan for\u00e5rsage monteringsproblemer.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Ignoring_manufacturing_tolerances\"><\/span>Ignorerer produktionstolerancer<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Der skal tages h\u00f8jde for tolerancer for maskejustering.<\/p><p>Mange p\u00e5lidelighedsproblemer under montering stammer fra designproblemer, der er diskuteret i: <strong>Almindelige PCB-fejl og p\u00e5lidelighedsproblemer<\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Considerations\"><\/span>Overvejelser vedr\u00f8rende fremstilling<span class=\"ez-toc-section-end\"><\/span><\/h2><p>PCB-producenter evaluerer loddemaskelag under CAM-analyse.<\/p><p>De gennemg\u00e5r:<\/p><ul class=\"wp-block-list\"><li>maske\u00e5bninger<\/li>\n\n<li>maskeafstand<\/li>\n\n<li>d\u00e6mningsbredder<\/li>\n\n<li>Justeringstolerancer<\/li><\/ul><p>Hos producenter som f.eks. <strong><a href=\"https:\/\/www.topfastpcb.com\/da\/about\/\">TOPFAST<\/a><\/strong>I forbindelse med en ny prototype verificerer ingeni\u00f8rteams typisk loddemaskeparametre f\u00f8r fremstilling for at sikre kompatibilitet med b\u00e5de PCB-fremstilling og monteringsprocesser.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Konklusion<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Loddemaskedesign spiller en afg\u00f8rende rolle for PCB-fremstilling og monteringssikkerhed.<\/p><p>Ved at f\u00f8lge praktiske designregler - s\u00e5som korrekt maskeafstand, tilstr\u00e6kkelig d\u00e6mningsbredde og korrekte paddefinitioner - kan ingeni\u00f8rer reducere monteringsfejl og forbedre produktionsudbyttet.<\/p><p>T\u00e6t koordinering mellem designteams og printkortproducenter hj\u00e6lper ogs\u00e5 med at sikre, at loddemaskelagene lever op til produktionskapaciteten.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"406\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-2.jpg\" alt=\"PCB-loddemaske\" class=\"wp-image-5226\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-2-300x203.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCB_Solder_Mask_FAQ\"><\/span>FAQ om PCB-loddemaske<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1773133323837\"><strong class=\"schema-faq-question\">Q: Hvad er loddemaskeafstand i PCB-design?<\/strong> <p class=\"schema-faq-answer\">A: Loddemaskeafstand er afstanden mellem kobberpudekanten og loddemaske\u00e5bningen, hvilket sikrer, at puderne forbliver synlige under samlingen.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1773133514435\"><strong class=\"schema-faq-question\">Q: Hvad er den mindste bredde p\u00e5 loddemasken?<\/strong> <p class=\"schema-faq-answer\">A: De fleste PCB-producenter anbefaler en minimumsbredde p\u00e5 loddemasken p\u00e5 <strong>4 mil<\/strong> for at forhindre, at masken g\u00e5r i stykker.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1773133582473\"><strong class=\"schema-faq-question\">Q: Hvad sker der, hvis \u00e5bningerne i loddemasken er for sm\u00e5?<\/strong> <p class=\"schema-faq-answer\">A: Sm\u00e5 maske\u00e5bninger kan delvist d\u00e6kke pads, hvilket resulterer i d\u00e5rlige loddesamlinger.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1773133596476\"><strong class=\"schema-faq-question\">Q: Hvad er forskellen p\u00e5 SMD- og NSMD-pads?<\/strong> <p class=\"schema-faq-answer\">A: SMD-pads er defineret af loddemaske\u00e5bninger, mens NSMD-pads er defineret af selve kobberpaden. NSMD-pads bruges ofte til BGA-komponenter.<\/p> <\/div> <\/div><p><\/p>","protected":false},"excerpt":{"rendered":"<p>Loddemasken er et beskyttende lag, der p\u00e5f\u00f8res overfladen af printkort for at forhindre loddebroer og beskytte kobberspor. Korrekt design af loddemasken er afg\u00f8rende for p\u00e5lidelig printkortmontering og produktionsudbytte. Denne artikel forklarer de vigtigste retningslinjer for loddemaskedesign, herunder maskeafstand, maskeudvidelse, pad\u00e5bninger og almindelige layoutfejl. Ved at f\u00f8lge praktiske DFM-regler (Design for Manufacturing) kan ingeni\u00f8rer forbedre monteringssikkerheden, reducere loddefejl og sikre kompatibilitet med standard PCB-fremstillingsprocesser.<\/p>","protected":false},"author":1,"featured_media":5227,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[108],"tags":[446],"class_list":["post-5223","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb-solder-mask"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB Solder Mask Design Guidelines: Clearance, Expansion and Manufacturing Rules<\/title>\n<meta name=\"description\" content=\"Learn PCB solder mask design guidelines including mask clearance, expansion rules, pad openings, and common DFM mistakes to improve PCB manufacturing reliability.\" \/>\n<meta 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What is solder mask clearance in PCB design?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Solder mask clearance is the distance between the copper pad edge and the solder mask opening, ensuring pads remain exposed during assembly.\",\"inLanguage\":\"da-DK\"},\"inLanguage\":\"da-DK\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133514435\",\"position\":2,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133514435\",\"name\":\"Q: What is the minimum solder mask dam width?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Most PCB manufacturers recommend a minimum solder mask dam width of <strong>4 mil<\/strong> to prevent mask breakage.\",\"inLanguage\":\"da-DK\"},\"inLanguage\":\"da-DK\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133582473\",\"position\":3,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133582473\",\"name\":\"Q: What happens if solder mask openings are too small?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Small mask openings may partially cover pads, resulting in poor solder joints.\",\"inLanguage\":\"da-DK\"},\"inLanguage\":\"da-DK\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133596476\",\"position\":4,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133596476\",\"name\":\"Q: What is the difference between SMD and NSMD pads?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: SMD pads are defined by solder mask openings, while NSMD pads are defined by the copper pad itself. NSMD pads are commonly used for BGA components.\",\"inLanguage\":\"da-DK\"},\"inLanguage\":\"da-DK\"},{\"@type\":\"HowTo\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#howto-1\",\"name\":\"PCB Solder Mask Design Guidelines for Reliable Manufacturing\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#article\"},\"description\":\"Engineers typically follow several steps when defining solder mask rules.\",\"step\":[{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#how-to-step-1773134083798\",\"name\":\"Step 1 \u2014 Define mask expansion rules\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Set the global mask expansion in the PCB design software.<br\/>Typical range: 2\u20134 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What is solder mask clearance in PCB design?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Solder mask clearance is the distance between the copper pad edge and the solder mask opening, ensuring pads remain exposed during assembly.","inLanguage":"da-DK"},"inLanguage":"da-DK"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133514435","position":2,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133514435","name":"Q: What is the minimum solder mask dam width?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Most PCB manufacturers recommend a minimum solder mask dam width of <strong>4 mil<\/strong> to prevent mask 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