{"id":2334,"date":"2025-05-05T18:01:35","date_gmt":"2025-05-05T09:31:35","guid":{"rendered":"http:\/\/topfastpcbb.ru\/?p=2334"},"modified":"2025-05-06T14:46:44","modified_gmt":"2025-05-06T06:16:44","slug":"8-layer-pcb-stackup","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/de\/blog\/8-layer-pcb-stackup\/","title":{"rendered":"8-Lagen-Leiterplatten-Stapel"},"content":{"rendered":"<p>Die 8-Lagen-Leiterplattenstruktur umfasst in der Regel eine Signalschicht, eine Stromversorgungsschicht und eine Masseschicht. Die spezifische Anordnung und die Designprinzipien sind wie folgt<\/p><p>Signalschicht: Sie umfasst in der Regel die oberste Schicht (TOP), die unterste Schicht (Bottom) und die Signalschicht in der Mitte (z.B. Signal2, Signal3, etc.). Die Signalschicht wird haupts\u00e4chlich f\u00fcr die Verdrahtung und \u00dcbertragung elektrischer Signale verwendet.<\/p><p>Versorgungsschicht:Sie umfasst in der Regel eine oder mehrere Stromversorgungsschichten (z. B. Power1, Power2 usw.), die zur Bereitstellung einer stabilen Stromversorgung dienen.Die Stromversorgungsschicht grenzt an die Masseschicht, um die Kopplung zwischen der Stromversorgung und der Masse besser zu realisieren und die Impedanz zwischen der Stromversorgungsebene und der Masseschicht zu verringern.<\/p><p>Masseschicht: umfasst eine oder mehrere Masseschichten (z. B. Ground1, Ground2 usw.), die haupts\u00e4chlich dazu dienen, eine stabile Massebezugsebene zu schaffen und elektromagnetische St\u00f6rungen zu verringern.Die Masseebene liegt neben der Stromversorgungsebene, um eine bessere Signalintegrit\u00e4t zu gew\u00e4hrleisten.<\/p><h2><a href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-design-principles\/\">Gestaltungsprinzipien<\/a> und gemeinsame Absprachen<\/h2><p>Die an den Hauptchip angrenzende Schicht ist die Grundplatte: Sie bietet eine stabile Bezugsebene f\u00fcr den Hauptchip und reduziert Interferenzen.<br>Alle Signallagen liegen so weit wie m\u00f6glich neben der Grundplatte: Das sorgt f\u00fcr eine bessere Signalintegrit\u00e4t.<br>Vermeiden Sie so weit wie m\u00f6glich zwei direkt nebeneinander liegende Signalschichten, um Signalst\u00f6rungen zu reduzieren.<br>Die Hauptstromversorgung liegt so nah wie m\u00f6glich an der entsprechenden Grundplatte, um die Impedanz zwischen der Stromversorgungsebene und der Grundplatte zu verringern.<br>Symmetrisches Design der Struktur: Dicke und Art der dielektrischen Schicht, Dicke der Kupferfolie und Art der grafischen Verteilung sollten symmetrisch sein, um die Auswirkungen der Asymmetrie zu minimieren.<br><\/p><h2>Gemeinsame Entwurfsbeispiele und Verwendung von Werkzeugen<\/h2><p>\u00dcblicher Stacked-Layer-Aufbau: z.B. TOP-Gnd-Signal-Power-Gnd-Signal-Gnd-Bottom, etc. Dieses Design kann eine bessere Signalintegrit\u00e4t und elektromagnetische Kompatibilit\u00e4t bieten.<br>Verwendung des DFM-Tools von Huaqiu:Dieses Tool hilft bei der Berechnung der Impedanz, der Auswahl der richtigen Leitungsbreite und des richtigen Abstands und gew\u00e4hrleistet die Genauigkeit des Entwurfs.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"591\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1.jpg\" alt=\"\" class=\"wp-image-2363\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1-300x296.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1-100x100.jpg 100w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhalts\u00fcbersicht<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/8-layer-pcb-stackup\/#8-Layer_PCB_Stackup_Design_Analysis\" >8-Layer PCB Stackup Design Analyse<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/8-layer-pcb-stackup\/#Option_1_Six_Signal_Layer_Design_Not_Recommended\" >Option 1: Sechs-Signal-Layer-Design (nicht empfohlen)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/8-layer-pcb-stackup\/#Option_2_Four_Signal_Layer_Design_Recommended\" >Option 2: Vier-Signal-Layer-Design (empfohlen)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/8-layer-pcb-stackup\/#Option_3_Optimal_Four_Signal_Layer_Design_Highly_Recommended\" >Option 3: Optimales Design mit vier Signalschichten (dringend empfohlen)<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"8-Layer_PCB_Stackup_Design_Analysis\"><\/span>8-Layer PCB Stackup Design Analyse<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_1_Six_Signal_Layer_Design_Not_Recommended\"><\/span>Option 1: Sechs-Signal-Layer-Design (nicht empfohlen)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Struktur Merkmale<\/strong>:<\/p><ol class=\"wp-block-list\"><li><strong>Oberste Schicht<\/strong>: Signal 1 (Komponentenseite\/Mikrostreifen-F\u00fchrungsschicht)<\/li>\n\n<li><strong>Innere Schicht<\/strong>: Signal 2 (Mikrostrip in X-Richtung, Premium-Routing-Layer)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Masse (Massefl\u00e4che)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Signal 3 (Streifenleitung in Y-Richtung, Premium-F\u00fchrungsschicht)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Signal 4 (Stripline-F\u00fchrungsschicht)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Leistung (Leistungsebene)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Signal 5 (Microstrip Routing Layer)<\/li>\n\n<li><strong>Unterste Schicht<\/strong>: Signal 6 (Microstrip Routing Layer)<\/li><\/ol><p><strong>Nachteilige Analyse<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Schlechte elektromagnetische Absorption<\/li>\n\n<li>Hohe Leistungsimpedanz<\/li>\n\n<li>Unvollst\u00e4ndige Signalr\u00fcckleitungen<\/li>\n\n<li>Geringere EMI-Leistung<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_2_Four_Signal_Layer_Design_Recommended\"><\/span>Option 2: Vier-Signal-Layer-Design (empfohlen)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Verbesserte Merkmale<\/strong>:<\/p><ol class=\"wp-block-list\"><li><strong>Oberste Schicht<\/strong>: Signal 1 (Komponentenseite\/Microstrip, Premium-Routing-Ebene)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Masse (Massefl\u00e4che mit niedriger Impedanz, hervorragende EM-Absorption)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Signal 2 (Stripline, Premium-F\u00fchrungsschicht)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Leistung (Die Leistungsebene bildet eine kapazitive Kopplung mit der angrenzenden Masse)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Masse (Massefl\u00e4che)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Signal 3 (Stripline, Premium-F\u00fchrungsschicht)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Leistung (Leistungsebene)<\/li>\n\n<li><strong>Unterste Schicht<\/strong>Signal 4 (Microstrip, Premium-Routing-Layer)<\/li><\/ol><p><strong>Vorteile<\/strong>:<br>\u2713 Dedizierte Referenzebene f\u00fcr jede Signalebene<br>\u2713 Pr\u00e4zise Impedanzkontrolle (\u00b110%)<br>\u2713 Reduziertes \u00dcbersprechen (orthogonales Routing zwischen benachbarten Schichten)<br>\u2713 40%ige Verbesserung der Leistungsintegrit\u00e4t<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_3_Optimal_Four_Signal_Layer_Design_Highly_Recommended\"><\/span>Option 3: Optimales Design mit vier Signalschichten (dringend empfohlen)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Struktur der Goldenen Regel<\/strong>:<\/p><ol class=\"wp-block-list\"><li><strong>Oberste Schicht<\/strong>: Signal 1 (Komponentenseite\/Mikrostreifen)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Masse (Massive Massefl\u00e4che)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Signal 2 (Stripline)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Leistung (Leistungsebene)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Masse (Kerngrundplatte)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Signal 3 (Stripline)<\/li>\n\n<li><strong>Innere Schicht<\/strong>Masse (Abschirmungsebene)<\/li>\n\n<li><strong>Unterste Schicht<\/strong>Signal 4 (Microstrip)<\/li><\/ol><p><strong>Herausragende Leistung<\/strong>:<br>\u2605 F\u00fcnf Massefl\u00e4chen bieten perfekte EM-Abschirmung<br>\u2605 &lt;3mil Abstand zwischen Leistung und Masse f\u00fcr optimale Entkopplung<br>\u2605 Symmetrische Schichtverteilung verhindert Verzug<br>\u2605 Unterst\u00fctzt 20Gbps Hochgeschwindigkeits-Signalisierung<\/p><p><strong>Design-Empfehlungen<\/strong>:<\/p><ol class=\"wp-block-list\"><li>F\u00fchren Sie kritische Signale zuerst auf S2\/S3-Streifenleiterschichten<\/li>\n\n<li>Implementierung eines Split-Power-Plane-Designs<\/li>\n\n<li>Begrenzung der Leiterbahnen der oberen\/unteren Schicht auf &lt;5mm L\u00e4nge<\/li>\n\n<li>Beibehaltung des orthogonalen Routings zwischen benachbarten Signalschichten<\/li><\/ol><h2><strong>Referenz f\u00fcr die Stapeldicke<\/strong><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Ebene<\/th><th>Material<\/th><th>Dicke(mil)<\/th><\/tr><\/thead><tbody><tr><td>1-2<\/td><td>FR4<\/td><td>3.2<\/td><\/tr><tr><td>2-3<\/td><td>1080PP<\/td><td>4.5<\/td><\/tr><tr><td>4-5<\/td><td>Kern<\/td><td>8.0<\/td><\/tr><tr><td>6-7<\/td><td>2116PP<\/td><td>5.2<\/td><\/tr><tr><td>7-8<\/td><td>FR4<\/td><td>3.2<\/td><\/tr><\/tbody><\/table><\/figure><p>Hinweis: Alle Entw\u00fcrfe sollten blinde\/vergrabene Durchkontaktierungen enthalten, um den Platz f\u00fcr die Entflechtung optimal zu nutzen.<\/p>","protected":false},"excerpt":{"rendered":"<p>Ein 8-lagiger Leiterplattenstapel besteht in der Regel aus Signal-, Stromversorgungs- und Masselagen.<\/p>","protected":false},"author":1,"featured_media":2364,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[216,215],"class_list":["post-2334","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-8-layer-pcb","tag-8-layer-pcb-stackup"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>8-Layer PCB Stackup - Topfastpcb<\/title>\n<meta name=\"description\" content=\"An 8-layer PCB stack typically consists of signal, power, and ground layers.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/8-layer-pcb-stackup\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" 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