{"id":2757,"date":"2025-05-22T08:34:00","date_gmt":"2025-05-22T00:34:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=2757"},"modified":"2025-05-21T16:28:45","modified_gmt":"2025-05-21T08:28:45","slug":"high-frequency-pcb-design-and-layout-guide","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/","title":{"rendered":"Leitfaden f\u00fcr Design und Layout von Hochfrequenz-Leiterplatten"},"content":{"rendered":"<p>Hochfrequenz-Leiterplatte bezieht sich auf die elektromagnetische Frequenz der h\u00f6heren speziellen Leiterplatten f\u00fcr Hochfrequenz (Frequenz gr\u00f6\u00dfer als 300MHZ oder Wellenl\u00e4nge von weniger als 1 Meter) und Mikrowelle (Frequenz gr\u00f6\u00dfer als 3GHZ oder Wellenl\u00e4nge von weniger als 0,1 Meter) im Bereich der PCB, ist in der Mikrowelle Substrat kupferkaschierten Laminatplatten auf die Verwendung von gew\u00f6hnlichen starren Leiterplatten hergestellt mit einigen der Prozesse oder die Verwendung von speziellen Behandlungsmethoden und die Produktion von Leiterplatten.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/High-Frequency-PCB-1.jpg\" alt=\"Hochfrequenz-Leiterplatte\" class=\"wp-image-2758\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/High-Frequency-PCB-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/High-Frequency-PCB-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/High-Frequency-PCB-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhalts\u00fcbersicht<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#High-frequency_PCB_layout_and_wiring_design_specifications\" >Spezifikationen f\u00fcr Hochfrequenz-Leiterplattenlayout und Verdrahtungsdesign<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#1Isolation_and_grounding_principles\" >1. die Grunds\u00e4tze der Isolierung und Erdung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#2Wiring_Priority_Order\" >2.Verdrahtung Priorit\u00e4tenfolge<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#3Surface_treatment_specification\" >3) Spezifikation der Oberfl\u00e4chenbehandlung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#4Cross_wiring_specification\" >4. die Spezifikation der Querverdrahtung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#5Mixed_Signal_Processing\" >5. gemischte Signalverarbeitung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#6Alignment_Integrity_Requirements\" >6. die Anforderungen an die Ausrichtungsintegrit\u00e4t<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#7Vias_Handling_Specifications\" >7.Vias Handhabung Spezifikationen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#8Baseband_interface_wiring\" >8. die Verdrahtung der Basisband-Schnittstelle<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#9Control_line_wiring\" >9. die Verdrahtung der Steuerleitung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#10Interference_protection\" >10. der Schutz vor Interferenzen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#11Clock_wiring\" >11. Verdrahtung der Uhr<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#12VCO_wiring\" >12.VCO-Verkabelung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#13Multilayer_design\" >13. mehrschichtiger Aufbau<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#14Grounding_System\" >14. erdungsanlage<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#High-speed_high-frequency_PCB_key_performance_parameters_technical_specifications\" >Technische Spezifikationen f\u00fcr Hochgeschwindigkeits-Hochfrequenz-Leiterplatten mit den wichtigsten Leistungsparametern<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#1Dielectric_Characteristic_Parameters\" >1. dielektrische Kenngr\u00f6\u00dfen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#2Thermo-mechanical_properties\" >2. thermomechanische Eigenschaften<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#3Environmental_stability\" >3. \u00f6kologische Stabilit\u00e4t<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#4Electrical_Performance\" >4. elektrische Leistung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#5Mechanical_Reliability\" >5. mechanische Verl\u00e4sslichkeit<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#6Special_Performance_Requirements\" >6. besondere Leistungsanforderungen<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#High-Frequency_PCB_Material_DkDf_Testing_Technical_White_Paper\" >Hochfrequenz PCB Material Dk\/Df Testing Technisches Wei\u00dfbuch<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-24\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#1_Classification_and_Selection_Principles_of_Testing_Methods\" >1. Klassifizierung und Auswahlprinzipien von Pr\u00fcfmethoden<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-25\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#11_Testing_Method_System\" >1.1 Pr\u00fcfverfahren System<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-26\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#12_Method_Selection_Matrix\" >1.2 Matrix f\u00fcr die Methodenauswahl<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-27\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#2_Detailed_Explanation_of_Core_Testing_Techniques\" >2. Detaillierte Erl\u00e4uterung der wichtigsten Pr\u00fcftechniken<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-28\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#21_X-Band_Clamped_Stripline_Resonator_Method_IPC-TM-650_25550\" >2.1 X-Band-geklemmte Streifenleitungsresonator-Methode (IPC-TM-650 2.5.5.50)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-29\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#22_Split_Cylinder_Resonator_Method_IPC-TM-650_25513\" >2.2 Verfahren mit geteiltem Zylinderresonator (IPC-TM-650 2.5.5.13)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-30\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#23_Microstrip_Ring_Resonator_Method\" >2.3 Microstrip-Ringresonator-Methode<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-31\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#3_Test_Error_Analysis_and_Compensation\" >3. Testfehleranalyse und -kompensation<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-32\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#31_Major_Error_Sources\" >3.1 Wichtige Fehlerquellen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-33\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#32_Data_Correction_Methods\" >3.2 Methoden zur Datenkorrektur<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-34\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#4_Engineering_Application_Guidelines\" >4. Technische Anwendungsrichtlinien<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-35\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#41_Testing_Plan_Development_Process\" >4.1 Prozess der Pr\u00fcfplanentwicklung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-36\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#42_Data_Comparison_Standards\" >4.2 Standards f\u00fcr den Datenvergleich<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-37\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#5_Evolution_of_Testing_Standards\" >5. Entwicklung der Pr\u00fcfnormen<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-38\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#51_Emerging_Testing_Technologies\" >5.1 Aufkommende Testtechnologien<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-39\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/#52_Standardization_Trends\" >5.2 Trends in der Normung<\/a><\/li><\/ul><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High-frequency_PCB_layout_and_wiring_design_specifications\"><\/span><a href=\"https:\/\/www.topfastpcb.com\/de\/products\/high-frequency-pcb-board\/\">Hochfrequenz-Leiterplatte<\/a> Spezifikationen f\u00fcr das Layout und die Verkabelung<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1Isolation_and_grounding_principles\"><\/span>1. die Grunds\u00e4tze der Isolierung und Erdung<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Streng getrennte digitale und analoge Schaltungsbereiche<\/li>\n\n<li>Stellen Sie sicher, dass alle HF-Ausrichtungen einen vollst\u00e4ndigen Bezug zur Grundplatte haben.<\/li>\n\n<li>Priorisieren Sie die Ausrichtung der Oberfl\u00e4chenschicht f\u00fcr die RF-Signal\u00fcbertragung<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2Wiring_Priority_Order\"><\/span>2.Verdrahtung Priorit\u00e4tenfolge<span class=\"ez-toc-section-end\"><\/span><\/h3><p>HF-Leitungen \u2192 Basisband-HF-Schnittstellenleitungen (IQ-Leitungen) \u2192 Taktsignalleitungen \u2192 Stromversorgungsleitungen \u2192 digitale Basisbandschaltungen \u2192 Erdungsnetz<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3Surface_treatment_specification\"><\/span>3) Spezifikation der Oberfl\u00e4chenbehandlung<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Hochfrequenz-Singleboard (&gt;1GHz) wird empfohlen, um die gr\u00fcne \u00d6labdeckung im Bereich der Mikrostreifenleitung zu beseitigen.<\/li>\n\n<li>Nieder- und mittelfrequente Einplatinen-Mikrostreifenleitungen werden empfohlen, um die gr\u00fcne \u00d6lschutzschicht zu erhalten.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4Cross_wiring_specification\"><\/span>4. die Spezifikation der Querverdrahtung<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Strenges Verbot der Kreuzverdrahtung von digitalen und analogen Signalen.<\/li>\n\n<li>HF-Leitungen und Signalleitungen m\u00fcssen beim Kreuzen beachtet werden:<br>a) Bevorzugte Option: Hinzuf\u00fcgen einer isolierten Grundplatte<br>b) Zweite Wahl: Beibehaltung der orthogonalen 90\u00b0-Kreuzungen.<\/li>\n\n<li>Anforderungen an parallele RF-Leitungsabst\u00e4nde:<br>a) Normale Verdrahtung: 3W-Abstand einhalten.<br>b) Wenn Parallelit\u00e4t erforderlich ist, f\u00fcgen Sie eine gut geerdete, isolierte Grundplatte in der Mitte ein.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5Mixed_Signal_Processing\"><\/span>5. gemischte Signalverarbeitung<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Duplexer\/Mischer und andere Multisignalger\u00e4te sind erforderlich:<br>a) RF\/IF-Signale werden orthogonal weitergeleitet.<br>b) Isolierte Erdungsbarriere zwischen Signalen<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"6Alignment_Integrity_Requirements\"><\/span>6. die Anforderungen an die Ausrichtungsintegrit\u00e4t<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>\u00dcberh\u00e4ngende Enden der HF-Ausrichtung sind streng verboten.<\/li>\n\n<li>Beibehaltung der Konsistenz der charakteristischen Impedanz der \u00dcbertragungsleitung<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"7Vias_Handling_Specifications\"><\/span>7.Vias Handhabung Spezifikationen<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Vermeiden Sie den Wechsel von Schichten der HF-Ausrichtung so weit wie m\u00f6glich.<\/li>\n\n<li>Wenn ein Ebenenwechsel erforderlich ist:<br>a) Verwenden Sie die kleinste Lochgr\u00f6\u00dfe (empfohlen 0,2 mm)<br>b) Begrenzung der Anzahl der Durchkontaktierungen (\u2264 2 pro Zeile)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"8Baseband_interface_wiring\"><\/span>8. die Verdrahtung der Basisband-Schnittstelle<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>IQ-Linienbreite \u2265 10 mil<\/li>\n\n<li>Strenge Gleichl\u00e4ngenanpassung (\u0394L \u2264 5 mil)<\/li>\n\n<li>Einheitliche Abst\u00e4nde einhalten (\u00b110% Toleranz)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"9Control_line_wiring\"><\/span>9. die Verdrahtung der Steuerleitung<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Streckenl\u00e4nge optimiert f\u00fcr Abschlussimpedanz<\/li>\n\n<li>Minimierung der N\u00e4he zum RF-Pfad<\/li>\n\n<li>Verbot der Platzierung von Erdungsl\u00f6chern neben Steuerdr\u00e4hten<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"10Interference_protection\"><\/span>10. der Schutz vor Interferenzen<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>3H Abstand zwischen Digital-\/Stromversorgungsanordnungen und HF-Schaltungen (H ist die Dicke des Dielektrikums)<\/li>\n\n<li>Getrennter Abschirmungsbereich f\u00fcr Taktschaltungen<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"11Clock_wiring\"><\/span>11. Verdrahtung der Uhr<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Taktverdrahtung \u2265 10 mils<\/li>\n\n<li>Doppelseitig geerdete Abschirmung<\/li>\n\n<li>Banddrahtstruktur wird bevorzugt<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"12VCO_wiring\"><\/span>12.VCO-Verkabelung<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Steuerleitungen \u22652mm von RF-Leitungen<\/li>\n\n<li>Erforderlichenfalls ist eine vollst\u00e4ndige Behandlung des Bodens durchzuf\u00fchren.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"13Multilayer_design\"><\/span>13. mehrschichtiger Aufbau<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Bevorzugen Sie ein schicht\u00fcbergreifendes Isolationsschema<\/li>\n\n<li>Die zweite Wahl der orthogonalen Crossover-L\u00f6sung<\/li>\n\n<li>Grenzparallele L\u00e4nge (\u2264\u03bb\/10)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"14Grounding_System\"><\/span>14. erdungsanlage<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Vollst\u00e4ndigkeit der Grundfl\u00e4che jeder Schicht &gt;80<\/li>\n\n<li>Abstand der Erdungsl\u00f6cher &lt;\u03bb\/20<\/li>\n\n<li>Mehrpunkt-Erdung in kritischen Bereichen<\/li><\/ul><p>Hinweis: Alle Ma\u00dfangaben sollten entsprechend der Wellenl\u00e4nge (\u03bb) der tats\u00e4chlichen Betriebsfrequenz angepasst werden, und es wird empfohlen, eine dreidimensionale elektromagnetische Feldsimulation durchzuf\u00fchren, um den endg\u00fcltigen Entwurf zu \u00fcberpr\u00fcfen.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/High-Frequency-PCB-3.jpg\" alt=\"Hochfrequenz-Leiterplatte\" class=\"wp-image-2759\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/High-Frequency-PCB-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/High-Frequency-PCB-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/High-Frequency-PCB-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High-speed_high-frequency_PCB_key_performance_parameters_technical_specifications\"><\/span>Technische Spezifikationen f\u00fcr Hochgeschwindigkeits-Hochfrequenz-Leiterplatten mit den wichtigsten Leistungsparametern<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1Dielectric_Characteristic_Parameters\"><\/span>1. dielektrische Kenngr\u00f6\u00dfen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>1.1 Dielektrizit\u00e4tskonstante (Dk)<\/p><ul class=\"wp-block-list\"><li>Typische Anforderung: 2,2-3,8 (@1GHz)<\/li>\n\n<li>Schl\u00fcsselindikator:<\/li>\n\n<li>Numerische Stabilit\u00e4t (\u00b10,05 Toleranz)<\/li>\n\n<li>Frequenzabh\u00e4ngigkeit (&lt;5% Abweichung von 1-40 GHz)<\/li>\n\n<li>Isotropie (X\/Y\/Z-Achsenvariation &lt;2%)<\/li><\/ul><p>1.2 Dielektrischer Verlust (Df)<\/p><ul class=\"wp-block-list\"><li>Standardbereich: 0,001-0,005 (@10GHz)<\/li>\n\n<li>Kernanforderungen:<\/li>\n\n<li>Geringe Verluste (Df &lt;0,003 bevorzugt)<\/li>\n\n<li>Temperaturstabilit\u00e4t (-55\u2103~125\u2103 Abweichung &lt;15%)<\/li>\n\n<li>Auswirkungen der Oberfl\u00e4chenrauheit (Ra &lt;1\u03bcm)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2Thermo-mechanical_properties\"><\/span>2. thermomechanische Eigenschaften<span class=\"ez-toc-section-end\"><\/span><\/h3><p>2.1 W\u00e4rmeausdehnungskoeffizient (WAK)<\/p><ul class=\"wp-block-list\"><li>Anforderungen an die Kupferfolie:<\/li>\n\n<li>X\/Y-Achse CTE: 12-16ppm\/\u00b0C<\/li>\n\n<li>Z-Achse CTE: 25- 50 ppm\/\u00b0C<\/li>\n\n<li>Zuverl\u00e4ssigkeitsstandard:<\/li>\n\n<li>300 W\u00e4rmezyklen (-55\u2103~125\u2103) ohne Delamination<\/li><\/ul><p>2.2 Index der Hitzebest\u00e4ndigkeit<\/p><ul class=\"wp-block-list\"><li>Tg-Punkt: \u2265170\u2103 (vorzugsweise 180-220\u2103)<\/li>\n\n<li>Td-Punkt: \u2265300\u2103 (Temperatur mit 5% Gewichtsverlust)<\/li>\n\n<li>Delaminierungszeit: &gt;60min (288\u2103 L\u00f6ttest)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3Environmental_stability\"><\/span>3. \u00f6kologische Stabilit\u00e4t<span class=\"ez-toc-section-end\"><\/span><\/h3><p>3.1 Eigenschaften der Feuchtigkeitsaufnahme<\/p><ul class=\"wp-block-list\"><li>Ges\u00e4ttigte Wasseraufnahme: &lt;0,2% (24h Eintauchen)<\/li>\n\n<li>Drift der dielektrischen Parameter:<\/li>\n\n<li>Dk \u00e4ndern &lt;2%<\/li>\n\n<li>Df \u00e4ndern &lt;10%<\/li><\/ul><p>3.2 Chemische Best\u00e4ndigkeit<\/p><ul class=\"wp-block-list\"><li>Best\u00e4ndigkeit gegen S\u00e4uren und Laugen:5%ige L\u00f6sungskonzentration, 24 Stunden ohne Korrosion<\/li>\n\n<li>L\u00f6semittelbest\u00e4ndigkeit: Bestandener IPC-TM-650 2.3.30 Test.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4Electrical_Performance\"><\/span>4. elektrische Leistung<span class=\"ez-toc-section-end\"><\/span><\/h3><p>4.1 Impedanzkontrolle<\/p><ul class=\"wp-block-list\"><li>Einseitig gesicherte Leitung: 50\u03a9\u00b110%.<\/li>\n\n<li>Differentiale Paare: 100\u03a9\u00b17%<\/li>\n\n<li>Wichtige Kontrollpunkte:<\/li>\n\n<li>Toleranz der Linienbreite \u00b15%<\/li>\n\n<li>Toleranz der dielektrischen Dicke \u00b18%<\/li>\n\n<li>Kupferdicke Toleranz \u00b110<\/li><\/ul><p>4.2 Signalintegrit\u00e4t<\/p><ul class=\"wp-block-list\"><li>Einf\u00fcgungsd\u00e4mpfung: &lt;0,5dB\/Zoll@10GHz<\/li>\n\n<li>R\u00fcckflussd\u00e4mpfung: &gt;20dB@Operating Band<\/li>\n\n<li>Nebensprechunterdr\u00fcckung: &lt;-50dB@1mm Abstand<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5Mechanical_Reliability\"><\/span>5. mechanische Verl\u00e4sslichkeit<span class=\"ez-toc-section-end\"><\/span><\/h3><p>5.1 Sch\u00e4lfestigkeit<\/p><ul class=\"wp-block-list\"><li>Anfangswert: &gt;1,0N\/mm<\/li>\n\n<li>Nach thermischer Alterung: \uff1e0,8N\/mm (125\u2103\/1000h)<\/li><\/ul><p>5.2 Schlagfestigkeit<\/p><ul class=\"wp-block-list\"><li>CAF-Best\u00e4ndigkeit: &gt;1000h (85\u2103\/85%RH\/50V)<\/li>\n\n<li>Mechanischer Schock: Besteht 30G\/0,5ms Test<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"6Special_Performance_Requirements\"><\/span>6. besondere Leistungsanforderungen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>6.1 Hochfrequenzstabilit\u00e4t<\/p><ul class=\"wp-block-list\"><li>Phasenkonsistenz: \u00b11\u00b0@10GHz\/100mm<\/li>\n\n<li>Gruppenverz\u00f6gerung: &lt;5ps\/cm@40GHz<\/li><\/ul><p>6.2 Oberfl\u00e4chenbehandlung<\/p><ul class=\"wp-block-list\"><li>Rauhigkeit der Kupferfolie:Rz\uff1c3\u03bcm<\/li>\n\n<li>Effekt der L\u00f6tstoppmaske: Dk-Abweichung &lt;1%<\/li><\/ul><p>Anmerkungen:<\/p><ol class=\"wp-block-list\"><li>Alle Parameter sollten gem\u00e4\u00df den IPC-TM-650 Standardmethoden gepr\u00fcft werden.<\/li>\n\n<li>F\u00fcr die wichtigsten Parameter wird die Entnahme von Stichproben empfohlen.<\/li>\n\n<li>Bei Hochfrequenzanwendungen sollte Dk\/Df mit einer Frequenz\u00e4nderungskurve versehen sein.<\/li>\n\n<li>Multilayer-Platten sollten auf die Konsistenz der Z-Achsen-Parameter gepr\u00fcft werden.<\/li><\/ol><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High-Frequency_PCB_Material_DkDf_Testing_Technical_White_Paper\"><\/span>Hochfrequenz PCB Material Dk\/Df Testing Technisches Wei\u00dfbuch<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Classification_and_Selection_Principles_of_Testing_Methods\"><\/span>1. Klassifizierung und Auswahlprinzipien von Pr\u00fcfmethoden<span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"11_Testing_Method_System\"><\/span>1.1 Pr\u00fcfverfahren System<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>IPC-Standardmethoden<\/strong>: 12 standardisierte Pr\u00fcfprotokolle<\/li>\n\n<li><strong>Branchen\u00fcbliche Methoden<\/strong>: Propriet\u00e4re L\u00f6sungen von Forschungseinrichtungen und Herstellern<\/li>\n\n<li><strong>Praktische Auswahlkriterien<\/strong>:<br>- Frequenzanpassung (\u00b120% des Betriebsbandes)<br>- Konsistenz der elektrischen Feldrichtung (Z-Achse\/XY-Ebene)<br>- Korrelation mit den Herstellungsprozessen (Rohmaterial\/fertige Platte)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"12_Method_Selection_Matrix\"><\/span>1.2 Matrix f\u00fcr die Methodenauswahl<span class=\"ez-toc-section-end\"><\/span><\/h4><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Anforderung an die Pr\u00fcfung<\/th><th>Empfohlene Methode<\/th><th>Anwendungsszenario<\/th><\/tr><\/thead><tbody><tr><td>Bewertung von Rohstoffen<\/td><td>Vorrichtungsbasierte Methode<\/td><td>Eingehende Kontrolle<\/td><\/tr><tr><td>Validierung der fertigen Platte<\/td><td>Pr\u00fcfverfahren f\u00fcr Schaltkreise<\/td><td>\u00dcberpr\u00fcfung des Designs<\/td><\/tr><tr><td>Anisotropie-Analyse<\/td><td>Kombinierter Pr\u00fcfansatz<\/td><td>Hochfrequenz-Materialforschung<\/td><\/tr><\/tbody><\/table><\/figure><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Detailed_Explanation_of_Core_Testing_Techniques\"><\/span>2. Detaillierte Erl\u00e4uterung der wichtigsten Pr\u00fcftechniken<span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"21_X-Band_Clamped_Stripline_Resonator_Method_IPC-TM-650_25550\"><\/span>2.1 X-Band-geklemmte Streifenleitungsresonator-Methode (IPC-TM-650 2.5.5.50)<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Test Struktur<\/strong>:<br>\u250c\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2510<br>\u2502 Erdungsebene \u2502<br>\u251c\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2524<br>\u2502 Pr\u00fcfling (Z-Achse) \u2502<br>\u251c\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2524<br>\u2502 Resonator-Schaltung\u2502<br>\u251c\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2524<br>\u2502 Pr\u00fcfling (Z-Achse) \u2502<br>\u251c\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2524<br>\u2502 Erdungsebene \u2502<br>\u2514\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2500\u2518<\/li>\n\n<li><strong>Technische Merkmale<\/strong>:<br>- Frequenzbereich: 2,5-12,5 GHz (in Schritten von 2,5 GHz)<br>- Genauigkeit: \u00b10,02 (Dk), \u00b10,0005 (Df)<br>- Fehlerquellen:Luftspalte der Halterung (~1-3% Abweichung)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"22_Split_Cylinder_Resonator_Method_IPC-TM-650_25513\"><\/span>2.2 Verfahren mit geteiltem Zylinderresonator (IPC-TM-650 2.5.5.13)<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Wichtige Parameter<\/strong>:<br>- Pr\u00fcfrichtung:Eigenschaften in der XY-Ebene<br>- Resonanzspitzen:3-5 charakteristische Frequenzpunkte<br>- Anisotropie-Analyse: Kann mit Daten der Z-Achse verglichen werden<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"23_Microstrip_Ring_Resonator_Method\"><\/span>2.3 Microstrip-Ringresonator-Methode<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Schaltungsanforderungen<\/strong>:<br>- Impedanz der Zuleitung: 50\u03a9 \u00b11%<br>- Ringspalt: 0,1-0,15 mm (erfordert Lithografiekontrolle)<br>- Toleranz der Kupferdicke: \u00b15 \u03bcm Ausgleich erforderlich<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Test_Error_Analysis_and_Compensation\"><\/span>3. Testfehleranalyse und -kompensation<span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"31_Major_Error_Sources\"><\/span>3.1 Wichtige Fehlerquellen<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Material Dispersion<\/strong>: Frequenzabh\u00e4ngiger Dk (typisch: -0,5%\/GHz)<\/li>\n\n<li><strong>Kupferrauhigkeit Auswirkungen<\/strong>: Rauhigkeitsstufe Dk Abweichung Rz &lt; 1 \u03bcm &lt;1% Rz = 3 \u03bcm 3-5% Rz &gt; 5 \u03bcm &gt;8%<\/li>\n\n<li><strong>Prozess-Variationen<\/strong>:<br>- Dicke des plattierten Kupfers (0,3% Fehler pro 10 \u03bcm Abweichung)<br>- Einfluss der L\u00f6tmaske (0,5-1,2 % Abweichung aufgrund der Gr\u00fcn\u00f6labdeckung)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"32_Data_Correction_Methods\"><\/span>3.2 Methoden zur Datenkorrektur<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Algorithmus zur Frequenzkompensation<\/strong>:<br><em>Dk<\/em>(<em>f<\/em>)=<em>Dk<\/em>o\u22c5(1-<em>\u03b1<\/em>\u22c5log(<em>f<\/em>\/<em>f<\/em>o))<\/li>\n\n<li><strong>Korrektur der Oberfl\u00e4chenrauhigkeit<\/strong>: Hammerstad-Jensen-Modell<\/li>\n\n<li><strong>Anisotroper Materialtransport<\/strong>: Methode der Tensoranalyse<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Engineering_Application_Guidelines\"><\/span>4. Technische Anwendungsrichtlinien<span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"41_Testing_Plan_Development_Process\"><\/span>4.1 Prozess der Pr\u00fcfplanentwicklung<span class=\"ez-toc-section-end\"><\/span><\/h4><ol class=\"wp-block-list\"><li>Bestimmen Sie das Betriebsfrequenzband (Mittenfrequenz \u00b130%)<\/li>\n\n<li>Analyse der prim\u00e4ren elektrischen Feldrichtung (Microstrip\/Stripline)<\/li>\n\n<li>Bewerten Sie das Fenster des Herstellungsprozesses (Kupferdicke\/Linienbreitentoleranz)<\/li>\n\n<li>W\u00e4hlen Sie eine Pr\u00fcfmethode mit &gt;80% \u00dcbereinstimmungsgenauigkeit<\/li><\/ol><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"42_Data_Comparison_Standards\"><\/span>4.2 Standards f\u00fcr den Datenvergleich<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>G\u00fcltige Vergleichsbedingungen<\/strong>:<br>- Gleiche Pr\u00fcfrichtung (Z-Achse oder XY-Ebene)<br>- Frequenzabweichung &lt; \u00b15%<br>- Konstante Temperaturbedingungen (23\u00b12\u00b0C)<\/li>\n\n<li><strong>Typische Variationen der Materialparameter<\/strong>: Pr\u00fcfmethode Dk-Abweichung Df-Abweichung Halterung vs. Schaltung 2-8% 15-30% Z-Achse vs. XY-Ebene 1-15% 5-20%<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Evolution_of_Testing_Standards\"><\/span>5. Entwicklung der Pr\u00fcfnormen<span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"51_Emerging_Testing_Technologies\"><\/span>5.1 Aufkommende Testtechnologien<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>Terahertz-Zeitbereichsspektroskopie (0,1-4 THz)<\/li>\n\n<li>Nahfeld-Rastermikrowellenmikroskopie (10-100 GHz)<\/li>\n\n<li>AI-gest\u00fctzte Systeme zur Parameterextraktion<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"52_Standardization_Trends\"><\/span>5.2 Trends in der Normung<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>Pr\u00fcfverfahren f\u00fcr mehrlagige Leiterplatten (IPC-2023 Entwurf)<\/li>\n\n<li>5G mmWave-spezifische Testprotokolle (28\/39 GHz)<\/li>\n\n<li>Normen f\u00fcr dynamische Temperaturwechselpr\u00fcfungen<\/li><\/ul><p><strong>Hinweis<\/strong>: Alle Tests sollten in einer kontrollierten Umgebung durchgef\u00fchrt werden (23\u00b11\u00b0C, 50\u00b15% RH). Automatisierte Pr\u00fcfsysteme mit Integration <strong>Vektor-Netzwerk-Analysatoren (VNA)<\/strong> und Sondenstationen werden empfohlen. Die Pr\u00fcfdaten m\u00fcssen Folgendes umfassen <strong>3\u03c3 statistische Analyse<\/strong>.<\/p>","protected":false},"excerpt":{"rendered":"<p>Erfahren Sie, wie Sie die Impedanzkontrolle optimieren, Signalverluste minimieren und den richtigen Testansatz f\u00fcr 5G-, RF- und Hochgeschwindigkeitsdesigns w\u00e4hlen.<\/p>","protected":false},"author":1,"featured_media":2760,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[248,249,111],"class_list":["post-2757","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-high-frequency-pcb","tag-high-frequency-pcb-design","tag-pcb"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>High Frequency PCB Design and Layout Guide - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Learn how to optimize impedance control, minimize signal loss, and select the right testing approach for 5G, RF, and high-speed designs.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-frequency-pcb-design-and-layout-guide\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"High Frequency PCB Design and Layout Guide - 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