{"id":3647,"date":"2025-07-17T18:29:10","date_gmt":"2025-07-17T10:29:10","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=3647"},"modified":"2025-07-17T18:31:42","modified_gmt":"2025-07-17T10:31:42","slug":"what-is-the-most-important-aspect-of-pcb-design","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/","title":{"rendered":"Was ist der wichtigste Aspekt beim PCB-Design?"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhalts\u00fcbersicht<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-1'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#Key_Points_of_PCB_Design\" >Kernpunkte des PCB-Designs<\/a><ul class='ez-toc-list-level-2' ><li class='ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#1_PCB_Layout_Planning\" >1. PCB Layout Planung<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#11_Functional_Partitioning_and_Isolation_Design\" >1.1 Funktionale Partitionierung und Isolationsdesign<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#12_Mechanical_and_Thermal_Design_Standards\" >1.2 Mechanische und thermische Auslegungsstandards<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#2_High-Speed_PCB_Routing_Strategies\" >2. Hochgeschwindigkeits-PCB-Routing-Strategien<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#21_Fundamental_Routing_Principles\" >2.1 Grundlegende Routing-Prinzipien<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#22_Special_Signal_Handling\" >2.2 Spezielle Signalverarbeitung<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#3_Power_Integrity_Design\" >3. Entwurf der Leistungsintegrit\u00e4t<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#31_Multilayer_Board_Power_Architecture\" >3.1 Leistungsarchitektur der Mehrschichtplatine<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#32_Voltage_Conversion_Design\" >3.2 Auslegung der Spannungsumwandlung<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#4_Advanced_Signal_Integrity_Optimization\" >4. Erweiterte Optimierung der Signalintegrit\u00e4t<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#41_Transmission_Line_Control\" >4.1 Kontrolle der \u00dcbertragungsleitung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#42_Crosstalk_Mitigation_Techniques\" >4.2 Techniken zur Verringerung des \u00dcbersprechens<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#5_DFM_Design_for_Manufacturing_Standards\" >5. DFM-Normen (Design for Manufacturing)<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#51_Process_Capability_Parameters\" >5.1 Parameter der Prozessf\u00e4higkeit<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#52_Special_Structure_Design\" >5.2 Besondere Bauweise<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#6_Design_Verification_Process\" >6. Prozess der Entwurfsverifizierung<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-the-most-important-aspect-of-pcb-design\/#61_Pre-Production_Checklist\" >6.1 Checkliste f\u00fcr die Produktionsvorbereitung<\/a><\/li><\/ul><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h1 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Key_Points_of_PCB_Design\"><\/span>Kernpunkte des PCB-Designs<span class=\"ez-toc-section-end\"><\/span><\/h1><p><a href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-layout-design\/\">PCB-Design<\/a> ist die Grundlage f\u00fcr elektronische Produkte. Die Qualit\u00e4t der Leiterplatte wirkt sich direkt darauf aus, wie gut das Ger\u00e4t funktioniert, wie zuverl\u00e4ssig es ist und wie hoch die Produktionskosten sind. Es gibt mehrere wichtige Teile des Designs <a href=\"https:\/\/www.topfastpcb.com\/de\/blog\/printed-circuit-board-pcb\/\">gedruckte Schaltplatten<\/a> (PCBs). Dazu geh\u00f6ren die Planung des Layouts, die Festlegung der Entflechtungsstrategien und die Sicherstellung einer guten Energie- und Signalversorgung. Auch die Anforderungen an den Herstellungsprozess sind wichtig.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/pcb-degin-1.jpg\" alt=\"Leiterplattendesign\" class=\"wp-image-3650\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/pcb-degin-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/pcb-degin-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/pcb-degin-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_PCB_Layout_Planning\"><\/span>1. PCB Layout Planung<span class=\"ez-toc-section-end\"><\/span><\/h2><p><a href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-layer-selection-strategy\/\">PCB-Layout<\/a> ist die wichtigste Phase des Entwurfs, in der die richtige Platzierung der Komponenten den Signalfluss optimiert, Interferenzen reduziert und die thermische Effizienz verbessert.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"11_Functional_Partitioning_and_Isolation_Design\"><\/span>1.1 Funktionale Partitionierung und Isolationsdesign<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Analog\/Digital\/RF Zonenisolierung<\/strong>: Erreicht durch physikalischen Abstand (\u22655mm) und Trennung der Grundplatte<\/li>\n\n<li><strong>Bereich Hochspannung und Niederspannung<\/strong>: Leistungsumwandlungsmodule sollten einen Abstand von 10-15 mm zu empfindlichen Signalen einhalten<\/li>\n\n<li><strong>Platzierung w\u00e4rmeempfindlicher Komponenten<\/strong>: BGA-Geh\u00e4use erfordern eine Sperrzone von 5 mm; w\u00e4rmeerzeugende Komponenten (z. B. Leistungs-MOSFETs) sollten in der N\u00e4he der Platinenr\u00e4nder liegen.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"12_Mechanical_and_Thermal_Design_Standards\"><\/span>1.2 Mechanische und thermische Auslegungsstandards<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Koordinatensystem einrichten<\/strong>: Ursprung in der Mitte der Befestigungsl\u00f6cher in den Ecken (\u00b10,05 mm Genauigkeit)<\/li>\n\n<li><strong>Planung des W\u00e4rmemanagements<\/strong>:<\/li>\n\n<li>Layout mit nat\u00fcrlicher Konvektion: Komponenten mit hoher W\u00e4rmeentwicklung auf der Oberseite der Leiterplatte<\/li>\n\n<li>Gezwungene Luftk\u00fchlung: Ausrichtung der Komponenten in Richtung des Luftstroms<\/li>\n\n<li><strong>Strukturelle Kompatibilit\u00e4t<\/strong>: Steckverbinder m\u00fcssen mit den Geh\u00e4use\u00f6ffnungen fluchten (\u00b10,2 mm Toleranz)<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_High-Speed_PCB_Routing_Strategies\"><\/span>2. <a href=\"https:\/\/www.topfastpcb.com\/de\/products\/high-speed-pcb\/\">Hochgeschwindigkeits-Leiterplatte<\/a> Routing-Strategien<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"21_Fundamental_Routing_Principles\"><\/span>2.1 Grundlegende Routing-Prinzipien<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>3W-Regel<\/strong>: Leiterbahnabstand \u22653\u00d7 Leiterbahnbreite (z. B. 15mil Abstand bei 5mil Breite)<\/li>\n\n<li><strong>Routing auf orthogonaler Ebene<\/strong>: Benachbarte Signalschichten werden senkrecht verlegt (0\u00b0\/90\u00b0-Kreuzung)<\/li>\n\n<li><strong>\u00dcber Optimierung<\/strong>: Hochgeschwindigkeitssignale, die die Ebenen wechseln, erfordern nebeneinander liegende Masse-R\u00fcckleitungen (Abstand \u2264\u03bb\/10)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"22_Special_Signal_Handling\"><\/span>2.2 Spezielle Signalverarbeitung<span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Signalart<\/th><th>Anforderungen an das Routing<\/th><th>Typische Parameter<\/th><\/tr><\/thead><tbody><tr><td>Differentiale Paare<\/td><td>L\u00e4ngenanpassung (\u00b15mil)<\/td><td>100\u03a9\u00b110% Impedanz<\/td><\/tr><tr><td>Taktsignale<\/td><td>Spuren bewachen<\/td><td>6mil Breite<\/td><\/tr><tr><td>RF-Signale<\/td><td>Gebogene Ecken<\/td><td>50\u03a9 Impedanz<\/td><\/tr><\/tbody><\/table><\/figure><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/pcb-degin-2.jpg\" alt=\"Leiterplattendesign\" class=\"wp-image-3649\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/pcb-degin-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/pcb-degin-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/pcb-degin-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Power_Integrity_Design\"><\/span>3. Entwurf der Leistungsintegrit\u00e4t<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"31_Multilayer_Board_Power_Architecture\"><\/span>3.1 Leistungsarchitektur der Mehrschichtplatine<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Segmentierung der Ebene<\/strong>:<\/li>\n\n<li>Digitale (1,2V\/1,8V) und analoge Leistungsisolierung<\/li>\n\n<li>20H-Regel: Leistungsebene 20\u00d7 dielektrische Dicke von der Masse zur\u00fcckgesetzt<\/li>\n\n<li><strong>Platzierung des Entkopplungskondensators<\/strong>:<\/li>\n\n<li>Bulk-Kondensatoren (10\u03bcF) an den Leistungseing\u00e4ngen<\/li>\n\n<li>Kleine Kondensatoren (0,1\u03bcF) in der N\u00e4he der IC-Stifte (\u22643mm)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"32_Voltage_Conversion_Design\"><\/span>3.2 Auslegung der Spannungsumwandlung<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>DC-DC-Layout Grundlagen<\/strong>:<\/li>\n\n<li>Abstand zwischen Induktor und Schalter \u22645mm<\/li>\n\n<li>R\u00fcckkopplungsspuren, die von St\u00f6rquellen weggef\u00fchrt werden<\/li>\n\n<li><strong>Steuerung der Welligkeit<\/strong>:<\/li>\n\n<li>Einschwingverhalten der Last \u0394V&lt;2%<\/li>\n\n<li>\u226540dB Rauschunterdr\u00fcckung @100MHz<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Advanced_Signal_Integrity_Optimization\"><\/span>4. Erweiterte Optimierung der Signalintegrit\u00e4t<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"41_Transmission_Line_Control\"><\/span>4.1 Kontrolle der \u00dcbertragungsleitung<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Berechnung der Impedanzanpassung<\/strong>:<\/li><\/ul><pre class=\"wp-block-code\"><code>  Formel f\u00fcr die Impedanz von Mikrostreifen:  \n  Z0 = [87\/sqrt(\u03b5r+1.41)] * ln[5.98h\/(0.8w+t)]  <\/code><\/pre><ul class=\"wp-block-list\"><li><strong>Strategien f\u00fcr die Beendigung<\/strong>:<\/li>\n\n<li>Abschluss der Quellenserie (22-33\u03a9)<\/li>\n\n<li>End-Parallelabschluss (50\u03a9 gegen Masse)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"42_Crosstalk_Mitigation_Techniques\"><\/span>4.2 Techniken zur Verringerung des \u00dcbersprechens<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>3D-Abstandsregeln<\/strong>:<\/li>\n\n<li>Abstand zwischen den einzelnen Schichten \u22653H (H = H\u00f6he zur Bezugsebene)<\/li>\n\n<li>Gestaffeltes Routing auf der Nachbarschaftsschicht<\/li>\n\n<li><strong>Methoden zur Abschirmung<\/strong>:<\/li>\n\n<li>1 Massebahn pro 5 Hochgeschwindigkeitssignale<\/li>\n\n<li>Kritische Signale in Streifenleitungskonfiguration<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/pcb-degin-3.jpg\" alt=\"Leiterplattendesign\" class=\"wp-image-3648\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/pcb-degin-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/pcb-degin-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/pcb-degin-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_DFM_Design_for_Manufacturing_Standards\"><\/span>5. DFM-Normen (Design for Manufacturing)<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"51_Process_Capability_Parameters\"><\/span>5.1 Parameter der Prozessf\u00e4higkeit<span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Parameter<\/th><th>Standardverfahren<\/th><th>Hochpr\u00e4zises Verfahren<\/th><\/tr><\/thead><tbody><tr><td>Min. Leiterbahnbreite<\/td><td>0,1 mm<\/td><td>0,05 mm<\/td><\/tr><tr><td>Minimale Bohrergr\u00f6\u00dfe<\/td><td>0,2 mm<\/td><td>0,1 mm<\/td><\/tr><tr><td>Pad-Abstand<\/td><td>0,15 mm<\/td><td>0,08 mm<\/td><\/tr><\/tbody><\/table><\/figure><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"52_Special_Structure_Design\"><\/span>5.2 Besondere Bauweise<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Thermische Via-Arrays<\/strong>: 0,3 mm Durchmesser, 0,6 mm Abstand<\/li>\n\n<li><strong>Kupfer Auswuchten<\/strong>: &lt;30% Kupferfl\u00e4chenunterschied pro Seite<\/li>\n\n<li><strong>Panelisierung Design<\/strong>: V-f\u00f6rmig geschnittene Linien, die Bereiche mit hoher Routingdichte vermeiden<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"6_Design_Verification_Process\"><\/span>6. Prozess der Entwurfsverifizierung<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"61_Pre-Production_Checklist\"><\/span>6.1 Checkliste f\u00fcr die Produktionsvorbereitung<span class=\"ez-toc-section-end\"><\/span><\/h3><ol class=\"wp-block-list\"><li>Elektrische Regelpr\u00fcfung (ERC): \u00dcberpr\u00fcfung auf Unterbrechung\/Kurzschluss<\/li>\n\n<li>Entwurfsregelpr\u00fcfung (DRC): \u00dcber 300 Prozessregeln<\/li>\n\n<li>Simulation der Signalintegrit\u00e4t: Einrichtungs-\/Haltespanne &gt;15%<\/li>\n\n<li>Thermische Analyse: Sperrschichttemperatur &lt;80% Bewertung<\/li><\/ol><p><\/p>","protected":false},"excerpt":{"rendered":"<p>Dieser Artikel befasst sich mit den Grundprinzipien des Leiterplattendesigns, vom grundlegenden Layout bis hin zur Hochgeschwindigkeits-Signalverarbeitung, und bietet eine detaillierte Erl\u00e4uterung von L\u00f6sungen f\u00fcr die Stromversorgungsintegrit\u00e4t, die Unterdr\u00fcckung elektromagnetischer Interferenzen (EMI) und Fertigungsstandards, einschlie\u00dflich Impedanzberechnungen, W\u00e4rmemanagement und Verifizierungsworkflows.<\/p>","protected":false},"author":1,"featured_media":3651,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[109],"tags":[110],"class_list":["post-3647","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-faq","tag-pcb-design"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>What is the most important aspect of PCB design? - Topfastpcb<\/title>\n<meta name=\"description\" content=\"The following core PCB design technologies are covered: high-speed routing, power integrity, EMC design and DFM specifications. 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