{"id":4135,"date":"2025-08-20T08:34:00","date_gmt":"2025-08-20T00:34:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4135"},"modified":"2025-08-19T15:47:31","modified_gmt":"2025-08-19T07:47:31","slug":"pcb-hasl-and-lead-free-hasl-processes","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","title":{"rendered":"PCB-HASL und bleifreie HASL-Verfahren"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhalts\u00fcbersicht<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#HASL_process\" >HASL-Verfahren<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#11_Differences_between_HASL_and_lead-free_HASL\" >1.1 Unterschiede zwischen HASL und bleifreiem HASL<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#12_Core_HASL_Process_Flow\" >1.2 Kernprozessablauf bei HASL<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#121_Pre-Treatment_Stage\" >1.2.1 Vorbehandlungsstufe<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#122_Flux_Application\" >1.2.2 Flussmittel Anwendung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#123_Hot_Air_Leveling_Key_Steps\" >1.2.3 Schl\u00fcsselschritte der Hei\u00dfluftnivellierung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#124_Quality_Inspection\" >1.2.4 Qualit\u00e4tspr\u00fcfung<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#13_Process_Advantages_and_Limitations\" >1.3 Vorteile und Beschr\u00e4nkungen des Verfahrens<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Advantages\" >Vorteile<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Limitations\" >Beschr\u00e4nkungen<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#ENIG_Electroless_Nickel_Immersion_Gold_Process\" >ENIG (Chemisch Nickel Immersions Gold) Verfahren<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#21_Process_Principles\" >2.1 Verfahrensgrunds\u00e4tze<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#22_Advantages\" >2.2 Vorteile<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#23_Challenges\" >2.3 Herausforderungen<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#OSP_Organic_Solderability_Preservative\" >OSP (Organisches Konservierungsmittel f\u00fcr die L\u00f6tbarkeit)<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#31_Process_Principles\" >3.1 Verfahrensgrunds\u00e4tze<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#32_Advantages\" >3.2 Vorteile<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#33_Limitations\" >3.3 Beschr\u00e4nkungen<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Process_Selection_Guide\" >Leitfaden zur Prozessauswahl<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#41_Comparison\" >4.1 Vergleich<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#42_Recommendations\" >4.2 Empfehlungen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#43_Topfast_Capabilities\" >4.3 Topfast-F\u00e4higkeiten<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"HASL_process\"><\/span>HASL-Verfahren<span class=\"ez-toc-section-end\"><\/span><\/h2><p>HASL (Hot Air Solder Leveling) ist eines der klassischsten und kosteneffizientesten Oberfl\u00e4chenbehandlungsverfahren in der Leiterplattenherstellung und spielt eine wichtige Rolle in der Elektronikindustrie. Bei diesem Verfahren wird die Kupferoberfl\u00e4che mit einer Zinn-Blei-Legierungsschicht \u00fcberzogen, um eine zuverl\u00e4ssige L\u00f6tleistung und einen Oxidationsschutz f\u00fcr Leiterplatten zu gew\u00e4hrleisten.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1.jpg\" alt=\"HASL-Verfahren\" class=\"wp-image-4137\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"11_Differences_between_HASL_and_lead-free_HASL\"><\/span>1.1 Unterschiede zwischen HASL und bleifreiem HASL<span class=\"ez-toc-section-end\"><\/span><\/h3><p>HASL (Hot Air Solder Leveling) ist eine der klassischsten und kosteneffektivsten Oberfl\u00e4chenbehandlungsmethoden in der <a href=\"https:\/\/www.topfastpcb.com\/de\/\">PCB-Herstellung<\/a>. Bei diesem Verfahren werden Kupferoberfl\u00e4chen mit einer Zinn-Blei-Legierungsschicht \u00fcberzogen, um zuverl\u00e4ssige L\u00f6tbarkeit und Oxidationsbest\u00e4ndigkeit zu gew\u00e4hrleisten. Mit zunehmenden Umweltanforderungen ist bleifreies HASL zum Industriestandard geworden.<\/p><p><strong>Unterschiede in der Materialzusammensetzung<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Traditionelles HASL verwendet eine Sn63\/Pb37-Legierung (63 % Zinn + 37 % Blei) mit einem Schmelzpunkt von 183 \u00b0C.<\/li>\n\n<li>Bleifreies HASL wird haupts\u00e4chlich verwendet:<\/li>\n\n<li>SAC305 (96,5 % Zinn + 3 % Silber + 0,5 % Kupfer), Schmelzpunkt: 217\u2013220 \u00b0C<\/li>\n\n<li>SnCu0,7 (99,3 % Zinn + 0,7 % Kupfer), Schmelzpunkt: 227 \u00b0C<\/li>\n\n<li>Reines Zinn (Sn100), Schmelzpunkt: 232 \u00b0C<\/li><\/ul><p><strong>Vergleich der Prozessmerkmale<\/strong>:<\/p><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Eigentum<\/th><th>Verbleites HASL<\/th><th>Bleifreies HASL<\/th><\/tr><\/thead><tbody><tr><td>Schmelzpunkt<\/td><td>183 \u00b0C<\/td><td>217\u2013232 \u00b0C<\/td><\/tr><tr><td>L\u00f6ttopf-Temperatur<\/td><td>200\u2013210 \u00b0C<\/td><td>240\u2013255 \u00b0C<\/td><\/tr><tr><td>Oberfl\u00e4che<\/td><td>Helles<\/td><td>Relativ langweilig<\/td><\/tr><tr><td>Mechanische Festigkeit<\/td><td>Gute Duktilit\u00e4t (hohe Schlagz\u00e4higkeit)<\/td><td>Hart aber spr\u00f6de<\/td><\/tr><tr><td>Benetzbarkeit<\/td><td>Ausgezeichnet (Kontaktwinkel &lt; 30\u00b0)<\/td><td>Gut (Kontaktwinkel 35\u201345\u00b0)<\/td><\/tr><tr><td>Einhaltung der Umweltvorschriften<\/td><td>Enth\u00e4lt Blei (37%)<\/td><td>Bleigehalt &lt;0,1% (RoHS-konform)<\/td><\/tr><tr><td>Kosten<\/td><td>Unter<\/td><td>15-20% h\u00f6her<\/td><\/tr><tr><td>Anwendbarkeit<\/td><td>Allgemeiner Zweck<\/td><td>Erfordert h\u00f6here L\u00f6ttemperaturen<\/td><\/tr><\/tbody><\/table><\/figure><p><strong>Praktische Leistungsunterschiede<\/strong>:<\/p><ul class=\"wp-block-list\"><li><strong>L\u00f6tbarkeit<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Verbleites HASL bietet bessere L\u00f6taktivit\u00e4t bei k\u00fcrzerer Benetzungszeit (1-2 Sekunden)<\/li>\n\n<li>Bleifreies HASL erfordert st\u00e4rkere Flussmittel und eine strengere Temperaturkontrolle<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Verl\u00e4sslichkeit<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Verbleite L\u00f6tstellen weisen eine bessere thermische Erm\u00fcdungsbest\u00e4ndigkeit auf (mehr Temperaturzyklen)<\/li>\n\n<li>Bleifreie L\u00f6tstellen behalten nach Langzeitalterung eine h\u00f6here mechanische Festigkeit<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Prozess-Fenster<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Bleihaltiges HASL hat ein breiteres Prozessfenster (\u00b110 \u00b0C).<\/li>\n\n<li>Bleifreies HASL erfordert eine strengere Temperaturkontrolle (\u00b13 \u00b0C).<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Profi-Tipp: Topfast optimiert die bleifreien HASL-Parameter, um eine L\u00f6tausbeute von &gt;99,5% zu erreichen und gleichzeitig die IPC-6012 Klasse 3-Normen zu erf\u00fcllen.<\/p><\/blockquote><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"12_Core_HASL_Process_Flow\"><\/span>1.2 Kernprozessablauf bei HASL<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Als professioneller Leiterplattenhersteller verf\u00fcgt Topfast \u00fcber vollautomatische HASL-Produktionslinien mit streng standardisierten Prozessen:<\/p><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"121_Pre-Treatment_Stage\"><\/span>1.2.1 Vorbehandlungsstufe<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Chemische Reinigung<\/strong>:<\/li>\n\n<li>Saurer Reiniger (pH 2-3) entfernt Kupferoxide<\/li>\n\n<li>Temperaturregelung: 40\u201350 \u00b0C, Dauer: 2\u20133 Min.<\/li>\n\n<li>Die Mikro\u00e4tzung gew\u00e4hrleistet eine Oberfl\u00e4chenrauheit von Ra 0,3\u20130,5 \u03bcm.<\/li>\n\n<li><strong>Sp\u00fclung<\/strong>:<\/li>\n\n<li>Dreistufige Gegenstromsp\u00fclung (Widerstandsf\u00e4higkeit des DI-Wassers &gt;15 M\u03a9\u00b7cm)<\/li>\n\n<li>Hei\u00dflufttrocknung (60\u201380 \u00b0C)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"122_Flux_Application\"><\/span>1.2.2 Flussmittel Anwendung<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>Anwendungsmethoden:<\/li>\n\n<li>Sch\u00e4umend (traditionell): Flussmittelst\u00e4rke 0,01-0,03mm<\/li>\n\n<li>Spr\u00fchen (fortschrittlich):Gleichm\u00e4\u00dfiger, 30% weniger Flussmittelverbrauch<\/li>\n\n<li>Flussmittel-Typen:<\/li>\n\n<li>No-clean auf Kolophoniumbasis (ROH)<\/li>\n\n<li>Feststoffgehalt: 8-12%, S\u00e4urewert: 35-45mgKOH\/g<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"123_Hot_Air_Leveling_Key_Steps\"><\/span>1.2.3 Schl\u00fcsselschritte der Hei\u00dfluftnivellierung<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Vorheizen<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Bleihaltig: 130\u2013140 \u00b0C<\/li>\n\n<li>Bleifrei: 150\u2013160 \u00b0C<\/li>\n\n<li>Dauer: 60-90 Sekunden<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Eintauchen in L\u00f6tzinn<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Temperatur des L\u00f6ttopfes:<ul class=\"wp-block-list\"><li>Bleihaltig: 210 \u00b1 5 \u00b0C<\/li>\n\n<li>Bleifrei: 250 \u00b1 5 \u00b0C<\/li><\/ul><\/li>\n\n<li>Verweildauer: 2\u20134 Sekunden (Genauigkeit \u00b10,5 Sekunden)<\/li>\n\n<li>Eintauchtiefe: 3-5 mm<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Hei\u00dfluft-Nivellierung<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Parameter des Luftmessers:<ul class=\"wp-block-list\"><li>Druck: 0,3-0,5MPa<\/li>\n\n<li>Temperatur: 300\u2013350 \u00b0C<\/li>\n\n<li>Winkel: 4\u00b0 Neigung nach unten<\/li>\n\n<li>Luftgeschwindigkeit: 20-30m\/s<\/li><\/ul><\/li>\n\n<li>Verarbeitungszeit: 1-2 Sekunden<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>K\u00fchlung<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Zwangsluftk\u00fchlung (Rate: 2\u20133 \u00b0C\/Sek.)<\/li>\n\n<li>Endtemperatur &lt; 60 \u00b0C<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"124_Quality_Inspection\"><\/span>1.2.4 Qualit\u00e4tspr\u00fcfung<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>Online AOI (100% Abdeckung):<\/li>\n\n<li>L\u00f6tdickenpr\u00fcfung (1\u201340 \u03bcm)<\/li>\n\n<li>Erkennung von Oberfl\u00e4chenfehlern (L\u00f6tkugeln, freiliegendes Kupfer usw.)<\/li>\n\n<li>Stichprobentests:<\/li>\n\n<li>L\u00f6tbarkeitstest (245 \u00b0C, 3 Sek.)<\/li>\n\n<li>Haftfestigkeitspr\u00fcfung (Klebebandmethode)<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Technologischer Durchbruch: Das stickstoffgesch\u00fctzte bleifreie HASL-Verfahren von Topfast reduziert die Oxidation des Lots von 5 % auf 1,5 % und verbessert damit die L\u00f6tausbeute erheblich.<\/p><\/blockquote><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"13_Process_Advantages_and_Limitations\"><\/span>1.3 Vorteile und Beschr\u00e4nkungen des Verfahrens<span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advantages\"><\/span>Vorteile<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Kosteneffizienz<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Geringe Ausr\u00fcstungsinvestitionen (~1\/3 von ENIG)<\/li>\n\n<li>Erhebliche Materialkosteneinsparungen (40-60% billiger als ENIG)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Zuverl\u00e4ssigkeit des L\u00f6tens<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>H\u00e4lt mehr als 3 Reflow-Zyklen stand (Spitzenwert 260 \u00b0C)<\/li>\n\n<li>Hohe Verbindungszugfestigkeit (verbleit: 50-60MPa; bleifrei: 55-65MPa)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Breite Anwendbarkeit<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Geeignet f\u00fcr verschiedene Padgr\u00f6\u00dfen (min. 0,5 mm Abstand)<\/li>\n\n<li>Kompatibel mit Durchgangsloch- und SMT-Verfahren<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Speicherleistung<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>12 Monate Haltbarkeitsdauer (RH &lt;60%)<\/li>\n\n<li>Ausgezeichnete Oxidationsbest\u00e4ndigkeit (48-Stunden-Salzspr\u00fchtest)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Limitations\"><\/span>Beschr\u00e4nkungen<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Fine-Pitch-Beschr\u00e4nkungen<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Nicht geeignet f\u00fcr &lt;0,4mm Pitch BGA\/QFN Komponenten<\/li>\n\n<li>Risiko der L\u00f6tbr\u00fcckenbildung bei Fine-Pitch-Designs<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Fragen der Planarit\u00e4t<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Oberfl\u00e4chenunebenheit: 15\u201325 \u03bcm (beeintr\u00e4chtigt die HDI-Montage)<\/li>\n\n<li>Dickenabweichung von bis zu 20 \u03bcm zwischen gro\u00dfen und kleinen Pads<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Thermische Belastung<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Hochtemperaturverfahren (insbesondere bleifreie) k\u00f6nnen sich auf Materialien mit hohem Tg-Wert auswirken<\/li>\n\n<li>H\u00f6heres Verzugsrisiko bei d\u00fcnnen Platten (&lt;0,8mm)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Umweltbezogene \u00dcberlegungen<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Verbleites HASL nicht RoHS-konform<\/li>\n\n<li>Bleifreies HASL verbraucht mehr Energie (30\u201350 \u00b0C h\u00f6here Temperaturen).<\/li><\/ul><p>Ben\u00f6tigen Sie professionelle HASL-Unterst\u00fctzung? <a href=\"https:\/\/www.topfastpcb.com\/de\/contact\/\">Kontakt zu Topfast-Ingenieuren<\/a> f\u00fcr ma\u00dfgeschneiderte L\u00f6sungen<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3.jpg\" alt=\"HASL-Verfahren\" class=\"wp-image-4139\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"ENIG_Electroless_Nickel_Immersion_Gold_Process\"><\/span>ENIG (Chemisch Nickel Immersions Gold) Verfahren<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"21_Process_Principles\"><\/span>2.1 Verfahrensgrunds\u00e4tze<span class=\"ez-toc-section-end\"><\/span><\/h3><p>ENIG bildet eine zusammengesetzte Schutzschicht durch stromloses Vernickeln und Tauchvergoldung:<\/p><ul class=\"wp-block-list\"><li>Nickelschicht: 3\u20136 \u03bcm (7\u20139 % Phosphor)<\/li>\n\n<li>Goldschicht: 0,05\u20130,1 \u03bcm<\/li><\/ul><p><strong>Wichtige Parameter<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Nickelbad-Temperatur: 85\u201390 \u00b0C<\/li>\n\n<li>Beschichtungsrate: 15\u201320 \u03bcm\/h<\/li>\n\n<li>Goldbad-Temperatur: 80\u201385 \u00b0C<\/li>\n\n<li>pH-Wert: Nickelbad 4,5-5,0, Goldbad 5,5-6,5<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"22_Advantages\"><\/span>2.2 Vorteile<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Hervorragende Ebenheit<\/strong> (Ra&lt;0,1 \u03bcm):<\/li><\/ul><ul class=\"wp-block-list\"><li>Ideal f\u00fcr &lt;BGA\/CSP mit 0,3 mm Abstand<\/li>\n\n<li>Pad-Koplanarit\u00e4t &lt; 5 \u03bcm\/m<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Oxidationsbest\u00e4ndigkeit<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>18-monatige Haltbarkeitsdauer<\/li>\n\n<li>J-STD-003B Klasse 3 zertifiziert<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Elektrische Leitf\u00e4higkeit<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Widerstandsf\u00e4higkeit von Gold: 2,44 \u03bc\u03a9\u00b7cm<\/li>\n\n<li>Kontaktwiderstand &lt;10 m\u03a9<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"23_Challenges\"><\/span>2.3 Herausforderungen<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Black Pad Ausgabe<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Ursachen: Nickel\u00fcber\u00e4tzung oder abnormaler Phosphorgehalt<\/li>\n\n<li>L\u00f6sung:Topfast&#8217;s patentierte Passivierung reduziert den Anteil der schwarzen Pads auf &lt;0,1%<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Kosten-Faktoren<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Hohe Materialkosten (Volatilit\u00e4t des Goldpreises)<\/li>\n\n<li>Komplexes Verfahren (8-10 Schritte)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Festigkeit der L\u00f6tverbindung<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Spr\u00f6de Ni-Au-IMC-Schicht<\/li>\n\n<li>Zugfestigkeit ~40-45MPa<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Topfasts ENIG erreicht eine Gleichm\u00e4\u00dfigkeit der Schichtdicke von \u00b110 % und \u00fcbertrifft damit die Branchenstandards von \u00b115 %.<\/p><\/blockquote><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"OSP_Organic_Solderability_Preservative\"><\/span>OSP (Organisches Konservierungsmittel f\u00fcr die L\u00f6tbarkeit) <span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"31_Process_Principles\"><\/span>3.1 Verfahrensgrunds\u00e4tze<span class=\"ez-toc-section-end\"><\/span><\/h3><p>OSP bildet einen 0,2\u20130,5 \u03bcm dicken organischen Schutzfilm auf blankem Kupfer, der Folgendes enth\u00e4lt:<\/p><ul class=\"wp-block-list\"><li>Benzotriazol-Verbindungen<\/li>\n\n<li>Imidazol-Verbindungen<\/li>\n\n<li>Carboxyls\u00e4uren<\/li><\/ul><p><strong>Prozessablauf<\/strong>:<\/p><ol class=\"wp-block-list\"><li>S\u00e4urereinigung (5% H2SO4, 2min)<\/li>\n\n<li>Mikro\u00e4tz (Na2S2O8, Entfernung von 1\u20132 \u03bcm Kupfer)<\/li>\n\n<li>OSP-Behandlung (40\u201350 \u00b0C, 1\u20132 min)<\/li>\n\n<li>Trocknen (60\u201380 \u00b0C Hei\u00dfluft)<\/li><\/ol><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"32_Advantages\"><\/span>3.2 Vorteile<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Kosteng\u00fcnstig<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>60% billiger als HASL<\/li>\n\n<li>Geringe Ausr\u00fcstungsinvestitionen (~1\/5 von ENIG)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Signalintegrit\u00e4t<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Stabile Dielektrizit\u00e4tskonstante (\u0394Dk &lt;0,02)<\/li>\n\n<li>Ideal f\u00fcr Hochfrequenzanwendungen (&gt;10GHz)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Umweltfreundlich<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Keine Schwermetalle<\/li>\n\n<li>Vereinfachte Abwasserbehandlung<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"33_Limitations\"><\/span>3.3 Beschr\u00e4nkungen<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Fenster L\u00f6tbarkeit<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Muss innerhalb von 24 Stunden nach \u00d6ffnung verwendet werden<\/li>\n\n<li>Nur f\u00fcr 1 Reflow-Zyklus geeignet (Ausbeute sinkt um 30% beim zweiten Reflow)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Schwierigkeiten bei der Inspektion<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Optisch schwer zu messende Schichtdicke<\/li>\n\n<li>Erfordert eine spezielle IKT-Behandlung<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Lagerungsbedingungen<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Vakuumverpackung erforderlich (RH &lt;30%)<\/li>\n\n<li>Lagertemperatur: 15\u201330 \u00b0C<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Topfast&#8217;s verbesserter OSP verl\u00e4ngert die Haltbarkeit von 3 auf 6 Monate und h\u00e4lt 2 Reflow-Zyklen stand.<\/p><\/blockquote><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2.jpg\" alt=\"HASL-Verfahren\" class=\"wp-image-4138\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Process_Selection_Guide\"><\/span>Leitfaden zur Prozessauswahl<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"41_Comparison\"><\/span>4.1 Vergleich<span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Parameter<\/th><th>HASL<\/th><th>ENIG<\/th><th>OSP<\/th><\/tr><\/thead><tbody><tr><td>Kosten<\/td><td>$<\/td><td>$$$<\/td><td>$<\/td><\/tr><tr><td>Ebenheit<\/td><td>\u25b3 (15\u201325 \u03bcm)<\/td><td>\u25ce (&lt;5 \u03bcm)<\/td><td>\u25cb (&lt;10 \u03bcm)<\/td><\/tr><tr><td>L\u00f6tbarkeit<\/td><td>\u25ce (3 R\u00fcckfl\u00fcsse)<\/td><td>\u25cb (5 R\u00fcckfl\u00fcsse)<\/td><td>\u25b3 (1\u20132 R\u00fcckfl\u00fcsse)<\/td><\/tr><tr><td>Haltbarkeitsdauer<\/td><td>12mo<\/td><td>18mo<\/td><td>6mo<\/td><\/tr><tr><td>Min. Teilung<\/td><td>&gt;0.5mm<\/td><td>&gt;0,3mm<\/td><td>&gt;0,4mm<\/td><\/tr><tr><td>Umweltfreundlich<\/td><td>Bleifrei OK<\/td><td>Ausgezeichnet<\/td><td>Ausgezeichnet<\/td><\/tr><tr><td>Anwendungen<\/td><td>Unterhaltungselektronik<\/td><td>High-Density-ICs<\/td><td>Quick-Turn<\/td><\/tr><\/tbody><\/table><\/figure><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"42_Recommendations\"><\/span>4.2 Empfehlungen<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Unterhaltungselektronik<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Bleifreies HASL (bestes Preis-Leistungs-Verh\u00e4ltnis)<\/li>\n\n<li>Kontrolle der Lotpastenmenge f\u00fcr Fine-Pitch-Bauteile<\/li><\/ul><ul class=\"wp-block-list\"><li><strong><a href=\"https:\/\/www.topfastpcb.com\/de\/products\/hdi-pcb\/\">HDI-Tafeln<\/a><\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>ENIG (hervorragende Ebenheit)<\/li>\n\n<li>Strenge Qualit\u00e4tskontrolle bei Nickel<\/li><\/ul><ul class=\"wp-block-list\"><li><strong><a href=\"https:\/\/www.topfastpcb.com\/de\/products\/high-speed-pcb\/\">Hochgeschwindigkeits-PCBs<\/a><\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>OSP\/ENIG (bessere Signalintegrit\u00e4t)<\/li>\n\n<li>Vermeiden Sie HASL&#8217;s unebene Oberfl\u00e4che<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Prototyping<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>OSP (schnellste Bearbeitungszeit)<\/li>\n\n<li>Sicherstellung der rechtzeitigen Montage<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"43_Topfast_Capabilities\"><\/span>4.3 Topfast-F\u00e4higkeiten<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Komplette L\u00f6sungen f\u00fcr die Oberfl\u00e4chenbearbeitung:<\/p><ul class=\"wp-block-list\"><li>20 automatisierte HASL-Linien (500.000 m\u00b2\/Monat)<\/li>\n\n<li>10 ENIG-Leitungen (\u00b18 % Gleichm\u00e4\u00dfigkeit der Dicke)<\/li>\n\n<li>5 OSP-Linien (nano-verst\u00e4rkt verf\u00fcgbar)<\/li>\n\n<li>100%ige Inline-Pr\u00fcfung (AOI+SPI)<\/li><\/ul><p><a href=\"https:\/\/www.topfastpcb.com\/de\/contact\/\">Leitfaden zur Auswahl der PCB-Oberfl\u00e4chenbeschaffenheit herunterladen<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>HASL-Hei\u00dfluft-Leveling-Verfahren, einschlie\u00dflich der Legierungszusammensetzung, des Prozessablaufs und der Leistungsunterschiede zwischen bleihaltigem und bleifreiem HASL. Eine detaillierte Analyse der Eigenschaften und Anwendungsszenarien von ENIG-Galvanik und OSP-Antioxidationsverfahren. Als professioneller Leiterplattenhersteller verf\u00fcgt Topfast \u00fcber umfassende F\u00e4higkeiten im Bereich der Oberfl\u00e4chenbehandlung und ein robustes Qualit\u00e4tskontrollsystem, das es uns erm\u00f6glicht, optimale Oberfl\u00e4chenbehandlungsl\u00f6sungen f\u00fcr verschiedene elektronische Produkte anzubieten.<\/p>","protected":false},"author":1,"featured_media":4136,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[351,260],"class_list":["post-4135","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-hasl-processes","tag-pcb-manufacturing-process"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB HASL and Lead-Free HASL Processes - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Topfast provides professional and reliable PCB manufacturing services. 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PCB surface treatment processes: detailed comparison of material differences, process flows, and performance characteristics between HASL and lead-free HASL; professional analysis of the applicable scenarios for ENIG gold plating and OSP processes.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#breadcrumb\"},\"inLanguage\":\"de\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"de\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg\",\"width\":600,\"height\":402,\"caption\":\"HASL process\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"\u9996\u9875\",\"item\":\"https:\/\/www.topfastpcb.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"PCB HASL and Lead-Free HASL Processes\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.topfastpcb.com\/#website\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"name\":\"Topfastpcb\",\"description\":\"Topfast Prime Choice for Global Electronics Manufacturing\",\"publisher\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.topfastpcb.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"de\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\",\"name\":\"Topfastpcb\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"de\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"width\":144,\"height\":56,\"caption\":\"Topfastpcb\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a\",\"name\":\"\u6258\u666e\u6cd5\u65af\u7279\",\"sameAs\":[\"http:\/\/www.topfastpcb.com\"],\"url\":\"https:\/\/www.topfastpcb.com\/de\/blog\/author\/admin\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"PCB HASL and Lead-Free HASL Processes - Topfastpcb","description":"Topfast provides professional and reliable PCB manufacturing services. PCB surface treatment processes: detailed comparison of material differences, process flows, and performance characteristics between HASL and lead-free HASL; professional analysis of the applicable scenarios for ENIG gold plating and OSP processes.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","og_locale":"de_DE","og_type":"article","og_title":"PCB HASL and Lead-Free HASL Processes - Topfastpcb","og_description":"Topfast provides professional and reliable PCB manufacturing services. PCB surface treatment processes: detailed comparison of material differences, process flows, and performance characteristics between HASL and lead-free HASL; professional analysis of the applicable scenarios for ENIG gold plating and OSP processes.","og_url":"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","og_site_name":"Topfastpcb","article_published_time":"2025-08-20T00:34:00+00:00","og_image":[{"width":600,"height":402,"url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg","type":"image\/jpeg"}],"author":"\u6258\u666e\u6cd5\u65af\u7279","twitter_card":"summary_large_image","twitter_misc":{"Verfasst von":"\u6258\u666e\u6cd5\u65af\u7279","Gesch\u00e4tzte Lesezeit":"5\u00a0Minuten"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#article","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/"},"author":{"name":"\u6258\u666e\u6cd5\u65af\u7279","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a"},"headline":"PCB HASL and Lead-Free HASL Processes","datePublished":"2025-08-20T00:34:00+00:00","mainEntityOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/"},"wordCount":1036,"publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg","keywords":["HASL Processes","PCB Manufacturing Process"],"articleSection":["Knowledge"],"inLanguage":"de"},{"@type":"WebPage","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","url":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","name":"PCB HASL and Lead-Free HASL Processes - Topfastpcb","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg","datePublished":"2025-08-20T00:34:00+00:00","description":"Topfast provides professional and reliable PCB manufacturing services. PCB surface treatment processes: detailed comparison of material differences, process flows, and performance characteristics between HASL and lead-free HASL; professional analysis of the applicable scenarios for ENIG gold plating and OSP processes.","breadcrumb":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#breadcrumb"},"inLanguage":"de","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/"]}]},{"@type":"ImageObject","inLanguage":"de","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg","width":600,"height":402,"caption":"HASL process"},{"@type":"BreadcrumbList","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"\u9996\u9875","item":"https:\/\/www.topfastpcb.com\/"},{"@type":"ListItem","position":2,"name":"PCB HASL and Lead-Free HASL Processes"}]},{"@type":"WebSite","@id":"https:\/\/www.topfastpcb.com\/#website","url":"https:\/\/www.topfastpcb.com\/","name":"Topfastpcb","description":"Topfast Prime Choice for Global Electronics Manufacturing","publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.topfastpcb.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"de"},{"@type":"Organization","@id":"https:\/\/www.topfastpcb.com\/#organization","name":"Topfastpcb","url":"https:\/\/www.topfastpcb.com\/","logo":{"@type":"ImageObject","inLanguage":"de","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","width":144,"height":56,"caption":"Topfastpcb"},"image":{"@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a","name":"\u6258\u666e\u6cd5\u65af\u7279","sameAs":["http:\/\/www.topfastpcb.com"],"url":"https:\/\/www.topfastpcb.com\/de\/blog\/author\/admin\/"}]}},"_links":{"self":[{"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/posts\/4135","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/comments?post=4135"}],"version-history":[{"count":1,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/posts\/4135\/revisions"}],"predecessor-version":[{"id":4140,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/posts\/4135\/revisions\/4140"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/media\/4136"}],"wp:attachment":[{"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/media?parent=4135"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/categories?post=4135"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/tags?post=4135"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}