{"id":4310,"date":"2025-09-06T15:03:56","date_gmt":"2025-09-06T07:03:56","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4310"},"modified":"2025-09-06T15:03:59","modified_gmt":"2025-09-06T07:03:59","slug":"what-is-a-ceramic-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-a-ceramic-pcb\/","title":{"rendered":"Was ist eine keramische Leiterplatte, und welche Arten von keramischen Leiterplatten gibt es?"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhalts\u00fcbersicht<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-a-ceramic-pcb\/#What_is_a_Ceramic_PCB\" >Was ist eine keramische Leiterplatte?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-a-ceramic-pcb\/#Types_of_Ceramic_PCBs\" >Arten von keramischen PCBs<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-a-ceramic-pcb\/#1_HTCC_High-Temperature_Co-fired_Ceramic\" >1. HTCC (High-Temperature Co-fired Ceramic)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-a-ceramic-pcb\/#2_LTCC_Low-Temperature_Co-fired_Ceramic\" >2.LTCC (Low-Temperature Co-fired Ceramic)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-a-ceramic-pcb\/#3_Thick-Film_Ceramic_PCB\" >3.Dickschicht-Keramik-Leiterplatte<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-a-ceramic-pcb\/#4_Thin-Film_Ceramic_PCB\" >4.D\u00fcnnschicht-Keramik-Leiterplatte<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-a-ceramic-pcb\/#5_DBCDPC_Direct_Bonded_CopperDirect_Plated_Copper_Ceramic_Substrate\" >5.DBC\/DPC (Direct Bonded Copper\/Direct Plated Copper Ceramic Substrate)<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-a-ceramic-pcb\/#Advantages_of_Ceramic_PCBs\" >Vorteile von keramischen Leiterplatten<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-a-ceramic-pcb\/#Manufacturing_Process_of_Ceramic_PCBs\" >Herstellungsverfahren f\u00fcr keramische Leiterplatten<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-a-ceramic-pcb\/#When_to_Choose_Ceramic_PCBs\" >Wann sollte man sich f\u00fcr keramische Leiterplatten entscheiden?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/what-is-a-ceramic-pcb\/#Application_Fields\" >Anwendungsbereiche<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_is_a_Ceramic_PCB\"><\/span>Was ist ein <a href=\"https:\/\/www.topfastpcb.com\/de\/products\/category\/ceramic-pcb\/\">Keramik-Leiterplatte<\/a>?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Keramische Leiterplatten (PCBs) sindLeiterplatten, bei denen Keramikmaterialien alsSubstrateverwendet werden.Sie werden aus Keramikpulvern (wie Aluminiumoxid, Aluminiumnitrid oder Berylliumoxid) in Kombination mit organischen Bindemitteln hergestellt.Ihre W\u00e4rmeleitf\u00e4higkeitliegt typischerweise zwischen 9 und 20W\/m\u00b7K, wodurch sie sich hervorragend f\u00fcr dasW\u00e4rmemanagement eignen. Au\u00dferdem weisen sie einen niedrigen W\u00e4rmeausdehnungskoeffizienten (CTE) und stabile elektrische Eigenschaften auf. Sie werden mit Techniken wie der laseraktivierten Metallisierung (LAM) hergestellt, wodurch sie sich perfekt f\u00fcr elektronische Ger\u00e4te eignen, die in Umgebungen mit hoher Leistung, hoher Frequenz und hohen Temperaturen betrieben werden.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-2.jpg\" alt=\"Keramik-Leiterplatte\" class=\"wp-image-4312\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Types_of_Ceramic_PCBs\"><\/span>Arten von keramischen PCBs<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Auf der Grundlage von Materialsystemen und Herstellungsverfahren werden keramische Leiterplatten haupts\u00e4chlich in die folgenden Typen eingeteilt:<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_HTCC_High-Temperature_Co-fired_Ceramic\"><\/span><strong>1. HTCC (High-Temperature Co-fired Ceramic)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Materialien<\/strong>: Keramiken auf Aluminiumoxidbasis mit Wolfram\/Molybd\u00e4n-Metallpasten.<\/li>\n\n<li><strong>Prozess<\/strong>: Mitverbrennung in einer Wasserstoffatmosph\u00e4rebei 1600\u20131700 \u00b0C f\u00fcr bis zu 48 Stunden.<\/li>\n\n<li><strong>Eigenschaften<\/strong>Hohe strukturelle Festigkeit und Pr\u00e4zision, geeignet f\u00fcr hochzuverl\u00e4ssige Luft- und Raumfahrt- und Milit\u00e4ranwendungen.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_LTCC_Low-Temperature_Co-fired_Ceramic\"><\/span><strong>2.LTCC (Low-Temperature Co-fired Ceramic)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Materialien<\/strong>Kristallglas + keramische Verbundwerkstoffe mit Pasten auf Goldbasis.<\/li>\n\n<li><strong>Prozess<\/strong>: Sintern bei etwa 900 \u00b0C, gefolgt vonLaminieren und Formen.<\/li>\n\n<li><strong>Eigenschaften<\/strong>Geringe Schrumpfungstoleranz und hohe mechanische Festigkeit, weit verbreitet in HF-Modulen und Sensoren.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Thick-Film_Ceramic_PCB\"><\/span><strong>3.Dickschicht-Keramik-Leiterplatte<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Prozess<\/strong>Siebdruck von Silber-\/Gold-Palladium-Pasten aufKeramiksubstrate,gefolgt von Hochtemperatursintern(\u22641000 \u00b0C).<\/li>\n\n<li><strong>Eigenschaften<\/strong>: Leiterbahnschichtdicke von 10\u201313 \u03bcm,unterst\u00fctzt die Integration passiver Komponenten wie Widerst\u00e4nde und Kondensatoren, geeignet f\u00fcr komplexeSchaltungsdesigns.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Thin-Film_Ceramic_PCB\"><\/span><strong>4.D\u00fcnnschicht-Keramik-Leiterplatte<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Prozess<\/strong>Herstellung von Metallschaltungen im Mikrometerbereich durch Vakuumabscheidung oder Sputtern.<\/li>\n\n<li><strong>Eigenschaften<\/strong>Hohe Schaltungspr\u00e4zision, ideal f\u00fcr Hochfrequenz-Mikrowellenschaltungen.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_DBCDPC_Direct_Bonded_CopperDirect_Plated_Copper_Ceramic_Substrate\"><\/span><strong>5.DBC\/DPC (Direct Bonded Copper\/Direct Plated Copper Ceramic Substrate)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Prozess<\/strong>Direktes Aufkleben von Kupferfolie auf keramische Oberfl\u00e4chen bei hohen Temperaturen (DBC) oder Schaltkreisbildung durch Galvanisieren (DPC).<\/li>\n\n<li><strong>Eigenschaften<\/strong>Hervorragende W\u00e4rmeleitf\u00e4higkeit und Strombelastbarkeit, was sie zur bevorzugten Wahl f\u00fcr Leistungshalbleiter (z. B. IGBTs) und LED-Beleuchtung macht.<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advantages_of_Ceramic_PCBs\"><\/span>Vorteile von keramischen Leiterplatten<span class=\"ez-toc-section-end\"><\/span><\/h2><ol class=\"wp-block-list\"><li><strong>Hohe W\u00e4rmeleitf\u00e4higkeit<\/strong>:<br>Die W\u00e4rmeleitf\u00e4higkeit ist viel h\u00f6herals bei herk\u00f6mmlichen FR-4-Substraten (z. B. kann Aluminiumnitrid 170\u2013230 W\/m\u00b7K erreichen), wodurch die W\u00e4rmeableitung inHochleistungsger\u00e4ten effektiv gew\u00e4hrleistet wird.<\/li>\n\n<li><strong>Ausgezeichnete Hochfrequenzleistung<\/strong>:<br>Geringer dielektrischer Verlust und stabile Dielektrizit\u00e4tskonstante, geeignet f\u00fcr 5G-, RF- und Mikrowellenkommunikation.<\/li>\n\n<li><strong>Stabilit\u00e4t bei hohen Temperaturen<\/strong>:<br>Kann in Umgebungen mit Temperaturen \u00fcber350\u00b0Cbetrieben werden und eignet sich daher ideal f\u00fcr Automobilelektronik, Luft- und Raumfahrt sowie andere Hochtemperaturanwendungen.<\/li>\n\n<li><strong>Mechanische und chemische Best\u00e4ndigkeit<\/strong>:<br>Hohe mechanische Festigkeit, Best\u00e4ndigkeit gegen Vibrationen, Korrosion und chemische Erosion.<\/li>\n\n<li><strong>Dimensionsstabilit\u00e4t und niedriger WAK<\/strong>:<br>Der thermische Ausdehnungskoeffizient liegt nahe an dem von Siliziumchips, was Verbindungsfehler durch thermische Belastung reduziert.<\/li>\n\n<li><strong>Integrationsf\u00e4higkeit mit hoher Packungsdichte<\/strong>:<br>Unterst\u00fctzt feine Linienbreiten, Microvias und Multilayer-Stacking, geeignet f\u00fcr miniaturisierte Designs.<\/li><\/ol><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-1-1.jpg\" alt=\"Keramische PCBs\" class=\"wp-image-4314\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-1-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-1-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/09\/Ceramic-PCB-1-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Process_of_Ceramic_PCBs\"><\/span>Herstellungsverfahren f\u00fcr keramische Leiterplatten<span class=\"ez-toc-section-end\"><\/span><\/h2><ol class=\"wp-block-list\"><li><strong>Gestaltung und Layout<\/strong>:<br>Schaltungsentwurf mit CAD-Software, Optimierung des W\u00e4rmemanagements und der Signalintegrit\u00e4t.<\/li>\n\n<li><strong>Vorbereitung des Substrats<\/strong>:<br>Keramiksubstrate (Al\u2082O\u2083, AlN, SiC usw.)werden auf die gew\u00fcnschten Abmessungen zugeschnitten und poliert.<\/li>\n\n<li><strong>Leitende Schichtabscheidung<\/strong>:<br>Die Silber-\/Gold-Palladium-Leitpaste wird im Siebdruck- oder Tintenstrahlverfahren aufgebracht.<\/li>\n\n<li><strong>\u00dcber Bohren und F\u00fcllen<\/strong>:<br>Laser- oder mechanisches Bohren, wobei leitf\u00e4hige Materialien die Durchgangsl\u00f6cher f\u00fcr die Verbindungen zwischen den Schichten f\u00fcllen.<\/li>\n\n<li><strong>Mitbrennen und Sintern<\/strong>:<\/li><\/ol><ul class=\"wp-block-list\"><li>HTCC: Gesintert in einer Wasserstoffumgebungbei1600\u20131700\u00b0C.<\/li>\n\n<li>LTCC: Niedertemperatursintern bei etwa900 \u00b0C.<br>Mehrschichtige Schaltungen m\u00fcssen vor dem Co-Firing gestapelt werden.<\/li><\/ul><ol class=\"wp-block-list\"><li><strong>Montage und Pr\u00fcfung von Bauteilen<\/strong>:<br>Die SMD-Bauteile werden gel\u00f6tet, anschlie\u00dfend werden elektrische, Umwelt- und Zuverl\u00e4ssigkeitstests durchgef\u00fchrt.<\/li>\n\n<li><strong>Schutzbeschichtung und Verpackung<\/strong>:<br>Um die Umweltbest\u00e4ndigkeit zu erh\u00f6hen, werden Schutzschichten aufgebracht, gefolgt von einer abschlie\u00dfenden Funktionspr\u00fcfung und Verpackung.<\/li><\/ol><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"When_to_Choose_Ceramic_PCBs\"><\/span>Wann sollte man sich f\u00fcr keramische Leiterplatten entscheiden?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Keramische Leiterplatten eignen sich f\u00fcr die folgenden Szenarien:<\/p><ul class=\"wp-block-list\"><li><strong>High-Power-Ger\u00e4te<\/strong>: Zum Beispiel IGBT-Module, Power-Management-Systeme und LED-Autolampen.<\/li>\n\n<li><strong>Hochfrequenz-Anwendungen<\/strong>5G-Basisstationen, Radarsysteme, Satellitenkommunikation.<\/li>\n\n<li><strong>Umgebungen mit hohen Temperaturen<\/strong>Motorsteuerungen f\u00fcr die Luft- und Raumfahrt, Automobilelektronik.<\/li>\n\n<li><strong>Hohe Zuverl\u00e4ssigkeitsanforderungen<\/strong>Medizinische Ger\u00e4te (z. B. chirurgische Laserinstrumente), milit\u00e4rische Ausr\u00fcstung.<\/li>\n\n<li><strong>Chemisch korrosive Umgebungen<\/strong>: Erd\u00f6lexploration, industrielle Automatisierung.<\/li><\/ul><p><strong>\u00dcberlegungen<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Keramische Leiterplatten sind relativ teuer und eignen sich daher eher f\u00fcr Hochleistungsanforderungen als f\u00fcr Verbraucherprodukte.<\/li>\n\n<li>Bei der Konstruktion muss die Spr\u00f6digkeit des Materials ber\u00fccksichtigt werden, um eine Konzentration mechanischer Spannungen zu vermeiden.<\/li>\n\n<li>Eine hohe Prozesskomplexit\u00e4t erfordert die Zusammenarbeit mit Lieferanten mit ausgereiftem technischem Know-how.<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Application_Fields\"><\/span>Anwendungsbereiche<span class=\"ez-toc-section-end\"><\/span><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Feld<\/th><th>Anwendungsbeispiele<\/th><\/tr><\/thead><tbody><tr><td><strong>Luft- und Raumfahrt<\/strong><\/td><td>Raketensteuerungssysteme, Radar-Transceivermodule, Satellitenkommunikationsger\u00e4te.<\/td><\/tr><tr><td><strong>Kfz-Elektronik<\/strong><\/td><td>Leistungsmodule f\u00fcr Elektrofahrzeuge, LED-Autolampen, Sensoren.<\/td><\/tr><tr><td><strong>5G und Kommunikation<\/strong><\/td><td>Hochfrequenz-RF-Module, Antennen-Arrays und Leistungsverst\u00e4rker f\u00fcr Basisstationen.<\/td><\/tr><tr><td><strong>Medizinische Ger\u00e4te<\/strong><\/td><td>Medizinische Laserger\u00e4te, R\u00f6ntgenger\u00e4te und chirurgische Hochfrequenzinstrumente.<\/td><\/tr><tr><td><strong>Industrielle Elektronik<\/strong><\/td><td>Hochleistungsger\u00e4te, Industrielaser und Ausr\u00fcstung f\u00fcr die \u00d6lexploration.<\/td><\/tr><tr><td><strong>Milit\u00e4r und Verteidigung<\/strong><\/td><td>Radarsysteme, Raketensteuerung und strahlungsbest\u00e4ndige elektronische Ger\u00e4te.<\/td><\/tr><\/tbody><\/table><\/figure>","protected":false},"excerpt":{"rendered":"<p>Keramische Leiterplatten sind Leiterplatten mit Keramiksubstraten, die eine au\u00dfergew\u00f6hnliche W\u00e4rmeleitf\u00e4higkeit, Hochfrequenzleistung und Hochtemperaturstabilit\u00e4t bieten. Sie werden haupts\u00e4chlich in HTCC-, LTCC- und Dickschicht-Keramik-Typen unterteilt und eignen sich f\u00fcr hochzuverl\u00e4ssige Anwendungen wie Luft- und Raumfahrt, 5G-Kommunikation, Automobilelektronik und medizinische Ger\u00e4te.<\/p>","protected":false},"author":1,"featured_media":4311,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[109],"tags":[365],"class_list":["post-4310","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-faq","tag-ceramic-pcb"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>What is a ceramic PCB, and what are the types of ceramic PCBs? - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Ceramic PCB is a high-performance circuit board utilizing an aluminum oxide\/aluminum nitride substrate, offering high thermal conductivity, high-frequency stability, and high-temperature resistance. 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