{"id":4628,"date":"2025-11-16T08:29:00","date_gmt":"2025-11-16T00:29:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4628"},"modified":"2025-11-14T15:34:28","modified_gmt":"2025-11-14T07:34:28","slug":"ai-catalyzes-pcb-industry-growth-in-both-volume-and-price","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/","title":{"rendered":"AI katalysiert das Wachstum der PCB-Industrie in Bezug auf Volumen und Preis"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhalts\u00fcbersicht<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Industry_Overview\" >\u00dcberblick \u00fcber die Industrie<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Market_Prospects\" >Marktperspektiven<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Industry_Trends\" >Trends in der Industrie<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Cycle_Evolution\" >Zyklus-Entwicklung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Equipment_Market\" >Ausr\u00fcstungsmarkt<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Equipment_Structure_and_Market_Space\" >Ausr\u00fcstungsstruktur und Marktraum<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Competitive_Landscape_and_Localization_Opportunities\" >Wettbewerbslandschaft und Lokalisierungsm\u00f6glichkeiten<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Technology_Frontier\" >Grenze der Technologie<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#PCB_Backplanes_Replacing_Copper_Cables\" >PCB-Backplanes als Ersatz f\u00fcr Kupferkabel<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#CoWoP_Packaging_Technology\" >CoWoP-Verpackungstechnik<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Conclusion\" >Schlussfolgerung<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Industry_Overview\"><\/span>\u00dcberblick \u00fcber die Industrie<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Gedruckte Schaltungen (PCBs) werden als die \"Mutter der elektronischen Produkte\" bezeichnet, da sie die zentrale Grundlage f\u00fcr die Aufnahme elektronischer Komponenten und die Herstellung elektrischer Verbindungen bilden. Die aktuellen PCB-Produkte entwickeln sich rasch in Richtung h\u00f6herer Lagenzahl und gr\u00f6\u00dferer Dichte. Nach der Lagenzahl lassen sie sich in einseitige, doppelseitige und mehrlagige Leiterplatten einteilen; strukturell umfassen sie unter anderem starre Leiterplatten, flexible Leiterplatten, starr-flexible Leiterplatten, HDI-Leiterplatten (High-Density Interconnect) und IC-Verpackungssubstrate.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB.jpg\" alt=\"AI+PCB\" class=\"wp-image-4629\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Market_Prospects\"><\/span>Marktperspektiven<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Laut Prismark-Statistiken wird die weltweite Leiterplattenindustrie im Jahr 2024 einen Gesamtproduktionswert von $73,6 Mrd. erreichen, was einem Anstieg von 5,8% im Vergleich zum Vorjahr entspricht. China, die weltweit gr\u00f6\u00dfte Leiterplattenproduktionsbasis, h\u00e4lt einen Anteil von 56% am Weltmarkt. Vor dem Hintergrund der sich beschleunigenden Entwicklung von KI-Anwendungen steigt die Marktnachfrage nach High-End-Leiterplatten mit d\u00fcnneren Profilen, h\u00f6herer Dichte und besserem W\u00e4rmemanagement\" weiter an. Der Wert der weltweiten Leiterplattenproduktion wird bis 2029 voraussichtlich $94,661 Milliarden erreichen, mit einer durchschnittlichen j\u00e4hrlichen Wachstumsrate (CAGR) von 5,2% von 2024 bis 2029.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Industry_Trends\"><\/span>Trends in der Industrie<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Betrachtet man die Produktstruktur, so zeigt sich, dass das Wachstum der verschiedenen Leiterplattentypen im Jahr 2024 stark divergiert:<\/p><ul class=\"wp-block-list\"><li>Der Produktionswert von HDI-Platten stieg im Vergleich zum Vorjahr um 18,8%, was die beste Leistung darstellt.<\/li>\n\n<li>Der Produktionswert und das Produktionsvolumen von mehrschichtigen Platten mit mehr als 18 Schichten stiegen um 25,2% bzw. 35,4%.<\/li>\n\n<li>Der Wert der Leiterplattenproduktion im Server- und Speicherbereich stieg im Vergleich zum Vorjahr um 33,1% und erreichte $10,92 Milliarden.<\/li><\/ul><p>Diese Wachstumsstruktur spiegelt in vollem Umfang die starke Nachfrage nach High-End-Leiterplatten wider, die durch <a href=\"https:\/\/www.topfastpcb.com\/de\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/\">AI-Server<\/a> und Hochgeschwindigkeitsnetzinfrastruktur.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Cycle_Evolution\"><\/span>Zyklus-Entwicklung<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Die Leiterplattenindustrie hat deutliche Zykluswechsel erlebt:<\/p><ul class=\"wp-block-list\"><li><strong>Erste Runde (2014-2018):<\/strong> Angetrieben durch den Aufbau von 4G-Netzen und die Verbreitung von Smartphones.<\/li>\n\n<li><strong>Zweite Runde (2018-2022):<\/strong> Angetrieben von der Nachfrage nach 5G-Basisstationen, Fernarbeit und Automobilelektronik.<\/li>\n\n<li><strong>Dritte Runde (2023-Gegenwart):<\/strong> AIDC und Automobilelektronik werden zu neuen Wachstumspolen.<\/li><\/ul><p>In den ersten drei Quartalen des Jahres 2025 erreichten die Investitionen der acht f\u00fchrenden inl\u00e4ndischen Leiterplattenunternehmen zusammen 16,3 Milliarden RMB, was einem deutlichen Anstieg von 85% im Vergleich zum Vorjahr entspricht und den beschleunigten Beginn einer neuen Expansionsrunde markiert.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-2.jpg\" alt=\"AI+PCB\" class=\"wp-image-4630\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Equipment_Market\"><\/span>Ausr\u00fcstungsmarkt<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Equipment_Structure_and_Market_Space\"><\/span>Ausr\u00fcstungsstruktur und Marktraum<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Die Leiterplattenproduktion umfasst sieben Hauptprozesse: Bohren, Belichten, Pr\u00fcfen, Beschichten, Laminieren, Formen und Laminieren. Darunter:<\/p><ul class=\"wp-block-list\"><li>Bohrger\u00e4te haben mit 20,2% den h\u00f6chsten Wertanteil.<\/li>\n\n<li>Auf die Belichtungsger\u00e4te entfallen 13,5%.<\/li>\n\n<li>Auf Inspektionsger\u00e4te entfallen 11,9%.<\/li><\/ul><p>Der weltweite Markt f\u00fcr PCB-Ausr\u00fcstung stieg von $5,84 Milliarden im Jahr 2020 auf $7,085 Milliarden im Jahr 2024 und wird voraussichtlich $7,793 Milliarden im Jahr 2025 erreichen. Der chinesische Markt hatte 2024 ein Volumen von 29,442 Milliarden RMB und wird voraussichtlich bis 2025 auf 32,4 Milliarden RMB ansteigen.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Competitive_Landscape_and_Localization_Opportunities\"><\/span>Wettbewerbslandschaft und Lokalisierungsm\u00f6glichkeiten<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Die Konzentration des chinesischen Marktes f\u00fcr Leiterplattenmaschinen ist mit einem CR5 von 23,9% relativ gering. Han's CNC h\u00e4lt als inl\u00e4ndischer Marktf\u00fchrer einen Marktanteil von etwa 10,1%. Derzeit liegt die Lokalisierungsrate f\u00fcr High-End-Ger\u00e4te bei weniger als 30%, aber in Segmenten wie Bohren, Belichtung, Beschichtung und Verbrauchsmaterial hat sich eine globale Wettbewerbsf\u00e4higkeit herausgebildet.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technology_Frontier\"><\/span>Grenze der Technologie<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCB_Backplanes_Replacing_Copper_Cables\"><\/span>PCB-Backplanes als Ersatz f\u00fcr Kupferkabel<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Produkte der n\u00e4chsten Generation werden m\u00f6glicherweise aus M9-Material bestehen und PCB-Backplanes anstelle von Kupferkabeln verwenden, um kompaktere Schaltschranklayouts zu erreichen.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"CoWoP_Packaging_Technology\"><\/span>CoWoP-Verpackungstechnik<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Einf\u00fchrung der CoWoS (Chip-on-Wafer-on-Substrate)-Technologie f\u00fcr die n\u00e4chste Generation von Grafikprozessoren, wobei das Substrat weggelassen und die Chips direkt auf Silizium-Interposer gel\u00f6tet werden, die in die Hauptplatine integriert sind, wodurch eine strukturelle Integration als \"Geh\u00e4use als Hauptplatine\" erreicht wird. Diese Technologie wird dazu f\u00fchren, dass die Anforderungen an die Verdrahtungsdichte, die Ebenheit und die Materialkontrolle von Leiterplatten auf Verpackungsniveau steigen.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-3.jpg\" alt=\"AI+PCB\" class=\"wp-image-4631\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Schlussfolgerung<span class=\"ez-toc-section-end\"><\/span><\/h2><p>In der Leiterplattenindustrie bieten sich Entwicklungsm\u00f6glichkeiten, die durch die KI katalysiert werden und zu Mengen- und Preissteigerungen f\u00fchren:<\/p><ul class=\"wp-block-list\"><li><strong>Volumenwachstum:<\/strong> Die weltweiten Investitionsausgaben der vier gro\u00dfen CSPs erreichten im ersten Halbjahr 2025 $155,5 Milliarden, 73% mehr als im Vorjahr.<\/li>\n\n<li><strong>Preiserh\u00f6hung:<\/strong> Der Anteil der hochlagigen Leiterplatten und HDI-Leiterplatten nimmt zu, was mit einer h\u00f6heren Komplexit\u00e4t der Verarbeitung einhergeht.<\/li><\/ul>","protected":false},"excerpt":{"rendered":"<p>Die Leiterplattenindustrie tritt in einen neuen Wachstumszyklus ein, der durch die Nachfrage von KI-Servern, Automobilelektronik und anderen Sektoren angetrieben wird. Die Nachfrage nach High-End-Produkten wie HDI-Leiterplatten und Multilayer-Leiterplatten mit 18 oder mehr Lagen steigt sprunghaft an und treibt sowohl Volumen- als auch Preissteigerungen in der gesamten Branche voran. Der weltweite Markt f\u00fcr Leiterplattenausr\u00fcstungen expandiert weiter, wobei technologisch fortschrittliche, f\u00fchrende Unternehmen durchweg profitieren. Die Industriekette ist bereit f\u00fcr strukturelle Investitionsm\u00f6glichkeiten.<\/p>","protected":false},"author":1,"featured_media":4632,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[108],"tags":[406],"class_list":["post-4628","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb-industry-analysis"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>AI Catalyzes PCB Industry Growth in Both Volume and Price - Topfastpcb<\/title>\n<meta name=\"description\" content=\"2025 PCB Industry In-Depth Analysis: AI Catalyzes Industry Growth in Both Volume and Price Global Market Trends: $73.6 Billion Market, Explosive Growth in HDI Boards, Opportunities Emerge for China&#039;s High-End Equipment Sector\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"AI Catalyzes PCB Industry Growth in Both Volume and Price - 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