{"id":5054,"date":"2026-01-31T08:14:00","date_gmt":"2026-01-31T00:14:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=5054"},"modified":"2026-01-21T15:56:43","modified_gmt":"2026-01-21T07:56:43","slug":"cracked-vias-and-barrel-cracks-in-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/","title":{"rendered":"Gerissene Durchkontaktierungen und Trommelrisse in Leiterplatten"},"content":{"rendered":"<p>Rissige Durchkontaktierungen und Trommelrisse geh\u00f6ren zu den kritischsten <strong>latente Zuverl\u00e4ssigkeitsm\u00e4ngel<\/strong> in der PCB-Herstellung.<\/p><p>Diese Defekte bestehen oft die ersten elektrischen Tests, versagen aber sp\u00e4ter bei thermischer oder mechanischer Belastung, was sie bei Anwendungen mit hoher Zuverl\u00e4ssigkeit besonders gef\u00e4hrlich macht.<\/p><p>Dieser Artikel erkl\u00e4rt:<\/p><ul class=\"wp-block-list\"><li>Was sind Via-Risse und Fass-Risse?<\/li>\n\n<li>Warum sie auftreten<\/li>\n\n<li>Wie sie entdeckt werden<\/li>\n\n<li>Wie Hersteller ihr Auftreten reduzieren<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"337\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures.jpg\" alt=\"PCB-Fehlfunktionen\" class=\"wp-image-5055\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-300x169.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-18x10.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhalts\u00fcbersicht<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#What_Are_Via_Cracks_and_Barrel_Cracks\" >Was sind Via Cracks und Barrel Cracks?<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Via_Crack\" >\u00dcber Crack<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Barrel_Crack\" >Barrel Crack<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Why_Via_Cracks_Are_a_Serious_Reliability_Issue\" >Warum Risse im Via ein ernsthaftes Problem f\u00fcr die Zuverl\u00e4ssigkeit darstellen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Primary_Causes_of_Via_and_Barrel_Cracks\" >Hauptursachen f\u00fcr Via- und Barrel-Risse<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Z-Axis_Expansion_Mismatch\" >Fehlanpassung der Z-Achse<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Thin_or_Non-Uniform_Copper_Plating\" >D\u00fcnne oder ungleichm\u00e4\u00dfige Verkupferung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#High_Aspect_Ratio_Vias\" >Vias mit hohem Streckungsverh\u00e4ltnis<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Excessive_Thermal_Cycling\" >\u00dcberm\u00e4\u00dfiges thermisches Zyklieren<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Design_Factors_That_Increase_Via_Crack_Risk\" >Konstruktionsfaktoren, die das Rissrisiko erh\u00f6hen<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#High-Risk_Design_Choices\" >Hochriskante Designentscheidungen<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Manufacturing_Factors_Contributing_to_Via_Cracks\" >Herstellungsfaktoren, die zu Via-Rissen beitragen<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Drilling_Quality\" >Qualit\u00e4t der Bohrungen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Inadequate_Desmear_Process\" >Unzureichender Desmear-Prozess<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Plating_Stress_Control\" >Stresskontrolle bei der Beschichtung<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#How_Via_Cracks_Are_Detected\" >Wie Via Cracks erkannt werden<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Common_Detection_Methods\" >G\u00e4ngige Nachweismethoden<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Preventing_Cracked_Vias_and_Barrel_Cracks\" >Vorbeugung gegen gerissene Vias und Trommelrisse<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Design-Level_Prevention\" >Pr\u00e4vention auf Entwurfsebene<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Process-Level_Prevention\" >Pr\u00e4vention auf Prozessebene<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Material_Selection\" >Auswahl des Materials<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Relationship_to_Other_PCB_Failure_Modes\" >Beziehung zu anderen PCB-Fehlermodi<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Conclusion\" >Schlussfolgerung<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-24\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Via_Cracks_in_PCB_FAQ\" >Via-Risse in PCB FAQ<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Are_Via_Cracks_and_Barrel_Cracks\"><\/span>Was sind Via Cracks und Barrel Cracks?<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Via_Crack\"><\/span>\u00dcber Crack<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Ein Via-Riss ist ein Bruch in der Kupferbeschichtung eines Vias, typischerweise an:<\/p><ul class=\"wp-block-list\"><li>Das Knie der Via<\/li>\n\n<li>Die Schnittstelle zwischen Kupfer und Dielektrikum<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Barrel_Crack\"><\/span>Barrel Crack<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Ein Trommelriss bezieht sich speziell auf eine <strong>umlaufender Riss<\/strong> in der plattierten Via-Tonne.<\/p><p>Beide unterbrechen mit der Zeit die elektrische Kontinuit\u00e4t.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Why_Via_Cracks_Are_a_Serious_Reliability_Issue\"><\/span>Warum Risse im Via ein ernsthaftes Problem f\u00fcr die Zuverl\u00e4ssigkeit darstellen<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Via-Risse sind gef\u00e4hrlich, weil sie:<\/p><ul class=\"wp-block-list\"><li>sind oft intermittierend<\/li>\n\n<li>Verschlimmert sich bei Temperaturwechsel<\/li>\n\n<li>sind visuell schwer zu erkennen<\/li><\/ul><p>H\u00e4ufig treten sie erst nach dem Einsatz im Feld oder bei Belastungstests auf.<\/p><p><em>\u00dcberblick \u00fcber das Scheitern:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/de\/blog\/common-pcb-failures-causes-solutions\/\">H\u00e4ufige PCB-Fehler erkl\u00e4rt<\/a><\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Primary_Causes_of_Via_and_Barrel_Cracks\"><\/span>Hauptursachen f\u00fcr Via- und Barrel-Risse<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Z-Axis_Expansion_Mismatch\"><\/span>Fehlanpassung der Z-Achse<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Beim Erhitzen dehnen sich dielektrische Materialien in der Z-Achse st\u00e4rker aus als Kupfer.<\/p><p>Durch wiederholtes Ausdehnen und Zusammenziehen entstehen Spannungen in der H\u00fclse.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Thin_or_Non-Uniform_Copper_Plating\"><\/span>D\u00fcnne oder ungleichm\u00e4\u00dfige Verkupferung<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Eine unzureichende Schichtdicke verringert die F\u00e4higkeit der Durchkontaktierung, mechanische Belastungen zu absorbieren.<\/p><p> <em>Prozess-Detail:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/de\/blog\/copper-plating-process-in-pcb-manufacturing-explained\/\">Verkupferungsprozess in der PCB-Herstellung<\/a><\/strong><\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High_Aspect_Ratio_Vias\"><\/span>Vias mit hohem Streckungsverh\u00e4ltnis<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Durchkontaktierungen mit hohem Aspektverh\u00e4ltnis sind schwieriger gleichm\u00e4\u00dfig zu plattieren und unterliegen gr\u00f6\u00dferen Belastungen.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Excessive_Thermal_Cycling\"><\/span>\u00dcberm\u00e4\u00dfiges thermisches Zyklieren<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Wiederholte Exposition gegen\u00fcber:<\/p><ul class=\"wp-block-list\"><li>Reflow-L\u00f6ten<\/li>\n\n<li>Power Cycling<\/li>\n\n<li>\u00c4nderungen der Umgebungstemperatur<\/li><\/ul><p>Beschleunigt die Rissbildung.<\/p><p><em>Zuverl\u00e4ssigkeitstests:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-reliability-testing-standards\/\">Thermische Zuverl\u00e4ssigkeitstests f\u00fcr PCB<\/a><\/strong><\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"337\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-1.jpg\" alt=\"PCB-Fehlfunktionen\" class=\"wp-image-5056\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-1-300x169.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-1-18x10.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Design_Factors_That_Increase_Via_Crack_Risk\"><\/span>Konstruktionsfaktoren, die das Rissrisiko erh\u00f6hen<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Bestimmte Konstruktionsentscheidungen erh\u00f6hen das Risiko erheblich.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High-Risk_Design_Choices\"><\/span>Hochriskante Designentscheidungen<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Sehr kleine Via-Durchmesser<\/li>\n\n<li>Geringe Leiterplattendicke mit tiefen Durchkontaktierungen<\/li>\n\n<li>Gro\u00dfe Kupferfl\u00e4chen ohne Relief<\/li>\n\n<li>Dichte Via-in-Pad-Strukturen<\/li><\/ul><p>Die \u00dcberpr\u00fcfung der Zuverl\u00e4ssigkeit der Konstruktion ist entscheidend.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Factors_Contributing_to_Via_Cracks\"><\/span>Herstellungsfaktoren, die zu Via-Rissen beitragen<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Drilling_Quality\"><\/span>Qualit\u00e4t der Bohrungen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Bohrspuren, raue Lochw\u00e4nde oder Faserausbr\u00fcche schw\u00e4chen die Kupferhaftung.<\/p><p><em>Vergleich:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-drilling-vs-laser-drilling\/\">PCB-Bohren vs. Laserbohren<\/a><\/strong><\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Inadequate_Desmear_Process\"><\/span>Unzureichender Desmear-Prozess<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Schlechtes Desmear verhindert eine ordnungsgem\u00e4\u00dfe Kupferverbindung mit dem Dielektrikum.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Plating_Stress_Control\"><\/span>Stresskontrolle bei der Beschichtung<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Eine unsachgem\u00e4\u00dfe Beschichtungschemie kann zu inneren Spannungen in Kupferablagerungen f\u00fchren.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_Via_Cracks_Are_Detected\"><\/span>Wie Via Cracks erkannt werden<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Durchgangsrisse werden nur selten allein durch Oberfl\u00e4cheninspektion entdeckt.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_Detection_Methods\"><\/span>G\u00e4ngige Nachweismethoden<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Thermische Belastungstests<\/li>\n\n<li>Analyse von Mikroschnitten<\/li>\n\n<li>Elektrische Pr\u00fcfung nach dem Zyklus<\/li>\n\n<li>R\u00f6ntgeninspektion (begrenzte Wirksamkeit)<\/li><\/ul><p><em>\u00dcberblick \u00fcber die Inspektion:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-inspection-and-testing\/\">PCB Inspektion und Pr\u00fcfung erkl\u00e4rt<\/a><\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Preventing_Cracked_Vias_and_Barrel_Cracks\"><\/span>Vorbeugung gegen gerissene Vias und Trommelrisse<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Design-Level_Prevention\"><\/span>Pr\u00e4vention auf Entwurfsebene<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Angemessener Durchgangsdurchmesser<\/li>\n\n<li>Kontrolliertes Seitenverh\u00e4ltnis<\/li>\n\n<li>Thermische Entlastungsmuster<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Process-Level_Prevention\"><\/span>Pr\u00e4vention auf Prozessebene<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Optimierte Bohrparameter<\/li>\n\n<li>Gleichm\u00e4\u00dfige Kupferschichtdicke<\/li>\n\n<li>Spannungsgesteuerte Beschichtungschemie<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Material_Selection\"><\/span>Auswahl des Materials<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Materialien mit geringer Ausdehnung in der Z-Achse<\/li>\n\n<li>Hoch-Tg-Laminate f\u00fcr thermische Stabilit\u00e4t<\/li><\/ul><p>Hersteller wie TOPFAST integrieren \u00dcberlegungen zur Zuverl\u00e4ssigkeit fr\u00fchzeitig in die Prozessplanung.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"337\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-2.jpg\" alt=\"PCB-Fehlfunktionen\" class=\"wp-image-5057\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-2-300x169.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-2-18x10.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Relationship_to_Other_PCB_Failure_Modes\"><\/span>Beziehung zu anderen PCB-Fehlermodi<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Via Risse koexistieren oft mit:<\/p><ul class=\"wp-block-list\"><li>Delamination<\/li>\n\n<li>CAF-Bildung<\/li>\n\n<li>Intermittierende offene Stromkreise<\/li><\/ul><p><em>Verwandtes Thema:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/de\/blog\/pcb-delamination-causes-prevention\/\">PCB-Delamination - Ursachen und Pr\u00e4vention<\/a><\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Schlussfolgerung<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Rissige Durchkontaktierungen und Trommelrisse sind keine zuf\u00e4lligen Defekte, sondern vorhersehbare Ergebnisse von <strong>thermische Belastung, Konstruktionsentscheidungen und Prozessgrenzen<\/strong>.<\/p><p>Durch:<\/p><ul class=\"wp-block-list\"><li>Ordnungsgem\u00e4\u00dfe Entwurfspraktiken<\/li>\n\n<li>Kontrollierte Herstellungsprozesse<\/li>\n\n<li>Geeignete Materialauswahl<\/li><\/ul><p>Ihr Auftreten kann erheblich reduziert werden.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Via_Cracks_in_PCB_FAQ\"><\/span>Via-Risse in PCB FAQ<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1768981138484\"><strong class=\"schema-faq-question\">F: K\u00f6nnen Risse in der Oberfl\u00e4che repariert werden?<\/strong> <p class=\"schema-faq-answer\">A: Nein. Einmal gerissene Durchkontaktierungen lassen sich nicht zuverl\u00e4ssig reparieren.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1768981208332\"><strong class=\"schema-faq-question\">Q: <strong>F\u00fchren alle durchgehenden Risse zu einem sofortigen Ausfall?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: Nein. Viele sind latent und intermittierend.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1768981226138\"><strong class=\"schema-faq-question\">Q: <strong>Ist dickeres Kupfer immer besser?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: Nicht immer, aber eine ausreichende und gleichm\u00e4\u00dfige Dicke ist entscheidend.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1768981244482\"><strong class=\"schema-faq-question\">Q: <strong>Treten bei bleifreier Montage h\u00e4ufiger Durchkontaktierungsrisse auf?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: Ja, aufgrund der h\u00f6heren Reflow-Temperaturen.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1768981259852\"><strong class=\"schema-faq-question\">Q: <strong>Kann R\u00f6ntgenstrahlung \u00fcber Risse erkennen?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: Normalerweise nicht, es sei denn, die Risse sind schwerwiegend.<\/p> <\/div> <\/div>","protected":false},"excerpt":{"rendered":"<p>Rissige Durchkontaktierungen und tonnenf\u00f6rmige Risse sind h\u00e4ufige PCB-Fehler. Dieser Artikel befasst sich mit den Ursachen, den Erkennungstechniken und den Pr\u00e4ventivma\u00dfnahmen, die die Hersteller zur Gew\u00e4hrleistung der Zuverl\u00e4ssigkeit einsetzen.<\/p>","protected":false},"author":1,"featured_media":5058,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[108],"tags":[438],"class_list":["post-5054","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb-failures"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Cracked Vias and Barrel Cracks in PCB: Causes, Detection, and Prevention<\/title>\n<meta name=\"description\" content=\"Cracked vias and barrel cracks are common PCB reliability failures. 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severe.","inLanguage":"de"},"inLanguage":"de"}]}},"_links":{"self":[{"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/posts\/5054","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/comments?post=5054"}],"version-history":[{"count":1,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/posts\/5054\/revisions"}],"predecessor-version":[{"id":5059,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/posts\/5054\/revisions\/5059"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/media\/5058"}],"wp:attachment":[{"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/media?parent=5054"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/categories?post=5054"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/de\/wp-json\/wp\/v2\/tags?post=5054"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}