{"id":5893,"date":"2026-07-05T08:36:00","date_gmt":"2026-07-05T00:36:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=5893"},"modified":"2026-06-24T16:50:40","modified_gmt":"2026-06-24T08:50:40","slug":"high-tg-fr4-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/","title":{"rendered":"Leitfaden zu FR4-Leiterplattenmaterial mit hohem TG-Wert"},"content":{"rendered":"<p>\u201eFR4 mit hohem TG\u201c bezeichnet eine Klasse von Epoxid-Glasfaser-Laminaten mit einer erh\u00f6hten Glas\u00fcbergangstemperatur. In der Praxis <a href=\"https:\/\/www.topfastpcb.com\/de\/pcb-manufacturing\/\">PCB-Herstellung<\/a>, TG ist einer der wichtigsten Parameter, der das Verhalten einer Leiterplatte unter thermischer Belastung bestimmt, insbesondere beim bleifreien L\u00f6ten und beim langfristigen Betrieb bei hohen Temperaturen.<\/p><p>Im Vergleich zu herk\u00f6mmlichem FR4 bieten Materialien mit hohem TG eine bessere strukturelle Stabilit\u00e4t und werden h\u00e4ufig in Anwendungen eingesetzt, bei denen die thermische Zuverl\u00e4ssigkeit von entscheidender Bedeutung ist.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/High-TG-FR4-PCB-Material.jpg\" alt=\"FR4-Leiterplattenmaterial mit hohem TG-Wert\" class=\"wp-image-5894\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/High-TG-FR4-PCB-Material.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/High-TG-FR4-PCB-Material-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/High-TG-FR4-PCB-Material-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhalts\u00fcbersicht<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#What_TG_Means_in_PCB_Materials\" >Was TG bei Leiterplattenmaterialien bedeutet<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Standard_TG_vs_High_TG_FR4\" >FR4 mit Standard-TG im Vergleich zu FR4 mit hohem TG<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Standard_TG_FR4\" >Standard-TG FR4<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Mid_TG_FR4\" >Mid TG FR4<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#High_TG_FR4\" >FR4 mit hohem Glas\u00fcbergangspunkt<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Why_High_TG_FR4_Matters_in_PCB_Manufacturing\" >Warum FR4 mit hohem TG-Wert bei der Leiterplattenherstellung wichtig ist<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Electrical_and_Mechanical_Properties\" >Elektrische und mechanische Eigenschaften<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Where_High_TG_FR4_Is_Used\" >Anwendungsbereiche von FR4 mit hohem TG-Wert<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Automotive_Electronics\" >Kfz-Elektronik<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Power_Electronics\" >Leistungselektronik<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Communication_Systems\" >Kommunikationssysteme<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Server_and_Data_Systems\" >Server und Datensysteme<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Manufacturing_Considerations\" >\u00dcberlegungen zur Herstellung<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Drilling_and_Via_Reliability\" >Bohr- und Via-Zuverl\u00e4ssigkeit<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Lamination_Process\" >Lamination Prozess<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Reflow_Resistance\" >Reflow-Best\u00e4ndigkeit<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#High_TG_FR4_vs_Standard_FR4\" >FR4 mit hohem TG im Vergleich zu Standard-FR4<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Limitations_of_High_TG_FR4\" >Einschr\u00e4nkungen von FR4 mit hohem TG-Wert<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Material_Selection_Strategy\" >Strategie der Materialauswahl<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#Common_High_TG_FR4_Suppliers\" >G\u00e4ngige Lieferanten von FR4 mit hohem TG-Wert<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/de\/blog\/high-tg-fr4-pcb\/#FAQ\" >FAQ<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_TG_Means_in_PCB_Materials\"><\/span>Was TG bei Leiterplattenmaterialien bedeutet<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Die TG (Glas\u00fcbergangstemperatur) ist der Punkt, an dem das Epoxidharz beginnt, von einem starren, glasartigen Zustand in einen weicheren, gummiartigen Zustand \u00fcberzugehen.<\/p><p>Unterhalb der TG bleibt das Material stabil und mechanisch fest. Oberhalb der TG beginnt das Material, sich schneller auszudehnen, und verliert an Steifigkeit.<\/p><p>Beim Leiterplattenentwurf wirkt sich dies unmittelbar auf Folgendes aus:<\/p><ul class=\"wp-block-list\"><li>Formstabilit\u00e4t<\/li>\n\n<li>\u00dcber Zuverl\u00e4ssigkeit<\/li>\n\n<li>Ausrichtung der Ebenen<\/li>\n\n<li>Langfristige mechanische Festigkeit<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Standard_TG_vs_High_TG_FR4\"><\/span>FR4 mit Standard-TG im Vergleich zu FR4 mit hohem TG<span class=\"ez-toc-section-end\"><\/span><\/h2><p>FR4-Materialien werden im Allgemeinen in drei Kategorien unterteilt:<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Standard_TG_FR4\"><\/span>Standard-TG FR4<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>TG bei ca. 130 \u00b0C\u2013140 \u00b0C<\/li>\n\n<li>Geeignet f\u00fcr allgemeine Elektronik<\/li>\n\n<li>H\u00e4ufig in preisg\u00fcnstigen Konsumg\u00fctern anzutreffen<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Mid_TG_FR4\"><\/span>Mid TG FR4<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>TG bei ca. 150 \u00b0C\u2013160 \u00b0C<\/li>\n\n<li>Ausgewogenes Verh\u00e4ltnis zwischen Leistung und Kosten<\/li>\n\n<li>Einsatz in der Industrieelektronik<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High_TG_FR4\"><\/span>FR4 mit hohem Glas\u00fcbergangspunkt<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>TG \u2265 170 \u00b0C<\/li>\n\n<li>Entwickelt f\u00fcr Umgebungen mit hoher thermischer Belastung<\/li>\n\n<li>H\u00e4ufig in Anwendungen mit hohen Zuverl\u00e4ssigkeitsanforderungen eingesetzt<\/li><\/ul><p>Materialien mit hohem TG-Wert behalten ihre strukturelle Integrit\u00e4t auch nach mehreren Reflow-Zyklen bei und eignen sich daher f\u00fcr moderne SMT-Prozesse.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Why_High_TG_FR4_Matters_in_PCB_Manufacturing\"><\/span>Warum FR4 mit hohem TG-Wert bei der Leiterplattenherstellung wichtig ist<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Da Leiterplattenbaugruppen immer komplexer werden, hat die thermische Belastung w\u00e4hrend der Produktion und im Betrieb erheblich zugenommen.<\/p><p>Materialien mit hohem TG-Wert tragen dazu bei, Folgendes zu reduzieren:<\/p><ul class=\"wp-block-list\"><li>Zersetzung des Harzes beim L\u00f6ten<\/li>\n\n<li>Risiken der Delaminierung<\/li>\n\n<li>\u00dcber das Knacken<\/li>\n\n<li>Verformungen in mehrschichtigen Strukturen<\/li><\/ul><p>Au\u00dferdem verbessern sie die langfristige Zuverl\u00e4ssigkeit in rauen Umgebungen.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Electrical_and_Mechanical_Properties\"><\/span>Elektrische und mechanische Eigenschaften<span class=\"ez-toc-section-end\"><\/span><\/h2><p>FR4 mit hohem TG weist im Allgemeinen \u00e4hnliche elektrische Eigenschaften wie Standard-FR4 auf, verf\u00fcgt jedoch \u00fcber ein verbessertes thermisches Verhalten.<\/p><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><th>Eigentum<\/th><th>Typischer Bereich<\/th><\/tr><tr><td>TG<\/td><td>\u2265170 \u00b0C<\/td><\/tr><tr><td>Dielektrizit\u00e4tskonstante (Dk)<\/td><td>4,2\u20134,7<\/td><\/tr><tr><td>Verlustfaktor (Df)<\/td><td>0,015\u20130,020<\/td><\/tr><tr><td>W\u00e4rmeausdehnung (Z-Achse)<\/td><td>Niedriger als bei Standard-FR4<\/td><\/tr><tr><td>Zersetzungstemperatur<\/td><td>~300 \u00b0C<\/td><\/tr><\/tbody><\/table><\/figure><p>Die wichtigste Verbesserung ist die geringere Ausdehnung in der Z-Achse, was sich direkt auf die Zuverl\u00e4ssigkeit auswirkt.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/High-TG-FR4-PCB-Material-1.jpg\" alt=\"FR4-Leiterplattenmaterial mit hohem TG-Wert\" class=\"wp-image-5895\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/High-TG-FR4-PCB-Material-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/High-TG-FR4-PCB-Material-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/High-TG-FR4-PCB-Material-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Where_High_TG_FR4_Is_Used\"><\/span>Anwendungsbereiche von FR4 mit hohem TG-Wert<span class=\"ez-toc-section-end\"><\/span><\/h2><p>FR4 mit hohem TG-Wert ist nicht f\u00fcr jedes Produkt erforderlich, wird jedoch unverzichtbar, wenn die Anforderungen an die Zuverl\u00e4ssigkeit steigen oder die Temperaturen zunehmen.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Automotive_Electronics\"><\/span>Kfz-Elektronik<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Moderne Fahrzeuge sind in hohem Ma\u00dfe auf elektronische Steuerungssysteme angewiesen, die hohen Temperaturen unter der Motorhaube ausgesetzt sind.<\/p><p>Die Anwendungen umfassen:<\/p><ul class=\"wp-block-list\"><li>Motorsteuerger\u00e4te (ECU)<\/li>\n\n<li>Servolenkungssysteme<\/li>\n\n<li>Batterie-Management-Systeme (BMS)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Power_Electronics\"><\/span>Leistungselektronik<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Materialien mit hohem TG-Wert finden breite Anwendung in:<\/p><ul class=\"wp-block-list\"><li>Schaltnetzteile<\/li>\n\n<li>Wechselrichter<\/li>\n\n<li>Industrielle Leistungsmodule<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Communication_Systems\"><\/span>Kommunikationssysteme<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Verwendet in:<\/p><ul class=\"wp-block-list\"><li>Basisstationsplatinen<\/li>\n\n<li>Netzwerkinfrastruktur-Ger\u00e4te<\/li>\n\n<li>Optische Module<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Server_and_Data_Systems\"><\/span>Server und Datensysteme<span class=\"ez-toc-section-end\"><\/span><\/h3><p>FR4 mit hohem TG-Wert kommt h\u00e4ufig vor in:<\/p><ul class=\"wp-block-list\"><li>Server-Motherboards<\/li>\n\n<li>Lagersysteme<\/li>\n\n<li>Rechenplatinen mit hoher Packungsdichte<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Considerations\"><\/span>\u00dcberlegungen zur Herstellung<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Die Verwendung von Materialien mit hohem TG wirkt sich in mehrfacher Hinsicht auf die Leiterplattenherstellung aus.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Drilling_and_Via_Reliability\"><\/span>Bohr- und Via-Zuverl\u00e4ssigkeit<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Eine geringere Ausdehnung der Z-Achse verbessert die Zuverl\u00e4ssigkeit der Durchflussd\u00fcse bei Temperaturwechselbeanspruchung.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Lamination_Process\"><\/span>Lamination Prozess<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Materialien mit hohem TG-Wert erfordern h\u00e4ufig:<\/p><ul class=\"wp-block-list\"><li>H\u00f6herer Laminierdruck<\/li>\n\n<li>Gesteuerte Heizprofile<\/li>\n\n<li>Strenge Steuerung des Harzflusses<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Reflow_Resistance\"><\/span>Reflow-Best\u00e4ndigkeit<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Die Leiterplatten m\u00fcssen mehreren SMT-Reflow-Zyklen standhalten, ohne dass es zu Delaminationen oder Blasenbildung kommt.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High_TG_FR4_vs_Standard_FR4\"><\/span>FR4 mit hohem TG im Vergleich zu Standard-FR4<span class=\"ez-toc-section-end\"><\/span><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td>Merkmal<\/td><td>Standard FR4<\/td><td>FR4 mit hohem Glas\u00fcbergangspunkt<\/td><\/tr><tr><td>TG-Wert<\/td><td>130\u2013140 \u00b0C<\/td><td>\u2265170 \u00b0C<\/td><\/tr><tr><td>Thermische Stabilit\u00e4t<\/td><td>M\u00e4\u00dfig<\/td><td>Hoch<\/td><\/tr><tr><td>Kosten<\/td><td>Unter<\/td><td>Etwas h\u00f6her<\/td><\/tr><tr><td>Verl\u00e4sslichkeit<\/td><td>Allgemeine Verwendung<\/td><td>Hohe Zuverl\u00e4ssigkeit<\/td><\/tr><tr><td>Eignung f\u00fcr die SMT-Montage<\/td><td>Grundlegend<\/td><td>Erweiterter Multi-Reflow<\/td><\/tr><\/tbody><\/table><\/figure><p>Der Kostenunterschied ist im Vergleich zur Verbesserung der Zuverl\u00e4ssigkeit relativ gering.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Limitations_of_High_TG_FR4\"><\/span>Einschr\u00e4nkungen von FR4 mit hohem TG-Wert<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Obwohl ein hoher TG-Wert die thermische Leistung verbessert, basieren diese Materialien nach wie vor auf Epoxidharzsystemen.<\/p><p>Zu den Beschr\u00e4nkungen geh\u00f6ren:<\/p><ul class=\"wp-block-list\"><li>H\u00f6here dielektrische Verluste bei hohen Frequenzen<\/li>\n\n<li>Nicht f\u00fcr Mikrowellenkonstruktionen geeignet<\/li>\n\n<li>Eingeschr\u00e4nkte Leistung oberhalb von mehreren GHz<\/li>\n\n<li>Die W\u00e4rmeleitf\u00e4higkeit ist nach wie vor relativ gering<\/li><\/ul><p>F\u00fcr HF- oder Ultrahochgeschwindigkeitsanwendungen werden verlustarme Materialien wie Rogers oder Megtron bevorzugt.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Material_Selection_Strategy\"><\/span>Strategie der Materialauswahl<span class=\"ez-toc-section-end\"><\/span><\/h2><p>In der Praxis der Leiterplattenentwicklung stellt FR4 mit hoher Glas\u00fcbergangstemperatur oft einen \u201eKompromiss\u201c dar.<\/p><p>Eine typische Auswahllogik lautet:<\/p><ul class=\"wp-block-list\"><li>Kosteng\u00fcnstige Elektronik \u2192 Standard-FR4<\/li>\n\n<li>Industrie \/ Automobilindustrie \u2192 FR4 mit hohem Glas\u00fcbergangspunkt<\/li>\n\n<li>Hochgeschwindigkeits-\/HF-Leitungen \u2192 Rogers oder PTFE<\/li>\n\n<li>Ultraschnelle Backplanes \u2192 Megtron oder Isola High-Speed-Serien<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/High-TG-FR4-PCB-Material-2.jpg\" alt=\"FR4-Leiterplattenmaterial mit hohem TG-Wert\" class=\"wp-image-5896\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/High-TG-FR4-PCB-Material-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/High-TG-FR4-PCB-Material-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/High-TG-FR4-PCB-Material-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_High_TG_FR4_Suppliers\"><\/span>G\u00e4ngige Lieferanten von FR4 mit hohem TG-Wert<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Mehrere Laminathersteller bieten weit verbreitete Materialien mit hohem TG an:<\/p><ul class=\"wp-block-list\"><li>Shengyi<\/li>\n\n<li>Kingboard<\/li>\n\n<li>ITEQ<\/li>\n\n<li>Insel<\/li>\n\n<li>Ventec<\/li><\/ul><p>Jeder Anbieter hat mehrere TG-Typen im Sortiment, die unterschiedlichen Leistungs- und Kostenanforderungen gerecht werden.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"FAQ\"><\/span>FAQ<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1782283350742\"><strong class=\"schema-faq-question\">F: Ist FR4 mit hohem TG-Wert immer besser als Standard-FR4?<\/strong> <p class=\"schema-faq-answer\">A: Nicht immer. Ein hoher TG-Wert ist nur dann erforderlich, wenn die Leiterplatte einer h\u00f6heren thermischen Belastung oder mehreren Reflow-Zyklen ausgesetzt ist.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1782283361368\"><strong class=\"schema-faq-question\">F: Verbessert FR4 mit hohem TG-Wert die Signalqualit\u00e4t?<\/strong> <p class=\"schema-faq-answer\">A: Nicht wesentlich. Es verbessert vor allem die thermische und mechanische Zuverl\u00e4ssigkeit und weniger die Hochfrequenzleistung.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1782283520743\"><strong class=\"schema-faq-question\">F: Ab welchem TG-Wert spricht man von einem hohen TG-Wert?<\/strong> <p class=\"schema-faq-answer\">A: In der Regel werden Materialien mit einer TG von \u2265 170 \u00b0C als FR4 mit hoher TG eingestuft.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1782283531090\"><strong class=\"schema-faq-question\">F: Ist FR4 mit hohem TG teurer?<\/strong> <p class=\"schema-faq-answer\">A: Ja, aber der Preisunterschied ist im Vergleich zu Standard-FR4 in der Regel gering.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1782283586027\"><strong class=\"schema-faq-question\">F: Kann FR4 mit hohem TG-Wert bei der Entwicklung von Hochgeschwindigkeits-Leiterplatten verwendet werden?<\/strong> <p class=\"schema-faq-answer\">A: Es kann f\u00fcr Anwendungen mit m\u00e4\u00dfiger \u00dcbertragungsgeschwindigkeit verwendet werden, f\u00fcr HF-Signale oder Signale mit sehr hoher \u00dcbertragungsgeschwindigkeit sind jedoch verlustarme Laminate vorzuziehen.<\/p> <\/div> <\/div>","protected":false},"excerpt":{"rendered":"<p>High TG FR4 is designed for PCB applications requiring improved thermal stability and reliability. It reduces warpage, improves via performance, and is widely used in automotive, power electronics, and server systems. 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