{"id":2334,"date":"2025-05-05T18:01:35","date_gmt":"2025-05-05T09:31:35","guid":{"rendered":"http:\/\/topfastpcbb.ru\/?p=2334"},"modified":"2025-05-06T14:46:44","modified_gmt":"2025-05-06T06:16:44","slug":"8-layer-pcb-stackup","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/es\/blog\/8-layer-pcb-stackup\/","title":{"rendered":"Apilamiento de PCB de 8 capas"},"content":{"rendered":"<p>La estructura laminada de PCB de 8 capas generalmente incluye capa de se\u00f1al, capa de potencia y capa de tierra, la disposici\u00f3n espec\u00edfica y los principios de dise\u00f1o son los siguientes<\/p><p>Capa de se\u00f1al: Por lo general, incluye la capa superior (TOP), la capa inferior (Bottom) y la capa de se\u00f1al en el medio (por ejemplo, Signal2, Signal3, etc.). La capa de se\u00f1al se utiliza principalmente para cablear y transmitir se\u00f1ales el\u00e9ctricas.<\/p><p>Capa de alimentaci\u00f3n: Por lo general, incluye una o m\u00e1s capas de potencia (por ejemplo, Power1, Power2, etc.), que se utilizan para proporcionar una fuente de alimentaci\u00f3n estable. La capa de la fuente de alimentaci\u00f3n es adyacente a la capa de tierra para realizar mejor el acoplamiento entre la fuente de alimentaci\u00f3n y la tierra, y para reducir la impedancia entre el plano de potencia y el plano de tierra.<\/p><p>Capa de tierra: incluye una o m\u00e1s capas de tierra (por ejemplo, Tierra1, Tierra2, etc.), que se utilizan principalmente para proporcionar un plano de referencia de tierra estable y reducir la interferencia electromagn\u00e9tica. El plano de tierra es adyacente al plano de potencia para proporcionar una mejor integridad de la se\u00f1al.<\/p><h2><a href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-design-principles\/\">Principios de dise\u00f1o<\/a> y Acuerdos Comunes<\/h2><p>La capa adyacente al chip principal es el plano de tierra: proporciona un plano de referencia estable para el chip principal y reduce las interferencias.<br>Todas las capas de se\u00f1al est\u00e1n adyacentes al plano de tierra tanto como sea posible: proporciona una mejor integridad de la se\u00f1al.<br>Evite en la medida de lo posible dos capas de se\u00f1al directamente adyacentes entre s\u00ed: reduzca las interferencias de la se\u00f1al.<br>La fuente de alimentaci\u00f3n principal est\u00e1 adyacente a su plano de tierra correspondiente tanto como sea posible: para reducir la impedancia entre el plano de potencia y el plano de tierra.<br>Dise\u00f1o de estructura sim\u00e9trica: el espesor y el tipo de capa diel\u00e9ctrica, el espesor de la l\u00e1mina de cobre y el tipo de distribuci\u00f3n gr\u00e1fica deben ser sim\u00e9tricos para minimizar el impacto de la asimetr\u00eda.<br><\/p><h2>Ejemplos comunes de dise\u00f1o y uso de herramientas<\/h2><p>Dise\u00f1o de capa apilada com\u00fan: como TOP-Gnd-Signal-Power-Gnd-Signal-Gnd-Bottom, etc. Este dise\u00f1o puede proporcionar una mejor integridad de la se\u00f1al y compatibilidad electromagn\u00e9tica.<br>Uso de la herramienta Huaqiu DFM: esta herramienta ayuda a calcular la impedancia, seleccionar el ancho y el espaciado de l\u00ednea adecuados y garantizar la precisi\u00f3n del dise\u00f1o.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"591\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1.jpg\" alt=\"\" class=\"wp-image-2363\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1-300x296.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1-100x100.jpg 100w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Tabla de contenidos<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/8-layer-pcb-stackup\/#8-Layer_PCB_Stackup_Design_Analysis\" >An\u00e1lisis de dise\u00f1o de apilamiento de PCB de 8 capas<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/8-layer-pcb-stackup\/#Option_1_Six_Signal_Layer_Design_Not_Recommended\" >Opci\u00f3n 1: Dise\u00f1o de seis capas de se\u00f1al (no recomendado)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/8-layer-pcb-stackup\/#Option_2_Four_Signal_Layer_Design_Recommended\" >Opci\u00f3n 2: Dise\u00f1o de cuatro capas de se\u00f1al (recomendado)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/8-layer-pcb-stackup\/#Option_3_Optimal_Four_Signal_Layer_Design_Highly_Recommended\" >Opci\u00f3n 3: Dise\u00f1o \u00f3ptimo de cuatro capas de se\u00f1al (muy recomendable)<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"8-Layer_PCB_Stackup_Design_Analysis\"><\/span>An\u00e1lisis de dise\u00f1o de apilamiento de PCB de 8 capas<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_1_Six_Signal_Layer_Design_Not_Recommended\"><\/span>Opci\u00f3n 1: Dise\u00f1o de seis capas de se\u00f1al (no recomendado)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Caracter\u00edsticas de la estructura<\/strong>:<\/p><ol class=\"wp-block-list\"><li><strong>Capa superior<\/strong>: Se\u00f1al 1 (Lado del componente\/capa de enrutamiento Microstrip)<\/li>\n\n<li><strong>Capa interior<\/strong>: Se\u00f1al 2 (microstrip de direcci\u00f3n X, capa de enrutamiento premium)<\/li>\n\n<li><strong>Capa interior<\/strong>: Tierra (Plano de tierra)<\/li>\n\n<li><strong>Capa interior<\/strong>: Se\u00f1al 3 (l\u00ednea de banda en direcci\u00f3n Y, capa de enrutamiento premium)<\/li>\n\n<li><strong>Capa interior<\/strong>: Se\u00f1al 4 (capa de enrutamiento de l\u00ednea de banda)<\/li>\n\n<li><strong>Capa interior<\/strong>: Potencia (Plano de potencia)<\/li>\n\n<li><strong>Capa interior<\/strong>: Se\u00f1al 5 (capa de enrutamiento Microstrip)<\/li>\n\n<li><strong>Capa inferior<\/strong>: Se\u00f1al 6 (capa de enrutamiento Microstrip)<\/li><\/ol><p><strong>An\u00e1lisis de inconvenientes<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Mala absorci\u00f3n electromagn\u00e9tica<\/li>\n\n<li>Impedancia de alta potencia<\/li>\n\n<li>Rutas de retorno de se\u00f1al incompletas<\/li>\n\n<li>Rendimiento EMI inferior<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_2_Four_Signal_Layer_Design_Recommended\"><\/span>Opci\u00f3n 2: Dise\u00f1o de cuatro capas de se\u00f1al (recomendado)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Caracter\u00edsticas mejoradas<\/strong>:<\/p><ol class=\"wp-block-list\"><li><strong>Capa superior<\/strong>: Se\u00f1al 1 (Lado del componente\/Microstrip, capa de enrutamiento premium)<\/li>\n\n<li><strong>Capa interior<\/strong>: Tierra (plano de tierra de baja impedancia, excelente absorci\u00f3n EM)<\/li>\n\n<li><strong>Capa interior<\/strong>: Se\u00f1al 2 (Stripline, capa de enrutamiento premium)<\/li>\n\n<li><strong>Capa interior<\/strong>: Potencia (acoplamiento capacitivo formador de plano de potencia con tierra adyacente)<\/li>\n\n<li><strong>Capa interior<\/strong>: Tierra (Plano de tierra)<\/li>\n\n<li><strong>Capa interior<\/strong>: Se\u00f1al 3 (Stripline, capa de enrutamiento premium)<\/li>\n\n<li><strong>Capa interior<\/strong>: Potencia (Plano de potencia)<\/li>\n\n<li><strong>Capa inferior<\/strong>: Se\u00f1al 4 (Microstrip, capa de enrutamiento premium)<\/li><\/ol><p><strong>Ventajas<\/strong>:<br>? Plano de referencia dedicado para cada capa de se\u00f1al<br>? Control preciso de la impedancia (\u00b110%)<br>? Reducci\u00f3n de la diafon\u00eda (enrutamiento ortogonal entre capas adyacentes)<br>? Mejora del 40% en la integridad de la energ\u00eda<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_3_Optimal_Four_Signal_Layer_Design_Highly_Recommended\"><\/span>Opci\u00f3n 3: Dise\u00f1o \u00f3ptimo de cuatro capas de se\u00f1al (muy recomendable)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Estructura de la Regla de Oro<\/strong>:<\/p><ol class=\"wp-block-list\"><li><strong>Capa superior<\/strong>: Se\u00f1al 1 (Lado del componente\/Microstrip)<\/li>\n\n<li><strong>Capa interior<\/strong>: Tierra (plano de tierra s\u00f3lida)<\/li>\n\n<li><strong>Capa interior<\/strong>: Se\u00f1al 2 (Stripline)<\/li>\n\n<li><strong>Capa interior<\/strong>: Potencia (Plano de potencia)<\/li>\n\n<li><strong>Capa interior<\/strong>: Tierra (plano de tierra del n\u00facleo)<\/li>\n\n<li><strong>Capa interior<\/strong>: Se\u00f1al 3 (L\u00ednea de banda)<\/li>\n\n<li><strong>Capa interior<\/strong>: Tierra (Plano de tierra blindado)<\/li>\n\n<li><strong>Capa inferior<\/strong>: Se\u00f1al 4 (Microstrip)<\/li><\/ol><p><strong>Rendimiento sobresaliente<\/strong>:<br>\u2605 Cinco planos de tierra proporcionan un blindaje EM perfecto<br>\u2605 Espaciado entre alimentaci\u00f3n y tierra de &lt;3 mil\u00e9simas de pulgada para un desacoplamiento \u00f3ptimo<br>\u2605 La distribuci\u00f3n sim\u00e9trica de las capas evita la deformaci\u00f3n<br>\u2605 Admite se\u00f1alizaci\u00f3n de alta velocidad de 20 Gbps<\/p><p><strong>Recomendaciones de dise\u00f1o<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Enrute primero las se\u00f1ales cr\u00edticas en las capas de l\u00ednea de banda S2\/S3<\/li>\n\n<li>Dise\u00f1o de plano de potencia dividido para implementos<\/li>\n\n<li>Limite los trazos de la capa superior\/inferior a &lt;5 mm de longitud<\/li>\n\n<li>Mantener el enrutamiento ortogonal entre capas de se\u00f1al adyacentes<\/li><\/ol><h2><strong>Referencia de espesor de apilamiento<\/strong><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>La capa<\/th><th>Material<\/th><th>Espesor (mil)<\/th><\/tr><\/thead><tbody><tr><td>1-2<\/td><td>FR4<\/td><td>3.2<\/td><\/tr><tr><td>2-3<\/td><td>1080PP<\/td><td>4.5<\/td><\/tr><tr><td>4-5<\/td><td>n\u00facleo<\/td><td>8.0<\/td><\/tr><tr><td>6-7<\/td><td>2116PP<\/td><td>5.2<\/td><\/tr><tr><td>7-8<\/td><td>FR4<\/td><td>3.2<\/td><\/tr><\/tbody><\/table><\/figure><p>Nota: Todos los dise\u00f1os deben incorporar v\u00edas ciegas\/enterradas para una utilizaci\u00f3n \u00f3ptima del espacio de enrutamiento.<\/p>","protected":false},"excerpt":{"rendered":"<p>Una pila de PCB de 8 capas t\u00edpicamente consiste de se\u00f1al, alimentaci\u00f3n y capas de tierra.<\/p>","protected":false},"author":1,"featured_media":2364,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[216,215],"class_list":["post-2334","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-8-layer-pcb","tag-8-layer-pcb-stackup"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - 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