{"id":3727,"date":"2025-07-30T17:42:23","date_gmt":"2025-07-30T09:42:23","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=3727"},"modified":"2025-07-30T17:45:43","modified_gmt":"2025-07-30T09:45:43","slug":"minimum-line-width-and-line-spacing-for-pcb-circuit-boards","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/","title":{"rendered":"Anchura m\u00ednima de l\u00ednea y espaciado de l\u00ednea para PCB"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Tabla de contenidos<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#What_are_PCB_trace_width_and_trace_spacing\" >\u00bfQu\u00e9 son la anchura de traza y la distancia entre trazas en PCB?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#1_Industry_Standard_Minimum_Trace_Width_and_Spacing\" >1. Anchura y espaciado m\u00ednimos de las trazas est\u00e1ndar del sector<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#11_Conventional_Process_Capabilities\" >1.1 Capacidades de proceso convencionales<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#12_Advanced_Processes_HDI\" >1.2 Procesos avanzados (IDH)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#13_Extreme_Challenges\" >1.3 Desaf\u00edos extremos<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#2_Four_Key_Factors_Influencing_Trace_WidthSpacing_Selection\" >2. Cuatro factores clave que influyen en la selecci\u00f3n de la anchura\/espaciado de las trazas<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#21_Current_Carrying_Capacity_and_Temperature_Rise\" >2.1 Capacidad de carga actual y aumento de la temperatura<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#22_Signal_Integrity\" >2.2 Integridad de la se\u00f1al<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#23_Manufacturing_Process_and_Cost\" >2.3 Proceso de fabricaci\u00f3n y coste<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#24_Layout_Density_and_BGA_Design\" >2.4 Densidad de disposici\u00f3n y dise\u00f1o BGA<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#3_PCB_Design_Optimization_Strategies\" >3. Estrategias de optimizaci\u00f3n del dise\u00f1o de PCB<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#31_Layer_Strategy\" >3.1 Estrategia de capas<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#32_Avoid_Common_Mistakes\" >3.2 Evitar errores comunes<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#33_Cost_Balancing\" >3.3 Equilibrio de costes<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#4_PCB_Design_Spacing_Specifications\" >4. Especificaciones de espaciado de dise\u00f1o de PCB<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#1_Traces\" >1. Trazas<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#2_Vias\" >2. V\u00edas<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#3_PTH_Pads_Plated_Through-Holes\" >3. Almohadillas PTH (agujeros pasantes chapados)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#4_Solder_Mask\" >4. M\u00e1scara de soldadura<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#5_Silkscreen_Text\" >5. Serigraf\u00eda (texto)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#6_Non-Plated_Slots\" >6. Ranuras no chapadas<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#7_Panelization\" >7. Panelizaci\u00f3n<\/a><\/li><\/ul><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_are_PCB_trace_width_and_trace_spacing\"><\/span>\u00bfQu\u00e9 son la anchura de traza y la distancia entre trazas en PCB?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>En <a href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-design-principles\/\">dise\u00f1o de placas de circuito impreso (PCB),<\/a> <strong>ancho de trazo<\/strong> y <strong>distancia entre trazos<\/strong> son dos par\u00e1metros fundamentales pero cr\u00edticos:<\/p><ul class=\"wp-block-list\"><li><strong>Ancho de traza<\/strong>: La anchura de la l\u00e1mina de cobre conductora, que determina la capacidad de conducci\u00f3n de corriente y el aumento de temperatura.<\/li>\n\n<li><strong>Espacio entre trazas<\/strong>: La distancia entre trazas adyacentes, que afecta al aislamiento de la se\u00f1al y a los riesgos de cortocircuito.<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width.jpg\" alt=\"Anchura de l\u00ednea PCB\" class=\"wp-image-3728\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Industry_Standard_Minimum_Trace_Width_and_Spacing\"><\/span>1. Anchura y espaciado m\u00ednimos de las trazas est\u00e1ndar del sector<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"11_Conventional_Process_Capabilities\"><\/span>1.1 Capacidades de proceso convencionales<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Principales fabricantes<\/strong>: M\u00e1s de 80% puede producir de forma estable dise\u00f1os con <strong>6 mil\/6 mil<\/strong> (0,15 mm\/0,15 mm) a menor coste.<\/li>\n\n<li><strong>Fabricantes de alta precisi\u00f3n<\/strong>: Soporte 70% <strong>4 mil\/4 mil<\/strong> (0,1 mm\/0,1 mm), adecuado para la mayor\u00eda de los dise\u00f1os de alta densidad.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"12_Advanced_Processes_HDI\"><\/span>1.2 Procesos avanzados (IDH)<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Taladrado l\u00e1ser Tecnolog\u00eda Microvia<\/strong>: Admite <strong>2 mil\/2 mil<\/strong> (0,05 mm\/0,05 mm), utilizados en aplicaciones ultrafinas de alta densidad como smartphones y m\u00f3dulos de radiofrecuencia, pero los costes aumentan considerablemente.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"13_Extreme_Challenges\"><\/span>1.3 Desaf\u00edos extremos<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>3,5 mil\/3,5 mil<\/strong> (0,09 mm\/0,09 mm) est\u00e1 limitado a unos pocos fabricantes y requiere estrictas pruebas de rendimiento.<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Four_Key_Factors_Influencing_Trace_WidthSpacing_Selection\"><\/span>2. Cuatro factores clave que influyen en la selecci\u00f3n de la anchura\/espaciado de las trazas<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"21_Current_Carrying_Capacity_and_Temperature_Rise\"><\/span>2.1 Capacidad de carga actual y aumento de la temperatura<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>F\u00f3rmula de referencia<\/strong>: Seg\u00fan la norma IPC-2221, la anchura de la traza debe cumplir los requisitos de corriente. Por ejemplo, con un espesor de cobre de 1 onza, una corriente de 1 A requiere al menos <strong>40 mil (1 mm)<\/strong> ancho de traza (para un aumento de temperatura de 10\u00b0C).<\/li>\n\n<li><strong>Asistencia para herramientas<\/strong>: Utilice las calculadoras de anchura de traza de PCB en l\u00ednea (por ejemplo, Saturn PCB Toolkit) introduciendo la corriente, el grosor del cobre y los l\u00edmites de aumento de temperatura para obtener r\u00e1pidamente los valores recomendados.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"22_Signal_Integrity\"><\/span>2.2 Integridad de la se\u00f1al<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Se\u00f1ales de alta velocidad<\/strong>: Requieren adaptaci\u00f3n de impedancia, donde la anchura de la traza est\u00e1 relacionada con el grosor de la capa diel\u00e9ctrica y la permitividad. Por ejemplo, una l\u00ednea microstrip de 50 \u03a9 en una placa FR4 suele tener una anchura de traza de <strong>8-12 mil<\/strong>.<\/li>\n\n<li><strong>Pares diferenciales<\/strong>: Mantenga la misma anchura y separaci\u00f3n (por ejemplo, 5 mil\/5 mil) para reducir la diafon\u00eda.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"23_Manufacturing_Process_and_Cost\"><\/span>2.3 Proceso de fabricaci\u00f3n y coste<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Umbral de coste<\/strong>: Cuando la anchura\/espaciado de las trazas es &lt; 5 mil, los precios pueden duplicarse (debido al menor rendimiento y a los requisitos del proceso l\u00e1ser).<\/li>\n\n<li><strong>Selecci\u00f3n del espesor del cobre<\/strong>: Las capas exteriores suelen utilizar 1 oz (35 \u03bcm), las capas interiores 0,5 oz; para escenarios de alta corriente, se puede utilizar cobre de 2 oz de espesor, pero requiere trazas m\u00e1s anchas.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"24_Layout_Density_and_BGA_Design\"><\/span>2.4 Densidad de disposici\u00f3n y dise\u00f1o BGA<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Enrutamiento de escape BGA<\/strong>: Para BGAs con paso de 1 mm, utilice 6 mil\/6 mil si encamina una traza entre dos pines; utilice 4 mil\/4 mil si encamina dos trazas.<\/li>\n\n<li><strong>Evitar cuellos de botella<\/strong>: Planifique con antelaci\u00f3n la anchura de las trazas en las zonas de alta densidad para evitar repeticiones posteriores.<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-2.jpg\" alt=\"Anchura de l\u00ednea PCB\" class=\"wp-image-3729\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_PCB_Design_Optimization_Strategies\"><\/span>3. Estrategias de optimizaci\u00f3n del dise\u00f1o de PCB<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"31_Layer_Strategy\"><\/span>3.1 Estrategia de capas<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Capas de potencia<\/strong>: Utilice trazas anchas o vaciados de cobre (por ejemplo, 50 mil+) para reducir la impedancia y la generaci\u00f3n de calor.<\/li>\n\n<li><strong>Capas de se\u00f1ales<\/strong>: Dar prioridad a las se\u00f1ales de alta frecuencia en las capas internas (estructura estriada) para minimizar las interferencias de la radiaci\u00f3n.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"32_Avoid_Common_Mistakes\"><\/span>3.2 Evitar errores comunes<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Trazos en \u00e1ngulo agudo<\/strong>: Sustituir por esquinas de 45\u00b0 o curvadas para reducir las discontinuidades de impedancia.<\/li>\n\n<li><strong>Ignorar los comentarios de los fabricantes<\/strong>: Confirmar los documentos de capacidad de proceso (por ejemplo, apertura m\u00ednima, tolerancias de ancho de traza) antes de finalizar los dise\u00f1os.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"33_Cost_Balancing\"><\/span>3.3 Equilibrio de costes<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Priorizar la relajaci\u00f3n de las se\u00f1ales no cr\u00edticas<\/strong>: Utilice anchos de traza de 8-10 mil para las se\u00f1ales de E\/S generales a fin de ahorrar espacio para las rutas cr\u00edticas.<\/li><\/ul><p>La optimizaci\u00f3n de la anchura y el espaciado de las trazas de las placas de circuito impreso requiere un equilibrio entre el rendimiento el\u00e9ctrico, las limitaciones del proceso y el coste. <strong>4 mil\/4 mil<\/strong> es el punto \u00f3ptimo para la mayor\u00eda de los dise\u00f1os de alta densidad, mientras que <strong>2 mil\/2 mil<\/strong> se reserva para aplicaciones de IDH de gama alta. En las primeras fases del dise\u00f1o deben utilizarse herramientas de c\u00e1lculo para verificar los requisitos actuales y comunicarse con los fabricantes para garantizar la producibilidad.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-1.jpg\" alt=\"Anchura de l\u00ednea PCB\" class=\"wp-image-3730\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_PCB_Design_Spacing_Specifications\"><\/span>4. Especificaciones de espaciado de dise\u00f1o de PCB<span class=\"ez-toc-section-end\"><\/span><\/h2><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Traces\"><\/span><strong>1. Trazas<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>M\u00edn. Anchura<\/strong>: 5 mil (0,127 mm)<\/li>\n\n<li><strong>M\u00edn. Espacio<\/strong>: 5 mil (0,127 mm)<\/li>\n\n<li><strong>Trazado hasta el borde de la placa<\/strong>: \u22650,3mm (20mil)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Vias\"><\/span><strong>2. V\u00edas<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>M\u00edn. Tama\u00f1o del agujero<\/strong>: 0,3 mm (12 mil\u00edmetros)<\/li>\n\n<li><strong>Anchura del anillo de la almohadilla<\/strong>: \u22656mil (0,153mm)<\/li>\n\n<li><strong>Espaciado entre v\u00edas<\/strong>: \u22656mil (borde a borde)<\/li>\n\n<li><strong>V\u00eda al borde del tablero<\/strong>: \u22650,508mm (20mil)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_PTH_Pads_Plated_Through-Holes\"><\/span><strong>3. Almohadillas PTH (agujeros pasantes chapados)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>M\u00edn. Tama\u00f1o del agujero<\/strong>\u22650,2 mm mayor que el cable del componente<\/li>\n\n<li><strong>Anchura del anillo de la almohadilla<\/strong>: \u22650,2mm (8mil)<\/li>\n\n<li><strong>Distancia entre agujeros<\/strong>: \u22650,3 mm (de borde a borde)<\/li>\n\n<li><strong>Almohadilla al borde del tablero<\/strong>: \u22650,508mm (20mil)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Solder_Mask\"><\/span><strong>4. M\u00e1scara de soldadura<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Apertura PTH\/SMD<\/strong>: \u22650.1mm (4mil) de holgura<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Silkscreen_Text\"><\/span><strong>5. Serigraf\u00eda (texto)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>M\u00edn. Ancho de l\u00ednea<\/strong>: 6mil (0.153mm)<\/li>\n\n<li><strong>M\u00edn. Altura<\/strong>: 32 mil\u00edmetros (0,811 mm)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"6_Non-Plated_Slots\"><\/span><strong>6. Ranuras no chapadas<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>M\u00edn. Espacio<\/strong>: \u22651,6mm<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"7_Panelization\"><\/span><strong>7. Panelizaci\u00f3n<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Separaci\u00f3n (tablero de 1,6 mm)<\/strong>: \u22651,6mm<\/li>\n\n<li><strong>Corte en V\/Sin separaci\u00f3n<\/strong>: ~0,5 mm<\/li>\n\n<li><strong>Proceso<\/strong>: \u22655mm<\/li><\/ul><p><\/p>","protected":false},"excerpt":{"rendered":"<p>\u00bfQu\u00e9 son la anchura de traza y la separaci\u00f3n de traza en PCB? En el dise\u00f1o de placas de circuito impreso (PCB), la anchura y la separaci\u00f3n de las trazas son dos par\u00e1metros fundamentales pero cr\u00edticos: 1. 1.1 Capacidades de los procesos convencionales 1.2 Procesos avanzados (HDI) 1.3 Desaf\u00edos extremos 2. Cuatro factores clave que influyen en la selecci\u00f3n de la anchura de traza\/espaciado 2. Cuatro factores clave que influyen en la selecci\u00f3n de la anchura\/espaciado de las trazas 2.1 Transporte de corriente [&hellip;]<\/p>","protected":false},"author":1,"featured_media":3731,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[110,332],"class_list":["post-3727","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-pcb-design","tag-pcb-line-width"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Minimum line width and line spacing for PCB - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Design specifications for minimum line width and line spacing on PCB circuit boards, including manufacturing process limitations, current carrying capacity, signal integrity optimization, and cost considerations, to ensure high-performance circuit board design.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/\" \/>\n<meta property=\"og:locale\" content=\"es_ES\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Minimum line width and line spacing for PCB - 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