{"id":4135,"date":"2025-08-20T08:34:00","date_gmt":"2025-08-20T00:34:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4135"},"modified":"2025-08-19T15:47:31","modified_gmt":"2025-08-19T07:47:31","slug":"pcb-hasl-and-lead-free-hasl-processes","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","title":{"rendered":"PCB HASL y procesos HASL sin plomo"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Tabla de contenidos<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#HASL_process\" >Proceso HASL<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#11_Differences_between_HASL_and_lead-free_HASL\" >1.1 Diferencias entre HASL y HASL sin plomo<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#12_Core_HASL_Process_Flow\" >1.2 Flujo del proceso HASL b\u00e1sico<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#121_Pre-Treatment_Stage\" >1.2.1 Etapa de pretratamiento<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#122_Flux_Application\" >1.2.2 Aplicaci\u00f3n de fundentes<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#123_Hot_Air_Leveling_Key_Steps\" >1.2.3 Pasos clave de la nivelaci\u00f3n por aire caliente<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#124_Quality_Inspection\" >1.2.4 Inspecci\u00f3n de calidad<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#13_Process_Advantages_and_Limitations\" >1.3 Ventajas y limitaciones del proceso<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Advantages\" >Ventajas<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Limitations\" >Limitaciones<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#ENIG_Electroless_Nickel_Immersion_Gold_Process\" >Proceso ENIG (n\u00edquel qu\u00edmico por inmersi\u00f3n en oro)<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#21_Process_Principles\" >2.1 Principios del proceso<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#22_Advantages\" >2.2 Ventajas<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#23_Challenges\" >2.3 Desaf\u00edos<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#OSP_Organic_Solderability_Preservative\" >OSP (Conservante org\u00e1nico de soldabilidad)<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#31_Process_Principles\" >3.1 Principios del proceso<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#32_Advantages\" >3.2 Ventajas<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#33_Limitations\" >3.3 Limitaciones<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Process_Selection_Guide\" >Gu\u00eda de selecci\u00f3n de procesos<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#41_Comparison\" >4.1 Comparaci\u00f3n<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#42_Recommendations\" >4.2 Recomendaciones<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#43_Topfast_Capabilities\" >4.3 Capacidades Topfast<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"HASL_process\"><\/span>Proceso HASL<span class=\"ez-toc-section-end\"><\/span><\/h2><p>HASL (Hot Air Solder Leveling) es uno de los procesos de tratamiento de superficies m\u00e1s cl\u00e1sicos y rentables en la fabricaci\u00f3n de PCB y desempe\u00f1a un papel importante en la industria de fabricaci\u00f3n de productos electr\u00f3nicos. Este proceso consiste en cubrir la superficie de cobre con una capa de aleaci\u00f3n de esta\u00f1o y plomo para proporcionar un rendimiento fiable de la soldadura y una protecci\u00f3n contra la oxidaci\u00f3n de las placas de circuito impreso.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1.jpg\" alt=\"Proceso HASL\" class=\"wp-image-4137\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"11_Differences_between_HASL_and_lead-free_HASL\"><\/span>1.1 Diferencias entre HASL y HASL sin plomo<span class=\"ez-toc-section-end\"><\/span><\/h3><p>HASL (Hot Air Solder Leveling) es una de las tecnolog\u00edas de tratamiento de superficies m\u00e1s cl\u00e1sicas y rentables del mercado. <a href=\"https:\/\/www.topfastpcb.com\/es\/\">Fabricaci\u00f3n de PCB<\/a>. Este proceso recubre las superficies de cobre con una capa de aleaci\u00f3n de esta\u00f1o y plomo para proporcionar una soldabilidad fiable y resistencia a la oxidaci\u00f3n. Con el aumento de los requisitos medioambientales, el HASL sin plomo se ha convertido en la norma del sector.<\/p><p><strong>Diferencias en la composici\u00f3n de los materiales<\/strong>:<\/p><ul class=\"wp-block-list\"><li>El HASL tradicional utiliza unaaleaci\u00f3n Sn63\/Pb37 (63 % de esta\u00f1o + 37 % de plomo), con un punto de fusi\u00f3n de 183 \u00b0C.<\/li>\n\n<li>HASL sin plomo se utiliza principalmente:<\/li>\n\n<li>SAC305(96,5 % de esta\u00f1o+ 3% de plata + 0,5 % de cobre), punto de fusi\u00f3n: 217-220 \u00b0C<\/li>\n\n<li>SnCu0,7 (99,3 % deesta\u00f1o+ 0,7% de cobre), punto de fusi\u00f3n: 227 \u00b0C<\/li>\n\n<li>Esta\u00f1opuro(Sn100), punto de fusi\u00f3n: 232 \u00b0C<\/li><\/ul><p><strong>Comparaci\u00f3n de las caracter\u00edsticas del proceso<\/strong>:<\/p><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Propiedad<\/th><th>HASL con plomo<\/th><th>HASL sin plomo<\/th><\/tr><\/thead><tbody><tr><td>Punto de fusi\u00f3n<\/td><td>183 \u00b0C<\/td><td>217-232 \u00b0C<\/td><\/tr><tr><td>Temperatura del crisol de soldadura<\/td><td>200-210 \u00b0C<\/td><td>240-255 \u00b0C<\/td><\/tr><tr><td>Acabado superficial<\/td><td>Brillante<\/td><td>Relativamente aburrido<\/td><\/tr><tr><td>Resistencia mec\u00e1nica<\/td><td>Buena ductilidad (alta resistencia al impacto)<\/td><td>Duro pero quebradizo<\/td><\/tr><tr><td>Mojabilidad<\/td><td>Excelente (\u00e1ngulo de contacto &lt;30\u00b0)<\/td><td>Bueno (\u00e1ngulo de contacto35-45\u00b0)<\/td><\/tr><tr><td>Cumplimiento de la normativa medioambiental<\/td><td>Contiene plomo (37%)<\/td><td>Contenido de plomo &lt;0,1% (Conformidad RoHS)<\/td><\/tr><tr><td>costo<\/td><td>Baja<\/td><td>15-20% m\u00e1s<\/td><\/tr><tr><td>Aplicabilidad<\/td><td>Uso general<\/td><td>Requiere temperaturas de soldadura m\u00e1s altas<\/td><\/tr><\/tbody><\/table><\/figure><p><strong>Diferencias pr\u00e1cticas de rendimiento<\/strong>:<\/p><ul class=\"wp-block-list\"><li><strong>Soldabilidad<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>HASL con plomo ofrece una mejor actividad de soldadura con un tiempo de humectaci\u00f3n m\u00e1s corto (1-2 seg.)<\/li>\n\n<li>HASL sin plomo requiere un fundente m\u00e1s potente y un control m\u00e1s estricto de la temperatura<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Fiabilidad<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Las uniones soldadas con plomo presentan una mayor resistencia a la fatiga t\u00e9rmica (m\u00e1s ciclos de temperatura)<\/li>\n\n<li>Las uniones soldadas sin plomo mantienen una mayor resistencia mec\u00e1nica tras un envejecimiento prolongado<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Ventana de proceso<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>El HASL conplomo tieneuna ventana de proceso m\u00e1s amplia (\u00b110 \u00b0C).<\/li>\n\n<li>El HASL sinplomo requiere un control de temperatura m\u00e1s estricto (\u00b13 \u00b0C).<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Consejo Profesional: Topfast optimiza los par\u00e1metros HASL sin plomo para lograr un rendimiento de soldadura del 99,5%, cumpliendo las normas IPC-6012 Clase 3.<\/p><\/blockquote><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"12_Core_HASL_Process_Flow\"><\/span>1.2 Flujo del proceso HASL b\u00e1sico<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Como fabricante profesional de PCB, Topfast emplea l\u00edneas de producci\u00f3n HASL totalmente automatizadas con estrictos procesos estandarizados:<\/p><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"121_Pre-Treatment_Stage\"><\/span>1.2.1 Etapa de pretratamiento<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Limpieza qu\u00edmica<\/strong>:<\/li>\n\n<li>El limpiador \u00e1cido (pH 2-3) elimina los \u00f3xidos de cobre<\/li>\n\n<li>Control de temperatura:40-50 \u00b0C, duraci\u00f3n: 2-3 min.<\/li>\n\n<li>El micrograbado garantizauna rugosidad superficial de Ra 0,3-0,5 \u03bcm.<\/li>\n\n<li><strong>Aclarado<\/strong>:<\/li>\n\n<li>Enjuague encontracorriente en tres etapas(resistividad del agua desionizada &gt;15 M\u03a9\u00b7cm)<\/li>\n\n<li>Secadocon aire caliente(60-80\u00b0C)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"122_Flux_Application\"><\/span>1.2.2 Aplicaci\u00f3n de fundentes<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>M\u00e9todos de aplicaci\u00f3n:<\/li>\n\n<li>Espumado (tradicional): Espesor del fundente 0,01-0,03 mm<\/li>\n\n<li>Spray (avanzado):M\u00e1s uniforme, 30% menos de consumo de fundente<\/li>\n\n<li>Tipos de flujo:<\/li>\n\n<li>A base de colofonia sin limpiar (ROH)<\/li>\n\n<li>Contenido en s\u00f3lidos: 8-12%, valor \u00e1cido: 35-45mgKOH\/g<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"123_Hot_Air_Leveling_Key_Steps\"><\/span>1.2.3 Pasos clave de la nivelaci\u00f3n por aire caliente<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Precalentamiento<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Con plomo: 130-140\u00b0C<\/li>\n\n<li>Sin plomo: 150-160\u00b0C<\/li>\n\n<li>Duraci\u00f3n: 60-90 seg<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Soldadura por inmersi\u00f3n<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Temperatura del crisol de soldadura:<ul class=\"wp-block-list\"><li>Con plomo: 210 \u00b1 5\u00b0C<\/li>\n\n<li>Sin plomo: 250 \u00b1 5\u00b0C<\/li><\/ul><\/li>\n\n<li>Tiempode permanencia: 2-4 segundos (precisi\u00f3n de \u00b10,5 segundos)<\/li>\n\n<li>Profundidad de inmersi\u00f3n: 3-5 mm<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Nivelaci\u00f3n por aire caliente<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Par\u00e1metros de la cuchilla de aire:<ul class=\"wp-block-list\"><li>Presi\u00f3n: 0,3-0,5MPa<\/li>\n\n<li>Temperatura: 300-350 \u00b0C<\/li>\n\n<li>\u00c1ngulo: inclinaci\u00f3n haciaabajode 4\u00b0<\/li>\n\n<li>Velocidad del aire: 20-30 m\/s<\/li><\/ul><\/li>\n\n<li>Tiempo de procesamiento: 1-2 segundos<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Refrigeraci\u00f3n<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Refrigeraci\u00f3n por aire forzado (velocidad:2-3 \u00b0C\/seg.)<\/li>\n\n<li>Temperaturafinal &lt;60 \u00b0C<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"124_Quality_Inspection\"><\/span>1.2.4 Inspecci\u00f3n de calidad<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>AOI en l\u00ednea (cobertura del 100%):<\/li>\n\n<li>Inspecci\u00f3n del espesor delasoldadura (1-40 \u03bcm)<\/li>\n\n<li>Detecci\u00f3n de defectos superficiales (bolas de soldadura, cobre expuesto, etc.)<\/li>\n\n<li>Pruebas de muestreo:<\/li>\n\n<li>Pruebade soldabilidad (245 \u00b0C,3 segundos)<\/li>\n\n<li>Prueba de adherencia (m\u00e9todo de la cinta)<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Avance tecnol\u00f3gico: El proceso HASL sin plomo y protegido con nitr\u00f3geno de Topfast reduce la oxidaci\u00f3n de la soldadura del 5% al 1,5%, mejorando significativamente el rendimiento de la soldadura.<\/p><\/blockquote><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"13_Process_Advantages_and_Limitations\"><\/span>1.3 Ventajas y limitaciones del proceso<span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advantages\"><\/span>Ventajas<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Eficiencia de costes<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Baja inversi\u00f3n en equipos (~1\/3 de la ENIG)<\/li>\n\n<li>Importante ahorro en costes de material (40-60% m\u00e1s barato que ENIG)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Fiabilidad de la soldadura<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Soporta m\u00e1sde 3 ciclosde reflujo (pico de 260 \u00b0C).<\/li>\n\n<li>Alta resistencia a la tracci\u00f3n de las juntas (con plomo: 50-60MPa; sin plomo: 55-65MPa)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Amplia aplicabilidad<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Adecuado para varios tama\u00f1os de almohadilla (paso m\u00ednimo de 0,5 mm)<\/li>\n\n<li>Compatible con procesos pasantes y SMT<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Rendimiento del almacenamiento<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>12 meses de conservaci\u00f3n (HR &lt;60%)<\/li>\n\n<li>Excelente resistencia a la oxidaci\u00f3n (prueba de niebla salina de 48 horas)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Limitations\"><\/span>Limitaciones<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Restricciones de paso fino<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>No apto para componentes BGA\/QFN de 0,4 mm de paso<\/li>\n\n<li>Riesgo de puentes de soldadura en dise\u00f1os de paso fino<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Cuestiones de planaridad<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Irregularidad de la superficie:15-25 \u03bcm (afecta al montaje del HDI)<\/li>\n\n<li>Variaci\u00f3n de espesor dehasta 20 \u03bcm entre almohadillas grandes y peque\u00f1as.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Estr\u00e9s t\u00e9rmico<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Los procesos de alta temperatura (especialmente sin plomo) pueden afectar a los materiales de alta Tg.<\/li>\n\n<li>Mayor riesgo de alabeo en tableros finos (&lt;0,8 mm)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Consideraciones medioambientales<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>HASL con plomo no conforme con RoHS<\/li>\n\n<li>El HASL sinplomo consumem\u00e1s energ\u00eda (temperaturas entre 30 y 50 \u00b0C m\u00e1s altas).<\/li><\/ul><p>\u00bfNecesita asistencia profesional HASL? <a href=\"https:\/\/www.topfastpcb.com\/es\/contact\/\">P\u00f3ngase en contacto con los ingenieros de Topfast<\/a> para soluciones personalizadas<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3.jpg\" alt=\"Proceso HASL\" class=\"wp-image-4139\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"ENIG_Electroless_Nickel_Immersion_Gold_Process\"><\/span>Proceso ENIG (n\u00edquel qu\u00edmico por inmersi\u00f3n en oro)<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"21_Process_Principles\"><\/span>2.1 Principios del proceso<span class=\"ez-toc-section-end\"><\/span><\/h3><p>La ENIG forma una capa protectora compuesta mediante niquelado qu\u00edmico y dorado por inmersi\u00f3n:<\/p><ul class=\"wp-block-list\"><li>Capa de n\u00edquel: 3-6 \u03bcm (7-9 % de f\u00f3sforo)<\/li>\n\n<li>Capa de oro: 0,05-0,1 \u03bcm<\/li><\/ul><p><strong>Par\u00e1metros clave<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Temperaturadel ba\u00f1o den\u00edquel:85-90 \u00b0C<\/li>\n\n<li>Velocidad de recubrimiento: 15-20 \u03bcm\/h<\/li>\n\n<li>Temperaturadel ba\u00f1o deoro:80-85 \u00b0C<\/li>\n\n<li>pH: Ba\u00f1o de n\u00edquel 4,5-5,0, Ba\u00f1o de oro 5,5-6,5<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"22_Advantages\"><\/span>2.2 Ventajas<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Excelente planitud<\/strong> (Ra&lt;0,1 \u03bcm):<\/li><\/ul><ul class=\"wp-block-list\"><li>Ideal para BGA\/CSP de 0,3 mm de paso<\/li>\n\n<li>Coplanaridad de laalmohadilla &lt;5 \u03bcm\/m<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Resistencia a la oxidaci\u00f3n<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>18 meses de caducidad<\/li>\n\n<li>Certificado J-STD-003B Clase 3<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Conductividad el\u00e9ctrica<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Resistividad del oro: 2,44 \u03bc\u03a9\u00b7cm<\/li>\n\n<li>Resistenciade contacto&lt;10 m\u03a9<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"23_Challenges\"><\/span>2.3 Desaf\u00edos<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Cuesti\u00f3n de la almohadilla negra<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Causas: Sobregrabado de n\u00edquel o contenido anormal de f\u00f3sforo.<\/li>\n\n<li>Soluci\u00f3n:La pasivaci\u00f3n patentada de Topfast reduce la tasa de almohadilla negra al 0,1%.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Factores de coste<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Costes de material elevados (volatilidad del precio del oro)<\/li>\n\n<li>Proceso complejo (8-10 pasos)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Resistencia de la uni\u00f3n soldada<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Capa fr\u00e1gil de Ni-Au IMC<\/li>\n\n<li>Resistencia a la tracci\u00f3n ~40-45MPa<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>El ENIG de Topfastalcanza una uniformidadde espesor del \u00b110 %, superando los est\u00e1ndares del sector, que son del \u00b115 %.<\/p><\/blockquote><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"OSP_Organic_Solderability_Preservative\"><\/span>OSP (Conservante org\u00e1nico de soldabilidad) <span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"31_Process_Principles\"><\/span>3.1 Principios del proceso<span class=\"ez-toc-section-end\"><\/span><\/h3><p>El OSPforma una pel\u00edculaprotectora org\u00e1nica de 0,2-0,5 \u03bcm sobre el cobre desnudo, que contiene:<\/p><ul class=\"wp-block-list\"><li>Compuestos de benzotriazol<\/li>\n\n<li>Compuestos de imidazol<\/li>\n\n<li>\u00c1cidos carbox\u00edlicos<\/li><\/ul><p><strong>Flujo del proceso<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Limpieza \u00e1cida (5% H2SO4, 2min)<\/li>\n\n<li>Micrograbado (Na2S2O8, elimina 1-2 \u03bcm de cobre)<\/li>\n\n<li>TratamientoOSP (40-50 \u00b0C, 1-2 min)<\/li>\n\n<li>Secado(aire caliente a60-80 \u00b0C)<\/li><\/ol><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"32_Advantages\"><\/span>3.2 Ventajas<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Rentable<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>60% m\u00e1s barato que HASL<\/li>\n\n<li>Baja inversi\u00f3n en equipos (~1\/5 de la ENIG)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Integridad de la se\u00f1al<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Constante diel\u00e9ctrica estable (\u0394Dk &lt;0,02)<\/li>\n\n<li>Ideal para aplicaciones de alta frecuencia (&gt;10GHz)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Ecol\u00f3gico<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Sin metales pesados<\/li>\n\n<li>Tratamiento simplificado de las aguas residuales<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"33_Limitations\"><\/span>3.3 Limitaciones<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Ventana de soldabilidad<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Debe utilizarse en las 24 horas siguientes a su apertura<\/li>\n\n<li>S\u00f3lo apto para 1 ciclo de reflujo (el rendimiento cae un 30% para el segundo reflujo)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Dificultades de inspecci\u00f3n<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Espesor de la pel\u00edcula dif\u00edcil de medir \u00f3pticamente<\/li>\n\n<li>Requiere un tratamiento TIC especial<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Condiciones de almacenamiento<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Se requiere envasado al vac\u00edo (HR &lt;30%)<\/li>\n\n<li>Temperaturade almacenamiento: 15-30 \u00b0C<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>El OSP mejorado de Topfast ampl\u00eda la vida \u00fatil de 3 a 6 meses y resiste 2 ciclos de reflujo.<\/p><\/blockquote><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2.jpg\" alt=\"Proceso HASL\" class=\"wp-image-4138\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Process_Selection_Guide\"><\/span>Gu\u00eda de selecci\u00f3n de procesos<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"41_Comparison\"><\/span>4.1 Comparaci\u00f3n<span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Par\u00e1metro<\/th><th>HASL<\/th><th>ENIG<\/th><th>OSP<\/th><\/tr><\/thead><tbody><tr><td>costo<\/td><td>$<\/td><td>$$$<\/td><td>$<\/td><\/tr><tr><td>Planitud<\/td><td>\u25b3 (15-25 \u03bcm)<\/td><td>\u25ce (&lt;5 \u03bcm)<\/td><td>\u25cb (&lt;10\u03bcm)<\/td><\/tr><tr><td>Soldabilidad<\/td><td>\u25ce (3 reflujos)<\/td><td>\u25cb (5 reflujos)<\/td><td>\u25b3 (1-2reflujos)<\/td><\/tr><tr><td>Vida \u00fatil<\/td><td>12mo<\/td><td>18mo<\/td><td>6mo<\/td><\/tr><tr><td>Min. Paso<\/td><td>0,5 mm<\/td><td>0,3 mm<\/td><td>0,4 mm<\/td><\/tr><tr><td>Ecol\u00f3gico<\/td><td>Sin plomo OK<\/td><td>Excelente<\/td><td>Excelente<\/td><\/tr><tr><td>Aplicaciones<\/td><td>Electr\u00f3nica de consumo<\/td><td>Circuitos integrados de alta densidad<\/td><td>Vuelta r\u00e1pida<\/td><\/tr><\/tbody><\/table><\/figure><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"42_Recommendations\"><\/span>4.2 Recomendaciones<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Electr\u00f3nica de consumo<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>HASL sin plomo (mejor relaci\u00f3n coste-rendimiento)<\/li>\n\n<li>Control del volumen de pasta de soldadura para componentes de paso fino<\/li><\/ul><ul class=\"wp-block-list\"><li><strong><a href=\"https:\/\/www.topfastpcb.com\/es\/products\/hdi-pcb\/\">Placas de IDH<\/a><\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>ENIG (planitud superior)<\/li>\n\n<li>Estricto control de calidad del n\u00edquel<\/li><\/ul><ul class=\"wp-block-list\"><li><strong><a href=\"https:\/\/www.topfastpcb.com\/es\/products\/high-speed-pcb\/\">Placas de circuito impreso de alta velocidad<\/a><\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>OSP\/ENIG (mejor integridad de la se\u00f1al)<\/li>\n\n<li>Evite la superficie irregular de HASL&amp;#8217<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Creaci\u00f3n de prototipos<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>OSP (respuesta m\u00e1s r\u00e1pida)<\/li>\n\n<li>Garantizar el montaje a tiempo<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"43_Topfast_Capabilities\"><\/span>4.3 Capacidades Topfast<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Soluciones completas de acabado de superficies:<\/p><ul class=\"wp-block-list\"><li>20 l\u00edneas HASL automatizadas(500 000 m\u00b2\/mes)<\/li>\n\n<li>10 l\u00edneas ENIG (uniformidad delespesor \u00b18%)<\/li>\n\n<li>5 l\u00edneas OSP (nano-mejoradas disponibles)<\/li>\n\n<li>Inspecci\u00f3n 100% en l\u00ednea (AOI+SPI)<\/li><\/ul><p><a href=\"https:\/\/www.topfastpcb.com\/es\/contact\/\">Descargar la Gu\u00eda de selecci\u00f3n del acabado superficial de las placas de circuito impreso<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>Proceso de nivelado HASL por aire caliente, incluida la composici\u00f3n de la aleaci\u00f3n, el flujo del proceso y las diferencias de rendimiento entre HASL con y sin plomo. Un an\u00e1lisis detallado de las caracter\u00edsticas y escenarios de aplicaci\u00f3n de galvanoplastia ENIG y procesos de antioxidaci\u00f3n OSP. Como fabricante profesional de PCB, Topfast posee capacidades completas de proceso de tratamiento de superficie y un sistema de control de calidad robusto, permitiendonos proporcionar soluciones optimas de tratamiento de superficie para varios productos electronicos.<\/p>","protected":false},"author":1,"featured_media":4136,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[351,260],"class_list":["post-4135","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-hasl-processes","tag-pcb-manufacturing-process"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB HASL and Lead-Free HASL Processes - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Topfast provides professional and reliable PCB manufacturing services. 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