{"id":4423,"date":"2025-10-09T15:10:01","date_gmt":"2025-10-09T07:10:01","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4423"},"modified":"2025-10-09T15:10:06","modified_gmt":"2025-10-09T07:10:06","slug":"what-is-an-integrated-circuit-ic","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/","title":{"rendered":"Circuito integrado (IC): \u00bfCu\u00e1l es la diferencia entre una PCB y un IC?"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Tabla de contenidos<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#Integrated_Circuits_ICs_The_Miniature_Engines_of_the_Digital_Age\" >Circuitos integrados (IC): los motores en miniatura de la era digital<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#What_is_an_Integrated_Circuit\" >\u00bfQu\u00e9 es un circuito integrado?<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#The_Core_Value_of_ICs\" >El valor fundamental de los circuitos integrados<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#ICs_vs_PCBs_An_In-Depth_Analysis_of_Functions_and_Relationships\" >IC frente a PCB: an\u00e1lisis en profundidad de funciones y relaciones<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#Fundamental_Difference\" >Diferencia fundamental<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#Mode_of_Collaboration\" >Modo de colaboraci\u00f3n<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#Technological_Evolution_and_Classification_of_Integrated_Circuits\" >Evoluci\u00f3n tecnol\u00f3gica y clasificaci\u00f3n de los circuitos integrados<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#Historical_Development\" >Desarrollo hist\u00f3rico<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#IC_Technology_Classification\" >Clasificaci\u00f3n de la tecnolog\u00eda IC<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#IC_Design_vs_PCB_Design\" >Dise\u00f1o de circuitos integrados frente a dise\u00f1o de placas de circuito impreso<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#Difference_in_Design_Focus\" >Diferencia en el enfoque del dise\u00f1o<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#Complexity_Comparison\" >Comparaci\u00f3n de complejidad<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#Integrated_Circuit_Packaging_Technology\" >Tecnolog\u00eda de encapsulado de circuitos integrados<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#Future_Outlook_The_Innovation_Frontier_of_Integrated_Circuits\" >Perspectivas de futuro: la frontera de la innovaci\u00f3n en circuitos integrados<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/what-is-an-integrated-circuit-ic\/#Conclusion\" >Conclusi\u00f3n<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Integrated_Circuits_ICs_The_Miniature_Engines_of_the_Digital_Age\"><\/span>Circuitos integrados (IC): los motores en miniatura de la era digital<span class=\"ez-toc-section-end\"><\/span><\/h2><p>En los dispositivos electr\u00f3nicos modernos, los circuitos integrados (IC) son el coraz\u00f3n del mundo digital, ya que alimentan todo, desde tel\u00e9fonos inteligentes hasta naves espaciales. Este art\u00edculo profundizar\u00e1 en la esencia de los circuitos integrados y aclarar\u00e1 sus principales diferencias con respecto a <a href=\"https:\/\/www.topfastpcb.com\/es\/blog\/printed-circuit-board-pcb\/\">circuitos impresos<\/a> (PCB).<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_is_an_Integrated_Circuit\"><\/span><a href=\"https:\/\/www.topfastpcb.com\/es\/products\/integrated-circuits\/\">\u00bfQu\u00e9 es un circuito integrado?<\/a>?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>En <strong>Circuito integrado (IC)<\/strong>, a menudo denominado chip, es un dispositivo electr\u00f3nico en miniatura. Mediante procesos especializados, se fabrican componentes como transistores, resistencias, condensadores y sus conexiones el\u00e9ctricas, y se unen entre s\u00ed en una oblea semiconductora o sustrato diel\u00e9ctrico, que posteriormente se encapsula. Esta microestructura altamente integrada ha supuesto un gran avance en el <strong>miniaturizaci\u00f3n, bajo consumo energ\u00e9tico e inteligencia<\/strong> de componentes electr\u00f3nicos.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"The_Core_Value_of_ICs\"><\/span>El valor fundamental de los circuitos integrados<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Los circuitos integrados se han convertido en la piedra angular de la electr\u00f3nica moderna debido principalmente a tres valores fundamentales:<\/p><ol class=\"wp-block-list\"><li><strong>Miniaturizaci\u00f3n extrema:<\/strong> Integrar millones o miles de millones de componentes en un chip del tama\u00f1o de una u\u00f1a.<\/li>\n\n<li><strong>Rendimiento excepcional:<\/strong> El dise\u00f1o interno optimizado proporciona capacidades de procesamiento de se\u00f1ales eficientes y de alta velocidad.<\/li>\n\n<li><strong>Rentabilidad:<\/strong> La producci\u00f3n en masa reduce significativamente el coste por unidad funcional.<\/li><\/ol><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/10\/Integrated-Circuit-IC-1.jpg\" alt=\"Circuito integrado (IC)\" class=\"wp-image-4424\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/10\/Integrated-Circuit-IC-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/10\/Integrated-Circuit-IC-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/10\/Integrated-Circuit-IC-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"ICs_vs_PCBs_An_In-Depth_Analysis_of_Functions_and_Relationships\"><\/span>IC frente a PCB: an\u00e1lisis en profundidad de funciones y relaciones<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Fundamental_Difference\"><\/span>Diferencia fundamental<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>El circuito integrado es el \u00abcerebro\u00bb y la placa de circuito impreso es el \u00abcuerpo\u00bb.<\/strong><\/p><ul class=\"wp-block-list\"><li><strong>IC:<\/strong> Sirve como n\u00facleo funcional, responsable del procesamiento de se\u00f1ales, el c\u00e1lculo de datos y el control del sistema.<\/li>\n\n<li><strong>PCB:<\/strong> Act\u00faa como soporte f\u00edsico, proporcionando soporte mec\u00e1nico y conexiones el\u00e9ctricas.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Mode_of_Collaboration\"><\/span>Modo de colaboraci\u00f3n<span class=\"ez-toc-section-end\"><\/span><\/h3><p>En los dispositivos electr\u00f3nicos actuales, los circuitos integrados y las placas de circuito impreso forman una estrecha relaci\u00f3n simbi\u00f3tica:<\/p><ol class=\"wp-block-list\"><li><strong>Integraci\u00f3n f\u00edsica:<\/strong> Los circuitos integrados se montan en la placa de circuito impreso utilizando tecnolog\u00eda de montaje superficial (SMT) o tecnolog\u00eda de orificio pasante.<\/li>\n\n<li><strong>Conexi\u00f3n el\u00e9ctrica:<\/strong> Las pistas de cobre en la placa de circuito impreso conectan el circuito integrado con otros componentes, formando un sistema de circuito completo.<\/li>\n\n<li><strong>Cooperaci\u00f3n del sistema:<\/strong> El circuito integrado (IC) realiza funciones espec\u00edficas, mientras que la placa de circuito impreso (PCB) garantiza una transmisi\u00f3n fluida de la se\u00f1al entre todos los componentes.<\/li><\/ol><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technological_Evolution_and_Classification_of_Integrated_Circuits\"><\/span>Evoluci\u00f3n tecnol\u00f3gica y clasificaci\u00f3n de los circuitos integrados<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Historical_Development\"><\/span>Desarrollo hist\u00f3rico<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Desde su nacimiento en la d\u00e9cada de 1950, los circuitos integrados han experimentado una notable evoluci\u00f3n tecnol\u00f3gica:<\/p><ul class=\"wp-block-list\"><li><strong>A\u00f1os 50:<\/strong> Circuitos integrados primitivos con solo unos pocos componentes.<\/li>\n\n<li><strong>A\u00f1os 60:<\/strong> Integraci\u00f3n a peque\u00f1a y mediana escala (SSI, MSI), con un n\u00famero de transistores que alcanza los miles.<\/li>\n\n<li><strong>A\u00f1os 70:<\/strong> Integraci\u00f3n a gran escala y a muy gran escala (LSI, VLSI), con un n\u00famero de componentes que supera los millones.<\/li>\n\n<li><strong>Siglo XXI:<\/strong> Integraci\u00f3n a escala ultragrande (ULSI), que integra decenas de miles de millones de componentes en un solo chip.<\/li>\n\n<li><strong>Tendencias futuras:<\/strong> Tecnolog\u00eda 2.5D\/3D-IC, que permite el apilamiento tridimensional y una integraci\u00f3n de mayor densidad.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"IC_Technology_Classification\"><\/span>Clasificaci\u00f3n de la tecnolog\u00eda IC<span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>tipo<\/th><th>Caracter\u00edsticas funcionales<\/th><th>Aplicaciones t\u00edpicas<\/th><\/tr><\/thead><tbody><tr><td><strong>Circuito integrado digital<\/strong><\/td><td>Procesa se\u00f1ales discretas, realiza operaciones l\u00f3gicas.<\/td><td>Microprocesadores, chips de memoria<\/td><\/tr><tr><td><strong>IC anal\u00f3gico<\/strong><\/td><td>Procesa se\u00f1ales continuas, realiza amplificaci\u00f3n y filtrado.<\/td><td>Amplificadores operacionales, gesti\u00f3n de energ\u00eda<\/td><\/tr><tr><td><strong>Circuito integrado de se\u00f1al mixta<\/strong><\/td><td>Combina funciones anal\u00f3gicas y digitales.<\/td><td>Convertidores anal\u00f3gico-digitales (ADC)<\/td><\/tr><tr><td><strong>Circuito integrado espec\u00edfico para una aplicaci\u00f3n (ASIC)<\/strong><\/td><td>Dise\u00f1ado a medida para una aplicaci\u00f3n espec\u00edfica.<\/td><td>Procesadores para consolas de videojuegos, chips para m\u00e1quinas mineras<\/td><\/tr><\/tbody><\/table><\/figure><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/10\/Integrated-Circuit-IC.jpg\" alt=\"Circuito integrado (IC)\" class=\"wp-image-4425\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/10\/Integrated-Circuit-IC.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/10\/Integrated-Circuit-IC-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/10\/Integrated-Circuit-IC-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"IC_Design_vs_PCB_Design\"><\/span>Dise\u00f1o de circuitos integrados frente a dise\u00f1o de placas de circuito impreso<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Difference_in_Design_Focus\"><\/span>Diferencia en el enfoque del dise\u00f1o<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Dise\u00f1o de circuitos integrados<\/strong> se centra <em>en<\/em> el chip:<\/p><ul class=\"wp-block-list\"><li>Optimizaci\u00f3n del dise\u00f1o a nivel de transistores<\/li>\n\n<li>Planificaci\u00f3n de la ruta de la se\u00f1al<\/li>\n\n<li>Consumo energ\u00e9tico y gesti\u00f3n t\u00e9rmica<\/li><\/ul><p><strong>Dise\u00f1o de PCB<\/strong> se centra en el <em>a nivel de la junta directiva<\/em> sistema:<\/p><ul class=\"wp-block-list\"><li>Colocaci\u00f3n de componentes y trazado de pistas<\/li>\n\n<li>Garant\u00eda de integridad de la se\u00f1al<\/li>\n\n<li>Dise\u00f1o de compatibilidad electromagn\u00e9tica (EMC)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Complexity_Comparison\"><\/span>Comparaci\u00f3n de complejidad<span class=\"ez-toc-section-end\"><\/span><\/h3><p>El dise\u00f1o de circuitos integrados suele implicar un nivel m\u00e1s profundo de conocimientos especializados, que requiere experiencia en f\u00edsica de semiconductores y microelectr\u00f3nica. El dise\u00f1o de placas de circuito impreso se centra m\u00e1s en la integraci\u00f3n a nivel de sistema y en los requisitos de aplicaci\u00f3n pr\u00e1ctica.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Integrated_Circuit_Packaging_Technology\"><\/span>Tecnolog\u00eda de encapsulado de circuitos integrados<span class=\"ez-toc-section-end\"><\/span><\/h2><p>El encapsulado de circuitos integrados no solo proporciona protecci\u00f3n f\u00edsica, sino que tambi\u00e9n desempe\u00f1a un papel crucial en la disipaci\u00f3n del calor y la conexi\u00f3n el\u00e9ctrica. Los tipos de encapsulado m\u00e1s comunes son:<\/p><ul class=\"wp-block-list\"><li><strong>Paquetes tradicionales:<\/strong> DIP, SOP, etc.<\/li>\n\n<li><strong>Paquetes avanzados:<\/strong> BGA, QFN, etc.<\/li>\n\n<li><strong>Tecnolog\u00edas de vanguardia:<\/strong> Integraci\u00f3n 2.5D\/3D, encapsulado a nivel de oblea (WLP)<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Future_Outlook_The_Innovation_Frontier_of_Integrated_Circuits\"><\/span>Perspectivas de futuro: la frontera de la innovaci\u00f3n en circuitos integrados<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Con el r\u00e1pido desarrollo de las tecnolog\u00edas de IA, IoT y 5G, los circuitos integrados est\u00e1n evolucionando en las siguientes direcciones:<\/p><ol class=\"wp-block-list\"><li><strong>Integraci\u00f3n heterog\u00e9nea:<\/strong> Combinaci\u00f3n de chips fabricados con diferentes nodos de proceso dentro del mismo paquete.<\/li>\n\n<li><strong>Nuevas aplicaciones de materiales:<\/strong> Nanotubos de carbono, materiales 2D que podr\u00edan sustituir al silicio tradicional.<\/li>\n\n<li><strong>Integraci\u00f3n optoelectr\u00f3nica:<\/strong> La profunda integraci\u00f3n de la comunicaci\u00f3n \u00f3ptica y los chips electr\u00f3nicos.<\/li>\n\n<li><strong>Computaci\u00f3n neurom\u00f3rfica:<\/strong> Nuevos dise\u00f1os de circuitos integrados que imitan la estructura del cerebro humano.<\/li><\/ol><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/10\/Integrated-Circuit-IC-3.jpg\" alt=\"Circuito integrado (IC)\" class=\"wp-image-4426\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/10\/Integrated-Circuit-IC-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/10\/Integrated-Circuit-IC-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/10\/Integrated-Circuit-IC-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Conclusi\u00f3n<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Como base de la era de la informaci\u00f3n, la importancia de los circuitos integrados es evidente. Su diferencia con respecto a las placas de circuito impreso (PCB) es similar a la relaci\u00f3n entre el cerebro y el sistema nervioso: cada uno tiene su propia funci\u00f3n, pero son inseparables entre s\u00ed. Comprender esta diferencia y conexi\u00f3n es fundamental para entender las tendencias en tecnolog\u00eda electr\u00f3nica y tomar las decisiones t\u00e9cnicas correctas.A medida que la tecnolog\u00eda sigue avanzando, los circuitos integrados sin duda seguir\u00e1n abriendo nuevos caminos en cuanto a tama\u00f1o m\u00e1s peque\u00f1o, mayor rendimiento y menor consumo de energ\u00eda, escribiendo nuevos cap\u00edtulos para la civilizaci\u00f3n tecnol\u00f3gica humana.<\/p><p><\/p>","protected":false},"excerpt":{"rendered":"<p>Esta completa descripci\u00f3n general presenta el concepto, las clasificaciones funcionales y los avances tecnol\u00f3gicos de los circuitos integrados (IC). Ofrece un an\u00e1lisis detallado de las funciones espec\u00edficas y la relaci\u00f3n de colaboraci\u00f3n entre los IC y las placas de circuito impreso (PCB) dentro de los sistemas electr\u00f3nicos. El contenido abarca los principios clave del dise\u00f1o de IC, las tecnolog\u00edas de encapsulado y las tendencias de desarrollo futuras.<\/p>","protected":false},"author":1,"featured_media":4427,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[381,377],"class_list":["post-4423","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-ic","tag-packaging-technologies"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Integrated Circuit (IC)-What is the difference between a PCB and an IC? - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Delve into the definition, functions, and core distinctions between integrated circuits (ICs) and printed circuit boards (PCBs). 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