{"id":4628,"date":"2025-11-16T08:29:00","date_gmt":"2025-11-16T00:29:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4628"},"modified":"2025-11-14T15:34:28","modified_gmt":"2025-11-14T07:34:28","slug":"ai-catalyzes-pcb-industry-growth-in-both-volume-and-price","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/","title":{"rendered":"La IA cataliza el crecimiento del sector de los PCB, tanto en volumen como en precio"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Tabla de contenidos<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Industry_Overview\" >Panorama de la industria<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Market_Prospects\" >Perspectivas de mercado<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Industry_Trends\" >Tendencias del sector<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Cycle_Evolution\" >Evoluci\u00f3n del ciclo<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Equipment_Market\" >Mercado de equipos<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Equipment_Structure_and_Market_Space\" >Estructura de equipos y espacio de mercado<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Competitive_Landscape_and_Localization_Opportunities\" >Panorama competitivo y oportunidades de localizaci\u00f3n<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Technology_Frontier\" >Frontera tecnol\u00f3gica<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#PCB_Backplanes_Replacing_Copper_Cables\" >Placas base de PCB Sustituci\u00f3n de cables de cobre<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#CoWoP_Packaging_Technology\" >Tecnolog\u00eda de envasado CoWoP<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/#Conclusion\" >Conclusi\u00f3n<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Industry_Overview\"><\/span>Panorama de la industria<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Las placas de circuito impreso (PCB) son conocidas como la \"madre de los productos electr\u00f3nicos\", ya que constituyen la base de los componentes electr\u00f3nicos y permiten las conexiones el\u00e9ctricas. Los productos actuales de PCB avanzan r\u00e1pidamente hacia un mayor n\u00famero de capas y una mayor densidad. Por n\u00famero de capas, pueden clasificarse en placas de una cara, de dos caras y multicapa; estructuralmente, abarcan placas r\u00edgidas, flexibles, r\u00edgido-flexibles, placas de interconexi\u00f3n de alta densidad (HDI) y sustratos de embalaje de circuitos integrados, entre otros tipos.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB.jpg\" alt=\"IA+PCB\" class=\"wp-image-4629\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Market_Prospects\"><\/span>Perspectivas de mercado<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Seg\u00fan las estad\u00edsticas de Prismark, la industria mundial de PCB alcanz\u00f3 un valor de producci\u00f3n total de $73,6 mil millones en 2024, lo que representa un aumento interanual de 5,8%. China, como la mayor base de fabricaci\u00f3n de PCB del mundo, posee una cuota de 56% del mercado mundial. En un contexto de aceleraci\u00f3n del desarrollo de aplicaciones de IA, la demanda de placas de circuito impreso de gama alta con \"perfiles m\u00e1s finos, mayor densidad y gesti\u00f3n t\u00e9rmica superior\" sigue aumentando. Se prev\u00e9 que el valor de la producci\u00f3n mundial de PCB alcance los 1.4TP4T94.661 millones en 2029, con una tasa de crecimiento anual compuesto (TCAC) del 5,2% de 2024 a 2029.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Industry_Trends\"><\/span>Tendencias del sector<span class=\"ez-toc-section-end\"><\/span><\/h2><p>En cuanto a la estructura de los productos, el crecimiento de los distintos tipos de PCB en 2024 mostr\u00f3 divergencias significativas:<\/p><ul class=\"wp-block-list\"><li>El valor de la producci\u00f3n de tableros HDI aument\u00f3 un 18,8% interanual, el rendimiento m\u00e1s destacado.<\/li>\n\n<li>El valor de la producci\u00f3n y el volumen de producci\u00f3n de placas multicapa de m\u00e1s de 18 capas crecieron 25,2% y 35,4%, respectivamente.<\/li>\n\n<li>El valor de la producci\u00f3n de PCB en el campo de servidores y almacenamiento creci\u00f3 un 33,1% interanual, alcanzando los $10.920 millones.<\/li><\/ul><p>Esta estructura de crecimiento refleja plenamente la fuerte demanda de placas de circuito impreso de gama alta impulsada por <a href=\"https:\/\/www.topfastpcb.com\/es\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/\">Servidores de IA<\/a> e infraestructura de red de alta velocidad.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Cycle_Evolution\"><\/span>Evoluci\u00f3n del ciclo<span class=\"ez-toc-section-end\"><\/span><\/h2><p>La industria de los PCB ha experimentado distintas rotaciones c\u00edclicas:<\/p><ul class=\"wp-block-list\"><li><strong>Primera Vuelta (2014-2018):<\/strong> Impulsado por la construcci\u00f3n de redes 4G y la proliferaci\u00f3n de smartphones.<\/li>\n\n<li><strong>Segunda Vuelta (2018-2022):<\/strong> Impulsado por la demanda de estaciones base 5G, trabajo remoto y electr\u00f3nica del autom\u00f3vil.<\/li>\n\n<li><strong>Tercera Vuelta (2023-Presente):<\/strong> La AIDC y la electr\u00f3nica del autom\u00f3vil se convierten en nuevos polos de crecimiento.<\/li><\/ul><p>En los tres primeros trimestres de 2025, el gasto de capital combinado de ocho de las principales empresas nacionales de PCB alcanz\u00f3 los 16.300 millones de RMB, lo que supuso un significativo aumento interanual de 85%, marcando el inicio acelerado de una nueva ronda del ciclo de expansi\u00f3n.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-2.jpg\" alt=\"IA+PCB\" class=\"wp-image-4630\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Equipment_Market\"><\/span>Mercado de equipos<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Equipment_Structure_and_Market_Space\"><\/span>Estructura de equipos y espacio de mercado<span class=\"ez-toc-section-end\"><\/span><\/h3><p>La producci\u00f3n de PCB abarca siete procesos principales: taladrado, exposici\u00f3n, inspecci\u00f3n, chapado, laminado y conformado. Entre ellos:<\/p><ul class=\"wp-block-list\"><li>Los equipos de perforaci\u00f3n tienen la mayor cuota de valor, con 20,2%.<\/li>\n\n<li>Los equipos de exposici\u00f3n representan 13,5%.<\/li>\n\n<li>Los equipos de inspecci\u00f3n representan 11,9%.<\/li><\/ul><p>El tama\u00f1o del mercado mundial de equipos PCB aument\u00f3 de $5,84 mil millones en 2020 a $7,085 mil millones en 2024 y se espera que alcance $7,793 mil millones en 2025. El tama\u00f1o del mercado chino fue de 29.442 millones de RMB en 2024, y se prev\u00e9 que aumente a 32.400 millones de RMB en 2025.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Competitive_Landscape_and_Localization_Opportunities\"><\/span>Panorama competitivo y oportunidades de localizaci\u00f3n<span class=\"ez-toc-section-end\"><\/span><\/h3><p>La concentraci\u00f3n del mercado chino de equipos de PCB es relativamente baja, con una CR5 de 23,9%. Han's CNC, como l\u00edder nacional, posee una cuota de mercado de aproximadamente 10,1%. Actualmente, la tasa de localizaci\u00f3n de equipos de gama alta es inferior a 30%, pero se ha formado una competitividad global en segmentos como el taladrado, la exposici\u00f3n, el chapado y los consumibles.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technology_Frontier\"><\/span>Frontera tecnol\u00f3gica<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCB_Backplanes_Replacing_Copper_Cables\"><\/span>Placas base de PCB Sustituci\u00f3n de cables de cobre<span class=\"ez-toc-section-end\"><\/span><\/h3><p>La pr\u00f3xima generaci\u00f3n de productos podr\u00eda adoptar el material M9, utilizando placas base de PCB en lugar de cables de cobre para lograr dise\u00f1os de armarios m\u00e1s compactos.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"CoWoP_Packaging_Technology\"><\/span>Tecnolog\u00eda de envasado CoWoP<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Introducci\u00f3n de la tecnolog\u00eda CoWoS (Chip-on-Wafer-on-Substrate) en las GPU de nueva generaci\u00f3n, omitiendo el sustrato y soldando los chips directamente en intercaladores de silicio integrados en la placa de circuito impreso principal, con lo que se consigue una integraci\u00f3n estructural de \"paquete como placa principal\". Con esta tecnolog\u00eda, las placas de circuito impreso cumplir\u00e1n requisitos de densidad de cableado, planitud y control de materiales propios de un sistema de envasado.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-3.jpg\" alt=\"IA+PCB\" class=\"wp-image-4631\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AIPCB-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Conclusi\u00f3n<span class=\"ez-toc-section-end\"><\/span><\/h2><p>La industria de las placas de circuito impreso est\u00e1 abriendo oportunidades de desarrollo con aumentos de volumen y precio catalizados por la IA:<\/p><ul class=\"wp-block-list\"><li><strong>Crecimiento del volumen:<\/strong> En el primer semestre de 2025, el gasto mundial de capital de los cuatro principales PSC alcanz\u00f3 los 155.500 millones de PT4T, lo que supone un aumento interanual de 731 PT3T.<\/li>\n\n<li><strong>Aumento de precios:<\/strong> Aumenta la proporci\u00f3n de placas con un elevado n\u00famero de capas y de IDH, lo que va acompa\u00f1ado de una mayor complejidad de procesamiento.<\/li><\/ul>","protected":false},"excerpt":{"rendered":"<p>El sector de las placas de circuito impreso est\u00e1 entrando en un nuevo ciclo de crecimiento impulsado por la demanda de servidores de inteligencia artificial, electr\u00f3nica del autom\u00f3vil y otros sectores. La demanda de productos de gama alta, como las placas HDI y las placas multicapa de 18 o m\u00e1s capas, est\u00e1 aumentando vertiginosamente, lo que impulsa los incrementos de volumen y precio en todo el sector. El mercado mundial de equipos de PCB sigue en expansi\u00f3n, y las empresas l\u00edderes tecnol\u00f3gicamente avanzadas se benefician constantemente. La cadena industrial est\u00e1 preparada para oportunidades de inversi\u00f3n estructural.<\/p>","protected":false},"author":1,"featured_media":4632,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[108],"tags":[406],"class_list":["post-4628","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb-industry-analysis"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>AI Catalyzes PCB Industry Growth in Both Volume and Price - Topfastpcb<\/title>\n<meta name=\"description\" content=\"2025 PCB Industry In-Depth Analysis: AI Catalyzes Industry Growth in Both Volume and Price Global Market Trends: $73.6 Billion Market, Explosive Growth in HDI Boards, Opportunities Emerge for China&#039;s High-End Equipment Sector\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/ai-catalyzes-pcb-industry-growth-in-both-volume-and-price\/\" \/>\n<meta property=\"og:locale\" content=\"es_ES\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"AI Catalyzes PCB Industry Growth in Both Volume and Price - 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