{"id":5054,"date":"2026-01-31T08:14:00","date_gmt":"2026-01-31T00:14:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=5054"},"modified":"2026-01-21T15:56:43","modified_gmt":"2026-01-21T07:56:43","slug":"cracked-vias-and-barrel-cracks-in-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/","title":{"rendered":"V\u00edas agrietadas y grietas en barril en PCB"},"content":{"rendered":"<p>Las fisuras en las v\u00edas y en los barriles se encuentran entre las m\u00e1s cr\u00edticas. <strong>fallos de fiabilidad latentes<\/strong> en la fabricaci\u00f3n de PCB.<\/p><p>A menudo, estos defectos superan las pruebas el\u00e9ctricas iniciales, pero fallan m\u00e1s tarde bajo tensi\u00f3n t\u00e9rmica o mec\u00e1nica, lo que los hace especialmente peligrosos en aplicaciones de alta fiabilidad.<\/p><p>Este art\u00edculo lo explica:<\/p><ul class=\"wp-block-list\"><li>Qu\u00e9 son las grietas de la v\u00eda y las grietas del ca\u00f1\u00f3n<\/li>\n\n<li>Por qu\u00e9 se producen<\/li>\n\n<li>C\u00f3mo se detectan<\/li>\n\n<li>C\u00f3mo reducen los fabricantes su incidencia<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"337\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures.jpg\" alt=\"Fallos de PCB\" class=\"wp-image-5055\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-300x169.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-18x10.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Tabla de contenidos<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#What_Are_Via_Cracks_and_Barrel_Cracks\" >\u00bfQu\u00e9 son las grietas de la v\u00eda y las grietas del ca\u00f1\u00f3n?<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Via_Crack\" >V\u00eda Crack<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Barrel_Crack\" >Grieta del barril<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Why_Via_Cracks_Are_a_Serious_Reliability_Issue\" >Por qu\u00e9 las grietas en las v\u00edas son un grave problema de fiabilidad<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Primary_Causes_of_Via_and_Barrel_Cracks\" >Causas principales de las grietas en las v\u00edas y los barriles<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Z-Axis_Expansion_Mismatch\" >Desajuste de la expansi\u00f3n del eje Z<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Thin_or_Non-Uniform_Copper_Plating\" >Cobreado fino o no uniforme<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#High_Aspect_Ratio_Vias\" >V\u00edas de alta relaci\u00f3n de aspecto<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Excessive_Thermal_Cycling\" >Ciclado t\u00e9rmico excesivo<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Design_Factors_That_Increase_Via_Crack_Risk\" >Factores de dise\u00f1o que aumentan el riesgo de grietas en la v\u00eda<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#High-Risk_Design_Choices\" >Opciones de dise\u00f1o de alto riesgo<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Manufacturing_Factors_Contributing_to_Via_Cracks\" >Factores de fabricaci\u00f3n que contribuyen a las grietas en las v\u00edas<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Drilling_Quality\" >Calidad de perforaci\u00f3n<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Inadequate_Desmear_Process\" >Proceso de desmanchado inadecuado<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Plating_Stress_Control\" >Control de tensiones de chapado<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#How_Via_Cracks_Are_Detected\" >C\u00f3mo se detectan las grietas en las v\u00edas<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Common_Detection_Methods\" >M\u00e9todos de detecci\u00f3n habituales<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Preventing_Cracked_Vias_and_Barrel_Cracks\" >Prevenci\u00f3n de grietas en las v\u00edas y en los barriles<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Design-Level_Prevention\" >Prevenci\u00f3n a nivel de dise\u00f1o<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Process-Level_Prevention\" >Prevenci\u00f3n a nivel de proceso<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Material_Selection\" >Selecci\u00f3n de materiales<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Relationship_to_Other_PCB_Failure_Modes\" >Relaci\u00f3n con otros modos de fallo de PCB<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Conclusion\" >Conclusi\u00f3n<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-24\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Via_Cracks_in_PCB_FAQ\" >V\u00eda Grietas en PCB FAQ<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Are_Via_Cracks_and_Barrel_Cracks\"><\/span>\u00bfQu\u00e9 son las grietas de la v\u00eda y las grietas del ca\u00f1\u00f3n?<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Via_Crack\"><\/span>V\u00eda Crack<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Una grieta en una v\u00eda es una fractura en el revestimiento de cobre de una v\u00eda, normalmente en:<\/p><ul class=\"wp-block-list\"><li>La rodilla de la v\u00eda<\/li>\n\n<li>La interfaz entre el cobre y el diel\u00e9ctrico<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Barrel_Crack\"><\/span>Grieta del barril<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Una grieta de barril se refiere espec\u00edficamente a una <strong>grieta circunferencial<\/strong> en el ca\u00f1\u00f3n de la v\u00eda chapada.<\/p><p>Ambos interrumpen la continuidad el\u00e9ctrica con el paso del tiempo.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Why_Via_Cracks_Are_a_Serious_Reliability_Issue\"><\/span>Por qu\u00e9 las grietas en las v\u00edas son un grave problema de fiabilidad<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Las grietas en las v\u00edas son peligrosas porque:<\/p><ul class=\"wp-block-list\"><li>Suelen ser intermitentes<\/li>\n\n<li>Empeora con los ciclos t\u00e9rmicos<\/li>\n\n<li>Son dif\u00edciles de detectar visualmente<\/li><\/ul><p>Con frecuencia aparecen s\u00f3lo despu\u00e9s de su uso sobre el terreno o en pruebas de esfuerzo.<\/p><p><em>Resumen de fallos:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/es\/blog\/common-pcb-failures-causes-solutions\/\">Explicaci\u00f3n de los fallos m\u00e1s comunes de las placas de circuito impreso<\/a><\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Primary_Causes_of_Via_and_Barrel_Cracks\"><\/span>Causas principales de las grietas en las v\u00edas y los barriles<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Z-Axis_Expansion_Mismatch\"><\/span>Desajuste de la expansi\u00f3n del eje Z<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Durante el calentamiento, los materiales diel\u00e9ctricos se dilatan m\u00e1s que el cobre en el eje Z.<\/p><p>Las repetidas dilataciones y contracciones crean tensiones en el ca\u00f1\u00f3n de la v\u00eda.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Thin_or_Non-Uniform_Copper_Plating\"><\/span>Cobreado fino o no uniforme<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Un grosor insuficiente del revestimiento reduce la capacidad de la v\u00eda para absorber tensiones mec\u00e1nicas.<\/p><p> <em>Detalle del proceso:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/es\/blog\/copper-plating-process-in-pcb-manufacturing-explained\/\">Proceso de cobreado en la fabricaci\u00f3n de PCB<\/a><\/strong><\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High_Aspect_Ratio_Vias\"><\/span>V\u00edas de alta relaci\u00f3n de aspecto<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Las v\u00edas de alta relaci\u00f3n de aspecto son m\u00e1s dif\u00edciles de revestir uniformemente y sufren mayores tensiones.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Excessive_Thermal_Cycling\"><\/span>Ciclado t\u00e9rmico excesivo<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Exposici\u00f3n repetida a:<\/p><ul class=\"wp-block-list\"><li>Soldadura reflow<\/li>\n\n<li>Ciclos de potencia<\/li>\n\n<li>Cambios de temperatura ambiental<\/li><\/ul><p>Acelera la formaci\u00f3n de grietas.<\/p><p><em>Pruebas de fiabilidad:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-reliability-testing-standards\/\">Pruebas de fiabilidad t\u00e9rmica de PCB<\/a><\/strong><\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"337\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-1.jpg\" alt=\"Fallos de PCB\" class=\"wp-image-5056\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-1-300x169.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-1-18x10.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Design_Factors_That_Increase_Via_Crack_Risk\"><\/span>Factores de dise\u00f1o que aumentan el riesgo de grietas en la v\u00eda<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Ciertas decisiones de dise\u00f1o aumentan significativamente el riesgo.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High-Risk_Design_Choices\"><\/span>Opciones de dise\u00f1o de alto riesgo<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Di\u00e1metros de v\u00eda muy peque\u00f1os<\/li>\n\n<li>Placas de circuito impreso de poco grosor con v\u00edas profundas<\/li>\n\n<li>Grandes planos de cobre sin relieve<\/li>\n\n<li>Estructuras densas via-in-pad<\/li><\/ul><p>La revisi\u00f3n del dise\u00f1o para la fiabilidad es fundamental.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Factors_Contributing_to_Via_Cracks\"><\/span>Factores de fabricaci\u00f3n que contribuyen a las grietas en las v\u00edas<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Drilling_Quality\"><\/span>Calidad de perforaci\u00f3n<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Las manchas de perforaci\u00f3n, las paredes rugosas de los orificios o la extracci\u00f3n de fibras debilitan la adherencia del cobre.<\/p><p><em>Comparaci\u00f3n:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-drilling-vs-laser-drilling\/\">Taladrado de placas de circuito impreso vs. Taladrado l\u00e1ser<\/a><\/strong><\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Inadequate_Desmear_Process\"><\/span>Proceso de desmanchado inadecuado<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Un desprendimiento deficiente impide la correcta uni\u00f3n del cobre al diel\u00e9ctrico.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Plating_Stress_Control\"><\/span>Control de tensiones de chapado<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Una qu\u00edmica de revestimiento inadecuada puede introducir tensiones internas en los dep\u00f3sitos de cobre.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_Via_Cracks_Are_Detected\"><\/span>C\u00f3mo se detectan las grietas en las v\u00edas<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Las grietas de las v\u00edas rara vez se detectan s\u00f3lo con una inspecci\u00f3n superficial.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_Detection_Methods\"><\/span>M\u00e9todos de detecci\u00f3n habituales<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Pruebas de estr\u00e9s t\u00e9rmico<\/li>\n\n<li>An\u00e1lisis de microsecciones<\/li>\n\n<li>Pruebas el\u00e9ctricas tras el ciclado<\/li>\n\n<li>Inspecci\u00f3n por rayos X (eficacia limitada)<\/li><\/ul><p><em>Resumen de la inspecci\u00f3n:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-inspection-and-testing\/\">Inspecci\u00f3n y ensayo de PCB<\/a><\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Preventing_Cracked_Vias_and_Barrel_Cracks\"><\/span>Prevenci\u00f3n de grietas en las v\u00edas y en los barriles<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Design-Level_Prevention\"><\/span>Prevenci\u00f3n a nivel de dise\u00f1o<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Di\u00e1metro adecuado de la v\u00eda<\/li>\n\n<li>Relaci\u00f3n de aspecto controlada<\/li>\n\n<li>Patrones de alivio t\u00e9rmico<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Process-Level_Prevention\"><\/span>Prevenci\u00f3n a nivel de proceso<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Par\u00e1metros de perforaci\u00f3n optimizados<\/li>\n\n<li>Espesor uniforme del cobreado<\/li>\n\n<li>Qu\u00edmica de revestimiento controlada por la tensi\u00f3n<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Material_Selection\"><\/span>Selecci\u00f3n de materiales<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Materiales de baja dilataci\u00f3n en el eje Z<\/li>\n\n<li>Laminados de alta Tg para estabilidad t\u00e9rmica<\/li><\/ul><p>Fabricantes como TOPFAST integran las consideraciones de fiabilidad en una fase temprana de la planificaci\u00f3n del proceso.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"337\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-2.jpg\" alt=\"Fallos de PCB\" class=\"wp-image-5057\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-2-300x169.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-2-18x10.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Relationship_to_Other_PCB_Failure_Modes\"><\/span>Relaci\u00f3n con otros modos de fallo de PCB<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Las grietas de las v\u00edas suelen coexistir con:<\/p><ul class=\"wp-block-list\"><li>Delaminaci\u00f3n<\/li>\n\n<li>Formaci\u00f3n de CAF<\/li>\n\n<li>Circuitos abiertos intermitentes<\/li><\/ul><p><em>Tema relacionado:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-delamination-causes-prevention\/\">Causas y prevenci\u00f3n de la delaminaci\u00f3n de PCB<\/a><\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Conclusi\u00f3n<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Las fisuras en las v\u00edas y en los barriles no son defectos aleatorios, sino resultados previsibles de <strong>estr\u00e9s t\u00e9rmico, decisiones de dise\u00f1o y limitaciones del proceso<\/strong>.<\/p><p>A trav\u00e9s de:<\/p><ul class=\"wp-block-list\"><li>Pr\u00e1cticas de dise\u00f1o adecuadas<\/li>\n\n<li>Procesos de fabricaci\u00f3n controlados<\/li>\n\n<li>Selecci\u00f3n adecuada del material<\/li><\/ul><p>Su incidencia puede reducirse significativamente.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Via_Cracks_in_PCB_FAQ\"><\/span>V\u00eda Grietas en PCB FAQ<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1768981138484\"><strong class=\"schema-faq-question\">P: \u00bfSe pueden reparar las grietas v\u00eda?<\/strong> <p class=\"schema-faq-answer\">R: No. Una vez agrietadas, las v\u00edas no pueden repararse de forma fiable.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1768981208332\"><strong class=\"schema-faq-question\">Q: <strong>\u00bfTodas las grietas v\u00eda causan un fallo inmediato?<\/strong><\/strong> <p class=\"schema-faq-answer\">R: No. Muchos son latentes e intermitentes.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1768981226138\"><strong class=\"schema-faq-question\">Q: <strong>\u00bfEs siempre mejor un cobre m\u00e1s grueso?<\/strong><\/strong> <p class=\"schema-faq-answer\">R: No siempre, pero es fundamental que el grosor sea suficiente y uniforme.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1768981244482\"><strong class=\"schema-faq-question\">Q: <strong>\u00bfSon m\u00e1s frecuentes las grietas en las v\u00edas en los ensamblajes sin plomo?<\/strong><\/strong> <p class=\"schema-faq-answer\">R: S\u00ed, debido a las temperaturas de reflujo m\u00e1s elevadas.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1768981259852\"><strong class=\"schema-faq-question\">Q: <strong>\u00bfPueden los rayos X detectar a trav\u00e9s de grietas?<\/strong><\/strong> <p class=\"schema-faq-answer\">R: Normalmente no, a menos que las grietas sean graves.<\/p> <\/div> <\/div>","protected":false},"excerpt":{"rendered":"<p>Las fisuras en las v\u00edas y en los barriles son fallos frecuentes en las placas de circuito impreso. Este art\u00edculo analiza sus causas, las t\u00e9cnicas de detecci\u00f3n y las medidas preventivas que emplean los fabricantes para garantizar su fiabilidad.<\/p>","protected":false},"author":1,"featured_media":5058,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[108],"tags":[438],"class_list":["post-5054","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb-failures"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Cracked Vias and Barrel Cracks in PCB: Causes, Detection, and Prevention<\/title>\n<meta name=\"description\" content=\"Cracked vias and barrel cracks are common PCB reliability failures. 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