{"id":5223,"date":"2026-03-15T08:32:00","date_gmt":"2026-03-15T00:32:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=5223"},"modified":"2026-03-10T17:27:50","modified_gmt":"2026-03-10T09:27:50","slug":"pcb-solder-mask-design-guidelines","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/","title":{"rendered":"Directrices de dise\u00f1o de m\u00e1scaras de soldadura de PCB para una fabricaci\u00f3n fiable"},"content":{"rendered":"<p>La m\u00e1scara de soldadura es una de las capas m\u00e1s visibles de una placa de circuito impreso. Cubre las pistas de cobre y deja expuestas las almohadillas de los componentes para la soldadura.<\/p><p>Aunque la m\u00e1scara de soldadura parece sencilla, un dise\u00f1o inadecuado puede dar lugar a varios problemas de fabricaci\u00f3n y montaje, entre ellos:<\/p><ul class=\"wp-block-list\"><li>puentes de soldadura entre pastillas<\/li>\n\n<li>malas juntas de soldadura<\/li>\n\n<li>zonas de cobre expuestas<\/li>\n\n<li>Reducci\u00f3n del rendimiento de los PCB<\/li><\/ul><p>Siguiendo correctamente <strong>Directrices de dise\u00f1o de m\u00e1scaras de soldadura para PCB<\/strong> garantiza que la capa de m\u00e1scara sea compatible con los procesos de fabricaci\u00f3n y montaje.<\/p><p>Esta gu\u00eda explica los principales par\u00e1metros de dise\u00f1o que los ingenieros deben tener en cuenta a la hora de crear aberturas y espacios libres para m\u00e1scaras de soldadura.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"437\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask.jpg\" alt=\"M\u00e1scara de soldadura PCB\" class=\"wp-image-5224\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-300x219.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-16x12.jpg 16w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Tabla de contenidos<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#What_Is_PCB_Solder_Mask\" >\u00bfQu\u00e9 es la m\u00e1scara de soldadura para PCB?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Types_of_Solder_Mask\" >Tipos de m\u00e1scara de soldadura<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Liquid_Photoimageable_Solder_Mask_LPI\" >M\u00e1scara de soldadura l\u00edquida fotoimageable (LPI)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Dry_Film_Solder_Mask\" >M\u00e1scara de soldadura de pel\u00edcula seca<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Epoxy_Screen-Printed_Mask\" >M\u00e1scara serigrafiada epoxi<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Key_PCB_Solder_Mask_Design_Rules\" >Reglas clave para el dise\u00f1o de m\u00e1scaras de soldadura de PCB<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#1_Solder_Mask_Clearance\" >1. Espacio libre de la m\u00e1scara de soldadura<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#2_Solder_Mask_Expansion\" >2. Expansi\u00f3n de la m\u00e1scara de soldadura<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#3_Solder_Mask_Dam_Width\" >3. Anchura del dique de m\u00e1scara de soldadura<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#4_Fine-Pitch_Component_Considerations\" >4. Consideraciones sobre los componentes de paso fino<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Solder_Mask_Defined_Pads_SMD\" >Almohadillas definidas por m\u00e1scara de soldadura (SMD)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Non-Solder_Mask_Defined_Pads_NSMD\" >Almohadillas definidas sin m\u00e1scara de soldadura (NSMD)<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#How_to_Design_PCB_Solder_Mask_Practical_Steps\" >C\u00f3mo dise\u00f1ar la m\u00e1scara de soldadura de PCB (pasos pr\u00e1cticos)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Common_PCB_Solder_Mask_Design_Mistakes\" >Errores comunes en el dise\u00f1o de m\u00e1scaras de soldadura para PCB<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Mask_openings_are_too_small\" >Las aberturas de las mascarillas son demasiado peque\u00f1as<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Insufficient_solder_mask_dam\" >Presa de m\u00e1scara de soldadura insuficiente<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Incorrect_pad_definitions\" >Definiciones incorrectas de las almohadillas<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Ignoring_manufacturing_tolerances\" >Ignorar las tolerancias de fabricaci\u00f3n<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Manufacturing_Considerations\" >Consideraciones sobre la fabricaci\u00f3n<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#Conclusion\" >Conclusi\u00f3n<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/#PCB_Solder_Mask_FAQ\" >M\u00e1scara de soldadura FAQ<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Is_PCB_Solder_Mask\"><\/span>\u00bfQu\u00e9 es la m\u00e1scara de soldadura para PCB?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>La m\u00e1scara de soldadura es un revestimiento de pol\u00edmero que se aplica a las superficies de las placas de circuito impreso para proteger las trazas de cobre y evitar conexiones de soldadura involuntarias.<\/p><p>Sus principales funciones son:<\/p><ul class=\"wp-block-list\"><li>proteger el cobre de la oxidaci\u00f3n<\/li>\n\n<li>prevenci\u00f3n de puentes de soldadura<\/li>\n\n<li>mejorar el aislamiento entre conductores<\/li>\n\n<li>mejorar el aspecto de las placas de circuito impreso<\/li><\/ul><p>Durante la fabricaci\u00f3n de placas de circuito impreso, la capa de m\u00e1scara de soldadura se aplica despu\u00e9s de la formaci\u00f3n del patr\u00f3n de cobre y antes del acabado de la superficie.<\/p><p>El flujo de trabajo general de fabricaci\u00f3n se explica en: <strong><a href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-manufacturing-process-explained-step-by-step\/\">Explicaci\u00f3n del proceso de fabricaci\u00f3n de PCB<\/a><\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Types_of_Solder_Mask\"><\/span>Tipos de m\u00e1scara de soldadura<span class=\"ez-toc-section-end\"><\/span><\/h2><p>En la fabricaci\u00f3n de placas de circuito impreso se utilizan varios tipos de m\u00e1scaras de soldadura.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Liquid_Photoimageable_Solder_Mask_LPI\"><\/span>M\u00e1scara de soldadura l\u00edquida fotoimageable (LPI)<span class=\"ez-toc-section-end\"><\/span><\/h3><p>El tipo m\u00e1s com\u00fan utilizado en los PCB modernos.<\/p><p>Caracter\u00edsticas:<\/p><ul class=\"wp-block-list\"><li>aplicado como revestimiento l\u00edquido<\/li>\n\n<li>estampado mediante fotolitograf\u00eda<\/li>\n\n<li>admite componentes de paso fino<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Dry_Film_Solder_Mask\"><\/span>M\u00e1scara de soldadura de pel\u00edcula seca<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Menos utilizados pero adecuados para aplicaciones espec\u00edficas.<\/p><p>Funciones:<\/p><ul class=\"wp-block-list\"><li>pel\u00edcula laminada<\/li>\n\n<li>espesor uniforme<\/li>\n\n<li>Adecuado para dise\u00f1os de alta precisi\u00f3n<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Epoxy_Screen-Printed_Mask\"><\/span>M\u00e1scara serigrafiada epoxi<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Se utiliza principalmente en procesos de PCB antiguos o de bajo coste.<\/p><p>Limitaciones:<\/p><ul class=\"wp-block-list\"><li>menor resoluci\u00f3n<\/li>\n\n<li>no apto para componentes de paso fino<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Key_PCB_Solder_Mask_Design_Rules\"><\/span>Reglas clave para el dise\u00f1o de m\u00e1scaras de soldadura de PCB<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Varios par\u00e1metros de dise\u00f1o influyen en el rendimiento de la m\u00e1scara de soldadura.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Solder_Mask_Clearance\"><\/span>1. Espacio libre de la m\u00e1scara de soldadura<span class=\"ez-toc-section-end\"><\/span><\/h3><p>El espacio libre de la m\u00e1scara de soldadura define la distancia entre el borde de la pastilla de cobre y la abertura de la m\u00e1scara.<\/p><p>Pauta t\u00edpica:<\/p><pre class=\"wp-block-preformatted\">Espacio libre de la m\u00e1scara: 3-4 mil<\/pre><p>Una holgura adecuada garantiza que las almohadillas queden totalmente expuestas durante el montaje.<\/p><p>Si el espacio libre es demasiado peque\u00f1o:<\/p><ul class=\"wp-block-list\"><li>La m\u00e1scara puede cubrir los bordes de la almohadilla<\/li>\n\n<li>Las soldaduras pueden ser poco fiables<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Solder_Mask_Expansion\"><\/span>2. Expansi\u00f3n de la m\u00e1scara de soldadura<span class=\"ez-toc-section-end\"><\/span><\/h3><p>La expansi\u00f3n de la m\u00e1scara es la cantidad en la que la abertura de la m\u00e1scara de soldadura se ampl\u00eda m\u00e1s all\u00e1 de la almohadilla de cobre.<\/p><p>Por ejemplo:<\/p><pre class=\"wp-block-preformatted\">Tama\u00f1o de la almohadilla = 20 mil<br>Apertura de la m\u00e1scara = 24 mil<br>Expansi\u00f3n = 2 mil por lado<\/pre><p>Esta expansi\u00f3n compensa las tolerancias de alineaci\u00f3n de la m\u00e1scara durante la fabricaci\u00f3n.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Solder_Mask_Dam_Width\"><\/span>3. Anchura del dique de m\u00e1scara de soldadura<span class=\"ez-toc-section-end\"><\/span><\/h3><p>La presa de m\u00e1scara de soldadura es la estrecha franja de m\u00e1scara entre dos almohadillas.<\/p><p>Anchura m\u00ednima t\u00edpica de una presa:<\/p><pre class=\"wp-block-preformatted\">\u2265 4 mil<\/pre><p>Si la presa es demasiado estrecha, puede romperse durante la fabricaci\u00f3n, aumentando el riesgo de puentes de soldadura.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Fine-Pitch_Component_Considerations\"><\/span>4. Consideraciones sobre los componentes de paso fino<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Los circuitos integrados de paso fino y los BGA requieren un dise\u00f1o especial de la m\u00e1scara de soldadura.<\/p><p>Entre los enfoques comunes se incluyen:<\/p><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Solder_Mask_Defined_Pads_SMD\"><\/span>Almohadillas definidas por m\u00e1scara de soldadura (SMD)<span class=\"ez-toc-section-end\"><\/span><\/h4><p>La apertura de la m\u00e1scara define el tama\u00f1o de la almohadilla.<\/p><p>Ventajas:<\/p><ul class=\"wp-block-list\"><li>control m\u00e1s estricto de los componentes peque\u00f1os<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Non-Solder_Mask_Defined_Pads_NSMD\"><\/span>Almohadillas definidas sin m\u00e1scara de soldadura (NSMD)<span class=\"ez-toc-section-end\"><\/span><\/h4><p>La almohadilla de cobre define el tama\u00f1o, la apertura de la m\u00e1scara es mayor.<\/p><p>Ventajas:<\/p><ul class=\"wp-block-list\"><li>mayor fiabilidad de la uni\u00f3n soldada<\/li>\n\n<li>com\u00fanmente utilizado para almohadillas BGA<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"468\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-1.jpg\" alt=\"M\u00e1scara de soldadura PCB\" class=\"wp-image-5225\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-1-300x234.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-1-15x12.jpg 15w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_to_Design_PCB_Solder_Mask_Practical_Steps\"><\/span>C\u00f3mo dise\u00f1ar la m\u00e1scara de soldadura de PCB (pasos pr\u00e1cticos)<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-how-to wp-block-yoast-how-to-block\"><p class=\"schema-how-to-description\">Los ingenieros suelen seguir varios pasos a la hora de definir las reglas de la m\u00e1scara de soldadura.<\/p> <ol class=\"schema-how-to-steps\"><li class=\"schema-how-to-step\" id=\"how-to-step-1773134083798\"><strong class=\"schema-how-to-step-name\">Paso 1 - Definir las reglas de ampliaci\u00f3n de la m\u00e1scara<\/strong> <p class=\"schema-how-to-step-text\">Configure la expansi\u00f3n de m\u00e1scara global en el software de dise\u00f1o de PCB.<br\/>Rango t\u00edpico: 2-4 mil<br\/><\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773134096300\"><strong class=\"schema-how-to-step-name\">Paso 2 - Comprobar los componentes de paso fino<\/strong> <p class=\"schema-how-to-step-text\">Verificar las aberturas de la m\u00e1scara de soldadura alrededor:<br\/>QFN<br\/>BGA<br\/>conectores de paso peque\u00f1o<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773134129021\"><strong class=\"schema-how-to-step-name\">Paso 3 - Verificar la anchura de los diques de m\u00e1scara<\/strong> <p class=\"schema-how-to-step-text\">Aseg\u00farese de que el espacio entre almohadillas adyacentes puede soportar presas de m\u00e1scara.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773134139200\"><strong class=\"schema-how-to-step-name\">Paso 4 - Realizar comprobaciones DFM<\/strong> <p class=\"schema-how-to-step-text\">Los fabricantes revisan los datos de las m\u00e1scaras de soldadura para garantizar su fabricabilidad.<br\/>El proceso de revisi\u00f3n DFM se describe en: <strong><a href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-dfm-checklist-before-sending-gerber-files\/\">Lista de comprobaci\u00f3n DFM de PCB antes de enviar archivos Gerber<\/a><\/strong><\/p> <\/li><\/ol><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_PCB_Solder_Mask_Design_Mistakes\"><\/span>Errores comunes en el dise\u00f1o de m\u00e1scaras de soldadura para PCB<span class=\"ez-toc-section-end\"><\/span><\/h2><p>En los dise\u00f1os de placas de circuito impreso aparecen con frecuencia varios problemas de dise\u00f1o.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Mask_openings_are_too_small\"><\/span>Las aberturas de las mascarillas son demasiado peque\u00f1as<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Puede cubrir parcialmente las almohadillas.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Insufficient_solder_mask_dam\"><\/span>Presa de m\u00e1scara de soldadura insuficiente<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Provoca puentes de soldadura.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Incorrect_pad_definitions\"><\/span>Definiciones incorrectas de las almohadillas<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Un desajuste entre la m\u00e1scara y las almohadillas de cobre puede causar problemas de montaje.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Ignoring_manufacturing_tolerances\"><\/span>Ignorar las tolerancias de fabricaci\u00f3n<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Deben tenerse en cuenta las tolerancias de alineaci\u00f3n de la m\u00e1scara.<\/p><p>Muchos problemas de fiabilidad durante el montaje tienen su origen en problemas de dise\u00f1o tratados en: <strong>Fallos comunes de las placas de circuito impreso y problemas de fiabilidad<\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Considerations\"><\/span>Consideraciones sobre la fabricaci\u00f3n<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Los fabricantes de PCB eval\u00faan las capas de m\u00e1scara de soldadura durante el an\u00e1lisis CAM.<\/p><p>Revisan:<\/p><ul class=\"wp-block-list\"><li>aperturas de m\u00e1scara<\/li>\n\n<li>limpieza de la m\u00e1scara<\/li>\n\n<li>anchura de las presas<\/li>\n\n<li>tolerancias de alineaci\u00f3n<\/li><\/ul><p>En fabricantes como <strong><a href=\"https:\/\/www.topfastpcb.com\/es\/about\/\">TOPFAST<\/a><\/strong>Por lo general, los equipos de ingenier\u00eda verifican los par\u00e1metros de la m\u00e1scara de soldadura antes de la fabricaci\u00f3n para garantizar la compatibilidad con los procesos de fabricaci\u00f3n y montaje de placas de circuito impreso.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Conclusi\u00f3n<span class=\"ez-toc-section-end\"><\/span><\/h2><p>El dise\u00f1o de la m\u00e1scara de soldadura desempe\u00f1a un papel crucial en la fabricaci\u00f3n de placas de circuito impreso y la fiabilidad del montaje.<\/p><p>Siguiendo unas reglas de dise\u00f1o pr\u00e1cticas, como una separaci\u00f3n adecuada de la m\u00e1scara, una anchura suficiente del dique y una definici\u00f3n correcta de las pastillas, los ingenieros pueden reducir los defectos de montaje y mejorar el rendimiento de la producci\u00f3n.<\/p><p>La estrecha coordinaci\u00f3n entre los equipos de dise\u00f1o y los fabricantes de placas de circuito impreso tambi\u00e9n ayuda a garantizar que las capas de m\u00e1scara de soldadura se ajusten a las capacidades de fabricaci\u00f3n.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"406\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-2.jpg\" alt=\"M\u00e1scara de soldadura PCB\" class=\"wp-image-5226\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-2-300x203.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCB_Solder_Mask_FAQ\"><\/span>M\u00e1scara de soldadura FAQ<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1773133323837\"><strong class=\"schema-faq-question\">P: \u00bfQu\u00e9 es la separaci\u00f3n de la m\u00e1scara de soldadura en el dise\u00f1o de placas de circuito impreso?<\/strong> <p class=\"schema-faq-answer\">R: El espacio libre de la m\u00e1scara de soldadura es la distancia entre el borde de la almohadilla de cobre y la abertura de la m\u00e1scara de soldadura, lo que garantiza que las almohadillas permanezcan expuestas durante el montaje.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1773133514435\"><strong class=\"schema-faq-question\">P: \u00bfCu\u00e1l es la anchura m\u00ednima del dique de la m\u00e1scara de soldadura?<\/strong> <p class=\"schema-faq-answer\">R: La mayor\u00eda de los fabricantes de placas de circuito impreso recomiendan una anchura m\u00ednima de la presa de la m\u00e1scara de soldadura de <strong>4 millones<\/strong> para evitar la rotura de la m\u00e1scara.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1773133582473\"><strong class=\"schema-faq-question\">P: \u00bfQu\u00e9 ocurre si las aberturas de la m\u00e1scara de soldadura son demasiado peque\u00f1as?<\/strong> <p class=\"schema-faq-answer\">R: Las peque\u00f1as aberturas de la m\u00e1scara pueden cubrir parcialmente las almohadillas, lo que da lugar a uniones de soldadura deficientes.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1773133596476\"><strong class=\"schema-faq-question\">P: \u00bfQu\u00e9 diferencia hay entre las pastillas SMD y NSMD?<\/strong> <p class=\"schema-faq-answer\">R: Los pads SMD se definen por las aberturas de la m\u00e1scara de soldadura, mientras que los pads NSMD se definen por el propio pad de cobre. Los pads NSMD se utilizan habitualmente para componentes BGA.<\/p> <\/div> <\/div><p><\/p>","protected":false},"excerpt":{"rendered":"<p>La m\u00e1scara de soldadura es una capa protectora que se aplica a la superficie de las placas de circuito impreso para evitar puentes de soldadura y proteger las trazas de cobre. Un dise\u00f1o adecuado de la m\u00e1scara de soldadura es esencial para un montaje fiable de las placas de circuito impreso y para el rendimiento de la fabricaci\u00f3n. En este art\u00edculo se explican las directrices clave para el dise\u00f1o de m\u00e1scaras de soldadura, como la separaci\u00f3n de las m\u00e1scaras, la expansi\u00f3n de las m\u00e1scaras, las aperturas de los pads y los errores de dise\u00f1o m\u00e1s comunes. Siguiendo las reglas pr\u00e1cticas del Dise\u00f1o para Fabricaci\u00f3n (DFM), los ingenieros pueden mejorar la fiabilidad del ensamblaje, reducir los defectos de soldadura y garantizar la compatibilidad con los procesos est\u00e1ndar de fabricaci\u00f3n de PCB.<\/p>","protected":false},"author":1,"featured_media":5227,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[108],"tags":[446],"class_list":["post-5223","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb-solder-mask"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB Solder Mask Design Guidelines: Clearance, Expansion and Manufacturing Rules<\/title>\n<meta name=\"description\" content=\"Learn PCB solder mask design guidelines including mask clearance, expansion rules, pad openings, and common DFM mistakes to improve PCB manufacturing reliability.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/\" \/>\n<meta property=\"og:locale\" content=\"es_ES\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"PCB Solder Mask Design Guidelines: Clearance, Expansion and Manufacturing Rules\" \/>\n<meta property=\"og:description\" content=\"Learn PCB solder mask design guidelines including mask clearance, expansion rules, pad openings, and common DFM mistakes to improve PCB manufacturing reliability.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/\" \/>\n<meta property=\"og:site_name\" content=\"Topfastpcb\" \/>\n<meta property=\"article:published_time\" content=\"2026-03-15T00:32:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-3.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"495\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"\u6258\u666e\u6cd5\u65af\u7279\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Escrito por\" \/>\n\t<meta name=\"twitter:data1\" content=\"\u6258\u666e\u6cd5\u65af\u7279\" \/>\n\t<meta name=\"twitter:label2\" content=\"Tiempo de lectura\" \/>\n\t<meta name=\"twitter:data2\" content=\"5 minutos\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/\"},\"author\":{\"name\":\"\u6258\u666e\u6cd5\u65af\u7279\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a\"},\"headline\":\"PCB Solder Mask Design Guidelines for Reliable Manufacturing\",\"datePublished\":\"2026-03-15T00:32:00+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/\"},\"wordCount\":818,\"publisher\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-3.jpg\",\"keywords\":[\"PCB Solder Mask\"],\"articleSection\":[\"News\"],\"inLanguage\":\"es\"},{\"@type\":[\"WebPage\",\"FAQPage\"],\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/\",\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/\",\"name\":\"PCB Solder Mask Design Guidelines: Clearance, Expansion and Manufacturing Rules\",\"isPartOf\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-3.jpg\",\"datePublished\":\"2026-03-15T00:32:00+00:00\",\"description\":\"Learn PCB solder mask design guidelines including mask clearance, expansion rules, pad openings, and common DFM mistakes to improve PCB manufacturing reliability.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#breadcrumb\"},\"mainEntity\":[{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133323837\"},{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133514435\"},{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133582473\"},{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133596476\"}],\"inLanguage\":\"es\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"es\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#primaryimage\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-3.jpg\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-3.jpg\",\"width\":600,\"height\":495,\"caption\":\"PCB Solder Mask\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"\u9996\u9875\",\"item\":\"https:\/\/www.topfastpcb.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"PCB Solder Mask Design Guidelines for Reliable Manufacturing\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.topfastpcb.com\/#website\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"name\":\"Topfastpcb\",\"description\":\"Topfast Prime Choice for Global Electronics Manufacturing\",\"publisher\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.topfastpcb.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"es\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\",\"name\":\"Topfastpcb\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"es\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"width\":144,\"height\":56,\"caption\":\"Topfastpcb\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a\",\"name\":\"\u6258\u666e\u6cd5\u65af\u7279\",\"sameAs\":[\"http:\/\/www.topfastpcb.com\"],\"url\":\"https:\/\/www.topfastpcb.com\/es\/blog\/author\/admin\/\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133323837\",\"position\":1,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133323837\",\"name\":\"Q: What is solder mask clearance in PCB design?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Solder mask clearance is the distance between the copper pad edge and the solder mask opening, ensuring pads remain exposed during assembly.\",\"inLanguage\":\"es\"},\"inLanguage\":\"es\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133514435\",\"position\":2,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133514435\",\"name\":\"Q: What is the minimum solder mask dam width?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Most PCB manufacturers recommend a minimum solder mask dam width of <strong>4 mil<\/strong> to prevent mask breakage.\",\"inLanguage\":\"es\"},\"inLanguage\":\"es\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133582473\",\"position\":3,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133582473\",\"name\":\"Q: What happens if solder mask openings are too small?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Small mask openings may partially cover pads, resulting in poor solder joints.\",\"inLanguage\":\"es\"},\"inLanguage\":\"es\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133596476\",\"position\":4,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133596476\",\"name\":\"Q: What is the difference between SMD and NSMD pads?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: SMD pads are defined by solder mask openings, while NSMD pads are defined by the copper pad itself. NSMD pads are commonly used for BGA components.\",\"inLanguage\":\"es\"},\"inLanguage\":\"es\"},{\"@type\":\"HowTo\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#howto-1\",\"name\":\"PCB Solder Mask Design Guidelines for Reliable Manufacturing\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#article\"},\"description\":\"Engineers typically follow several steps when defining solder mask rules.\",\"step\":[{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#how-to-step-1773134083798\",\"name\":\"Step 1 \u2014 Define mask expansion rules\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Set the global mask expansion in the PCB design software.<br\/>Typical range: 2\u20134 mil<br\/>\"}]},{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#how-to-step-1773134096300\",\"name\":\"Step 2 \u2014 Check fine-pitch components\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Verify solder mask openings around:<br\/>QFN<br\/>BGA<br\/>small pitch connectors\"}]},{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#how-to-step-1773134129021\",\"name\":\"Step 3 \u2014 Verify mask dam widths\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Ensure spacing between adjacent pads can support mask dams.\"}]},{\"@type\":\"HowToStep\",\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#how-to-step-1773134139200\",\"name\":\"Step 4 \u2014 Perform DFM checks\",\"itemListElement\":[{\"@type\":\"HowToDirection\",\"text\":\"Manufacturers review solder mask data to ensure manufacturability.<br\/>The DFM review process is described in: <strong><a href=\\\"https:\/\/www.topfastpcb.com\/blog\/pcb-dfm-checklist-before-sending-gerber-files\/\\\">PCB DFM Checklist Before Sending Gerber Files<\/a><\/strong>\"}]}],\"inLanguage\":\"es\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"PCB Solder Mask Design Guidelines: Clearance, Expansion and Manufacturing Rules","description":"Learn PCB solder mask design guidelines including mask clearance, expansion rules, pad openings, and common DFM mistakes to improve PCB manufacturing reliability.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/","og_locale":"es_ES","og_type":"article","og_title":"PCB Solder Mask Design Guidelines: Clearance, Expansion and Manufacturing Rules","og_description":"Learn PCB solder mask design guidelines including mask clearance, expansion rules, pad openings, and common DFM mistakes to improve PCB manufacturing reliability.","og_url":"https:\/\/www.topfastpcb.com\/es\/blog\/pcb-solder-mask-design-guidelines\/","og_site_name":"Topfastpcb","article_published_time":"2026-03-15T00:32:00+00:00","og_image":[{"width":600,"height":495,"url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-3.jpg","type":"image\/jpeg"}],"author":"\u6258\u666e\u6cd5\u65af\u7279","twitter_card":"summary_large_image","twitter_misc":{"Escrito por":"\u6258\u666e\u6cd5\u65af\u7279","Tiempo de lectura":"5 minutos"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#article","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/"},"author":{"name":"\u6258\u666e\u6cd5\u65af\u7279","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a"},"headline":"PCB Solder Mask Design Guidelines for Reliable Manufacturing","datePublished":"2026-03-15T00:32:00+00:00","mainEntityOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/"},"wordCount":818,"publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-3.jpg","keywords":["PCB Solder Mask"],"articleSection":["News"],"inLanguage":"es"},{"@type":["WebPage","FAQPage"],"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/","url":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/","name":"PCB Solder Mask Design Guidelines: Clearance, Expansion and Manufacturing Rules","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#primaryimage"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-3.jpg","datePublished":"2026-03-15T00:32:00+00:00","description":"Learn PCB solder mask design guidelines including mask clearance, expansion rules, pad openings, and common DFM mistakes to improve PCB manufacturing reliability.","breadcrumb":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#breadcrumb"},"mainEntity":[{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133323837"},{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133514435"},{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133582473"},{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133596476"}],"inLanguage":"es","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/"]}]},{"@type":"ImageObject","inLanguage":"es","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#primaryimage","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-3.jpg","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-3.jpg","width":600,"height":495,"caption":"PCB Solder Mask"},{"@type":"BreadcrumbList","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"\u9996\u9875","item":"https:\/\/www.topfastpcb.com\/"},{"@type":"ListItem","position":2,"name":"PCB Solder Mask Design Guidelines for Reliable Manufacturing"}]},{"@type":"WebSite","@id":"https:\/\/www.topfastpcb.com\/#website","url":"https:\/\/www.topfastpcb.com\/","name":"Topfastpcb","description":"Topfast Prime Choice for Global Electronics Manufacturing","publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.topfastpcb.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"es"},{"@type":"Organization","@id":"https:\/\/www.topfastpcb.com\/#organization","name":"Topfastpcb","url":"https:\/\/www.topfastpcb.com\/","logo":{"@type":"ImageObject","inLanguage":"es","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","width":144,"height":56,"caption":"Topfastpcb"},"image":{"@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a","name":"\u6258\u666e\u6cd5\u65af\u7279","sameAs":["http:\/\/www.topfastpcb.com"],"url":"https:\/\/www.topfastpcb.com\/es\/blog\/author\/admin\/"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133323837","position":1,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133323837","name":"Q: What is solder mask clearance in PCB design?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Solder mask clearance is the distance between the copper pad edge and the solder mask opening, ensuring pads remain exposed during assembly.","inLanguage":"es"},"inLanguage":"es"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133514435","position":2,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133514435","name":"Q: What is the minimum solder mask dam width?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Most PCB manufacturers recommend a minimum solder mask dam width of <strong>4 mil<\/strong> to prevent mask breakage.","inLanguage":"es"},"inLanguage":"es"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133582473","position":3,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133582473","name":"Q: What happens if solder mask openings are too small?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Small mask openings may partially cover pads, resulting in poor solder joints.","inLanguage":"es"},"inLanguage":"es"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133596476","position":4,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133596476","name":"Q: What is the difference between SMD and NSMD pads?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: SMD pads are defined by solder mask openings, while NSMD pads are defined by the copper pad itself. NSMD pads are commonly used for BGA components.","inLanguage":"es"},"inLanguage":"es"},{"@type":"HowTo","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#howto-1","name":"PCB Solder Mask Design Guidelines for Reliable Manufacturing","mainEntityOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#article"},"description":"Engineers typically follow several steps when defining solder mask rules.","step":[{"@type":"HowToStep","url":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#how-to-step-1773134083798","name":"Step 1 \u2014 Define mask expansion rules","itemListElement":[{"@type":"HowToDirection","text":"Set the global mask expansion in the PCB design software.<br\/>Typical range: 2\u20134 mil<br\/>"}]},{"@type":"HowToStep","url":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#how-to-step-1773134096300","name":"Step 2 \u2014 Check fine-pitch components","itemListElement":[{"@type":"HowToDirection","text":"Verify solder mask openings around:<br\/>QFN<br\/>BGA<br\/>small pitch connectors"}]},{"@type":"HowToStep","url":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#how-to-step-1773134129021","name":"Step 3 \u2014 Verify mask dam widths","itemListElement":[{"@type":"HowToDirection","text":"Ensure spacing between adjacent pads can support mask dams."}]},{"@type":"HowToStep","url":"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#how-to-step-1773134139200","name":"Step 4 \u2014 Perform DFM checks","itemListElement":[{"@type":"HowToDirection","text":"Manufacturers review solder mask data to ensure manufacturability.<br\/>The DFM review process is described in: <strong><a href=\"https:\/\/www.topfastpcb.com\/blog\/pcb-dfm-checklist-before-sending-gerber-files\/\">PCB DFM Checklist Before Sending Gerber Files<\/a><\/strong>"}]}],"inLanguage":"es"}]}},"_links":{"self":[{"href":"https:\/\/www.topfastpcb.com\/es\/wp-json\/wp\/v2\/posts\/5223","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.topfastpcb.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.topfastpcb.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/es\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/es\/wp-json\/wp\/v2\/comments?post=5223"}],"version-history":[{"count":1,"href":"https:\/\/www.topfastpcb.com\/es\/wp-json\/wp\/v2\/posts\/5223\/revisions"}],"predecessor-version":[{"id":5228,"href":"https:\/\/www.topfastpcb.com\/es\/wp-json\/wp\/v2\/posts\/5223\/revisions\/5228"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/es\/wp-json\/wp\/v2\/media\/5227"}],"wp:attachment":[{"href":"https:\/\/www.topfastpcb.com\/es\/wp-json\/wp\/v2\/media?parent=5223"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/es\/wp-json\/wp\/v2\/categories?post=5223"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/es\/wp-json\/wp\/v2\/tags?post=5223"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}