{"id":3541,"date":"2025-07-06T08:30:00","date_gmt":"2025-07-06T00:30:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=3541"},"modified":"2025-07-04T18:57:18","modified_gmt":"2025-07-04T10:57:18","slug":"what-is-the-difference-between-integrated-circuits-and-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/","title":{"rendered":"Mit\u00e4 eroa on integroitujen piirien ja piirilevyjen v\u00e4lill\u00e4?"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Sis\u00e4llysluettelo<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#Integrated_Circuits_and_PCBs\" >Integroidut piirit ja PCB:t<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#Fundamental_Difference\" >Perusero<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#Structural_Differences\" >Rakenteelliset erot<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#The_Microscopic_World_of_ICs\" >IC-piirien mikroskooppinen maailma<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#The_Macroscopic_Structure_of_PCBs\" >PCB:n makroskooppinen rakenne<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#Manufacturing_Processes\" >Valmistusprosessit<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#Cutting-Edge_IC_Manufacturing\" >Huippuluokan IC-valmistus<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#Mature_PCB_Production\" >Kyps\u00e4 PCB-tuotanto<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#Application_Synergy_Golden_Combination\" >Sovellus Synergia Kultainen yhdistelm\u00e4<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#Common_misconceptions\" >Yleiset v\u00e4\u00e4rink\u00e4sitykset<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#Future_Technological_Trends\" >Tulevat teknologiset suuntaukset<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#IC_Development_Directions\" >IC-kehityssuunnat:<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#PCB_Innovations\" >PCB Innovations:<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/#Key_Differences_Comparison\" >Keskeiset erot Vertailu<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Integrated_Circuits_and_PCBs\"><\/span>Integroidut piirit ja PCB:t<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Nykymaailmassa, jossa elektroniset laitteet ovat kaikkialla l\u00e4sn\u00e4,<a href=\"https:\/\/www.topfastpcb.com\/fi\/products\/integrated-circuits\/\"> <strong>integroidut piirit<\/strong><\/a><strong> (IC)<\/strong> ja <strong>painetut piirilevyt (PCB)<\/strong> muodostavat kaikkien \u00e4lylaitteiden fyysisen perustan. Ep\u00e4ammattilaiset sekoittavat kuitenkin usein n\u00e4m\u00e4 kaksi teknologiaa kesken\u00e4\u00e4n. Mitk\u00e4 ovat niiden perustavanlaatuiset erot? Mit\u00e4 rooleja niill\u00e4 on elektronisissa j\u00e4rjestelmiss\u00e4? <\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Fundamental_Difference\"><\/span>Perusero<span class=\"ez-toc-section-end\"><\/span><\/h2><p><strong>Integroidut piirit (IC)<\/strong> ovat elektronisten j\u00e4rjestelmien &#8220;aivot&#8221; ja &#8220;elimet&#8221;:<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/ic.jpg\" alt=\"ic\" class=\"wp-image-3542\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/ic.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/ic-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/ic-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><ul class=\"wp-block-list\"><li>Mikrokomponenttien, kuten transistorien, vastusten ja kondensaattoreiden integrointi puolijohdekiekkoihin.<\/li>\n\n<li>Suorittaa erityistoimintoja, kuten signaalink\u00e4sittely\u00e4, tietojen laskentaa ja tallennusta.<\/li>\n\n<li>Eritt\u00e4in pieni koko (nanometrist\u00e4 millimetriin), mik\u00e4 edellytt\u00e4\u00e4 mikroskooppia sis\u00e4isten rakenteiden havainnoimiseksi.<\/li><\/ul><p><strong><a href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/printed-circuit-board-pcb\/\">Painettu piirilevy<\/a>s (PCB)<\/strong> ovat elektronisten j\u00e4rjestelmien &#8220;luuranko&#8221; ja &#8220;hermosto&#8221;:<\/p><ul class=\"wp-block-list\"><li>Tarjoaa mekaanisen tukialustan elektroniikkakomponenteille<\/li>\n\n<li>Komponenttien v\u00e4listen s\u00e4hk\u00f6liit\u00e4nt\u00f6jen luominen<\/li>\n\n<li>Rakenteeltaan makroskooppinen (senttimetrist\u00e4 metriin ulottuvalla mittakaavalla), jossa on n\u00e4kyvi\u00e4 piirikaavioita.<\/li><\/ul><p>Jos elektroniikkalaite olisi ihmiskeho, IC:t olisivat toiminnalliset elimet (aivot, syd\u00e4n jne.), kun taas piirilevyt olisivat luuranko ja hermoverkko, jotka yhdist\u00e4v\u00e4t n\u00e4m\u00e4 elimet yhten\u00e4iseksi kokonaisuudeksi.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Structural_Differences\"><\/span>Rakenteelliset erot<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"The_Microscopic_World_of_ICs\"><\/span>IC-piirien mikroskooppinen maailma<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Materiaali:<\/strong> L\u00e4hinn\u00e4 piipohjaiset puolijohteet<\/li>\n\n<li><strong>Rakenne:<\/strong> Monikerroksiset nanokokoiset piirit<\/li>\n\n<li><strong>Komponentin tiheys:<\/strong> Nykyaikaiset IC:t voivat integroida miljardeja transistoreita.<\/li>\n\n<li><strong>Tyypillinen koko:<\/strong> Muutamasta neli\u00f6millimetrist\u00e4 muutamiin neli\u00f6senttimetreihin.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"The_Macroscopic_Structure_of_PCBs\"><\/span>PCB:n makroskooppinen rakenne<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Materiaali:<\/strong> Lasikuituinen substraatti, jossa on kuparifolion johtavia kerroksia<\/li>\n\n<li><strong>Rakenne:<\/strong> Vuorottelevat kerrokset johtavia j\u00e4lki\u00e4 ja erist\u00e4v\u00e4\u00e4 materiaalia.<\/li>\n\n<li><strong>Komponentin tiheys:<\/strong> Riippuu juottotekniikoista ja suunnittelustandardeista.<\/li>\n\n<li><strong>Tyypillinen koko:<\/strong> Pienist\u00e4 puettavista laitteista suuriin teollisuuden ohjauskortteihin<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/ic-1.jpg\" alt=\"ic\" class=\"wp-image-3544\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/ic-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/ic-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/ic-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Processes\"><\/span><a href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-manufacturing-process-flow\/\">Valmistusprosessit<\/a><span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Cutting-Edge_IC_Manufacturing\"><\/span>Huippuluokan IC-valmistus<span class=\"ez-toc-section-end\"><\/span><\/h3><ol class=\"wp-block-list\"><li><strong>Kiekkojen valmistelu:<\/strong> Eritt\u00e4in puhtaiden piikiteiden kasvattaminen<\/li>\n\n<li><strong>Fotolitografia:<\/strong> UV- tai extreme ultravioletti (EUV) litografia<\/li>\n\n<li><strong>Dopingprosessi:<\/strong> Ioni-implantointi puolijohteiden ominaisuuksien muuttamiseksi<\/li>\n\n<li><strong>Metallointi:<\/strong> Nanokokoluokan yhteyksien muodostaminen<\/li>\n\n<li><strong>Pakkaus &amp; testaus:<\/strong> Sirun suojaaminen ja ulkoisten nastojen liitt\u00e4minen<\/li><\/ol><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Mature_PCB_Production\"><\/span>Kyps\u00e4 PCB-tuotanto<span class=\"ez-toc-section-end\"><\/span><\/h3><ol class=\"wp-block-list\"><li><strong>Alustan valmistelu: essSuunnitteluohjeet:<\/strong> Kuparip\u00e4\u00e4llysteisen laminaattimateriaalin leikkaaminen<\/li>\n\n<li><strong>Kuvion siirto:<\/strong> Piirisuunnitelmien altistaminen ja kehitt\u00e4minen<\/li>\n\n<li><strong>Etsausprosessi:<\/strong> Ylim\u00e4\u00e4r\u00e4isen kuparifolion poistaminen<\/li>\n\n<li><strong>Poraus &amp; pinnoitus:<\/strong> Kerrosten v\u00e4listen yhteyksien luominen<\/li>\n\n<li><strong>Pintak\u00e4sittely:<\/strong> Hapettumisen esto ja juotoksen valmistelu<\/li><\/ol><p>IC-valmistus vaatii <strong>Luokan 100\/10 puhdastila<\/strong> ymp\u00e4rist\u00f6ss\u00e4, kun taas piirilevyjen valmistuksessa ymp\u00e4rist\u00f6vaatimukset ovat suhteellisen alhaisemmat. T\u00e4m\u00e4 johtaa suoraan huomattaviin eroihin investointikynnyksiss\u00e4 ja toimialajakaumassa.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Application_Synergy_Golden_Combination\"><\/span>Sovellus Synergia Kultainen yhdistelm\u00e4<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Todellisissa elektroniikkatuotteissa piirilevyt ja piirilevyt toimivat saumattomasti yhdess\u00e4:<\/p><p><strong>\u00c4lypuhelin Esimerkki:<\/strong><\/p><ul class=\"wp-block-list\"><li><strong>IC-komponentit:<\/strong> Prosessori, muisti, RF-sirut jne.<\/li>\n\n<li><strong>PCB-komponentit:<\/strong> Emolevy, joustavat piirit, jotka yhdist\u00e4v\u00e4t moduulit<\/li><\/ul><p><strong>Teollisuuden ohjausj\u00e4rjestelm\u00e4:<\/strong><\/p><ul class=\"wp-block-list\"><li><strong>IC-komponentit:<\/strong> MCU, ADC, tehoajurisirut<\/li>\n\n<li><strong>PCB-komponentit:<\/strong> Monikerroksiset ohjauskortit, tehonjakokortit<\/li><\/ul><p>Erityisesti nykyaikainen <strong>System-in-Package (SiP)<\/strong> teknologia h\u00e4m\u00e4rt\u00e4\u00e4 perinteisi\u00e4 rajoja integroitujen piirilevyjen ja piirilevyjen v\u00e4lill\u00e4 integroimalla joitakin piirilevytoimintoja sirupakkauksiin, mik\u00e4 johtaa elektronisten laitteiden pienemp\u00e4\u00e4n kokoon ja suurempaan suorituskykyyn.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_misconceptions\"><\/span>Yleiset v\u00e4\u00e4rink\u00e4sitykset<span class=\"ez-toc-section-end\"><\/span><\/h2><ol class=\"wp-block-list\"><li><strong>&#8220;IC:t voivat korvata piirilevyt&#8221;<\/strong>: V\u00e4\u00e4rin! IC:t vaativat piirilevyj\u00e4 virta- ja signaaliliit\u00e4nt\u00f6j\u00e4 varten.<\/li>\n\n<li><strong>&#8220;Piirilevyt ovat sama asia kuin sirut&#8221;<\/strong>: V\u00e4\u00e4rin! Piirilevyt ovat vain sirujen kantajia.<\/li>\n\n<li><strong>&#8220;IC:t ovat t\u00e4rke\u00e4mpi\u00e4 kuin piirilevyt&#8221;<\/strong>: Harhaanjohtava! Molemmilla on korvaamaton rooli.<\/li><\/ol><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Future_Technological_Trends\"><\/span>Tulevat teknologiset suuntaukset<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/ic-2.jpg\" alt=\"ic\" class=\"wp-image-3545\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/ic-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/ic-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/ic-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"IC_Development_Directions\"><\/span>IC-kehityssuunnat:<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Jatkuva prosessien miniatyrisointi (3 nm, 2 nm)<\/li>\n\n<li>3D-pinoamistekniikka korkeampaa integrointia varten<\/li>\n\n<li>Uusien puolijohdemateriaalien (GaN, SiC) k\u00e4ytt\u00f6\u00f6notto.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCB_Innovations\"><\/span>PCB Innovations:<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><a href=\"https:\/\/www.topfastpcb.com\/fi\/products\/hdi-pcb\/\">Suuren tiheyden yhteenliit\u00e4nt\u00e4 <\/a>(HDI) -tekniikka<\/li>\n\n<li>Joustavien\/j\u00e4ykkien levyjen yleistyminen<\/li>\n\n<li>Sulautettujen komponenttien tekniikan kehittyminen<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Key_Differences_Comparison\"><\/span>Keskeiset erot Vertailu<span class=\"ez-toc-section-end\"><\/span><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Ominaisuus<\/th><th>Integroidut piirit (IC)<\/th><th>Painetut piirilevyt (PCB)<\/th><\/tr><\/thead><tbody><tr><td><strong>Toiminto<\/strong><\/td><td>Signaalien k\u00e4sittely\/tiedonlaskenta<\/td><td>S\u00e4hk\u00f6liit\u00e4nn\u00e4t\/mekaaninen tuki<\/td><\/tr><tr><td><strong>Rakenne<\/strong><\/td><td>Nanokokoiset puolijohderakenteet<\/td><td>Mikronin mittakaavan kuparij\u00e4ljet &amp; leima; eristys<\/td><\/tr><tr><td><strong>Koko<\/strong><\/td><td>Millimetrin mittakaavan sirut<\/td><td>Senttimetrist\u00e4 metriin ulottuvat levyt<\/td><\/tr><tr><td><strong>Valmistus<\/strong><\/td><td>Luokan 100 puhdastila, fotolitografia<\/td><td>Vakiotehdas, etsausprosessi<\/td><\/tr><tr><td><strong>Kustannukset<\/strong><\/td><td>Eritt\u00e4in korkeat T&amp;K- ja kehitt\u00e4miskustannukset<\/td><td>Suhteellisen alhaisemmat kustannukset<\/td><\/tr><tr><td><strong>Korjattavuus<\/strong><\/td><td>Tyypillisesti korjauskelvoton<\/td><td>Komponentit voidaan vaihtaa<\/td><\/tr><\/tbody><\/table><\/figure><p>IC-piirien ja piirilevyjen v\u00e4listen erojen ja yhteyksien ymm\u00e4rt\u00e4minen on olennaisen t\u00e4rke\u00e4\u00e4 nykyaikaisen elektroniikan hallitsemiseksi. Olitpa sitten mukana elektronisten tuotteiden suunnittelussa, valmistuksessa tai yksinkertaisissa korjaust\u00f6iss\u00e4, t\u00e4m\u00e4 perustieto auttaa sinua ymm\u00e4rt\u00e4m\u00e4\u00e4n laitteiden periaatteet paremmin ja tekem\u00e4\u00e4n tietoon perustuvia teknisi\u00e4 p\u00e4\u00e4t\u00f6ksi\u00e4.<\/p>","protected":false},"excerpt":{"rendered":"<p>Haluatko tiet\u00e4\u00e4 eron integroitujen piirien ja piirilevyjen v\u00e4lill\u00e4? Vertaile IC-sirujen ja piirilevyjen keskeisi\u00e4 eroja toiminnassa, rakenteessa, valmistuksessa ja sovelluksissa sek\u00e4 analysoi niiden erilaisia rooleja ja synergisi\u00e4 suhteita elektronisissa laitteissa.<\/p>","protected":false},"author":1,"featured_media":3543,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[109],"tags":[317],"class_list":["post-3541","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-faq","tag-integrated-circuits"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>What is the difference between integrated circuits and PCB? - Topfastpcb<\/title>\n<meta name=\"description\" content=\"The key differences between integrated circuits (ICs) and printed circuit boards (PCBs) include differences in functional positioning, structural composition, manufacturing processes, and application scenarios.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-the-difference-between-integrated-circuits-and-pcb\/\" \/>\n<meta property=\"og:locale\" content=\"fi_FI\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"What is the difference between integrated circuits and PCB? 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