{"id":3754,"date":"2025-08-03T08:54:00","date_gmt":"2025-08-03T00:54:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=3754"},"modified":"2025-08-02T18:25:55","modified_gmt":"2025-08-02T10:25:55","slug":"key-parameters-of-pcb-circuit-boards","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/","title":{"rendered":"PCB-piirilevyjen t\u00e4rkeimm\u00e4t parametrit"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Sis\u00e4llysluettelo<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/#Detailed_Explanation_of_Key_PCB_Parameters\" >Yksityiskohtainen selitys t\u00e4rkeimmist\u00e4 PCB-parametreista<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/#1_Electrical_Performance_Parameters\" >1. S\u00e4hk\u00f6isen suorituskyvyn parametrit<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/#2_Thermal_Performance_Parameters\" >2. L\u00e4mp\u00f6tehokkuusparametrit<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/#3_Mechanical_Performance_Parameters\" >3. Mekaanisen suorituskyvyn parametrit<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/#4_Structural_Characteristics\" >4. Rakenteelliset ominaisuudet<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/#5_Reliability_Testing_Metrics\" >5. Luotettavuustestauksen mittarit<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/#6_Environmental_Process_Compliance\" >6. Ymp\u00e4rist\u00f6n ja prosessien vaatimustenmukaisuus<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/#PCB_Board_Classification_and_Selection\" >PCB-levyn luokittelu ja valinta<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/#1_Common_PCB_Materials\" >1. Yleiset PCB-materiaalit<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/#2_PCB_Material_Grades_Comparison\" >2. PCB-materiaaliluokkien vertailu<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/#3_How_to_Choose_the_Right_PCB_Material\" >3. Miten valita oikea PCB-materiaali?<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Detailed_Explanation_of_Key_PCB_Parameters\"><\/span><strong>Yksityiskohtainen selitys t\u00e4rkeimmist\u00e4 PCB-parametreista<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Electrical_Performance_Parameters\"><\/span><strong>1. S\u00e4hk\u00f6isen suorituskyvyn parametrit<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p>Piirilevyn s\u00e4hk\u00f6iset ominaisuudet vaikuttavat suoraan signaalin eheyteen erityisesti suurtaajuus- ja nopeissa piireiss\u00e4.<\/p><ul class=\"wp-block-list\"><li><strong>Dielektrinen vakio (Dk)<\/strong> - Mittaa materiaalin kyky\u00e4 varastoida s\u00e4hk\u00f6energiaa. Pienemm\u00e4t Dk-arvot (esim. PTFE, jonka Dk\u22482,2) mahdollistavat nopeamman signaalinsiirron, mik\u00e4 tekee niist\u00e4 ihanteellisia 5G- ja millimetriaaltosovelluksiin.<\/li>\n\n<li><strong>H\u00e4vi\u00f6kerroin (Df\/Loss Tangent)<\/strong> - Osoittaa signaalin energiah\u00e4vi\u00f6n. Korkeataajuussovellukset (esim. tutkat, satelliittiviestint\u00e4) edellytt\u00e4v\u00e4t Df &lt; 0,005.<\/li>\n\n<li><strong>Pinta\/tilavuus Resistivity<\/strong> - Korkea eristysresistanssi (&gt;10\u00b9\u00b2 \u03a9-cm) est\u00e4\u00e4 vuotovirrat, mik\u00e4 on t\u00e4rke\u00e4\u00e4 korkeaj\u00e4nnitteisille piirilevyille (esim. tehomoduuleille).<\/li>\n\n<li><strong>Katkaisuj\u00e4nnite<\/strong> - Tavallinen FR4 kest\u00e4\u00e4 \u226520 kV\/mm, kun taas keraamiset substraatit kest\u00e4v\u00e4t jopa 50 kV\/mm.<\/li>\n\n<li><strong>Impedanssin s\u00e4\u00e4t\u00f6<\/strong> - Nopeat piirilevyt (esim. DDR5, PCIe 6.0) edellytt\u00e4v\u00e4t tiukkaa impedanssitoleranssia (\u00b15%) signaalien heijastusten minimoimiseksi.<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/PCB-parameters.jpg\" alt=\"PCB-parametrit\" class=\"wp-image-3756\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/PCB-parameters.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/PCB-parameters-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/PCB-parameters-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Thermal_Performance_Parameters\"><\/span><strong>2. L\u00e4mp\u00f6tehokkuusparametrit<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p>Piirilevyn l\u00e4mm\u00f6nkest\u00e4vyys m\u00e4\u00e4ritt\u00e4\u00e4 sen luotettavuuden korkean l\u00e4mp\u00f6tilan ymp\u00e4rist\u00f6iss\u00e4, erityisesti lyijytt\u00f6m\u00e4n juottamisen ja pitk\u00e4aikaisen vakauden osalta.<\/p><ul class=\"wp-block-list\"><li><strong>Lasittumisl\u00e4mp\u00f6tila (Tg)<\/strong> - Standardin FR4:n Tg\u2248130\u00b0C on Tg\u2248130\u00b0C, kun taas korkean Tg:n piirilevyj\u00e4 (Tg\u2265170\u00b0C) k\u00e4ytet\u00e4\u00e4n auto- ja sotilaselektroniikassa.<\/li>\n\n<li><strong>Terminen hajoamisl\u00e4mp\u00f6tila (Td)<\/strong> - Materiaalit, joiden Td &gt; 325 \u00b0C (esim. Isola 370HR), ovat suositeltavia lyijytt\u00f6mi\u00e4 juotoksia varten.<\/li>\n\n<li><strong>L\u00e4mm\u00f6njohtavuus<\/strong> - FR4:ll\u00e4 on alhainen l\u00e4mm\u00f6njohtavuus (~ 0,3 W\/m-K), kun taas metalliytimill\u00e4 varustetut piirilevyt (esim. alumiini) voivat saavuttaa 10 W\/m-K, mik\u00e4 tekee niist\u00e4 ihanteellisia LED-j\u00e4\u00e4hdytykseen.<\/li>\n\n<li><strong>L\u00e4mp\u00f6laajenemiskerroin (CTE)<\/strong> - Z-akselin CTE:n tulisi olla &lt;50 ppm\/\u00b0C, jotta estet\u00e4\u00e4n delaminaatio monikerroksisissa piirilevyiss\u00e4 (IC-substraatit vaativat CTE\u22486 ppm\/\u00b0C).<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Mechanical_Performance_Parameters\"><\/span><strong>3. Mekaanisen suorituskyvyn parametrit<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p>Mekaaninen lujuus vaikuttaa kokoonpanoprosesseihin ja pitk\u00e4aikaiseen kest\u00e4vyyteen.<\/p><ul class=\"wp-block-list\"><li><strong>Taivutuslujuus<\/strong> - Tavallinen FR4 on 400-600 MPa, kun taas joustavat piirilevyt (polyimidi) vaativat yli 200 MPa.<\/li>\n\n<li><strong>Kuorinnan vahvuus<\/strong> - Kuparin tarttuvuuden on oltava yli 1,0 N\/mm (IPC-standardi), jotta estet\u00e4\u00e4n kalvon irtoaminen juottamisen aikana.<\/li>\n\n<li><strong>Veden imeytyminen<\/strong> - Alhainen kosteuden imeytyminen (&lt;0,2%) est\u00e4\u00e4 rakkuloiden muodostumisen; korkeataajuuslaminaattien kosteuden imeytyminen on yleens\u00e4 &lt;0,1%.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Structural_Characteristics\"><\/span><strong>4. Rakenteelliset ominaisuudet<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p>Valmistustarkkuus on ratkaisevan t\u00e4rke\u00e4\u00e4 <a href=\"https:\/\/www.topfastpcb.com\/fi\/products\/hdi-pcb\/\">tihe\u00e4 liit\u00e4nt\u00e4 (HDI)<\/a> ja miniatyrisoidut mallit.<\/p><ul class=\"wp-block-list\"><li><strong>Kuparin paksuuden toleranssi<\/strong> - Normaalin 1 oz:n kuparin toleranssi on \u00b110%, kun taas tarkkuuspiireiss\u00e4 vaaditaan \u00b15%.<\/li>\n\n<li><strong>Kerrosten v\u00e4linen rekister\u00f6intitarkkuus<\/strong> - HDI-piirilevyt vaativat &lt;25 \u03bcm:n kohdistusta, kun taas tavalliset monikerroslevyt sallivat &lt;50 \u03bcm:n kohdistuksen.<\/li>\n\n<li><strong>V\u00e4himm\u00e4isj\u00e4lki\/tilavuus (L\/S)<\/strong> - Tavallisissa piirilevyiss\u00e4 k\u00e4ytet\u00e4\u00e4n 0,1 mm\/0,1 mm, kun taas kehittyneiss\u00e4 IC-substraateissa k\u00e4ytet\u00e4\u00e4n 20 \u03bcm\/20 \u03bcm.<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/PCB-parameters-1.jpg\" alt=\"PCB-parametrit\" class=\"wp-image-3757\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/PCB-parameters-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/PCB-parameters-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/PCB-parameters-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Reliability_Testing_Metrics\"><\/span><strong>5. Luotettavuustestauksen mittarit<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p>PCB:n on l\u00e4p\u00e4ist\u00e4v\u00e4 tiukat testit pitk\u00e4aikaisen vakauden varmistamiseksi.<\/p><ul class=\"wp-block-list\"><li><strong>Johtavan anodisen langan (CAF) vastus<\/strong> - Arvioi oikosulkuriskit kosteissa olosuhteissa (85\u00b0C\/85% RH 1000 tunnin ajan).<\/li>\n\n<li><strong>Pinnan eristysresistanssi (SIR)<\/strong> - Sen on oltava yli 10\u2078 \u03a9 (JIS-standardien mukaan).<\/li>\n\n<li><strong>Thermal Cycling TestessSuunnitteluohjeet:<\/strong> - Kest\u00e4\u00e4 100 sykli\u00e4 (-55\u00b0C - 125\u00b0C) ilman halkeamia (autojen piirilevyt vaativat tiukempia testej\u00e4).<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"6_Environmental_Process_Compliance\"><\/span><strong>6. Ymp\u00e4rist\u00f6n ja prosessien vaatimustenmukaisuus<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p>Ymp\u00e4rist\u00f6m\u00e4\u00e4r\u00e4ykset (esim. RoHS, REACH) ohjaavat PCB-materiaalien kehityst\u00e4.<\/p><ul class=\"wp-block-list\"><li><strong>Vertaileva seurantaindeksi (CTI)<\/strong> - L\u00e4\u00e4kinn\u00e4lliset laitteet tarvitsevat luokan 3 (400-600 V), kun taas teollisuuden ohjauslaitteet vaativat luokan 2.<\/li>\n\n<li><strong>Halogeenivapaa<\/strong> - Kloori-\/bromipitoisuuden on oltava &lt; 900 ppm myrkkyp\u00e4\u00e4st\u00f6jen v\u00e4hent\u00e4miseksi.<\/li>\n\n<li><strong>Palonesto (UL94)<\/strong> - V-0 on korkein luokitus, joka on pakollinen ilmailu- ja avaruussovelluksissa.<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCB_Board_Classification_and_Selection\"><\/span><strong>PCB-levyn luokittelu ja valinta<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Common_PCB_Materials\"><\/span><strong>1. Yleiset PCB-materiaalit<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>FR4<\/strong> - Vakiomuotoinen epoksilasilaminaatti kulutuselektroniikkaa varten.<\/li>\n\n<li><strong>CEM-3<\/strong> - Komposiittisubstraatti, kustannustehokas yksinkertaisille kaksipuolisille piirilevyille.<\/li>\n\n<li><strong><a href=\"https:\/\/www.topfastpcb.com\/fi\/products\/high-tg-rigid-pcb\/\">Korkean Tg-pitoisuuden omaavat PCB:t<\/a> (Tg\u2265170\u00b0C)<\/strong> - L\u00e4mm\u00f6nkest\u00e4v\u00e4 auto- ja sotilask\u00e4ytt\u00f6\u00f6n.<\/li>\n\n<li><strong>Korkeataajuuslaminaatit (esim. Rogers RO4003C)<\/strong> - Matala Dk\/Df 5G-\/tutkasovelluksia varten.<\/li>\n\n<li><strong><a href=\"https:\/\/www.topfastpcb.com\/fi\/products\/metal-core-pcb\/\">Metal-Core PCB:t<\/a> (alumiini\/kupari)<\/strong> - Erinomainen l\u00e4mm\u00f6nhallinta LEDeille ja tehomoduuleille.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_PCB_Material_Grades_Comparison\"><\/span><strong>2. PCB-materiaaliluokkien vertailu<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Materiaaliluokka<\/th><th>Ominaisuudet<\/th><th>Tyypilliset sovellukset<\/th><\/tr><\/thead><tbody><tr><td><strong>94HB<\/strong><\/td><td>Paperipohjainen, ei liekit\u00f6n<\/td><td>Edullinen kulutuselektroniikka<\/td><\/tr><tr><td><strong>94V0<\/strong><\/td><td>Liekinkest\u00e4v\u00e4 paperialusta<\/td><td>Kodinkoneiden ohjaustaulut<\/td><\/tr><tr><td><strong>CEM-1<\/strong><\/td><td>Yksipuolinen lasikuitu<\/td><td>Yksinkertaiset piirit<\/td><\/tr><tr><td><strong>CEM-3<\/strong><\/td><td>Kaksipuolinen puoliksi lasi<\/td><td>Edulliset kaksikerroksiset PCB:t<\/td><\/tr><tr><td><strong>FR4<\/strong><\/td><td>Vakio lasikuitu<\/td><td>Viihde-elektroniikka, teollisuuden ohjauslaitteet<\/td><\/tr><tr><td><strong>Korkean Tg-pitoisuuden omaava FR4<\/strong><\/td><td>Korkean l\u00e4mp\u00f6tilan kest\u00e4v\u00e4<\/td><td>Autoteollisuus, ilmailu- ja avaruusala<\/td><\/tr><\/tbody><\/table><\/figure><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/PCB-parameters-3.jpg\" alt=\"PCB-parametrit\" class=\"wp-image-3758\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/PCB-parameters-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/PCB-parameters-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/PCB-parameters-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_How_to_Choose_the_Right_PCB_Material\"><\/span><strong>3. Miten valita oikea PCB-materiaali?<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Korkean taajuuden sovellukset<\/strong> \u2192 Materiaalit, joiden Dk\/Df-arvo on alhainen (Rogers, Taconic).<\/li>\n\n<li><strong>Korkean l\u00e4mp\u00f6tilan ymp\u00e4rist\u00f6t<\/strong> \u2192 Korkean Tg- (\u2265170\u00b0C) tai korkean Td- (&gt;325\u00b0C) l\u00e4mp\u00f6tilan materiaalit.<\/li>\n\n<li><strong>Suuren tehon l\u00e4mm\u00f6ntuotto<\/strong> \u2192 Metalliydin tai korkean l\u00e4mm\u00f6njohtavuuden FR4.<\/li>\n\n<li><strong>Ymp\u00e4rist\u00f6yst\u00e4v\u00e4lliset vaatimukset<\/strong> \u2192 Halogeenittomat, RoHS-vaatimusten mukaiset materiaalit.<\/li><\/ul><p>PCB-parametrien valinta vaikuttaa suoraan tuotteen suorituskykyyn, luotettavuuteen ja kustannuksiin. Insin\u00f6\u00f6rien on valittava sopivat levymateriaalit (kuten FR4, CEM-3, korkea Tg PCB jne.) sovellusskenaarion (kuten korkea taajuus, korkea l\u00e4mp\u00f6tila, korkea teho) perusteella ja optimoitava suunnittelu signaalin eheyden, l\u00e4mm\u00f6nhukkaominaisuuksien ja mekaanisen lujuuden parantamiseksi.<\/p>","protected":false},"excerpt":{"rendered":"<p>PCB-piirilevyjen suorituskyky riippuu useista keskeisist\u00e4 parametreista, kuten dielektrisyysvakio (DK-arvo), lasittumisl\u00e4mp\u00f6tila (Tg), l\u00e4mm\u00f6nkest\u00e4vyys (Td), CTI (virumisj\u00e4lki-indeksi) ja CTE (l\u00e4mp\u00f6laajenemiskerroin). Eri levymateriaalit (kuten FR4, CEM-3 ja korkean Tg:n piirilevy) soveltuvat erilaisiin sovelluksiin, kuten suurtaajuusviestint\u00e4\u00e4n, autoelektroniikkaan tai suuritehoisiin laitteisiin.<\/p>","protected":false},"author":1,"featured_media":3759,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[336],"class_list":["post-3754","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-pcb-parameters"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Key parameters of PCB circuit boards - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Key parameters of PCB circuit boards, including dielectric constant (DK value), glass transition temperature (Tg), heat resistance (Td), CTI, CTE, etc. Understand the characteristics and application scenarios of different board materials (FR4, CEM-3, high Tg PCB) to optimize PCB design and improve performance and reliability.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/key-parameters-of-pcb-circuit-boards\/\" \/>\n<meta property=\"og:locale\" content=\"fi_FI\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Key parameters of PCB circuit boards - 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