{"id":4135,"date":"2025-08-20T08:34:00","date_gmt":"2025-08-20T00:34:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4135"},"modified":"2025-08-19T15:47:31","modified_gmt":"2025-08-19T07:47:31","slug":"pcb-hasl-and-lead-free-hasl-processes","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","title":{"rendered":"PCB HASL ja lyijyt\u00f6n HASL prosessit"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Sis\u00e4llysluettelo<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#HASL_process\" >HASL-prosessi<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#11_Differences_between_HASL_and_lead-free_HASL\" >1.1 HASL:n ja lyijytt\u00f6m\u00e4n HASL:n erot<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#12_Core_HASL_Process_Flow\" >1.2 HASL-prosessin kulku<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#121_Pre-Treatment_Stage\" >1.2.1 Esik\u00e4sittelyvaihe<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#122_Flux_Application\" >1.2.2 Flux-sovellus<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#123_Hot_Air_Leveling_Key_Steps\" >1.2.3 Kuumailman tasoitus T\u00e4rkeimm\u00e4t vaiheet<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#124_Quality_Inspection\" >1.2.4 Laadun tarkastus<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#13_Process_Advantages_and_Limitations\" >1.3 Prosessin edut ja rajoitukset<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Advantages\" >Edut<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Limitations\" >Rajoitukset<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#ENIG_Electroless_Nickel_Immersion_Gold_Process\" >ENIG-prosessi (Electroless Nickel Immersion Gold)<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#21_Process_Principles\" >2.1 Prosessin periaatteet<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#22_Advantages\" >2.2 Edut<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#23_Challenges\" >2.3 Haasteet<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#OSP_Organic_Solderability_Preservative\" >OSP (orgaaninen juotettavuuden s\u00e4il\u00f6nt\u00e4aine)<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#31_Process_Principles\" >3.1 Prosessin periaatteet<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#32_Advantages\" >3.2 Edut<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#33_Limitations\" >3.3 Rajoitukset<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Process_Selection_Guide\" >Prosessin valintaopas<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#41_Comparison\" >4.1 Vertailu<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#42_Recommendations\" >4.2 Suositukset<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#43_Topfast_Capabilities\" >4.3 Topfast-ominaisuudet<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"HASL_process\"><\/span>HASL-prosessi<span class=\"ez-toc-section-end\"><\/span><\/h2><p>HASL (Hot Air Solder Leveling) on yksi klassisimmista ja kustannustehokkaimmista pintak\u00e4sittelyprosesseista piirilevyjen valmistuksessa, ja sill\u00e4 on t\u00e4rke\u00e4 rooli elektroniikan valmistusteollisuudessa. T\u00e4ss\u00e4 prosessissa kuparipinta peitet\u00e4\u00e4n tina-lyijy-seoskerroksella, joka tarjoaa piirilevyille luotettavan juotosominaisuuden ja hapettumissuojan.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1.jpg\" alt=\"HASL-prosessi\" class=\"wp-image-4137\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"11_Differences_between_HASL_and_lead-free_HASL\"><\/span>1.1 HASL:n ja lyijytt\u00f6m\u00e4n HASL:n erot<span class=\"ez-toc-section-end\"><\/span><\/h3><p>HASL (Hot Air Solder Leveling) on yksi klassisimmista ja kustannustehokkaimmista pintak\u00e4sittelytekniikoista. <a href=\"https:\/\/www.topfastpcb.com\/fi\/\">PCB-valmistus<\/a>. T\u00e4ss\u00e4 prosessissa kuparipinnat p\u00e4\u00e4llystet\u00e4\u00e4n tina-lyijy-seoskerroksella, joka takaa luotettavan juotettavuuden ja hapettumiskest\u00e4vyyden. Ymp\u00e4rist\u00f6vaatimusten lis\u00e4\u00e4ntyess\u00e4 lyijytt\u00f6m\u00e4st\u00e4 HASL:st\u00e4 on tullut alan standardi.<\/p><p><strong>Materiaalikoostumuserot<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Perinteisess\u00e4 HASL-prosessissa k\u00e4ytet\u00e4\u00e4nSn63\/Pb37-seosta (63 % tinaa + 37 % lyijy\u00e4), sulamispiste:183\u00b0C.<\/li>\n\n<li>Lyijyt\u00f6n HASL k\u00e4ytet\u00e4\u00e4n p\u00e4\u00e4asiassa:<\/li>\n\n<li>SAC305 (96,5 % tinaa +3 % hopeaa + 0,5 % kuparia), sulamispiste: 217\u2013220\u00b0C<\/li>\n\n<li>SnCu0,7 (99,3 % tinaa + 0,7 % kuparia), sulamispiste: 227 \u00b0C<\/li>\n\n<li>Puhdas tina (Sn100), sulamispiste: 232 \u00b0C<\/li><\/ul><p><strong>Prosessin ominaisuuksien vertailu<\/strong>:<\/p><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Kiinteist\u00f6<\/th><th>Lyijyllinen HASL<\/th><th>Lyijyt\u00f6n HASL<\/th><\/tr><\/thead><tbody><tr><td>Sulamispiste<\/td><td>183 \u00b0C<\/td><td>217\u2013232 \u00b0C<\/td><\/tr><tr><td>Juotospottil\u00e4mp\u00f6tila<\/td><td>200\u2013210 \u00b0C<\/td><td>240\u2013255 \u00b0C<\/td><\/tr><tr><td>Pinnan viimeistely<\/td><td>Kirkas<\/td><td>Suhteellisen tyls\u00e4<\/td><\/tr><tr><td>Mekaaninen lujuus<\/td><td>Hyv\u00e4 sitkeys (korkea iskunkest\u00e4vyys)<\/td><td>Kova mutta hauras<\/td><\/tr><tr><td>Kosteutuvuus<\/td><td>Erinomainen (kosketuskulma &lt;30\u00b0)<\/td><td>Hyv\u00e4 (kosketuskulma 35\u201345\u00b0)<\/td><\/tr><tr><td>Ymp\u00e4rist\u00f6nsuojelun vaatimustenmukaisuus<\/td><td>Sis\u00e4lt\u00e4\u00e4 lyijy\u00e4 (37 %)<\/td><td>Lyijypitoisuus &lt;0.1% (RoHS-yhteensopiva)<\/td><\/tr><tr><td>Kustannukset<\/td><td>Alempi<\/td><td>15-20 % korkeampi<\/td><\/tr><tr><td>Sovellettavuus<\/td><td>Yleinen k\u00e4ytt\u00f6tarkoitus<\/td><td>Vaatii korkeampia juotosl\u00e4mp\u00f6tiloja<\/td><\/tr><\/tbody><\/table><\/figure><p><strong>K\u00e4yt\u00e4nn\u00f6n suorituskykyerot<\/strong>:<\/p><ul class=\"wp-block-list\"><li><strong>Juotettavuus<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Lyijyllinen HASL tarjoaa paremman juotosaktiivisuuden lyhyemm\u00e4ll\u00e4 kostutusajalla (1-2 sekuntia).<\/li>\n\n<li>Lyijyt\u00f6n HASL vaatii vahvempaa fluxia ja tiukempaa l\u00e4mp\u00f6tilan hallintaa<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Luotettavuus<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Lyijyllisill\u00e4 juotosliitoksilla on parempi l\u00e4mp\u00f6v\u00e4symiskest\u00e4vyys (enemm\u00e4n l\u00e4mp\u00f6tilajaksoja).<\/li>\n\n<li>Lyijytt\u00f6m\u00e4t juotosliitokset s\u00e4ilytt\u00e4v\u00e4t suuremman mekaanisen lujuuden pitk\u00e4aikaisen ik\u00e4\u00e4ntymisen j\u00e4lkeen.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Prosessi-ikkuna<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Lyijypitoinen HASL:llaonlaajempi prosessi-ikkuna (\u00b110 \u00b0C).<\/li>\n\n<li>Lyijyt\u00f6nHASL vaatii tarkempaa l\u00e4mp\u00f6tilan s\u00e4\u00e4t\u00f6\u00e4 (\u00b13 \u00b0C).<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Ammattilaisen vinkki: 99,5 % juottotuoton saavuttamiseksi ja samalla IPC-6012 luokan 3 standardien t\u00e4ytt\u00e4miseksi: Topfast optimoi lyijytt\u00f6mi\u00e4 HASL-parametreja.<\/p><\/blockquote><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"12_Core_HASL_Process_Flow\"><\/span>1.2 HASL-prosessin kulku<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Ammattimaisena PCB-valmistajana Topfast k\u00e4ytt\u00e4\u00e4 t\u00e4ysin automatisoituja HASL-tuotantolinjoja, joissa on tiukat standardoidut prosessit:<\/p><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"121_Pre-Treatment_Stage\"><\/span>1.2.1 Esik\u00e4sittelyvaihe<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Kemiallinen puhdistus<\/strong>:<\/li>\n\n<li>Hapan puhdistusaine (pH 2-3) poistaa kuparioksidit.<\/li>\n\n<li>L\u00e4mp\u00f6tilan s\u00e4\u00e4t\u00f6: 40\u201350 \u00b0C, kesto: 2\u20133 min<\/li>\n\n<li>Mikroetsaus takaa pinnan karheuden Ra0,3\u20130,5 \u03bcm.<\/li>\n\n<li><strong>Huuhtelu<\/strong>:<\/li>\n\n<li>Kolmivaiheinen vastavirtahuuhtelu (DI-veden resistiivisyys &gt;15 M\u03a9\u00b7cm)<\/li>\n\n<li>Kuivaus kuumalla ilmalla (60\u201380 \u00b0C)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"122_Flux_Application\"><\/span>1.2.2 Flux-sovellus<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>Soveltamismenetelm\u00e4t:<\/li>\n\n<li>Vaahtoaminen (perinteinen): 0.01-0.03mm.<\/li>\n\n<li>Suihku (edistynyt):30 % pienempi fluxin kulutus: Tasaisempi, 30 % pienempi fluxin kulutus<\/li>\n\n<li>Virtaustyypit:<\/li>\n\n<li>Puhdistamaton kolofonipohjainen (ROH)<\/li>\n\n<li>Kiinte\u00e4 sis\u00e4lt\u00f6: 8-12 %, happoluku: 35-45mgKOH\/g<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"123_Hot_Air_Leveling_Key_Steps\"><\/span>1.2.3 Kuumailman tasoitus T\u00e4rkeimm\u00e4t vaiheet<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Esil\u00e4mmitys<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Lyijypitoinen: 130\u2013140\u00b0C<\/li>\n\n<li>Lyijyt\u00f6n: 150\u2013160 \u00b0C<\/li>\n\n<li>Kesto: Kesto: 60-90 sekuntia<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Juotos Dipping<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Juotospadan l\u00e4mp\u00f6tila:<ul class=\"wp-block-list\"><li>Lyijypitoinen: 210\u00b15\u00b0C<\/li>\n\n<li>Lyijyt\u00f6n: 250\u00b15 \u00b0C<\/li><\/ul><\/li>\n\n<li>Viipym\u00e4aika: 2\u20134 sekuntia(\u00b10,5 sekunnintarkkuus)<\/li>\n\n<li>Upotussyvyys: 3-5mm<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Kuuman ilman tasoitus<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Ilmaveitsen parametrit:<ul class=\"wp-block-list\"><li>Paine: 0,3-0,5MPa<\/li>\n\n<li>L\u00e4mp\u00f6tila: 300\u2013350 \u00b0C<\/li>\n\n<li>Kulma: 4\u00b0 alasp\u00e4in kallistus<\/li>\n\n<li>Ilman nopeus: 20-30 m\/s<\/li><\/ul><\/li>\n\n<li>K\u00e4sittelyaika: 1-2 sekuntia<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>J\u00e4\u00e4hdytys<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Pakotettu ilmanj\u00e4\u00e4hdytys (nopeus: 2\u20133\u00b0C\/sek)<\/li>\n\n<li>Lopullinen l\u00e4mp\u00f6tila &lt;60 \u00b0C<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"124_Quality_Inspection\"><\/span>1.2.4 Laadun tarkastus<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>Online AOI (100 % kattavuus):<\/li>\n\n<li>Juotospaksuuden tarkastus(1\u201340 \u03bcm)<\/li>\n\n<li>Pintavikojen havaitseminen (juotospallot, paljastunut kupari jne.)<\/li>\n\n<li>N\u00e4ytteenottotestit:<\/li>\n\n<li>Juotettavuustesti (245\u00b0C, 3 sekuntia)<\/li>\n\n<li>Tartuntatesti (teippimenetelm\u00e4)<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Teknologinen l\u00e4pimurto: Topfastin typpisuojattu lyijyt\u00f6n HASL-prosessi v\u00e4hent\u00e4\u00e4 juotteen hapettumista 5 prosentista 1,5 prosenttiin, mik\u00e4 parantaa juottotuotosta merkitt\u00e4v\u00e4sti.<\/p><\/blockquote><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"13_Process_Advantages_and_Limitations\"><\/span>1.3 Prosessin edut ja rajoitukset<span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advantages\"><\/span>Edut<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Kustannustehokkuus<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Pienet laiteinvestoinnit (~1\/3 ENIG:st\u00e4)<\/li>\n\n<li>Merkitt\u00e4v\u00e4t materiaalikustannuss\u00e4\u00e4st\u00f6t (40-60 % edullisempi kuin ENIG).<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Juotoksen luotettavuus<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Kest\u00e4\u00e4 yli 3 reflow-sykli\u00e4 (huippul\u00e4mp\u00f6tila 260 \u00b0C)<\/li>\n\n<li>Korkea liitoksen vetolujuus (lyijytetty: 50-60MPa; lyijyt\u00f6n: 55-65MPa)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Laaja sovellettavuus<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Soveltuu eri kokoisille tyynyille (min. 0,5 mm:n jako).<\/li>\n\n<li>Yhteensopiva l\u00e4pireik\u00e4- ja SMT-prosessien kanssa<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>S\u00e4ilytyksen suorituskyky<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>12 kuukauden s\u00e4ilyvyysaika (RH &lt;60 %)<\/li>\n\n<li>Erinomainen hapettumiskest\u00e4vyys (48 tunnin suolasumutesti)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Limitations\"><\/span>Rajoitukset<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Fine-Pitch-rajoitukset<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Ei sovellu &lt;0,4 mm:n BGA\/QFN-komponenteille.<\/li>\n\n<li>Juotossiltojen muodostumisriski hienojakoisissa malleissa<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Planaarisuuskysymykset<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Pinnan ep\u00e4tasaisuus: 15\u201325 \u03bcm (vaikuttaaHDI-kokoonpanoon)<\/li>\n\n<li>Paksuuden vaihtelu jopa 20 \u03bcm suurten\/pienten tyynyjenv\u00e4lill\u00e4<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>L\u00e4mp\u00f6stressi<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Korkean l\u00e4mp\u00f6tilan prosessi (erityisesti lyijyt\u00f6n) voi vaikuttaa korkean Tg:n materiaaleihin.<\/li>\n\n<li>Suurempi v\u00e4\u00e4ntymisriski ohuille levyille (&lt;0,8mm).<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Ymp\u00e4rist\u00f6n\u00e4k\u00f6kohdat<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Lyijyllinen HASL ei-RoHS-yhteensopiva<\/li>\n\n<li>Lyijyt\u00f6nHASL kuluttaaenemm\u00e4n energiaa (30\u201350 \u00b0Ckorkeammatl\u00e4mp\u00f6tilat)<\/li><\/ul><p>Tarvitsetko ammattimaista HASL-tukea? <a href=\"https:\/\/www.topfastpcb.com\/fi\/contact\/\">Ota yhteytt\u00e4 Topfastin insin\u00f6\u00f6reihin<\/a> r\u00e4\u00e4t\u00e4l\u00f6ityj\u00e4 ratkaisuja varten<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3.jpg\" alt=\"HASL-prosessi\" class=\"wp-image-4139\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"ENIG_Electroless_Nickel_Immersion_Gold_Process\"><\/span>ENIG-prosessi (Electroless Nickel Immersion Gold)<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"21_Process_Principles\"><\/span>2.1 Prosessin periaatteet<span class=\"ez-toc-section-end\"><\/span><\/h3><p>ENIG muodostaa komposiittisuojakerroksen s\u00e4hk\u00f6tt\u00f6m\u00e4n nikkel\u00f6innin ja upotuskullan avulla:<\/p><ul class=\"wp-block-list\"><li>Nikkelikerros: 3\u20136 \u03bcm (7\u20139 % fosforia)<\/li>\n\n<li>Kultakerros: 0,05\u20130,1 \u03bcm<\/li><\/ul><p><strong>Keskeiset parametrit<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Nikkelikylvyn l\u00e4mp\u00f6tila: 85\u201390 \u00b0C<\/li>\n\n<li>Pinnoitusnopeus: 15\u201320\u03bcm\/h<\/li>\n\n<li>Kultakylvyn l\u00e4mp\u00f6tila:80\u201385 \u00b0C<\/li>\n\n<li>pH: 5,5-5,0, kultakylpy 5,5-6,5<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"22_Advantages\"><\/span>2.2 Edut<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Erinomainen tasaisuus<\/strong> (Ra&lt;0,1 \u03bcm):<\/li><\/ul><ul class=\"wp-block-list\"><li>Ihanteellinen &lt;0,3 mm:n BGA\/CSP-jakoon<\/li>\n\n<li>Tyynyn koplanariteetti&lt;5\u03bcm\/m<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Hapettumisen kest\u00e4vyys<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>18 kuukauden s\u00e4ilyvyysaika<\/li>\n\n<li>J-STD-003B luokka 3 sertifioitu<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>S\u00e4hk\u00f6njohtavuus<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Kullan resistiivisyys:2,44 \u03bc\u03a9\u00b7cm<\/li>\n\n<li>Kosketusvastus &lt;10 m\u03a9<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"23_Challenges\"><\/span>2.3 Haasteet<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Black Pad Issue<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Syyt: Nikkelin ylisy\u00f6pyminen tai ep\u00e4normaali fosforipitoisuus.<\/li>\n\n<li>Ratkaisu:Topfastin patentoitu passivointi v\u00e4hent\u00e4\u00e4 mustan tyynyn osuuden &lt;0,1 %:iin.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Kustannustekij\u00e4t<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Korkeat materiaalikustannukset (kullan hinnan volatiliteetti)<\/li>\n\n<li>Monimutkainen prosessi (8-10 vaihetta)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Juotosliitoksen lujuus<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Hauras Ni-Au IMC-kerros<\/li>\n\n<li>Vetolujuus ~40-45MPa<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Topfastin ENIG saavuttaa \u00b110 %:n paksuuden tasaisuuden, mik\u00e4ylitt\u00e4\u00e4 alan\u00b115%:n standardit.<\/p><\/blockquote><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"OSP_Organic_Solderability_Preservative\"><\/span>OSP (orgaaninen juotettavuuden s\u00e4il\u00f6nt\u00e4aine) <span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"31_Process_Principles\"><\/span>3.1 Prosessin periaatteet<span class=\"ez-toc-section-end\"><\/span><\/h3><p>OSP muodostaa paljaalle kuparille 0,2\u20130,5 \u03bcm:n paksuisen orgaanisen suojakalvon, joka sis\u00e4lt\u00e4\u00e4:<\/p><ul class=\"wp-block-list\"><li>Bentsotriatsoliyhdisteet<\/li>\n\n<li>Imidatsoliyhdisteet<\/li>\n\n<li>Karboksyylihapot<\/li><\/ul><p><strong>Prosessin kulku<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Happopuhdistus (5% H2SO4, 2min)<\/li>\n\n<li>Mikroetsaus (Na2S2O8, poistaa 1\u20132 \u03bcm kuparia)<\/li>\n\n<li>OSP-k\u00e4sittely (40\u201350 \u00b0C, 1\u20132 min)<\/li>\n\n<li>Kuivaus (60\u201380 \u00b0C kuuma ilma)<\/li><\/ol><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"32_Advantages\"><\/span>3.2 Edut<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Kustannustehokas<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>60 % halvempi kuin HASL<\/li>\n\n<li>Pienet laiteinvestoinnit (~1\/5 ENIG:st\u00e4)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Signaalin eheys<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Vakaa dielektrisyysvakio (\u0394Dk &lt;0,02)<\/li>\n\n<li>Ihanteellinen korkeataajuussovelluksiin (&gt;10 GHz).<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Ymp\u00e4rist\u00f6yst\u00e4v\u00e4llinen<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Ei raskasmetalleja<\/li>\n\n<li>Yksinkertaistettu j\u00e4teveden k\u00e4sittely<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"33_Limitations\"><\/span>3.3 Rajoitukset<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Juotettavuusikkuna<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>K\u00e4ytett\u00e4v\u00e4 24 tunnin kuluessa avaamisesta<\/li>\n\n<li>Soveltuu vain yhdelle uudelleenjuoksutussyklille (saanto laskee 30 % toisessa uudelleenjuoksutuksessa).<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Tarkastusvaikeudet<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Kalvon paksuutta on vaikea mitata optisesti<\/li>\n\n<li>Vaatii tieto- ja viestint\u00e4tekniikan erityisk\u00e4sittely\u00e4<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Varastointiolosuhteet<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Vaaditaan tyhji\u00f6pakkaus (RH &lt;30%)<\/li>\n\n<li>S\u00e4ilytysl\u00e4mp\u00f6tila: 15\u201330 \u00b0C<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Topfastin parannettu OSP pident\u00e4\u00e4 s\u00e4ilyvyytt\u00e4 3 kuukaudesta 6 kuukauteen ja kest\u00e4\u00e4 2 reflow-sykli\u00e4.<\/p><\/blockquote><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2.jpg\" alt=\"HASL-prosessi\" class=\"wp-image-4138\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Process_Selection_Guide\"><\/span>Prosessin valintaopas<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"41_Comparison\"><\/span>4.1 Vertailu<span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Parametri<\/th><th>HASL<\/th><th>ENIG<\/th><th>OSP<\/th><\/tr><\/thead><tbody><tr><td>Kustannukset<\/td><td>$<\/td><td>$$$<\/td><td>$<\/td><\/tr><tr><td>Tasaisuus<\/td><td>\u25b3 (15\u201325\u03bcm)<\/td><td>\u25ce (&lt;5\u03bcm)<\/td><td>\u25cb (&lt;10\u03bcm)<\/td><\/tr><tr><td>Juotettavuus<\/td><td>\u25ce (3 reflows)<\/td><td>\u25cb (5 reflows)<\/td><td>\u25b3 (1\u20132 reflow-prosessia)<\/td><\/tr><tr><td>S\u00e4ilyvyys<\/td><td>12mo<\/td><td>18mo<\/td><td>6mo<\/td><\/tr><tr><td>Min. Pitch<\/td><td>&gt;0.5mm<\/td><td>&gt;0.3mm<\/td><td>&gt;0.4mm<\/td><\/tr><tr><td>Ymp\u00e4rist\u00f6yst\u00e4v\u00e4llinen<\/td><td>Lyijyt\u00f6n OK<\/td><td>Erinomainen<\/td><td>Erinomainen<\/td><\/tr><tr><td>Sovellukset<\/td><td>Viihde-elektroniikka<\/td><td>Suuren tiheyden IC:t<\/td><td>Quick-Turn<\/td><\/tr><\/tbody><\/table><\/figure><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"42_Recommendations\"><\/span>4.2 Suositukset<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Viihde-elektroniikka<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Lyijyt\u00f6n HASL (paras kustannustehokkuus)<\/li>\n\n<li>Juotospastan m\u00e4\u00e4r\u00e4n s\u00e4\u00e4t\u00f6 hienojakoisille komponenteille<\/li><\/ul><ul class=\"wp-block-list\"><li><strong><a href=\"https:\/\/www.topfastpcb.com\/fi\/products\/hdi-pcb\/\">HDI-levyt<\/a><\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>ENIG (erinomainen tasaisuus)<\/li>\n\n<li>Tiukka nikkelin laadunvalvonta<\/li><\/ul><ul class=\"wp-block-list\"><li><strong><a href=\"https:\/\/www.topfastpcb.com\/fi\/products\/high-speed-pcb\/\">Nopeat piirilevyt<\/a><\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>OSP\/ENIG (parempi signaalin eheys)<\/li>\n\n<li>V\u00e4lt\u00e4 HASL&#8217; s ep\u00e4tasainen pinta<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Prototyyppien rakentaminen<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>OSP (nopein l\u00e4pimenoaika)<\/li>\n\n<li>Varmista oikea-aikainen kokoonpano<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"43_Topfast_Capabilities\"><\/span>4.3 Topfast-ominaisuudet<span class=\"ez-toc-section-end\"><\/span><\/h3><p>T\u00e4ydelliset pintak\u00e4sittelyratkaisut:<\/p><ul class=\"wp-block-list\"><li>20automatisoitua HASL-linjaa (500 000 m\u00b2\/kk)<\/li>\n\n<li>10ENIG-linjaa (paksuudentasaisuus \u00b18 %)<\/li>\n\n<li>5 OSP-linjaa (saatavana nanovahvistettu)<\/li>\n\n<li>100 % inline-tarkastus (AOI+SPI)<\/li><\/ul><p><a href=\"https:\/\/www.topfastpcb.com\/fi\/contact\/\">Lataa PCB:n pintak\u00e4sittelyn valintaopas<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>HASL-kuumailmaprosessi, mukaan lukien seoksen koostumus, prosessin kulku ja lyijyisen ja lyijytt\u00f6m\u00e4n HASL:n v\u00e4liset suorituskykyerot. Yksityiskohtainen analyysi ENIG-pinnoituksen ja OSP-hapettumisenestoprosessien ominaisuuksista ja sovellusskenaarioista. Ammattimaisena piirilevyjen valmistajana Topfastilla on kattavat pintak\u00e4sittelyprosessivalmiudet ja vankka laadunvalvontaj\u00e4rjestelm\u00e4, joiden avulla voimme tarjota optimaalisia pintak\u00e4sittelyratkaisuja erilaisille elektroniikkatuotteille.<\/p>","protected":false},"author":1,"featured_media":4136,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[351,260],"class_list":["post-4135","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-hasl-processes","tag-pcb-manufacturing-process"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB HASL and Lead-Free HASL Processes - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Topfast provides professional and reliable PCB manufacturing services. PCB surface treatment processes: detailed comparison of material differences, process flows, and performance characteristics between HASL and lead-free HASL; professional analysis of the applicable scenarios for ENIG gold plating and OSP processes.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/\" \/>\n<meta property=\"og:locale\" content=\"fi_FI\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"PCB HASL and Lead-Free HASL Processes - Topfastpcb\" \/>\n<meta property=\"og:description\" content=\"Topfast provides professional and reliable PCB manufacturing services. PCB surface treatment processes: detailed comparison of material differences, process flows, and performance characteristics between HASL and lead-free HASL; professional analysis of the applicable scenarios for ENIG gold plating and OSP processes.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/\" \/>\n<meta property=\"og:site_name\" content=\"Topfastpcb\" \/>\n<meta property=\"article:published_time\" content=\"2025-08-20T00:34:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"402\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"\u6258\u666e\u6cd5\u65af\u7279\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Kirjoittanut\" \/>\n\t<meta name=\"twitter:data1\" content=\"\u6258\u666e\u6cd5\u65af\u7279\" \/>\n\t<meta name=\"twitter:label2\" content=\"Arvioitu lukuaika\" \/>\n\t<meta name=\"twitter:data2\" content=\"5 minuuttia\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/\"},\"author\":{\"name\":\"\u6258\u666e\u6cd5\u65af\u7279\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a\"},\"headline\":\"PCB HASL and Lead-Free HASL Processes\",\"datePublished\":\"2025-08-20T00:34:00+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/\"},\"wordCount\":1036,\"publisher\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg\",\"keywords\":[\"HASL Processes\",\"PCB Manufacturing Process\"],\"articleSection\":[\"Knowledge\"],\"inLanguage\":\"fi\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/\",\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/\",\"name\":\"PCB HASL and Lead-Free HASL Processes - Topfastpcb\",\"isPartOf\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg\",\"datePublished\":\"2025-08-20T00:34:00+00:00\",\"description\":\"Topfast provides professional and reliable PCB manufacturing services. PCB surface treatment processes: detailed comparison of material differences, process flows, and performance characteristics between HASL and lead-free HASL; professional analysis of the applicable scenarios for ENIG gold plating and OSP processes.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#breadcrumb\"},\"inLanguage\":\"fi\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"fi\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg\",\"width\":600,\"height\":402,\"caption\":\"HASL process\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"\u9996\u9875\",\"item\":\"https:\/\/www.topfastpcb.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"PCB HASL and Lead-Free HASL Processes\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.topfastpcb.com\/#website\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"name\":\"Topfastpcb\",\"description\":\"Topfast Prime Choice for Global Electronics Manufacturing\",\"publisher\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.topfastpcb.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"fi\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\",\"name\":\"Topfastpcb\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fi\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"width\":144,\"height\":56,\"caption\":\"Topfastpcb\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a\",\"name\":\"\u6258\u666e\u6cd5\u65af\u7279\",\"sameAs\":[\"http:\/\/www.topfastpcb.com\"],\"url\":\"https:\/\/www.topfastpcb.com\/fi\/blog\/author\/admin\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"PCB HASL and Lead-Free HASL Processes - Topfastpcb","description":"Topfast provides professional and reliable PCB manufacturing services. PCB surface treatment processes: detailed comparison of material differences, process flows, and performance characteristics between HASL and lead-free HASL; professional analysis of the applicable scenarios for ENIG gold plating and OSP processes.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","og_locale":"fi_FI","og_type":"article","og_title":"PCB HASL and Lead-Free HASL Processes - Topfastpcb","og_description":"Topfast provides professional and reliable PCB manufacturing services. PCB surface treatment processes: detailed comparison of material differences, process flows, and performance characteristics between HASL and lead-free HASL; professional analysis of the applicable scenarios for ENIG gold plating and OSP processes.","og_url":"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","og_site_name":"Topfastpcb","article_published_time":"2025-08-20T00:34:00+00:00","og_image":[{"width":600,"height":402,"url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg","type":"image\/jpeg"}],"author":"\u6258\u666e\u6cd5\u65af\u7279","twitter_card":"summary_large_image","twitter_misc":{"Kirjoittanut":"\u6258\u666e\u6cd5\u65af\u7279","Arvioitu lukuaika":"5 minuuttia"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#article","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/"},"author":{"name":"\u6258\u666e\u6cd5\u65af\u7279","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a"},"headline":"PCB HASL and Lead-Free HASL Processes","datePublished":"2025-08-20T00:34:00+00:00","mainEntityOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/"},"wordCount":1036,"publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg","keywords":["HASL Processes","PCB Manufacturing Process"],"articleSection":["Knowledge"],"inLanguage":"fi"},{"@type":"WebPage","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","url":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","name":"PCB HASL and Lead-Free HASL Processes - Topfastpcb","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg","datePublished":"2025-08-20T00:34:00+00:00","description":"Topfast provides professional and reliable PCB manufacturing services. PCB surface treatment processes: detailed comparison of material differences, process flows, and performance characteristics between HASL and lead-free HASL; professional analysis of the applicable scenarios for ENIG gold plating and OSP processes.","breadcrumb":{"@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#breadcrumb"},"inLanguage":"fi","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/"]}]},{"@type":"ImageObject","inLanguage":"fi","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#primaryimage","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process.jpg","width":600,"height":402,"caption":"HASL process"},{"@type":"BreadcrumbList","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"\u9996\u9875","item":"https:\/\/www.topfastpcb.com\/"},{"@type":"ListItem","position":2,"name":"PCB HASL and Lead-Free HASL Processes"}]},{"@type":"WebSite","@id":"https:\/\/www.topfastpcb.com\/#website","url":"https:\/\/www.topfastpcb.com\/","name":"Topfastpcb","description":"Topfast Prime Choice for Global Electronics Manufacturing","publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.topfastpcb.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"fi"},{"@type":"Organization","@id":"https:\/\/www.topfastpcb.com\/#organization","name":"Topfastpcb","url":"https:\/\/www.topfastpcb.com\/","logo":{"@type":"ImageObject","inLanguage":"fi","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","width":144,"height":56,"caption":"Topfastpcb"},"image":{"@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a","name":"\u6258\u666e\u6cd5\u65af\u7279","sameAs":["http:\/\/www.topfastpcb.com"],"url":"https:\/\/www.topfastpcb.com\/fi\/blog\/author\/admin\/"}]}},"_links":{"self":[{"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/posts\/4135","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/comments?post=4135"}],"version-history":[{"count":1,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/posts\/4135\/revisions"}],"predecessor-version":[{"id":4140,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/posts\/4135\/revisions\/4140"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/media\/4136"}],"wp:attachment":[{"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/media?parent=4135"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/categories?post=4135"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/tags?post=4135"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}