{"id":4555,"date":"2025-11-04T08:17:00","date_gmt":"2025-11-04T00:17:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4555"},"modified":"2025-11-03T20:20:03","modified_gmt":"2025-11-03T12:20:03","slug":"technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/","title":{"rendered":"PCB:n teknologinen kehitys teko\u00e4lyn aikakaudella"},"content":{"rendered":"<p>Teknologinen siirtyminen perinteisest\u00e4 l\u00e4pireik\u00e4asennuksesta suuritiheyksisiin liit\u00e4nt\u00f6ihin yhdess\u00e4 teko\u00e4lyn r\u00e4j\u00e4hdysm\u00e4isen kasvun kanssa muuttaa perusteellisesti piirilevyteollisuuden teknologista kehityst\u00e4, tuoterakennetta ja arvon jakautumista.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB.jpg\" alt=\"AI PCB\" class=\"wp-image-4556\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Sis\u00e4llysluettelo<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Technological_Requirements_Upgrade_of_AI_Computing_Hardware_for_PCBs\" >Teknologiset vaatimukset Teko\u00e4lyn laskentalaitteiston p\u00e4ivitt\u00e4minen PCB:t\u00e4 varten<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Demand_for_High_Layer_Count_and_High-Density_Interconnects\" >Suurten kerrosten lukum\u00e4\u00e4r\u00e4n ja tiheiden liit\u00e4nt\u00f6jen kysynt\u00e4<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Signal_Integrity_Challenges_and_Solutions\" >Signaalin eheyden haasteet ja ratkaisut<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Innovations_in_Thermal_Management_Technology\" >L\u00e4mm\u00f6nhallintateknologian innovaatiot<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Technological_Breakthroughs_and_Localization_Progress_of_Key_Materials\" >Teknologiset l\u00e4pimurrot ja keskeisten materiaalien lokalisoinnin edistyminen<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Advances_in_High-Frequency_and_High-Speed_Copper-Clad_Laminates\" >Suurtaajuus- ja suurnopeuskuparilaminaattien edistysaskeleet<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Specialty_Chemical_Materials\" >Erikoiskemikaalien materiaalit<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Technical_Bottlenecks_and_Breakthroughs_in_Manufacturing_Processes\" >Tekniset pullonkaulat ja l\u00e4pimurrot valmistusprosesseissa<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Laser_Drilling_Technology\" >Laserporaustekniikka<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Innovations_in_Lamination_Processes\" >Innovaatiot laminointiprosesseissa<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Upgrades_in_Inspection_Technology\" >Tarkastustekniikan p\u00e4ivitykset<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Industrial_Chain_Restructuring_and_Business_Model_Transformation\" >Teollisuusketjun rakenneuudistus ja liiketoimintamallin muutos<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Reshaping_of_Supply_Chain_Relationships\" >Toimitusketjusuhteiden uudelleenmuotoilu<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Increased_Concentration_Due_to_Higher_Technical_Barriers\" >Suurempien teknisten esteiden aiheuttama keskittyminen lis\u00e4\u00e4ntyy.<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Changes_in_Value_Distribution\" >Muutokset arvojakaumassa<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Future_Technological_Development_Trends\" >Tulevat teknologiset kehityssuuntaukset<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Integration_of_Advanced_Packaging_and_PCBs\" >Kehittyneiden pakkausten ja piirilevyjen integrointi<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Silicon_Photonics_Co-Packaging_Technology\" >Piifotoniikan yhteispakkaustekniikka<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Sustainability_Requirements\" >Kest\u00e4vyysvaatimukset<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Recommendations_for_Technical_Teams\" >Suositukset teknisille ryhmille<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Transformation_of_Talent_Structure\" >Talenttirakenteen muutos<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Focus_of_R_D_Investment\" >T&amp;K-investointien painopiste<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Patent_Layout_Strategy\" >Patenttien asettelustrategia<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technological_Requirements_Upgrade_of_AI_Computing_Hardware_for_PCBs\"><\/span>Teknologiset vaatimukset Teko\u00e4lyn laskentalaitteiston p\u00e4ivitt\u00e4minen PCB:t\u00e4 varten<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Demand_for_High_Layer_Count_and_High-Density_Interconnects\"><\/span>Suurten kerrosten lukum\u00e4\u00e4r\u00e4n ja tiheiden liit\u00e4nt\u00f6jen kysynt\u00e4<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Perinteisiss\u00e4 palvelinten emolevyiss\u00e4 on tyypillisesti 12-16 kerrosta, kun taas nykyiset valtavirran teko\u00e4lyn harjoittelupalvelimet (kuten NVIDIA DGX H100 -sarja) vaativat piirilevyjen kerroslukuja 20-30 kerrosta. Erityisesti GPU-alustoilla tarvitaan yli 5 000 BGA-juotospisteen liit\u00e4nt\u00e4tiheyksi\u00e4, ja j\u00e4ljen leveys\/v\u00e4li on pakattu perinteisest\u00e4 4\/4 milist\u00e4 2\/2 miliin tai jopa 1,5\/1,5 miliin. T\u00e4m\u00e4 suunnitteluvaatimus johtaa suoraan mSAP-prosessin (Modified Semi-Additive Process) k\u00e4ytt\u00f6\u00f6nottoon, koska perinteiset subtraktiiviset prosessit eiv\u00e4t en\u00e4\u00e4 pysty t\u00e4ytt\u00e4m\u00e4\u00e4n tarkkuusvaatimuksia.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Signal_Integrity_Challenges_and_Solutions\"><\/span>Signaalin eheyden haasteet ja ratkaisut<span class=\"ez-toc-section-end\"><\/span><\/h3><p>112 Gbps:n PAM4-siirtonopeuksilla inserttih\u00e4vi\u00f6n on oltava -0,6 dB\/tuuma. Simulointianalyysin avulla olemme havainneet, ett\u00e4 h\u00e4vi\u00f6kerrointa (Df) on pienennett\u00e4v\u00e4 perinteisen FR-4:n 0,02:sta alle 0,005:een. Teollisuuden nykyinen johtava ratkaisu on hiilivetyhartsi-keraaminen t\u00e4yteaine-komposiittij\u00e4rjestelm\u00e4 (kuten Rogers RO4835\u2122), joka s\u00e4ilytt\u00e4\u00e4 vakaan Dk-arvon 3,5 \u00b1 0,05 ja jolla on hyv\u00e4t dielektriset ominaisuudet jopa 77 GHz:n taajuudella.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Innovations_in_Thermal_Management_Technology\"><\/span>L\u00e4mm\u00f6nhallintateknologian innovaatiot<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Esimerkkin\u00e4 NVIDIA H100:n yhden piirin huipputehonkulutus on jopa 700 W, mik\u00e4 tekee perinteisist\u00e4 l\u00e4mp\u00f6suunnitteluratkaisuista t\u00e4ysin riitt\u00e4m\u00e4tt\u00f6mi\u00e4. Kehitt\u00e4m\u00e4mme sulautettu kuparilohko + terminen l\u00e4pivientij\u00e4rjestelm\u00e4 -tekniikka voi alentaa l\u00e4mp\u00f6vastuksen 0,8 \u00b0C\/W:iin. Substraattimateriaalin valinnassa korkeasta Tg:st\u00e4 (\u2265170 \u00b0C) ja korkeasta l\u00e4mm\u00f6njohtavuudesta (\u22650,8 W\/m-K) on tullut perusvaatimuksia, ja joissakin huippuluokan sovelluksissa on jo otettu k\u00e4ytt\u00f6\u00f6n metallisubstraattien ja orgaanisten materiaalien hybridirakenteita.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technological_Breakthroughs_and_Localization_Progress_of_Key_Materials\"><\/span>Teknologiset l\u00e4pimurrot ja keskeisten materiaalien lokalisoinnin edistyminen<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advances_in_High-Frequency_and_High-Speed_Copper-Clad_Laminates\"><\/span>Advances in <a href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/high-frequency-pcb-design-and-layout-guide\/\">Korkeataajuus<\/a> ja <a href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-a-high-speed-pcb\/\">Nopea<\/a> Copper-Clad laminaatit<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Shengyi Technologyn S7439-sarja on sertifioitu suurimpien OEM-valmistajien toimesta, ja sen Df-arvo on 0,0058 10 GHz:n taajuudella, mik\u00e4 vastaa kansainv\u00e4lisesti johtavia standardeja. Sinoma Science &amp; Technologyn kehitt\u00e4m\u00e4 Low Dk -elektroninen lasikangas (Dk=4,2) murtaa Nittobon teknologisen monopolin, ja sen massatuotantoa odotetaan vuoteen 2025 menness\u00e4.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Specialty_Chemical_Materials\"><\/span>Erikoiskemikaalien materiaalit<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Taiyo Ink SR-7200G-sarja tukee juotosresistiv\u00e4reiss\u00e4 suoraa laserkuvausta jopa 20 \u03bcm:n resoluutiolla. Galvanointilis\u00e4aineiden osalta MacDermid Enthonen Circuposit 8800 -sarja mahdollistaa tasaisen galvanoinnin 1:1-kuvasuhteella, mik\u00e4 ratkaisee ongelman tasaisesta kuparipinnoituksesta l\u00e4pivientirei'iss\u00e4 piirilevyiss\u00e4, joissa on paljon kerroksia.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3.jpg\" alt=\"AI PCB\" class=\"wp-image-4557\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technical_Bottlenecks_and_Breakthroughs_in_Manufacturing_Processes\"><\/span>Tekniset pullonkaulat ja l\u00e4pimurrot valmistusprosesseissa<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Laser_Drilling_Technology\"><\/span>Laserporaustekniikka<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Alle 0,1 mm:n mikrovian k\u00e4sittelyss\u00e4 CO2-laserit l\u00e4hestyv\u00e4t fyysisi\u00e4 rajojaan. Olemme ottaneet k\u00e4ytt\u00f6\u00f6n UV-laserin k\u00e4sittelyj\u00e4rjestelmi\u00e4 yhdistettyn\u00e4 s\u00e4teenmuotoilutekniikkaan, jolla voidaan parantaa k\u00e4sittelytarkkuutta 35 \u03bcm:iin. Han's Laserin UV-laserporauskoneilla, joissa k\u00e4ytet\u00e4\u00e4n 355 nm:n aallonpituutta, saavutetaan 50 \u03bcm:n rei\u00e4n minimihalkaisija \u00b115 \u03bcm:n paikannustarkkuudella.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Innovations_in_Lamination_Processes\"><\/span>Innovaatiot laminointiprosesseissa<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Yli 30 kerrosta ylitt\u00e4ville eritt\u00e4in korkeille levyille olemme kehitt\u00e4neet laminointiprosessin, jossa k\u00e4ytet\u00e4\u00e4n segmentoitua l\u00e4mmityst\u00e4 ja painetta. Kun hartsin virtausta ohjataan tarkasti, kerrosten v\u00e4linen t\u00e4ytt\u00f6aste nousee yli 95%:hen ja kerrosten v\u00e4linen kohdistustarkkuus pysyy \u00b125 \u03bcm:n tarkkuudella.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Upgrades_in_Inspection_Technology\"><\/span>Tarkastustekniikan p\u00e4ivitykset<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Kattava ratkaisu, jossa yhdistyv\u00e4t <a href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/what-is-aoi-automated-optical-inspection\/\">Automaattinen optinen tarkastus<\/a> (AOI) ja s\u00e4hk\u00f6inen testaus. Keysightin PathWave ADS -ohjelmisto tukee 3D-s\u00e4hk\u00f6magneettisen kent\u00e4n simulointia, mik\u00e4 mahdollistaa signaalin eheysongelmien varhaisen tunnistamisen. Piirin sis\u00e4isess\u00e4 testauksessa Teradynen TestStation-arkkitehtuuri tukee 112 Gbps:n liit\u00e4nt\u00f6jen bittivirheprosentin testausta.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Industrial_Chain_Restructuring_and_Business_Model_Transformation\"><\/span>Teollisuusketjun rakenneuudistus ja liiketoimintamallin muutos<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Reshaping_of_Supply_Chain_Relationships\"><\/span>Toimitusketjusuhteiden uudelleenmuotoilu<span class=\"ez-toc-section-end\"><\/span><\/h3><p>AI-palvelimen piirilevyjen toimitusketju on jaettu kolmeen tasoon: CPU-emolevyt noudattavat perinteist\u00e4 palvelintoimitusketjua, ja moduulivalmistajat hankkivat lis\u00e4moduulit itsen\u00e4isesti. T\u00e4m\u00e4 eriytt\u00e4minen edellytt\u00e4\u00e4 piirilevyvalmistajilta eriytettyj\u00e4 asiakassuhdeominaisuuksia.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Increased_Concentration_Due_to_Higher_Technical_Barriers\"><\/span><strong>Suurempien teknisten esteiden aiheuttama keskittyminen lis\u00e4\u00e4ntyy.<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p>P\u00e4\u00e4omainvestoinnit 18-kerroksisiin tai useampikerroksisiin piirilevyihin ovat 3-5 kertaa suuremmat kuin perinteisiin tuotteisiin, ja T&amp;K-syklit ovat 12-18 kuukautta. T\u00e4m\u00e4 on johtanut markkinaosuuksien keskittymiseen johtavien yritysten kesken, ja kolmen suurimman valmistajan osuus kotimaisista teko\u00e4lypalvelinten piirilevymarkkinoista on yli 60% vuonna 2024.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Changes_in_Value_Distribution\"><\/span>Muutokset arvojakaumassa<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Teko\u00e4lypalvelinten materiaalikustannuksissa piirilevyjen osuus on kasvanut perinteisten palvelinten 2-3%:st\u00e4 6-8%:hen. Erityisesti GPU-alustojen bruttomarginaalit voivat niiden suuren teknisen monimutkaisuuden vuoksi nousta 35-40%:iin, mik\u00e4 on huomattavasti enemm\u00e4n kuin perinteisten tuotteiden 15-20%.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2.jpg\" alt=\"AI PCB\" class=\"wp-image-4558\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Future_Technological_Development_Trends\"><\/span>Tulevat teknologiset kehityssuuntaukset<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Integration_of_Advanced_Packaging_and_PCBs\"><\/span>Kehittyneiden pakkausten ja piirilevyjen integrointi<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Chiplet-arkkitehtuuri edellytt\u00e4\u00e4, ett\u00e4 piirilevyjen on omaksuttava joitakin interposer-toimintoja, mik\u00e4 johtaa Substrate-Like PCB (SLP) -tekniikan siirtymiseen kohti 10\/10 \u03bcm:n raideleveytt\u00e4\/-v\u00e4li\u00e4. Shennan Circuitsin kehitt\u00e4m\u00e4 eSLP-teknologia on saavuttanut 8\/8 \u03bcm:n prosessikapasiteetin, ja sit\u00e4 validoidaan parhaillaan suurimpien siruvalmistajien kanssa.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Silicon_Photonics_Co-Packaging_Technology\"><\/span>Piifotoniikan yhteispakkaustekniikka<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Yli 1,6 T:n optisissa moduuleissa Co-Packaged Optics (CPO) on tullut v\u00e4ist\u00e4m\u00e4tt\u00f6m\u00e4ksi valinnaksi. T\u00e4m\u00e4 edellytt\u00e4\u00e4, ett\u00e4 piirilevyihin integroidaan fotonisia aaltojohtimia, ja kehit\u00e4mme piidioksidiaaltojohtimiin perustuvaa hybridialustatekniikkaa, jonka odotetaan saavuttavan teknisi\u00e4 sovelluksia vuoteen 2026 menness\u00e4.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Sustainability_Requirements\"><\/span>Kest\u00e4vyysvaatimukset<span class=\"ez-toc-section-end\"><\/span><\/h3><p>EU:n CE-RED-direktiivi asettaa piirilevyille uusia ymp\u00e4rist\u00f6vaatimuksia, kuten halogeenittomia materiaaleja ja lyijytt\u00f6mi\u00e4 prosesseja. Kehitt\u00e4m\u00e4mme biopohjainen epoksihartsij\u00e4rjestelm\u00e4 v\u00e4hent\u00e4\u00e4 hiilijalanj\u00e4lke\u00e4 40%:ll\u00e4 ja on saanut UL-sertifikaatin.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Recommendations_for_Technical_Teams\"><\/span>Suositukset teknisille ryhmille<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Transformation_of_Talent_Structure\"><\/span>Talenttirakenteen muutos<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Perinteisist\u00e4 prosessi-insin\u00f6\u00f6reist\u00e4 on siirrytt\u00e4v\u00e4 \"materiaali-prosessi-j\u00e4rjestelm\u00e4\" -komposiittikykyihin. Tiimiss\u00e4mme materiaalitieteellisen taustan omaavien insin\u00f6\u00f6rien osuus on kasvanut vuosikymmenen takaisesta 10%:st\u00e4 nykyiseen 35%:hen.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Focus_of_R_D_Investment\"><\/span>T&amp;K-investointien painopiste<span class=\"ez-toc-section-end\"><\/span><\/h3><p>T&amp;K-resursseista suositellaan osoitettavaksi 60% suurikerroksiseen HDI:hen, 30% kehittyneeseen pakkaamiseen ja 10% kest\u00e4v\u00e4n kehityksen teknologioihin. Erityist\u00e4 huomiota olisi kiinnitett\u00e4v\u00e4 varhaiseen yhteisty\u00f6h\u00f6n sirujen valmistajien kanssa ja osallistumiseen etup\u00e4\u00e4n suunnitteluun.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Patent_Layout_Strategy\"><\/span>Patenttien asettelustrategia<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Keskityt\u00e4\u00e4n patenttiasetteluihin kolmessa suunnassa: nopeat materiaalit, l\u00e4mp\u00f6h\u00e4vi\u00f6rakenteet ja tihe\u00e4t liit\u00e4nn\u00e4t. Viime vuosina haetuista ydinpatenteistamme 40% on erityisi\u00e4 l\u00e4mp\u00f6h\u00e4vi\u00f6rakenteita koskevia patentteja, joista tulee tulevaisuudessa teknologinen este.<\/p><p>Teko\u00e4ly nostaa piirilevyt apukomponenteista tietokonej\u00e4rjestelmien keskeisiksi osiksi. T\u00e4m\u00e4 aseman muutos edellytt\u00e4\u00e4 meilt\u00e4 tuotekehitysprosessien uudelleenm\u00e4\u00e4rittely\u00e4 j\u00e4rjestelm\u00e4tason ajattelutavalla ja siirtymist\u00e4 puhtaista valmistuspalvelujen tarjoajista teknisten ratkaisujen tarjoajiksi. Tulevaisuudessa alan kilpailu on materiaalij\u00e4rjestelmien, prosessikyvykkyyksien ja j\u00e4rjestelm\u00e4suunnittelun taitojen kokonaisvaltaista kilpailua.<\/p><p><\/p>","protected":false},"excerpt":{"rendered":"<p>Analysoidaan teko\u00e4lyn aiheuttamaa syv\u00e4llist\u00e4 muutosta piirilevyteollisuudelle teknisest\u00e4 n\u00e4k\u00f6kulmasta. Teko\u00e4lypalvelimet nostavat piirilevyjen kerroslukum\u00e4\u00e4r\u00e4n 20-30 kerrokseen, viivanleveys- ja v\u00e4livaatimusten ollessa alle 2\/2 mil ja signaalinsiirtonopeuksien kehittyess\u00e4 112 Gbps:iin.<\/p>","protected":false},"author":1,"featured_media":4559,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[382],"tags":[396,111],"class_list":["post-4555","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-guide","tag-ai-pcb","tag-pcb"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Technological Evolution of PCBs in the Era of Artificial Intelligence - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Revolutionary Demands of AI Computing Hardware on PCB Technology: From 20+ Layer High-Density Interconnect Design to 112Gbps Signal Integrity Assurance\u2014Exploring Innovations in High-Frequency Materials and Advanced Manufacturing Processes.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/\" \/>\n<meta property=\"og:locale\" content=\"fi_FI\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Technological Evolution of PCBs in the Era of Artificial Intelligence - 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Topfastpcb\",\"isPartOf\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-1.jpg\",\"datePublished\":\"2025-11-04T00:17:00+00:00\",\"description\":\"Revolutionary Demands of AI Computing Hardware on PCB Technology: From 20+ Layer High-Density Interconnect Design to 112Gbps Signal Integrity Assurance\u2014Exploring Innovations in High-Frequency Materials and Advanced Manufacturing Processes.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#breadcrumb\"},\"inLanguage\":\"fi\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"fi\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#primaryimage\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-1.jpg\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-1.jpg\",\"width\":600,\"height\":402,\"caption\":\"AI PCB\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"\u9996\u9875\",\"item\":\"https:\/\/www.topfastpcb.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Technological Evolution of PCBs in the Era of Artificial Intelligence\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.topfastpcb.com\/#website\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"name\":\"Topfastpcb\",\"description\":\"Topfast Prime Choice for Global Electronics Manufacturing\",\"publisher\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.topfastpcb.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"fi\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\",\"name\":\"Topfastpcb\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fi\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"width\":144,\"height\":56,\"caption\":\"Topfastpcb\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a\",\"name\":\"\u6258\u666e\u6cd5\u65af\u7279\",\"sameAs\":[\"http:\/\/www.topfastpcb.com\"],\"url\":\"https:\/\/www.topfastpcb.com\/fi\/blog\/author\/admin\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Technological Evolution of PCBs in the Era of Artificial Intelligence - Topfastpcb","description":"Revolutionary Demands of AI Computing Hardware on PCB Technology: From 20+ Layer High-Density Interconnect Design to 112Gbps Signal Integrity Assurance\u2014Exploring Innovations in High-Frequency Materials and Advanced Manufacturing Processes.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/","og_locale":"fi_FI","og_type":"article","og_title":"Technological Evolution of PCBs in the Era of Artificial Intelligence - Topfastpcb","og_description":"Revolutionary Demands of AI Computing Hardware on PCB Technology: From 20+ Layer High-Density Interconnect Design to 112Gbps Signal Integrity Assurance\u2014Exploring Innovations in High-Frequency Materials and Advanced Manufacturing Processes.","og_url":"https:\/\/www.topfastpcb.com\/fi\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/","og_site_name":"Topfastpcb","article_published_time":"2025-11-04T00:17:00+00:00","og_image":[{"width":600,"height":402,"url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-1.jpg","type":"image\/jpeg"}],"author":"\u6258\u666e\u6cd5\u65af\u7279","twitter_card":"summary_large_image","twitter_misc":{"Kirjoittanut":"\u6258\u666e\u6cd5\u65af\u7279","Arvioitu lukuaika":"6 minuuttia"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#article","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/"},"author":{"name":"\u6258\u666e\u6cd5\u65af\u7279","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a"},"headline":"Technological Evolution of PCBs in the Era of Artificial Intelligence","datePublished":"2025-11-04T00:17:00+00:00","mainEntityOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/"},"wordCount":1005,"publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-1.jpg","keywords":["AI PCB","PCB"],"articleSection":["PCB Guide"],"inLanguage":"fi"},{"@type":"WebPage","@id":"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/","url":"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/","name":"Technological Evolution of PCBs in the Era of Artificial Intelligence - Topfastpcb","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#primaryimage"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-1.jpg","datePublished":"2025-11-04T00:17:00+00:00","description":"Revolutionary Demands of AI Computing Hardware on PCB Technology: From 20+ Layer High-Density Interconnect Design to 112Gbps Signal Integrity Assurance\u2014Exploring Innovations in High-Frequency Materials and Advanced Manufacturing Processes.","breadcrumb":{"@id":"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#breadcrumb"},"inLanguage":"fi","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/"]}]},{"@type":"ImageObject","inLanguage":"fi","@id":"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#primaryimage","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-1.jpg","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-1.jpg","width":600,"height":402,"caption":"AI PCB"},{"@type":"BreadcrumbList","@id":"https:\/\/www.topfastpcb.com\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"\u9996\u9875","item":"https:\/\/www.topfastpcb.com\/"},{"@type":"ListItem","position":2,"name":"Technological Evolution of PCBs in the Era of Artificial Intelligence"}]},{"@type":"WebSite","@id":"https:\/\/www.topfastpcb.com\/#website","url":"https:\/\/www.topfastpcb.com\/","name":"Topfastpcb","description":"Topfast Prime Choice for Global Electronics Manufacturing","publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.topfastpcb.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"fi"},{"@type":"Organization","@id":"https:\/\/www.topfastpcb.com\/#organization","name":"Topfastpcb","url":"https:\/\/www.topfastpcb.com\/","logo":{"@type":"ImageObject","inLanguage":"fi","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","width":144,"height":56,"caption":"Topfastpcb"},"image":{"@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a","name":"\u6258\u666e\u6cd5\u65af\u7279","sameAs":["http:\/\/www.topfastpcb.com"],"url":"https:\/\/www.topfastpcb.com\/fi\/blog\/author\/admin\/"}]}},"_links":{"self":[{"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/posts\/4555","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/comments?post=4555"}],"version-history":[{"count":1,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/posts\/4555\/revisions"}],"predecessor-version":[{"id":4560,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/posts\/4555\/revisions\/4560"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/media\/4559"}],"wp:attachment":[{"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/media?parent=4555"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/categories?post=4555"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/fi\/wp-json\/wp\/v2\/tags?post=4555"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}