{"id":5223,"date":"2026-03-15T08:32:00","date_gmt":"2026-03-15T00:32:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=5223"},"modified":"2026-03-10T17:27:50","modified_gmt":"2026-03-10T09:27:50","slug":"pcb-solder-mask-design-guidelines","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/","title":{"rendered":"PCB-juotosmaskin suunnitteluohjeet luotettavaa valmistusta varten"},"content":{"rendered":"<p>Juotosmaski on yksi piirilevyn n\u00e4kyvimmist\u00e4 kerroksista. Se peitt\u00e4\u00e4 kuparij\u00e4ljet ja j\u00e4tt\u00e4\u00e4 komponenttipinnat n\u00e4kyviin juottamista varten.<\/p><p>Vaikka juotosmaski n\u00e4ytt\u00e4\u00e4 yksinkertaiselta, virheellinen suunnittelu voi johtaa useisiin valmistus- ja kokoonpano-ongelmiin, kuten:<\/p><ul class=\"wp-block-list\"><li>juotosillat tyynyjen v\u00e4lill\u00e4<\/li>\n\n<li>huonot juotosliitokset<\/li>\n\n<li>alttiina olevat kuparialueet<\/li>\n\n<li>V\u00e4hentynyt PCB:n tuotto<\/li><\/ul><p>Asianmukaisen <strong>PCB-juotosmaskin suunnitteluohjeet<\/strong> varmistetaan, ett\u00e4 maskikerros tukee sek\u00e4 valmistus- ett\u00e4 kokoonpanoprosesseja.<\/p><p>T\u00e4ss\u00e4 oppaassa selitet\u00e4\u00e4n t\u00e4rkeimm\u00e4t suunnitteluparametrit, jotka insin\u00f6\u00f6rien tulisi ottaa huomioon luodessaan juotosmaskin aukkoja ja v\u00e4lyksi\u00e4.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"437\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask.jpg\" alt=\"PCB juotosmaski\" class=\"wp-image-5224\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-300x219.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-16x12.jpg 16w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Sis\u00e4llysluettelo<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#What_Is_PCB_Solder_Mask\" >Mik\u00e4 on PCB-juotosmaski?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Types_of_Solder_Mask\" >Juotosmaskin tyypit<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Liquid_Photoimageable_Solder_Mask_LPI\" >Nestem\u00e4inen valokuvauskelpoinen juotosmaski (LPI)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Dry_Film_Solder_Mask\" >Kuivakalvon juotosmaski<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Epoxy_Screen-Printed_Mask\" >Epoksilla painettu maski<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Key_PCB_Solder_Mask_Design_Rules\" >T\u00e4rkeimm\u00e4t PCB-juotosmaskin suunnittelus\u00e4\u00e4nn\u00f6t<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#1_Solder_Mask_Clearance\" >1. Juotosmaskin tyhjyys<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#2_Solder_Mask_Expansion\" >2. Juotosmaskin laajennus<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#3_Solder_Mask_Dam_Width\" >3. Juotosnaamion padon leveys<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#4_Fine-Pitch_Component_Considerations\" >4. Hienojakoisten komponenttien huomioon ottaminen<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Solder_Mask_Defined_Pads_SMD\" >Juotosmaskilla m\u00e4\u00e4ritellyt tyynyt (SMD)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Non-Solder_Mask_Defined_Pads_NSMD\" >NSMD (Non-Solder Mask Defined Pads) -tyynyt (NSMD)<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#How_to_Design_PCB_Solder_Mask_Practical_Steps\" >Kuinka suunnitella PCB-juotosmaski (k\u00e4yt\u00e4nn\u00f6n vaiheet)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Common_PCB_Solder_Mask_Design_Mistakes\" >Yleiset PCB-juotosmaskin suunnitteluvirheet<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Mask_openings_are_too_small\" >Maskin aukot ovat liian pienet<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Insufficient_solder_mask_dam\" >Riitt\u00e4m\u00e4t\u00f6n juotosmaskin pato<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Incorrect_pad_definitions\" >Virheelliset tyynyn m\u00e4\u00e4ritelm\u00e4t<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Ignoring_manufacturing_tolerances\" >Valmistustoleranssien huomiotta j\u00e4tt\u00e4minen<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Manufacturing_Considerations\" >Valmistukseen liittyv\u00e4t seikat<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#Conclusion\" >P\u00e4\u00e4telm\u00e4<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-solder-mask-design-guidelines\/#PCB_Solder_Mask_FAQ\" >PCB Solder Mask FAQ<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Is_PCB_Solder_Mask\"><\/span>Mik\u00e4 on PCB-juotosmaski?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Juotosmaski on polymeeripinnoite, joka levitet\u00e4\u00e4n piirilevyn pinnoille kuparij\u00e4lkien suojaamiseksi ja tahattomien juotosliitosten est\u00e4miseksi.<\/p><p>Sen t\u00e4rkeimpi\u00e4 toimintoja ovat:<\/p><ul class=\"wp-block-list\"><li>kuparin suojaaminen hapettumiselta<\/li>\n\n<li>juotossiltojen muodostumisen est\u00e4minen<\/li>\n\n<li>johtimien v\u00e4lisen eristyksen parantaminen<\/li>\n\n<li>PCB:n ulkon\u00e4\u00f6n parantaminen<\/li><\/ul><p>PCB-valmistuksen aikana juotosmaskikerros levitet\u00e4\u00e4n kuparikuvion muodostamisen j\u00e4lkeen ja ennen pintak\u00e4sittely\u00e4.<\/p><p>Yleinen valmistuksen ty\u00f6nkulku selitet\u00e4\u00e4n asiakirjassa: <strong><a href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-manufacturing-process-explained-step-by-step\/\">PCB valmistusprosessi selitetty<\/a><\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Types_of_Solder_Mask\"><\/span>Juotosmaskin tyypit<span class=\"ez-toc-section-end\"><\/span><\/h2><p>PCB-valmistuksessa k\u00e4ytet\u00e4\u00e4n useita erilaisia juotosmaskityyppej\u00e4.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Liquid_Photoimageable_Solder_Mask_LPI\"><\/span>Nestem\u00e4inen valokuvauskelpoinen juotosmaski (LPI)<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Yleisin nykyaikaisissa piirilevyiss\u00e4 k\u00e4ytetty tyyppi.<\/p><p>Ominaisuudet:<\/p><ul class=\"wp-block-list\"><li>levitet\u00e4\u00e4n nestem\u00e4isen\u00e4 pinnoitteena<\/li>\n\n<li>kuvioitu fotolitografiaa k\u00e4ytt\u00e4en<\/li>\n\n<li>tukee hienojakoisia komponentteja<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Dry_Film_Solder_Mask\"><\/span>Kuivakalvon juotosmaski<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Harvemmin k\u00e4ytetty, mutta sopii tiettyihin sovelluksiin.<\/p><p>Ominaisuudet:<\/p><ul class=\"wp-block-list\"><li>laminoitu kalvo<\/li>\n\n<li>tasainen paksuus<\/li>\n\n<li>Hyv\u00e4 korkean tarkkuuden suunnitteluun<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Epoxy_Screen-Printed_Mask\"><\/span>Epoksilla painettu maski<span class=\"ez-toc-section-end\"><\/span><\/h3><p>K\u00e4ytet\u00e4\u00e4n p\u00e4\u00e4asiassa vanhemmissa tai edullisissa PCB-prosesseissa.<\/p><p>Rajoitukset:<\/p><ul class=\"wp-block-list\"><li>pienempi resoluutio<\/li>\n\n<li>ei sovellu hienojakoisille komponenteille<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Key_PCB_Solder_Mask_Design_Rules\"><\/span>T\u00e4rkeimm\u00e4t PCB-juotosmaskin suunnittelus\u00e4\u00e4nn\u00f6t<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Useat suunnitteluparametrit vaikuttavat juotosmaskin suorituskykyyn.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Solder_Mask_Clearance\"><\/span>1. Juotosmaskin tyhjyys<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Juotosmaskin v\u00e4lys m\u00e4\u00e4ritt\u00e4\u00e4 kuparialustan reunan ja maskiaukon v\u00e4lisen et\u00e4isyyden.<\/p><p>Tyypillinen ohje:<\/p><pre class=\"wp-block-preformatted\">Naamion tyhjennys: 3-4 mil<\/pre><p>Riitt\u00e4v\u00e4 et\u00e4isyys varmistaa, ett\u00e4 tyynyt ovat t\u00e4ysin n\u00e4kyviss\u00e4 kokoonpanon aikana.<\/p><p>Jos v\u00e4lys on liian pieni:<\/p><ul class=\"wp-block-list\"><li>Maski voi peitt\u00e4\u00e4 tyynyn reunat<\/li>\n\n<li>Juotosliitokset voivat olla ep\u00e4luotettavia<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Solder_Mask_Expansion\"><\/span>2. Juotosmaskin laajennus<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Maskin laajennus on m\u00e4\u00e4r\u00e4, jolla juotosmaskin aukko laajenee kuparialustan ulkopuolelle.<\/p><p>Esimerkki:<\/p><pre class=\"wp-block-preformatted\">Tyynyn koko = 20 mil<br>Maskin aukko = 24 mil<br>Laajeneminen = 2 mil per puoli<\/pre><p>T\u00e4m\u00e4 laajennus kompensoi maskin kohdistustoleranssit valmistuksen aikana.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Solder_Mask_Dam_Width\"><\/span>3. Juotosnaamion padon leveys<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Juotosmaskipato on kahden tyynyn v\u00e4liss\u00e4 oleva kapea maskikaistale.<\/p><p>Tyypillinen padon v\u00e4himm\u00e4isleveys:<\/p><pre class=\"wp-block-preformatted\">\u2265 4 mil<\/pre><p>Jos pato on liian kapea, se voi murtua valmistuksen aikana, mik\u00e4 lis\u00e4\u00e4 juotosiltojen riski\u00e4.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Fine-Pitch_Component_Considerations\"><\/span>4. Hienojakoisten komponenttien huomioon ottaminen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Hienojakoiset IC:t ja BGA:t edellytt\u00e4v\u00e4t erityist\u00e4 juotosmaskin suunnittelua.<\/p><p>Yleisi\u00e4 l\u00e4hestymistapoja ovat:<\/p><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Solder_Mask_Defined_Pads_SMD\"><\/span>Juotosmaskilla m\u00e4\u00e4ritellyt tyynyt (SMD)<span class=\"ez-toc-section-end\"><\/span><\/h4><p>Maskin aukko m\u00e4\u00e4ritt\u00e4\u00e4 tyynyn koon.<\/p><p>Edut:<\/p><ul class=\"wp-block-list\"><li>pienten komponenttien tiukempi valvonta<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Non-Solder_Mask_Defined_Pads_NSMD\"><\/span>NSMD (Non-Solder Mask Defined Pads) -tyynyt (NSMD)<span class=\"ez-toc-section-end\"><\/span><\/h4><p>Kuparityyny m\u00e4\u00e4ritt\u00e4\u00e4 koon, maskin aukko on suurempi.<\/p><p>Edut:<\/p><ul class=\"wp-block-list\"><li>parempi juotosliitoksen luotettavuus<\/li>\n\n<li>k\u00e4ytet\u00e4\u00e4n yleisesti BGA-levyihin<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"468\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-1.jpg\" alt=\"PCB juotosmaski\" class=\"wp-image-5225\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-1-300x234.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-1-15x12.jpg 15w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_to_Design_PCB_Solder_Mask_Practical_Steps\"><\/span>Kuinka suunnitella PCB-juotosmaski (k\u00e4yt\u00e4nn\u00f6n vaiheet)<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-how-to wp-block-yoast-how-to-block\"><p class=\"schema-how-to-description\">Insin\u00f6\u00f6rit noudattavat tyypillisesti useita vaiheita m\u00e4\u00e4ritelless\u00e4\u00e4n juotosmaskin s\u00e4\u00e4nt\u00f6j\u00e4.<\/p> <ol class=\"schema-how-to-steps\"><li class=\"schema-how-to-step\" id=\"how-to-step-1773134083798\"><strong class=\"schema-how-to-step-name\">Vaihe 1 - M\u00e4\u00e4rit\u00e4 maskin laajennuss\u00e4\u00e4nn\u00f6t<\/strong> <p class=\"schema-how-to-step-text\">Aseta maailmanlaajuinen maskin laajennus PCB-suunnitteluohjelmistossa.<br\/>Tyypillinen alue: 2-4 mil<br\/><\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773134096300\"><strong class=\"schema-how-to-step-name\">Vaihe 2 - Tarkista hienojakoiset komponentit<\/strong> <p class=\"schema-how-to-step-text\">Tarkista juotosmaskin aukot ymp\u00e4ri:<br\/>QFN<br\/>BGA<br\/>pienikokoiset liittimet<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773134129021\"><strong class=\"schema-how-to-step-name\">Vaihe 3 - Tarkista maskin patoleveydet<\/strong> <p class=\"schema-how-to-step-text\">Varmista, ett\u00e4 vierekk\u00e4isten tyynyjen v\u00e4lit kest\u00e4v\u00e4t maskipatoja.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-1773134139200\"><strong class=\"schema-how-to-step-name\">Vaihe 4 - Suorita DFM-tarkastukset<\/strong> <p class=\"schema-how-to-step-text\">Valmistajat tarkistavat juotosmaskin tiedot valmistettavuuden varmistamiseksi.<br\/>DFM:n tarkistusprosessi on kuvattu asiakirjassa: <strong><a href=\"https:\/\/www.topfastpcb.com\/fi\/blog\/pcb-dfm-checklist-before-sending-gerber-files\/\">PCB DFM tarkistuslista ennen Gerber-tiedostojen l\u00e4hett\u00e4mist\u00e4<\/a><\/strong><\/p> <\/li><\/ol><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_PCB_Solder_Mask_Design_Mistakes\"><\/span>Yleiset PCB-juotosmaskin suunnitteluvirheet<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Piirilevyjen ulkoasuissa esiintyy usein useita suunnittelukysymyksi\u00e4.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Mask_openings_are_too_small\"><\/span>Maskin aukot ovat liian pienet<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Saattaa osittain peitt\u00e4\u00e4 tyynyt.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Insufficient_solder_mask_dam\"><\/span>Riitt\u00e4m\u00e4t\u00f6n juotosmaskin pato<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Johtaa juotossiltojen muodostumiseen.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Incorrect_pad_definitions\"><\/span>Virheelliset tyynyn m\u00e4\u00e4ritelm\u00e4t<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Maskin ja kuparityynyjen v\u00e4linen ep\u00e4suhta voi aiheuttaa kokoonpano-ongelmia.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Ignoring_manufacturing_tolerances\"><\/span>Valmistustoleranssien huomiotta j\u00e4tt\u00e4minen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Maskin kohdistustoleranssit on otettava huomioon.<\/p><p>Monet kokoonpanon aikana ilmenev\u00e4t luotettavuusongelmat johtuvat suunnittelun ongelmista, joita k\u00e4sitell\u00e4\u00e4n kohdassa: <strong>Yleiset PCB-viat ja luotettavuusongelmat<\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Considerations\"><\/span>Valmistukseen liittyv\u00e4t seikat<span class=\"ez-toc-section-end\"><\/span><\/h2><p>PCB-valmistajat arvioivat juotosmaskikerroksia CAM-analyysin aikana.<\/p><p>He tarkastelevat:<\/p><ul class=\"wp-block-list\"><li>maskin aukot<\/li>\n\n<li>maskin poisto<\/li>\n\n<li>padon leveydet<\/li>\n\n<li>kohdistustoleranssit<\/li><\/ul><p>Sellaisilla valmistajilla kuin <strong><a href=\"https:\/\/www.topfastpcb.com\/fi\/about\/\">TOPFAST<\/a><\/strong>, suunnittelutiimit tarkistavat yleens\u00e4 juotosmaskin parametrit ennen valmistusta varmistaakseen yhteensopivuuden sek\u00e4 piirilevyn valmistus- ett\u00e4 kokoonpanoprosessien kanssa.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>P\u00e4\u00e4telm\u00e4<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Juotosmaskien suunnittelulla on ratkaiseva merkitys piirilevyjen valmistettavuuden ja kokoonpanon luotettavuuden kannalta.<\/p><p>Noudattamalla k\u00e4yt\u00e4nn\u00f6llisi\u00e4 suunnittelus\u00e4\u00e4nt\u00f6j\u00e4 - kuten asianmukaista maskiv\u00e4li\u00e4, riitt\u00e4v\u00e4\u00e4 padin leveytt\u00e4 ja oikeita tyynyjen m\u00e4\u00e4ritelmi\u00e4 - insin\u00f6\u00f6rit voivat v\u00e4hent\u00e4\u00e4 kokoonpanovirheit\u00e4 ja parantaa tuotannon tuottoa.<\/p><p>Tiivis koordinointi suunnitteluryhmien ja piirilevyvalmistajien v\u00e4lill\u00e4 auttaa my\u00f6s varmistamaan, ett\u00e4 juotosmaskikerrokset vastaavat valmistusvalmiuksia.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"406\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-2.jpg\" alt=\"PCB juotosmaski\" class=\"wp-image-5226\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-2-300x203.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/03\/PCB-Solder-Mask-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCB_Solder_Mask_FAQ\"><\/span>PCB Solder Mask FAQ<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1773133323837\"><strong class=\"schema-faq-question\">K: Mik\u00e4 on juotospeitteen tyhjennys PCB-suunnittelussa?<\/strong> <p class=\"schema-faq-answer\">V: Juotosmaskin v\u00e4lys on kuparialustan reunan ja juotosmaskin aukon v\u00e4linen et\u00e4isyys, joka varmistaa, ett\u00e4 tyynyt pysyv\u00e4t n\u00e4kyviss\u00e4 kokoonpanon aikana.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1773133514435\"><strong class=\"schema-faq-question\">K: Mik\u00e4 on juotosmaskin minimileveys?<\/strong> <p class=\"schema-faq-answer\">V: Useimmat PCB-valmistajat suosittelevat juotosmaskin v\u00e4himm\u00e4isleveydeksi juotospeitteen leveys on <strong>4 miljoonaa<\/strong> est\u00e4\u00e4ksesi maskin rikkoutumisen.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1773133582473\"><strong class=\"schema-faq-question\">K: Mit\u00e4 tapahtuu, jos juotosmaskin aukot ovat liian pienet?<\/strong> <p class=\"schema-faq-answer\">V: Pienet maskiaukot voivat osittain peitt\u00e4\u00e4 tyynyj\u00e4, mik\u00e4 johtaa huonoihin juotosliitoksiin.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1773133596476\"><strong class=\"schema-faq-question\">K: Mit\u00e4 eroa on SMD- ja NSMD-tyynyjen v\u00e4lill\u00e4?<\/strong> <p class=\"schema-faq-answer\">V: SMD-tyynyt m\u00e4\u00e4ritell\u00e4\u00e4n juotosmaskin aukkojen avulla, kun taas NSMD-tyynyt m\u00e4\u00e4ritell\u00e4\u00e4n itse kuparityynyn avulla. NSMD-tyynyj\u00e4 k\u00e4ytet\u00e4\u00e4n yleisesti BGA-komponenteissa.<\/p> <\/div> <\/div><p><\/p>","protected":false},"excerpt":{"rendered":"<p>Juotosmaski on painettujen piirilevyjen pinnalle levitett\u00e4v\u00e4 suojakerros, joka est\u00e4\u00e4 juotosillat ja suojaa kuparij\u00e4lki\u00e4. Oikea juotosmaskin suunnittelu on olennaisen t\u00e4rke\u00e4\u00e4 luotettavan piirilevyn kokoonpanon ja valmistuksen tuoton kannalta. T\u00e4ss\u00e4 artikkelissa selitet\u00e4\u00e4n keskeiset juotosmaskin suunnitteluohjeet, mukaan lukien maskin v\u00e4lys, maskin laajennus, tyynyjen aukot ja yleiset asetteluvirheet. Noudattamalla DFM-s\u00e4\u00e4nt\u00f6j\u00e4 (Design for Manufacturing) insin\u00f6\u00f6rit voivat parantaa kokoonpanon luotettavuutta, v\u00e4hent\u00e4\u00e4 juotosvirheit\u00e4 ja varmistaa yhteensopivuuden tavanomaisten PCB-valmistusprosessien kanssa.<\/p>","protected":false},"author":1,"featured_media":5227,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[108],"tags":[446],"class_list":["post-5223","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb-solder-mask"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB Solder Mask Design Guidelines: Clearance, Expansion and Manufacturing Rules<\/title>\n<meta name=\"description\" content=\"Learn PCB solder mask design guidelines including mask clearance, expansion rules, pad openings, and common DFM 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What is solder mask clearance in PCB design?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Solder mask clearance is the distance between the copper pad edge and the solder mask opening, ensuring pads remain exposed during assembly.\",\"inLanguage\":\"fi\"},\"inLanguage\":\"fi\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133514435\",\"position\":2,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-solder-mask-design-guidelines\/#faq-question-1773133514435\",\"name\":\"Q: What is the minimum solder mask dam width?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Most PCB manufacturers recommend a minimum solder mask dam width of <strong>4 mil<\/strong> to prevent mask 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