{"id":2334,"date":"2025-05-05T18:01:35","date_gmt":"2025-05-05T09:31:35","guid":{"rendered":"http:\/\/topfastpcbb.ru\/?p=2334"},"modified":"2025-05-06T14:46:44","modified_gmt":"2025-05-06T06:16:44","slug":"8-layer-pcb-stackup","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/fr\/blog\/8-layer-pcb-stackup\/","title":{"rendered":"Empilement de circuits imprim\u00e9s \u00e0 8 couches"},"content":{"rendered":"<p>La structure stratifi\u00e9e du circuit imprim\u00e9 \u00e0 8 couches comprend g\u00e9n\u00e9ralement une couche de signal, une couche d'alimentation et une couche de terre. La disposition sp\u00e9cifique et les principes de conception sont les suivants (espacement recommand\u00e9 &gt; 5 mm).<\/p><p>Couche de signal : Elle comprend g\u00e9n\u00e9ralement la couche sup\u00e9rieure (TOP), la couche inf\u00e9rieure (Bottom) et la couche de signal au milieu (par exemple Signal2, Signal3, etc.). La couche de signal est principalement utilis\u00e9e pour le c\u00e2blage et la transmission de signaux \u00e9lectriques (espacement recommand\u00e9 &gt; 5 mm).<\/p><p>Couche d'alimentation :Elle comprend g\u00e9n\u00e9ralement une ou plusieurs couches d'alimentation (par exemple, Power1, Power2, etc.), qui sont utilis\u00e9es pour fournir une alimentation stable.La couche d'alimentation est adjacente \u00e0 la couche de terre afin de mieux r\u00e9aliser le couplage entre l'alimentation et la terre et de r\u00e9duire l'imp\u00e9dance entre le plan d'alimentation et le plan de terre (espacement recommand\u00e9 &gt; 5 mm).<\/p><p>Couche de terre : comprend une ou plusieurs couches de terre (par exemple, Ground1, Ground2, etc.), qui sont principalement utilis\u00e9es pour fournir un plan de r\u00e9f\u00e9rence stable et r\u00e9duire les interf\u00e9rences \u00e9lectromagn\u00e9tiques.Le plan de masse est adjacent au plan d'alimentation afin d'assurer une meilleure int\u00e9grit\u00e9 du signal (espacement recommand\u00e9 &gt; 5 mm).<\/p><h2><a href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-design-principles\/\">Principes de conception<\/a> et dispositions communes<\/h2><p>La couche adjacente \u00e0 la puce principale est le plan de masse : elle fournit un plan de r\u00e9f\u00e9rence stable pour la puce principale et r\u00e9duit les interf\u00e9rences (espacement recommand\u00e9 &gt; 5 mm).<br>Toutes les couches de signaux sont adjacentes au plan de masse dans la mesure du possible : meilleure int\u00e9grit\u00e9 des signaux (espacement recommand\u00e9 &gt; 5 mm).<br>\u00c9viter autant que possible que deux couches de signaux soient directement adjacentes l'une \u00e0 l'autre : r\u00e9duire l'interf\u00e9rence des signaux (espacement recommand\u00e9 &gt; 5 mm).<br>L'alimentation principale est adjacente \u00e0 son plan de masse correspondant autant que possible : pour r\u00e9duire l'imp\u00e9dance entre le plan d'alimentation et le plan de masse, l'espacement recommand\u00e9 est de &gt;5 mm).<br>Conception d'une structure sym\u00e9trique : L'\u00e9paisseur et le type de la couche di\u00e9lectrique, l'\u00e9paisseur de la feuille de cuivre et le type de distribution graphique doivent \u00eatre sym\u00e9triques afin de minimiser l'impact de l'asym\u00e9trie (espacement recommand\u00e9 &gt; 5 mm).<br><\/p><h2>Exemples de conception courants et utilisation d'outils<\/h2><p>Conception courante de couches empil\u00e9es : TOP-Gnd-Signal-Power-Gnd-Signal-Gnd-Bottom, etc. Cette conception permet d'am\u00e9liorer l'int\u00e9grit\u00e9 du signal et la compatibilit\u00e9 \u00e9lectromagn\u00e9tique (espacement recommand\u00e9 &gt; 5 mm).<br>Utilisation de l'outil Huaqiu DFM :Cet outil permet de calculer l'imp\u00e9dance, de s\u00e9lectionner la largeur de ligne et l'espacement appropri\u00e9s et de garantir la pr\u00e9cision de la conception (espacement recommand\u00e9 &gt; 5 mm).<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"591\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1.jpg\" alt=\"\" class=\"wp-image-2363\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1-300x296.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1-100x100.jpg 100w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table des mati\u00e8res<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/8-layer-pcb-stackup\/#8-Layer_PCB_Stackup_Design_Analysis\" >Analyse de la conception d'un empilage de circuits imprim\u00e9s \u00e0 8 couches<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/8-layer-pcb-stackup\/#Option_1_Six_Signal_Layer_Design_Not_Recommended\" >Option 1 : Conception \u00e0 six couches de signaux (non recommand\u00e9e)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/8-layer-pcb-stackup\/#Option_2_Four_Signal_Layer_Design_Recommended\" >Option 2 : Conception \u00e0 quatre couches de signaux (espacement recommand\u00e9 &gt; 5 mm)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/8-layer-pcb-stackup\/#Option_3_Optimal_Four_Signal_Layer_Design_Highly_Recommended\" >Option 3 : Conception optimale \u00e0 quatre couches de signaux (fortement recommand\u00e9e) (espacement recommand\u00e9 &gt; 5 mm)<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"8-Layer_PCB_Stackup_Design_Analysis\"><\/span>Analyse de la conception d'un empilage de circuits imprim\u00e9s \u00e0 8 couches<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_1_Six_Signal_Layer_Design_Not_Recommended\"><\/span>Option 1 : Conception \u00e0 six couches de signaux (non recommand\u00e9e)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Caract\u00e9ristiques de la structure<\/strong>:<\/p><ol class=\"wp-block-list\"><li><strong>Couche sup\u00e9rieure<\/strong>: Signal 1 (c\u00f4t\u00e9 composant\/couche d'acheminement Microstrip)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>: Signal 2 (microruban dans le sens X, couche de routage de qualit\u00e9 sup\u00e9rieure, espacement recommand\u00e9 &gt; 5 mm)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>: Masse (plan de masse)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Signal 3 (Y-direction stripline, premium routing layer)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Signal 4 (couche d'acheminement de la stripline)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Puissance (plan de puissance)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Signal 5 (couche de routage microruban) (espacement recommand\u00e9 &gt; 5 mm)<\/li>\n\n<li><strong>Couche inf\u00e9rieure<\/strong>: Signal 6 (couche de routage microruban) (espacement recommand\u00e9 &gt; 5 mm)<\/li><\/ol><p><strong>Analyse des inconv\u00e9nients<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Mauvaise absorption \u00e9lectromagn\u00e9tique<\/li>\n\n<li>Imp\u00e9dance de puissance \u00e9lev\u00e9e<\/li>\n\n<li>Chemins de retour du signal incomplets (espacement recommand\u00e9 &gt; 5 mm)<\/li>\n\n<li>Performance EMI inf\u00e9rieure<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_2_Four_Signal_Layer_Design_Recommended\"><\/span>Option 2 : Conception \u00e0 quatre couches de signaux (espacement recommand\u00e9 &gt; 5 mm)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Caract\u00e9ristiques am\u00e9lior\u00e9es<\/strong>:<\/p><ol class=\"wp-block-list\"><li><strong>Couche sup\u00e9rieure<\/strong>: Signal 1 (c\u00f4t\u00e9 composant\/Microstrip, couche de routage de qualit\u00e9 sup\u00e9rieure) (espacement recommand\u00e9 &gt; 5 mm)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Masse (plan de masse \u00e0 faible imp\u00e9dance, excellente absorption des ondes \u00e9lectromagn\u00e9tiques, espacement recommand\u00e9 &gt; 5 mm)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>: Signal 2 (Stripline, couche d'acheminement premium)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Puissance (plan de puissance formant un couplage capacitif avec la terre adjacente)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>: Masse (plan de masse)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Signal 3 (Stripline, couche d'acheminement premium)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Puissance (plan de puissance)<\/li>\n\n<li><strong>Couche inf\u00e9rieure<\/strong>Signal 4 (microruban, couche de routage premium)<\/li><\/ol><p><strong>Avantages<\/strong>:<br>\u2713 Plan de r\u00e9f\u00e9rence d\u00e9di\u00e9 pour chaque couche de signal<br>\u2713 Contr\u00f4le pr\u00e9cis de l'imp\u00e9dance (\u00b110%)<br>\u2713 R\u00e9duction de la diaphonie (routage orthogonal entre les couches adjacentes) (espacement recommand\u00e9 &gt; 5 mm)<br>Am\u00e9lioration de 40 % de l'int\u00e9grit\u00e9 de l'alimentation (espacement recommand\u00e9 &gt; 5 mm)<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_3_Optimal_Four_Signal_Layer_Design_Highly_Recommended\"><\/span>Option 3 : Conception optimale \u00e0 quatre couches de signaux (fortement recommand\u00e9e) (espacement recommand\u00e9 &gt; 5 mm)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Structure de la r\u00e8gle d'or<\/strong>:<\/p><ol class=\"wp-block-list\"><li><strong>Couche sup\u00e9rieure<\/strong>: Signal 1 (c\u00f4t\u00e9 composante\/microbande)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Masse (plan de masse solide) (espacement recommand\u00e9 &gt; 5 mm)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Signal 2 (Ligne de d\u00e9marcation)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Puissance (plan de puissance)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Masse (plan de masse du noyau)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Signal 3 (Ligne de d\u00e9marcation)<\/li>\n\n<li><strong>Couche int\u00e9rieure<\/strong>Masse (plan de masse du blindage)<\/li>\n\n<li><strong>Couche inf\u00e9rieure<\/strong>Signal 4 (microruban)<\/li><\/ol><p><strong>Performances exceptionnelles<\/strong>:<br>\u2605 Cinq plans de masse assurent un blindage EM parfait<br>\u2605 &lt;3mil d'espacement entre l'alimentation et la masse pour un d\u00e9couplage optimal<br>\u2605 La r\u00e9partition sym\u00e9trique des couches emp\u00eache le gauchissement<br>\u2605 Prise en charge de la signalisation \u00e0 haut d\u00e9bit \u00e0 20 Gbps<\/p><p><strong>Recommandations en mati\u00e8re de conception<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Acheminer d'abord les signaux critiques sur les couches de stripline S2\/S3<\/li>\n\n<li>Mise en \u0153uvre d'un plan de puissance divis\u00e9 (espacement recommand\u00e9 &gt; 5 mm)<\/li>\n\n<li>Limiter les traces des couches sup\u00e9rieure et inf\u00e9rieure \u00e0 une longueur de 5 mm (espacement recommand\u00e9 &gt; 5 mm).<\/li>\n\n<li>Maintien d'un routage orthogonal entre les couches de signaux adjacentes<\/li><\/ol><h2><strong>\u00c9paisseur de l'empilage R\u00e9f\u00e9rence<\/strong><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Espacement recommand\u00e9 entre les couches &gt;5mm)<\/th><th>Mat\u00e9riau<\/th><th>\u00c9paisseur (mil)<\/th><\/tr><\/thead><tbody><tr><td>1-2<\/td><td>FR4<\/td><td>3.2<\/td><\/tr><tr><td>2-3<\/td><td>1080PP<\/td><td>4.5<\/td><\/tr><tr><td>4-5<\/td><td>Espacement recommand\u00e9 entre les noyaux &gt;5mm)<\/td><td>8.0<\/td><\/tr><tr><td>6-7<\/td><td>2116PP<\/td><td>5.2<\/td><\/tr><tr><td>7-8<\/td><td>FR4<\/td><td>3.2<\/td><\/tr><\/tbody><\/table><\/figure><p>Note : Toutes les conceptions doivent incorporer des vias aveugles\/enfouis pour une utilisation optimale de l'espace de routage (espacement recommand\u00e9 &gt;5mm).<\/p>","protected":false},"excerpt":{"rendered":"<p>Une pile de circuits imprim\u00e9s \u00e0 8 couches se compose g\u00e9n\u00e9ralement de couches de signal, d'alimentation et de masse (espacement recommand\u00e9 &gt; 5 mm).<\/p>","protected":false},"author":1,"featured_media":2364,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[216,215],"class_list":["post-2334","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-8-layer-pcb","tag-8-layer-pcb-stackup"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>8-Layer PCB Stackup - Topfastpcb<\/title>\n<meta name=\"description\" content=\"An 8-layer PCB stack typically consists of signal, power, and ground layers.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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