{"id":3689,"date":"2025-07-26T08:19:00","date_gmt":"2025-07-26T00:19:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=3689"},"modified":"2025-07-25T11:20:00","modified_gmt":"2025-07-25T03:20:00","slug":"what-is-the-purpose-of-unfilled-solder-pads-on-a-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/fr\/blog\/what-is-the-purpose-of-unfilled-solder-pads-on-a-pcb\/","title":{"rendered":"\u00c0 quoi servent les pastilles de soudure non remplies sur un circuit imprim\u00e9 ?"},"content":{"rendered":"<p>Lors de la fabrication <a href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/printed-circuit-board-pcb\/\">PCB<\/a> Dans les circuits imprim\u00e9s, les connexions \u00e9lectriques entre les composants \u00e9lectroniques et le circuit imprim\u00e9 sont r\u00e9alis\u00e9es en posant le c\u00e2blage sur la surface du circuit imprim\u00e9, en installant les composants \u00e9lectroniques et en les soudant en place. De bonnes connexions et la solidit\u00e9 des joints de soudure sont essentielles au fonctionnement normal des cartes de circuits imprim\u00e9s.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-solder-joint-1.jpg\" alt=\"Joint de soudure du circuit imprim\u00e9\" class=\"wp-image-3690\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-solder-joint-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-solder-joint-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-solder-joint-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table des mati\u00e8res<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/what-is-the-purpose-of-unfilled-solder-pads-on-a-pcb\/#1_Design_Purposes_of_Unfilled_Solder_Joints\" >1. Objectifs de la conception des joints de brasure non remplis<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/what-is-the-purpose-of-unfilled-solder-pads-on-a-pcb\/#2_Electrical_Performance_Impact_Mechanisms\" >2. M\u00e9canismes d'impact sur la performance \u00e9lectrique<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/what-is-the-purpose-of-unfilled-solder-pads-on-a-pcb\/#3_Solder_Joint_Quality_Inspection_Techniques\" >3. Techniques d'inspection de la qualit\u00e9 des joints de soudure<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/what-is-the-purpose-of-unfilled-solder-pads-on-a-pcb\/#4_Key_Process_Control_Parameters\" >4. Param\u00e8tres cl\u00e9s de contr\u00f4le du processus<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/what-is-the-purpose-of-unfilled-solder-pads-on-a-pcb\/#Common_Issues_Solutions\" >Probl\u00e8mes courants et solutions<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Design_Purposes_of_Unfilled_Solder_Joints\"><\/span>1. Objectifs de la conception des joints de brasure non remplis<span class=\"ez-toc-section-end\"><\/span><\/h2><ul class=\"wp-block-list\"><li><strong>Fonctionnalit\u00e9 du point d'essai<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>Test \u00e9lectrique : Les zones de cuivre expos\u00e9es servent de points de test pour les oscilloscopes, les testeurs \u00e0 sonde volante et d'autres appareils similaires.<\/li>\n\n<li>V\u00e9rification du processus : Post-refusion\/ soudure \u00e0 la vague, des points de test permettent de valider les param\u00e8tres du processus.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Exigences particuli\u00e8res en mati\u00e8re de conception<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>Dissipation de la chaleur : Le cuivre expos\u00e9 dans les traces de courant \u00e9lev\u00e9 am\u00e9liore la performance thermique (n\u00e9cessite des calculs de capacit\u00e9 de transport de courant).<\/li>\n\n<li>D\u00e9bogage RF : Points de test d'imp\u00e9dance non masqu\u00e9s pour les circuits haute fr\u00e9quence (plaquage or recommand\u00e9).<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Electrical_Performance_Impact_Mechanisms\"><\/span>2. M\u00e9canismes d'impact sur la performance \u00e9lectrique<span class=\"ez-toc-section-end\"><\/span><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Dimension de l'impact<\/th><th>M\u00e9canisme<\/th><th>Sc\u00e9nario type<\/th><\/tr><\/thead><tbody><tr><td>R\u00e9sistance des contacts<\/td><td>Les couches d'oxyde augmentent l'imp\u00e9dance de 3 \u00e0 5 fois<\/td><td>Chute de tension excessive dans les circuits d'alimentation<\/td><\/tr><tr><td>Perte de signal \u00e0 haute fr\u00e9quence<\/td><td>Les discordances d'imp\u00e9dance provoquent une perte de retour (&gt;3dB)<\/td><td>Augmentation des taux d'erreurs binaires dans les modules 5G<\/td><\/tr><tr><td>Fiabilit\u00e9 thermique<\/td><td>La r\u00e9sistance thermique plus \u00e9lev\u00e9e augmente les temp\u00e9ratures de jonction de 10 \u00e0 15\u00b0C<\/td><td>D\u00e9faillance pr\u00e9matur\u00e9e des MOSFET de puissance<\/td><\/tr><\/tbody><\/table><\/figure><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-solder-joint-3.jpg\" alt=\"Joint de soudure du circuit imprim\u00e9\" class=\"wp-image-3691\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-solder-joint-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-solder-joint-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-solder-joint-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Solder_Joint_Quality_Inspection_Techniques\"><\/span>3. Techniques d'inspection de la qualit\u00e9 des joints de soudure<span class=\"ez-toc-section-end\"><\/span><\/h2><ul class=\"wp-block-list\"><li><strong>Solutions de qualit\u00e9 industrielle<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>3D SPI : Mesure de l'\u00e9paisseur de la p\u00e2te \u00e0 braser (pr\u00e9cision de \u00b15\u03bcm).<\/li>\n\n<li>Rayon X microfocus : D\u00e9tecte les vides BGA de 0,2\u03bcm (taux de d\u00e9tection de 99,7%).<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Des solutions rentables<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>P\u00e9n\u00e9tration du colorant rouge : D\u00e9tection de fissures \u00e0 faible co\u00fbt (\u00e9conomies 80%)<\/li>\n\n<li>Imagerie thermique : Identifie les joints froids gr\u00e2ce \u00e0 des anomalies de temp\u00e9rature<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Key_Process_Control_Parameters\"><\/span>4. Param\u00e8tres cl\u00e9s de contr\u00f4le du processus<span class=\"ez-toc-section-end\"><\/span><\/h2><p><strong>Profil de soudage par refusion (exemple de proc\u00e9d\u00e9 sans plomb)<\/strong><\/p><ul class=\"wp-block-list\"><li>Pr\u00e9chauffage : 150\u00b0C (taux de rampe de 1-2\u00b0C\/s)<\/li>\n\n<li>Temps de trempage : 90 secondes (stabilisation \u00e0 \u00b15\u00b0C)<\/li>\n\n<li>Temp\u00e9rature de pointe : 245\u00b0C (dur\u00e9e de 30 \u00e0 45 secondes)<\/li>\n\n<li>Taux de refroidissement : 3\u00b0C\/s (\u00e9vite les chocs thermiques)<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-solder-joint-2.jpg\" alt=\"Joint de soudure du circuit imprim\u00e9\" class=\"wp-image-3692\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-solder-joint-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-solder-joint-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-solder-joint-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_Issues_Solutions\"><\/span>Probl\u00e8mes courants et solutions<span class=\"ez-toc-section-end\"><\/span><\/h2><p><strong>Q1 : Probl\u00e8mes d'int\u00e9grit\u00e9 du signal dans les circuits \u00e0 haute fr\u00e9quence - des joints de soudure non remplis suspect\u00e9s ?<\/strong><br>A1 : Utiliser la r\u00e9flectom\u00e9trie dans le domaine temporel (TDR) pour localiser les discontinuit\u00e9s d'imp\u00e9dance, puis v\u00e9rifier par radiographie. Recommandations :<\/p><ul class=\"wp-block-list\"><li>Utiliser des alliages de soudure \u00e0 faible perte (par exemple, SnAgCu).<\/li>\n\n<li>Conception de points de test avec compensation d'imp\u00e9dance<\/li><\/ul><p><strong>Q2 : Comment r\u00e9soudre rapidement le probl\u00e8me des joints de soudure froids dans la production de masse ?<\/strong><br>A2 : Mettre en \u0153uvre une m\u00e9thode de contr\u00f4le en trois \u00e9tapes :<\/p><ol class=\"wp-block-list\"><li>Optimisation du pochoir : Augmentation de la taille de l'ouverture de 5%<\/li>\n\n<li>Atmosph\u00e8re d'azote : Maintenir les niveaux d'O\u2082 &lt;1000ppm<\/li>\n\n<li>AOI en ligne : ajout d'une inspection par vision lat\u00e9rale<\/li><\/ol><p><strong>Q3 : Oxydation du cuivre expos\u00e9 dans des environnements humides, entra\u00eenant un mauvais contact ?<\/strong><br>A3 : Strat\u00e9gie de protection \u00e0 trois niveaux :<\/p><ul class=\"wp-block-list\"><li>Primaire : Nickel dor\u00e9 par immersion sans \u00e9lectrolyse (ENIG)<\/li>\n\n<li>Secondaire : rev\u00eatement local conforme (r\u00e9sine durcissant aux UV)<\/li>\n\n<li>Tertiaire : Conception \u00e9tanche conforme \u00e0 la norme IP67<\/li><\/ul><p><\/p>","protected":false},"excerpt":{"rendered":"<p>Les objectifs de conception, les impacts sur les performances \u00e9lectriques et les m\u00e9thodes d'inspection des plages de soudure non remplies (zones de cuivre expos\u00e9es) sur les circuits imprim\u00e9s, couvrant des points de connaissance cl\u00e9s tels que les fonctions des points de test, les risques pour l'int\u00e9grit\u00e9 du signal et la technologie d'inspection par rayons X, sont conformes aux normes industrielles telles que la norme IPC-610 et fournissent une assistance pour la conception des circuits imprim\u00e9s et les processus de fabrication.<\/p>","protected":false},"author":1,"featured_media":3693,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[109],"tags":[331],"class_list":["post-3689","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-faq","tag-pcb-solder-joint"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>What is the purpose of unfilled solder pads on a PCB? 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