{"id":4135,"date":"2025-08-20T08:34:00","date_gmt":"2025-08-20T00:34:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4135"},"modified":"2025-08-19T15:47:31","modified_gmt":"2025-08-19T07:47:31","slug":"pcb-hasl-and-lead-free-hasl-processes","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","title":{"rendered":"Proc\u00e9d\u00e9s HASL pour PCB et HASL sans plomb"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table des mati\u00e8res<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#HASL_process\" >Proc\u00e9d\u00e9 HASL<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#11_Differences_between_HASL_and_lead-free_HASL\" >1.1 Diff\u00e9rences entre HASL et HASL sans plomb<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#12_Core_HASL_Process_Flow\" >1.2 Flux du processus HASL de base<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#121_Pre-Treatment_Stage\" >1.2.1 Phase de pr\u00e9traitement<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#122_Flux_Application\" >1.2.2 Application du flux<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#123_Hot_Air_Leveling_Key_Steps\" >1.2.3 Etapes cl\u00e9s du nivellement \u00e0 air chaud<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#124_Quality_Inspection\" >1.2.4 Contr\u00f4le de la qualit\u00e9<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#13_Process_Advantages_and_Limitations\" >1.3 Avantages et limites du processus<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Advantages\" >Avantages<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Limitations\" >Limites<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#ENIG_Electroless_Nickel_Immersion_Gold_Process\" >Proc\u00e9d\u00e9 ENIG (Electroless Nickel Immersion Gold)<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#21_Process_Principles\" >2.1 Principes du processus<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#22_Advantages\" >2.2 Avantages<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#23_Challenges\" >2.3 Les d\u00e9fis<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#OSP_Organic_Solderability_Preservative\" >OSP (conservateur de soudabilit\u00e9 organique)<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#31_Process_Principles\" >3.1 Principes du processus<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#32_Advantages\" >3.2 Avantages<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#33_Limitations\" >3.3 Limites<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Process_Selection_Guide\" >Guide de s\u00e9lection des processus<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#41_Comparison\" >4.1 Comparaison<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#42_Recommendations\" >4.2 Recommandations<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#43_Topfast_Capabilities\" >4.3 Capacit\u00e9s Topfast<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"HASL_process\"><\/span>Proc\u00e9d\u00e9 HASL<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Le proc\u00e9d\u00e9 HASL (Hot Air Solder Leveling) est l'un des proc\u00e9d\u00e9s de traitement de surface les plus classiques et les plus rentables dans la fabrication des circuits imprim\u00e9s et joue un r\u00f4le important dans l'industrie de l'\u00e9lectronique. Ce proc\u00e9d\u00e9 consiste \u00e0 recouvrir la surface du cuivre d'une couche d'alliage d'\u00e9tain et de plomb afin d'assurer des performances de soudure fiables et une protection contre l'oxydation des circuits imprim\u00e9s.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1.jpg\" alt=\"Proc\u00e9d\u00e9 HASL\" class=\"wp-image-4137\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"11_Differences_between_HASL_and_lead-free_HASL\"><\/span>1.1 Diff\u00e9rences entre HASL et HASL sans plomb<span class=\"ez-toc-section-end\"><\/span><\/h3><p>L'HASL (Hot Air Solder Leveling) est l'une des technologies de traitement de surface les plus classiques et les plus rentables du march\u00e9. <a href=\"https:\/\/www.topfastpcb.com\/fr\/\">Fabrication de circuits imprim\u00e9s<\/a>. Ce proc\u00e9d\u00e9 consiste \u00e0 recouvrir les surfaces de cuivre d'une couche d'alliage d'\u00e9tain et de plomb afin de garantir une soudabilit\u00e9 et une r\u00e9sistance \u00e0 l'oxydation fiables. Les exigences environnementales \u00e9tant de plus en plus strictes, le proc\u00e9d\u00e9 HASL sans plomb est devenu la norme dans l'industrie.<\/p><p><strong>Diff\u00e9rences de composition des mat\u00e9riaux<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Le HASL traditionnel utilise un alliage Sn63\/Pb37 (63 % d'\u00e9tain + 37 % de plomb), point de fusion : 183 \u00b0C.<\/li>\n\n<li>L'HASL sans plomb est principalement utilis\u00e9 :<\/li>\n\n<li>SAC305 (96,5 % d'\u00e9tain + 3 % d'argent + 0,5 % de cuivre), point de fusion : 217-220 \u00b0C<\/li>\n\n<li>SnCu0,7 (99,3 % d'\u00e9tain + 0,7 % de cuivre), point de fusion : 227 \u00b0C<\/li>\n\n<li>\u00c9tain pur (Sn100), point de fusion : 232 \u00b0C<\/li><\/ul><p><strong>Comparaison des caract\u00e9ristiques du processus<\/strong>:<\/p><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Propri\u00e9t\u00e9<\/th><th>HASL plomb\u00e9<\/th><th>HASL sans plomb<\/th><\/tr><\/thead><tbody><tr><td>Point de fusion<\/td><td>183 \u00b0C<\/td><td>217-232 \u00b0C<\/td><\/tr><tr><td>Temp\u00e9rature du pot de soudure<\/td><td>200-210 \u00b0C<\/td><td>240-255 \u00b0C<\/td><\/tr><tr><td>Finition de la surface<\/td><td>Lumineux<\/td><td>Relativement terne<\/td><\/tr><tr><td>R\u00e9sistance m\u00e9canique<\/td><td>Bonne ductilit\u00e9 (haute r\u00e9sistance aux chocs)<\/td><td>Dur mais fragile<\/td><\/tr><tr><td>Mouillabilit\u00e9<\/td><td>Excellent (angle de contact &lt; 30\u00b0)<\/td><td>Bon (angle de contact 35-45\u00b0)<\/td><\/tr><tr><td>Conformit\u00e9 environnementale<\/td><td>Contient du plomb (37%)<\/td><td>Teneur en plomb &lt;0,1% (conforme \u00e0 la directive RoHS)<\/td><\/tr><tr><td>Co\u00fbt<\/td><td>Plus bas<\/td><td>15-20% de plus<\/td><\/tr><tr><td>Applicabilit\u00e9<\/td><td>Usage g\u00e9n\u00e9ral<\/td><td>N\u00e9cessite des temp\u00e9ratures de soudure plus \u00e9lev\u00e9es<\/td><\/tr><\/tbody><\/table><\/figure><p><strong>Diff\u00e9rences de performances pratiques<\/strong>:<\/p><ul class=\"wp-block-list\"><li><strong>Soudabilit\u00e9<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>L'HASL au plomb offre une meilleure activit\u00e9 de soudure avec un temps de mouillage plus court (1-2 sec).<\/li>\n\n<li>L'HASL sans plomb n\u00e9cessite un flux plus puissant et un contr\u00f4le plus strict de la temp\u00e9rature.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Fiabilit\u00e9<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Les joints de soudure au plomb pr\u00e9sentent une meilleure r\u00e9sistance \u00e0 la fatigue thermique (plus de cycles de temp\u00e9rature).<\/li>\n\n<li>Les joints de soudure sans plomb conservent une plus grande r\u00e9sistance m\u00e9canique apr\u00e8s un vieillissement \u00e0 long terme.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Fen\u00eatre de processus<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Le HASL au plomb offre une plage de temp\u00e9rature plus large (\u00b110 \u00b0C).<\/li>\n\n<li>Le HASL sans plomb n\u00e9cessite un contr\u00f4le plus strict de la temp\u00e9rature (\u00b13 \u00b0C).<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Conseil professionnel : Topfast optimise les param\u00e8tres HASL sans plomb pour obtenir un rendement de soudure de 99,5 % tout en respectant les normes IPC-6012 Classe 3.<\/p><\/blockquote><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"12_Core_HASL_Process_Flow\"><\/span>1.2 Flux du processus HASL de base<span class=\"ez-toc-section-end\"><\/span><\/h3><p>En tant que fabricant professionnel de circuits imprim\u00e9s, Topfast utilise des lignes de production HASL enti\u00e8rement automatis\u00e9es avec des processus standardis\u00e9s stricts :<\/p><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"121_Pre-Treatment_Stage\"><\/span>1.2.1 Phase de pr\u00e9traitement<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Nettoyage chimique<\/strong>:<\/li>\n\n<li>Un nettoyant acide (pH 2-3) \u00e9limine les oxydes de cuivre.<\/li>\n\n<li>Contr\u00f4le de la temp\u00e9rature : 40-50 \u00b0C, dur\u00e9e : 2-3 min<\/li>\n\n<li>La microgravure garantit une rugosit\u00e9 de surface Ra de 0,3 \u00e0 0,5 \u03bcm.<\/li>\n\n<li><strong>Rin\u00e7age<\/strong>:<\/li>\n\n<li>Rin\u00e7age \u00e0 contre-courant en trois \u00e9tapes (r\u00e9sistivit\u00e9 de l'eau d\u00e9ionis\u00e9e &gt; 15 M\u03a9\u00b7cm)<\/li>\n\n<li>S\u00e9chage \u00e0 l'air chaud (60-80 \u00b0C)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"122_Flux_Application\"><\/span>1.2.2 Application du flux<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>M\u00e9thodes d'application :<\/li>\n\n<li>Mousse (traditionnelle) : Epaisseur du flux 0,01-0,03mm<\/li>\n\n<li>Pulv\u00e9risation (avanc\u00e9e) :Plus uniforme, 30% de consommation de flux en moins<\/li>\n\n<li>Types de flux :<\/li>\n\n<li>A base de colophane non nettoy\u00e9e (ROH)<\/li>\n\n<li>Teneur en solides : 8-12%, indice d'acidit\u00e9 : 35-45mgKOH\/g<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"123_Hot_Air_Leveling_Key_Steps\"><\/span>1.2.3 Etapes cl\u00e9s du nivellement \u00e0 air chaud<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Pr\u00e9chauffage<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Au plomb : 130-140 \u00b0C<\/li>\n\n<li>Sans plomb : 150-160 \u00b0C<\/li>\n\n<li>Dur\u00e9e : 60-90 sec<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Trempage de la soudure<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Temp\u00e9rature du pot de soudure :<ul class=\"wp-block-list\"><li>Au plomb : 210 \u00b1 5 \u00b0C<\/li>\n\n<li>Sans plomb : 250 \u00b1 5 \u00b0C<\/li><\/ul><\/li>\n\n<li>Temps de s\u00e9jour : 2 \u00e0 4 secondes (pr\u00e9cision de \u00b10,5 seconde)<\/li>\n\n<li>Profondeur d'immersion : 3-5 mm<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Nivellement \u00e0 l'air chaud<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Param\u00e8tres de la lame d'air :<ul class=\"wp-block-list\"><li>Pression : 0,3-0,5MPa<\/li>\n\n<li>Temp\u00e9rature : 300-350 \u00b0C<\/li>\n\n<li>Angle : inclinaison vers le bas de 4\u00b0<\/li>\n\n<li>Vitesse de l'air : 20-30m\/s<\/li><\/ul><\/li>\n\n<li>Temps de traitement : 1-2 sec<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Refroidissement<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Refroidissement par air forc\u00e9 (vitesse : 2-3 \u00b0C\/sec)<\/li>\n\n<li>Temp\u00e9rature finale &lt; 60 \u00b0C<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"124_Quality_Inspection\"><\/span>1.2.4 Contr\u00f4le de la qualit\u00e9<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>AOI en ligne (couverture \u00e0 100 %) :<\/li>\n\n<li>Contr\u00f4le de l'\u00e9paisseur de la soudure (1-40 \u03bcm)<\/li>\n\n<li>D\u00e9tection des d\u00e9fauts de surface (billes de soudure, cuivre expos\u00e9, etc.)<\/li>\n\n<li>Tests d'\u00e9chantillonnage :<\/li>\n\n<li>Test de soudabilit\u00e9 (245 \u00b0C, 3 sec)<\/li>\n\n<li>Test d'adh\u00e9sion (m\u00e9thode du ruban)<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Perc\u00e9e technologique : Le proc\u00e9d\u00e9 HASL sans plomb prot\u00e9g\u00e9 par l'azote de Topfast r\u00e9duit l'oxydation de la soudure de 5 % \u00e0 1,5 %, ce qui am\u00e9liore consid\u00e9rablement le rendement de la soudure.<\/p><\/blockquote><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"13_Process_Advantages_and_Limitations\"><\/span>1.3 Avantages et limites du processus<span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advantages\"><\/span>Avantages<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Rapport co\u00fbt-efficacit\u00e9<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Faible investissement en \u00e9quipement (~1\/3 de l'ENIG)<\/li>\n\n<li>\u00c9conomies significatives sur le co\u00fbt des mat\u00e9riaux (40-60% moins cher que l'ENIG)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Fiabilit\u00e9 des soudures<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>R\u00e9siste \u00e0 plus de 3 cycles de refusion (pic \u00e0 260 \u00b0C)<\/li>\n\n<li>R\u00e9sistance \u00e9lev\u00e9e \u00e0 la traction des joints (avec plomb : 50-60MPa ; sans plomb : 55-65MPa)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Large applicabilit\u00e9<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Convient \u00e0 diff\u00e9rentes tailles de tampons (pas de 0,5 mm minimum)<\/li>\n\n<li>Compatible avec les proc\u00e9d\u00e9s de trous traversants et SMT<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Performances de stockage<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Dur\u00e9e de conservation de 12 mois (HR &lt;60%)<\/li>\n\n<li>Excellente r\u00e9sistance \u00e0 l'oxydation (test au brouillard salin de 48 heures)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Limitations\"><\/span>Limites<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Restrictions en hauteur<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Ne convient pas aux composants BGA\/QFN au pas de 0,4 mm<\/li>\n\n<li>Risque de pontage de soudure pour les conceptions \u00e0 pas fin<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Questions de plan\u00e9it\u00e9<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Irr\u00e9gularit\u00e9 de surface : 15-25 \u03bcm (affecte l'assemblage HDI)<\/li>\n\n<li>Variation d'\u00e9paisseur pouvant atteindre 20 \u03bcm entre les grands et les petits tampons<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Stress thermique<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Les proc\u00e9d\u00e9s \u00e0 haute temp\u00e9rature (en particulier sans plomb) peuvent affecter les mat\u00e9riaux \u00e0 haute Tg.<\/li>\n\n<li>Risque de gauchissement plus \u00e9lev\u00e9 pour les panneaux minces (&lt;0.8mm)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Consid\u00e9rations environnementales<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>HASL plomb\u00e9 non conforme \u00e0 la directive RoHS<\/li>\n\n<li>Le HASL sans plomb consomme plus d'\u00e9nergie (temp\u00e9ratures sup\u00e9rieures de 30 \u00e0 50 \u00b0C).<\/li><\/ul><p>Besoin d'un soutien professionnel de HASL ? <a href=\"https:\/\/www.topfastpcb.com\/fr\/contact\/\">Contacter les ing\u00e9nieurs de Topfast<\/a> pour des solutions personnalis\u00e9es<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3.jpg\" alt=\"Proc\u00e9d\u00e9 HASL\" class=\"wp-image-4139\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"ENIG_Electroless_Nickel_Immersion_Gold_Process\"><\/span>Proc\u00e9d\u00e9 ENIG (Electroless Nickel Immersion Gold)<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"21_Process_Principles\"><\/span>2.1 Principes du processus<span class=\"ez-toc-section-end\"><\/span><\/h3><p>ENIG forme une couche protectrice composite par nickelage chimique et dorure par immersion :<\/p><ul class=\"wp-block-list\"><li>Couche de nickel : 3-6 \u03bcm (7-9 % de phosphore)<\/li>\n\n<li>Couche d'or : 0,05-0,1 \u03bcm<\/li><\/ul><p><strong>Param\u00e8tres cl\u00e9s<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Temp\u00e9rature du bain de nickel : 85-90 \u00b0C<\/li>\n\n<li>Vitesse de placage : 15-20 \u03bcm\/h<\/li>\n\n<li>Temp\u00e9rature du bain d'or : 80-85 \u00b0C<\/li>\n\n<li>pH : Bain de nickel 4,5-5,0, bain d'or 5,5-6,5<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"22_Advantages\"><\/span>2.2 Avantages<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Superbe plan\u00e9it\u00e9<\/strong> (Ra&lt;0,1 \u03bcm) :<\/li><\/ul><ul class=\"wp-block-list\"><li>Id\u00e9al pour les BGA\/CSP au pas de 0,3 mm<\/li>\n\n<li>Coplanarit\u00e9 des patins &lt; 5 \u03bcm\/m<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>R\u00e9sistance \u00e0 l'oxydation<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Dur\u00e9e de conservation de 18 mois<\/li>\n\n<li>Certifi\u00e9 J-STD-003B Classe 3<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Conductivit\u00e9 \u00e9lectrique<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>R\u00e9sistivit\u00e9 de l'or : 2,44 \u03bc\u03a9\u00b7cm<\/li>\n\n<li>R\u00e9sistance de contact &lt; 10 m\u03a9<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"23_Challenges\"><\/span>2.3 Les d\u00e9fis<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Probl\u00e8me du tampon noir<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Causes : Surmordan\u00e7age du nickel ou teneur anormale en phosphore<\/li>\n\n<li>Solution :La passivation brevet\u00e9e de Topfast r\u00e9duit le taux de black pad \u00e0 0,1%.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Facteurs de co\u00fbt<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Co\u00fbts \u00e9lev\u00e9s des mat\u00e9riaux (volatilit\u00e9 du prix de l'or)<\/li>\n\n<li>Processus complexe (8-10 \u00e9tapes)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>R\u00e9sistance du joint de soudure<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Couche IMC Ni-Au fragile<\/li>\n\n<li>R\u00e9sistance \u00e0 la traction ~40-45MPa<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>L'ENIG de Topfast atteint une uniformit\u00e9 d'\u00e9paisseur de \u00b110 %, d\u00e9passant ainsi les normes industrielles de \u00b115 %.<\/p><\/blockquote><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"OSP_Organic_Solderability_Preservative\"><\/span>OSP (conservateur de soudabilit\u00e9 organique) <span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"31_Process_Principles\"><\/span>3.1 Principes du processus<span class=\"ez-toc-section-end\"><\/span><\/h3><p>L'OSP forme un film protecteur organique de 0,2 \u00e0 0,5 \u03bcm sur le cuivre nu, contenant :<\/p><ul class=\"wp-block-list\"><li>Compos\u00e9s du benzotriazole<\/li>\n\n<li>Compos\u00e9s de l'imidazole<\/li>\n\n<li>Acides carboxyliques<\/li><\/ul><p><strong>D\u00e9roulement du processus<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Nettoyage \u00e0 l'acide (5% H2SO4, 2min)<\/li>\n\n<li>Micro-gravure (Na2S2O8, \u00e9limination de 1 \u00e0 2 \u03bcm de cuivre)<\/li>\n\n<li>Traitement OSP (40-50 \u00b0C, 1-2 min)<\/li>\n\n<li>S\u00e9chage (air chaud \u00e0 60-80 \u00b0C)<\/li><\/ol><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"32_Advantages\"><\/span>3.2 Avantages<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Rentabilit\u00e9<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>60% moins cher que le HASL<\/li>\n\n<li>Faible investissement en \u00e9quipement (~1\/5 de l'ENIG)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Int\u00e9grit\u00e9 du signal<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Constante di\u00e9lectrique stable (\u0394Dk &lt;0,02)<\/li>\n\n<li>Id\u00e9al pour les applications \u00e0 haute fr\u00e9quence (&gt;10GHz)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Respect de l'environnement<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Pas de m\u00e9taux lourds<\/li>\n\n<li>Traitement simplifi\u00e9 des eaux us\u00e9es<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"33_Limitations\"><\/span>3.3 Limites<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Fen\u00eatre de soudabilit\u00e9<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>\u00c0 utiliser dans les 24 heures suivant l'ouverture<\/li>\n\n<li>Convient uniquement pour un cycle de refusion (le rendement chute de 30 % lors de la deuxi\u00e8me refusion)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Difficult\u00e9s d'inspection<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Difficile de mesurer optiquement l'\u00e9paisseur du film<\/li>\n\n<li>N\u00e9cessite un traitement sp\u00e9cial en mati\u00e8re de TIC<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Conditions de stockage<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Emballage sous vide requis (RH &lt;30%)<\/li>\n\n<li>Temp\u00e9rature de stockage : 15-30 \u00b0C<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>L'OSP am\u00e9lior\u00e9 de Topfast prolonge la dur\u00e9e de conservation de 3 \u00e0 6 mois et r\u00e9siste \u00e0 2 cycles de refusion.<\/p><\/blockquote><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2.jpg\" alt=\"Proc\u00e9d\u00e9 HASL\" class=\"wp-image-4138\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Process_Selection_Guide\"><\/span>Guide de s\u00e9lection des processus<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"41_Comparison\"><\/span>4.1 Comparaison<span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Param\u00e8tres<\/th><th>HASL<\/th><th>ENIG<\/th><th>OSP<\/th><\/tr><\/thead><tbody><tr><td>Co\u00fbt<\/td><td>$<\/td><td>$$$<\/td><td>$<\/td><\/tr><tr><td>Plan\u00e9it\u00e9<\/td><td>\u25b3 (15-25 \u03bcm)<\/td><td>\u25ce (&lt;5 \u03bcm)<\/td><td>\u25cb (&lt;10 \u03bcm)<\/td><\/tr><tr><td>Soudabilit\u00e9<\/td><td>\u25ce (3 reflux)<\/td><td>\u25cb (5 reflux)<\/td><td>\u25b3 (1 \u00e0 2 reflux)<\/td><\/tr><tr><td>Dur\u00e9e de conservation<\/td><td>12mo<\/td><td>18mo<\/td><td>6mo<\/td><\/tr><tr><td>Min. Pas<\/td><td>0,5 mm<\/td><td>0,3 mm<\/td><td>0,4 mm<\/td><\/tr><tr><td>Respect de l'environnement<\/td><td>Sans plomb OK<\/td><td>Excellent<\/td><td>Excellent<\/td><\/tr><tr><td>Applications<\/td><td>\u00c9lectronique grand public<\/td><td>Circuits int\u00e9gr\u00e9s \u00e0 haute densit\u00e9<\/td><td>Quick-Turn<\/td><\/tr><\/tbody><\/table><\/figure><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"42_Recommendations\"><\/span>4.2 Recommandations<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>\u00c9lectronique grand public<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>HASL sans plomb (meilleur rapport co\u00fbt\/performance)<\/li>\n\n<li>Contr\u00f4le du volume de p\u00e2te \u00e0 braser pour les composants \u00e0 pas fin<\/li><\/ul><ul class=\"wp-block-list\"><li><strong><a href=\"https:\/\/www.topfastpcb.com\/fr\/products\/hdi-pcb\/\">Cartes HDI<\/a><\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>ENIG (plan\u00e9it\u00e9 sup\u00e9rieure)<\/li>\n\n<li>Contr\u00f4le strict de la qualit\u00e9 du nickel<\/li><\/ul><ul class=\"wp-block-list\"><li><strong><a href=\"https:\/\/www.topfastpcb.com\/fr\/products\/high-speed-pcb\/\">Circuits imprim\u00e9s \u00e0 grande vitesse<\/a><\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>OSP\/ENIG (meilleure int\u00e9grit\u00e9 du signal)<\/li>\n\n<li>\u00c9viter la surface irr\u00e9guli\u00e8re de HASL<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Prototypage<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>OSP (d\u00e9lai le plus court)<\/li>\n\n<li>Assurer l'assemblage en temps voulu<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"43_Topfast_Capabilities\"><\/span>4.3 Capacit\u00e9s Topfast<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Solutions compl\u00e8tes de finition de surface :<\/p><ul class=\"wp-block-list\"><li>20 lignes HASL automatis\u00e9es (500 000 m\u00b2\/mois)<\/li>\n\n<li>10 lignes ENIG (uniformit\u00e9 d'\u00e9paisseur \u00b18 %)<\/li>\n\n<li>5 lignes OSP (nano-am\u00e9lior\u00e9es disponibles)<\/li>\n\n<li>Inspection 100% en ligne (AOI+SPI)<\/li><\/ul><p><a href=\"https:\/\/www.topfastpcb.com\/fr\/contact\/\">T\u00e9l\u00e9charger le guide de s\u00e9lection des \u00e9tats de surface des circuits imprim\u00e9s<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>Le processus de nivellement \u00e0 l'air chaud HASL, y compris la composition de l'alliage, le d\u00e9roulement du processus et les diff\u00e9rences de performance entre HASL avec et sans plomb. Une analyse d\u00e9taill\u00e9e des caract\u00e9ristiques et des sc\u00e9narios d'application des proc\u00e9d\u00e9s de galvanoplastie ENIG et d'anti-oxydation OSP. En tant que fabricant professionnel de PCB, Topfast poss\u00e8de des capacit\u00e9s de traitement de surface compl\u00e8tes et un syst\u00e8me de contr\u00f4le de qualit\u00e9 robuste, ce qui nous permet de fournir des solutions de traitement de surface optimales pour divers produits \u00e9lectroniques.<\/p>","protected":false},"author":1,"featured_media":4136,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[351,260],"class_list":["post-4135","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-hasl-processes","tag-pcb-manufacturing-process"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB HASL and Lead-Free HASL Processes - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Topfast provides professional and reliable PCB manufacturing services. 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