{"id":4555,"date":"2025-11-04T08:17:00","date_gmt":"2025-11-04T00:17:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4555"},"modified":"2025-11-03T20:20:03","modified_gmt":"2025-11-03T12:20:03","slug":"technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/","title":{"rendered":"\u00c9volution technologique des PCB \u00e0 l'\u00e8re de l'intelligence artificielle"},"content":{"rendered":"<p>Le passage technologique du montage traditionnel \u00e0 travers le trou aux interconnexions \u00e0 haute densit\u00e9, associ\u00e9 \u00e0 la croissance explosive de l'intelligence artificielle, remod\u00e8le fondamentalement la trajectoire technologique, la structure des produits et la r\u00e9partition de la valeur de l'industrie des circuits imprim\u00e9s.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB.jpg\" alt=\"PCB AI\" class=\"wp-image-4556\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Table des mati\u00e8res<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Technological_Requirements_Upgrade_of_AI_Computing_Hardware_for_PCBs\" >Exigences technologiques Mise \u00e0 niveau du mat\u00e9riel informatique d'IA pour les PCB<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Demand_for_High_Layer_Count_and_High-Density_Interconnects\" >Demande d'interconnexions \u00e0 nombre de couches \u00e9lev\u00e9 et \u00e0 haute densit\u00e9<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Signal_Integrity_Challenges_and_Solutions\" >D\u00e9fis et solutions en mati\u00e8re d'int\u00e9grit\u00e9 du signal<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Innovations_in_Thermal_Management_Technology\" >Innovations en mati\u00e8re de gestion thermique<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Technological_Breakthroughs_and_Localization_Progress_of_Key_Materials\" >Perc\u00e9es technologiques et progr\u00e8s en mati\u00e8re de localisation des mat\u00e9riaux cl\u00e9s<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Advances_in_High-Frequency_and_High-Speed_Copper-Clad_Laminates\" >Progr\u00e8s dans le domaine des stratifi\u00e9s \u00e0 haute fr\u00e9quence et \u00e0 haute vitesse \u00e0 base de cuivre<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Specialty_Chemical_Materials\" >Mat\u00e9riaux chimiques de sp\u00e9cialit\u00e9<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Technical_Bottlenecks_and_Breakthroughs_in_Manufacturing_Processes\" >Goulets d'\u00e9tranglement techniques et perc\u00e9es dans les processus de fabrication<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Laser_Drilling_Technology\" >Technologie de per\u00e7age au laser<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Innovations_in_Lamination_Processes\" >Innovations dans les proc\u00e9d\u00e9s de pelliculage<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Upgrades_in_Inspection_Technology\" >Modernisation des techniques d'inspection<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Industrial_Chain_Restructuring_and_Business_Model_Transformation\" >Restructuration de la cha\u00eene industrielle et transformation du mod\u00e8le d'entreprise<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Reshaping_of_Supply_Chain_Relationships\" >Remodelage des relations de la cha\u00eene d'approvisionnement<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Increased_Concentration_Due_to_Higher_Technical_Barriers\" >Concentration accrue en raison d'obstacles techniques plus importants<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Changes_in_Value_Distribution\" >Changements de valeur Distribution<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Future_Technological_Development_Trends\" >Tendances futures du d\u00e9veloppement technologique<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Integration_of_Advanced_Packaging_and_PCBs\" >Int\u00e9gration de l'emballage avanc\u00e9 et des circuits imprim\u00e9s<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Silicon_Photonics_Co-Packaging_Technology\" >Technologie de co-emballage pour la photonique au silicium<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Sustainability_Requirements\" >Exigences en mati\u00e8re de d\u00e9veloppement durable<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Recommendations_for_Technical_Teams\" >Recommandations pour les \u00e9quipes techniques<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Transformation_of_Talent_Structure\" >Transformation de la structure des talents<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Focus_of_R_D_Investment\" >L'investissement dans la R&amp;D<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Patent_Layout_Strategy\" >Strat\u00e9gie de mise en page des brevets<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technological_Requirements_Upgrade_of_AI_Computing_Hardware_for_PCBs\"><\/span>Exigences technologiques Mise \u00e0 niveau du mat\u00e9riel informatique d'IA pour les PCB<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Demand_for_High_Layer_Count_and_High-Density_Interconnects\"><\/span>Demande d'interconnexions \u00e0 nombre de couches \u00e9lev\u00e9 et \u00e0 haute densit\u00e9<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Les cartes m\u00e8res de serveurs traditionnelles utilisent g\u00e9n\u00e9ralement 12 \u00e0 16 couches, alors que les serveurs d'entra\u00eenement \u00e0 l'IA actuels (tels que la s\u00e9rie NVIDIA DGX H100) n\u00e9cessitent un nombre de couches de PCB de 20 \u00e0 30 couches. En particulier pour les substrats GPU, des densit\u00e9s d'interconnexion sup\u00e9rieures \u00e0 5 000 points de soudure BGA sont n\u00e9cessaires, avec une largeur\/espacement de trace comprim\u00e9 du 4\/4 mil conventionnel \u00e0 2\/2 mil ou m\u00eame 1,5\/1,5 mil. Cette demande de conception conduit directement \u00e0 l'adoption du mSAP (Modified Semi-Additive Process), car les proc\u00e9d\u00e9s soustractifs traditionnels ne peuvent plus r\u00e9pondre aux exigences de pr\u00e9cision.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Signal_Integrity_Challenges_and_Solutions\"><\/span>D\u00e9fis et solutions en mati\u00e8re d'int\u00e9grit\u00e9 du signal<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Aux taux de transmission PAM4 de 112 Gbps, la perte d'insertion doit \u00eatre contr\u00f4l\u00e9e \u00e0 -0,6 dB\/pouce. Gr\u00e2ce \u00e0 une analyse de simulation, nous avons constat\u00e9 que le facteur de dissipation (Df) doit \u00eatre r\u00e9duit de 0,02 pour le FR-4 conventionnel \u00e0 moins de 0,005. La solution actuellement privil\u00e9gi\u00e9e par l'industrie consiste \u00e0 utiliser un syst\u00e8me composite de r\u00e9sine d'hydrocarbure et de charge c\u00e9ramique (tel que le Rogers RO4835\u2122), qui maintient une valeur Dk stable de 3,5\u00b10,05 et pr\u00e9sente de bonnes propri\u00e9t\u00e9s di\u00e9lectriques, m\u00eame \u00e0 77 GHz.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Innovations_in_Thermal_Management_Technology\"><\/span>Innovations en mati\u00e8re de gestion thermique<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Si l'on prend l'exemple du NVIDIA H100, la consommation maximale d'\u00e9nergie d'une seule puce atteint 700 W, ce qui rend les solutions traditionnelles de conception thermique totalement inad\u00e9quates. Notre technologie de bloc de cuivre int\u00e9gr\u00e9 + r\u00e9seau de via thermiques peut r\u00e9duire la r\u00e9sistance thermique \u00e0 0,8\u00b0C\/W. En ce qui concerne le choix du mat\u00e9riau du substrat, une Tg \u00e9lev\u00e9e (\u2265170\u00b0C) et une conductivit\u00e9 thermique \u00e9lev\u00e9e (\u22650,8 W\/m-K) sont devenues des exigences fondamentales, certaines applications haut de gamme adoptant d\u00e9j\u00e0 des structures hybrides compos\u00e9es de substrats m\u00e9talliques et de mat\u00e9riaux organiques.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technological_Breakthroughs_and_Localization_Progress_of_Key_Materials\"><\/span>Perc\u00e9es technologiques et progr\u00e8s en mati\u00e8re de localisation des mat\u00e9riaux cl\u00e9s<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advances_in_High-Frequency_and_High-Speed_Copper-Clad_Laminates\"><\/span>Progr\u00e8s en mati\u00e8re de <a href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/high-frequency-pcb-design-and-layout-guide\/\">Haute fr\u00e9quence<\/a> et <a href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/what-is-a-high-speed-pcb\/\">Haute vitesse<\/a> Stratifi\u00e9s Copper-Clad<span class=\"ez-toc-section-end\"><\/span><\/h3><p>La s\u00e9rie S7439 de Shengyi Technology a \u00e9t\u00e9 certifi\u00e9e par les principaux \u00e9quipementiers, atteignant une valeur Df de 0,0058 \u00e0 10 GHz, se rapprochant ainsi des normes internationales de pointe. La mise au point par Sinoma Science &amp; Technology d'un tissu de verre \u00e9lectronique \u00e0 faible Dk (Dk=4,2) brise le monopole technologique de Nittobo, la production de masse \u00e9tant pr\u00e9vue pour 2025.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Specialty_Chemical_Materials\"><\/span>Mat\u00e9riaux chimiques de sp\u00e9cialit\u00e9<span class=\"ez-toc-section-end\"><\/span><\/h2><p>En ce qui concerne les encres de r\u00e9sistance de soudure, la s\u00e9rie SR-7200G de Taiyo Ink prend en charge l'imagerie directe par laser avec des r\u00e9solutions allant jusqu'\u00e0 20 \u03bcm. Pour les additifs de m\u00e9tallisation, la s\u00e9rie Circuposit 8800 de MacDermid Enthone permet une m\u00e9tallisation uniforme avec des rapports d'aspect 1:1, ce qui permet de r\u00e9soudre le probl\u00e8me de l'uniformisation de la m\u00e9tallisation du cuivre dans les trous de passage des circuits imprim\u00e9s \u00e0 nombre de couches \u00e9lev\u00e9.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3.jpg\" alt=\"PCB AI\" class=\"wp-image-4557\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technical_Bottlenecks_and_Breakthroughs_in_Manufacturing_Processes\"><\/span>Goulets d'\u00e9tranglement techniques et perc\u00e9es dans les processus de fabrication<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Laser_Drilling_Technology\"><\/span>Technologie de per\u00e7age au laser<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Pour le traitement des microvia inf\u00e9rieures \u00e0 0,1 mm, les lasers CO2 approchent des limites physiques. Nous avons introduit des syst\u00e8mes de traitement par laser UV combin\u00e9s \u00e0 une technologie de mise en forme du faisceau pour am\u00e9liorer la pr\u00e9cision du traitement jusqu'\u00e0 35 \u03bcm. Les perceuses laser UV de Han's Laser, qui utilisent une longueur d'onde de 355 nm, atteignent un diam\u00e8tre de trou minimal de 50 \u03bcm avec une pr\u00e9cision de positionnement de \u00b115 \u03bcm.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Innovations_in_Lamination_Processes\"><\/span>Innovations dans les proc\u00e9d\u00e9s de pelliculage<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Pour les cartes \u00e0 tr\u00e8s hautes couches d\u00e9passant 30 couches, nous avons mis au point un processus de laminage impliquant un chauffage segment\u00e9 et l'application d'une pression. En contr\u00f4lant pr\u00e9cis\u00e9ment le flux de r\u00e9sine, le taux de remplissage entre les couches est port\u00e9 \u00e0 plus de 95%, tandis que la pr\u00e9cision de l'alignement entre les couches est maintenue \u00e0 \u00b125 \u03bcm.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Upgrades_in_Inspection_Technology\"><\/span>Modernisation des techniques d'inspection<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Une solution compl\u00e8te combinant <a href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/what-is-aoi-automated-optical-inspection\/\">Inspection optique automatis\u00e9e<\/a> (AOI) et les tests \u00e9lectriques sont adopt\u00e9s. Le logiciel PathWave ADS de Keysight prend en charge la simulation du champ \u00e9lectromagn\u00e9tique en 3D, ce qui permet d'identifier rapidement les probl\u00e8mes d'int\u00e9grit\u00e9 du signal. Pour les essais en circuit, l'architecture TestStation de Teradyne prend en charge les essais de taux d'erreur binaire pour les interfaces \u00e0 112 Gbps.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Industrial_Chain_Restructuring_and_Business_Model_Transformation\"><\/span>Restructuration de la cha\u00eene industrielle et transformation du mod\u00e8le d'entreprise<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Reshaping_of_Supply_Chain_Relationships\"><\/span>Remodelage des relations de la cha\u00eene d'approvisionnement<span class=\"ez-toc-section-end\"><\/span><\/h3><p>La cha\u00eene d'approvisionnement des cartes de circuits imprim\u00e9s des serveurs d'IA est divis\u00e9e en trois niveaux : Les jeux de cartes GPU sont dirig\u00e9s par les fabricants de puces (par exemple, la cha\u00eene d'approvisionnement d\u00e9sign\u00e9e de NVIDIA) ; les cartes m\u00e8res CPU suivent la cha\u00eene d'approvisionnement traditionnelle des serveurs ; et les fabricants de modules se procurent ind\u00e9pendamment les modules accessoires. Cette diff\u00e9renciation exige des fabricants de cartes de circuits imprim\u00e9s qu'ils poss\u00e8dent des capacit\u00e9s d'engagement diff\u00e9renci\u00e9es aupr\u00e8s des clients.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Increased_Concentration_Due_to_Higher_Technical_Barriers\"><\/span><strong>Concentration accrue en raison d'obstacles techniques plus importants<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p>L'investissement en capital pour les PCB \u00e0 18 couches ou plus est 3 \u00e0 5 fois sup\u00e9rieur \u00e0 celui des produits traditionnels, et les cycles de R&amp;D s'\u00e9tendent sur 12 \u00e0 18 mois. Cela a conduit \u00e0 une concentration des parts de march\u00e9 entre les principales entreprises, les trois premiers fabricants repr\u00e9sentant plus de 60% du march\u00e9 national des PCB pour serveurs d'IA en 2024.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Changes_in_Value_Distribution\"><\/span>Changements de valeur Distribution<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Dans le co\u00fbt de la nomenclature des serveurs IA, la proportion de PCB est pass\u00e9e de 2-3% dans les serveurs traditionnels \u00e0 6-8%. En raison de leur grande complexit\u00e9 technique, les substrats pour GPU, en particulier, peuvent d\u00e9gager des marges brutes de 35 \u00e0 40%, soit nettement plus que les 15 \u00e0 20% des produits traditionnels.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2.jpg\" alt=\"PCB AI\" class=\"wp-image-4558\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Future_Technological_Development_Trends\"><\/span>Tendances futures du d\u00e9veloppement technologique<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Integration_of_Advanced_Packaging_and_PCBs\"><\/span>Int\u00e9gration de l'emballage avanc\u00e9 et des circuits imprim\u00e9s<span class=\"ez-toc-section-end\"><\/span><\/h3><p>L'architecture Chiplet exige que les circuits imprim\u00e9s assument certaines fonctions d'interposeur, ce qui pousse la technologie Substrate-Like PCB (SLP) vers une largeur\/espacement de trace de 10\/10 \u03bcm. La technologie eSLP d\u00e9velopp\u00e9e par Shennan Circuits a atteint une capacit\u00e9 de traitement de 8\/8 \u03bcm et fait l'objet d'une validation d'\u00e9chantillon avec les principaux fabricants de puces.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Silicon_Photonics_Co-Packaging_Technology\"><\/span>Technologie de co-emballage pour la photonique au silicium<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Pour les modules optiques de plus de 1,6T, l'optique copackag\u00e9e (CPO) est devenue un choix in\u00e9vitable. Pour ce faire, les circuits imprim\u00e9s doivent int\u00e9grer des guides d'ondes photoniques, et nous d\u00e9veloppons une technologie de substrat hybride bas\u00e9e sur des guides d'ondes en dioxyde de silicium, qui devrait trouver des applications techniques d'ici \u00e0 2026.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Sustainability_Requirements\"><\/span>Exigences en mati\u00e8re de d\u00e9veloppement durable<span class=\"ez-toc-section-end\"><\/span><\/h3><p>La directive CE-RED de l'UE impose de nouvelles exigences environnementales pour les circuits imprim\u00e9s, notamment des mat\u00e9riaux sans halog\u00e8ne et des processus sans plomb. Notre syst\u00e8me de r\u00e9sine \u00e9poxy biosourc\u00e9e r\u00e9duit l'empreinte carbone de 40% et a obtenu la certification UL.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Recommendations_for_Technical_Teams\"><\/span>Recommandations pour les \u00e9quipes techniques<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Transformation_of_Talent_Structure\"><\/span>Transformation de la structure des talents<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Il est n\u00e9cessaire de passer des ing\u00e9nieurs de proc\u00e9d\u00e9s traditionnels \u00e0 des talents composites \"mat\u00e9riaux-processus-syst\u00e8me\". Dans notre \u00e9quipe, la proportion d'ing\u00e9nieurs ayant une formation en sciences des mat\u00e9riaux est pass\u00e9e de 10% il y a dix ans \u00e0 35% aujourd'hui.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Focus_of_R_D_Investment\"><\/span>L'investissement dans la R&amp;D<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Il est recommand\u00e9 d'allouer 60% des ressources de R&amp;D \u00e0 l'IDH \u00e0 nombre de couches \u00e9lev\u00e9, 30% \u00e0 l'emballage avanc\u00e9 et 10% aux technologies de d\u00e9veloppement durable. Une attention particuli\u00e8re devrait \u00eatre accord\u00e9e \u00e0 la collaboration pr\u00e9coce avec les fabricants de puces et \u00e0 la participation \u00e0 la conception de l'avant-plan.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Patent_Layout_Strategy\"><\/span>Strat\u00e9gie de mise en page des brevets<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Se concentrer sur les brevets dans trois directions : mat\u00e9riaux \u00e0 haute vitesse, structures de dissipation thermique et interconnexions \u00e0 haute densit\u00e9. Parmi nos principaux brevets d\u00e9pos\u00e9s ces derni\u00e8res ann\u00e9es, ceux qui concernent des structures sp\u00e9ciales de dissipation thermique repr\u00e9sentent 40%, qui deviendront une future barri\u00e8re technologique.<\/p><p>L'intelligence artificielle fait passer les circuits imprim\u00e9s du statut de composants auxiliaires \u00e0 celui de pi\u00e8ces ma\u00eetresses des syst\u00e8mes informatiques. Ce changement de statut nous oblige \u00e0 red\u00e9finir les processus de d\u00e9veloppement de produits en adoptant un \u00e9tat d'esprit au niveau du syst\u00e8me, en passant du statut de simple fournisseur de services de fabrication \u00e0 celui de fournisseur de solutions techniques. \u00c0 l'avenir, la concurrence industrielle sera un concours complet de syst\u00e8mes de mat\u00e9riaux, de capacit\u00e9s de traitement et de prouesses en mati\u00e8re de conception de syst\u00e8mes.<\/p><p><\/p>","protected":false},"excerpt":{"rendered":"<p>Analyse de la profonde transformation que l'IA apporte \u00e0 l'industrie des circuits imprim\u00e9s d'un point de vue technique. Les serveurs d'IA font passer le nombre de couches de PCB \u00e0 20-30 couches, avec des exigences de largeur de ligne et d'espacement inf\u00e9rieures \u00e0 2\/2 mil, et des taux de transmission de signaux \u00e9voluant vers 112Gbps.<\/p>","protected":false},"author":1,"featured_media":4559,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[382],"tags":[396,111],"class_list":["post-4555","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-guide","tag-ai-pcb","tag-pcb"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Technological Evolution of PCBs in the Era of Artificial Intelligence - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Revolutionary Demands of AI Computing Hardware on PCB Technology: From 20+ Layer High-Density Interconnect Design to 112Gbps Signal Integrity Assurance\u2014Exploring Innovations in High-Frequency Materials and Advanced Manufacturing Processes.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/fr\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Technological Evolution of PCBs in the Era of Artificial Intelligence - 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