{"id":2334,"date":"2025-05-05T18:01:35","date_gmt":"2025-05-05T09:31:35","guid":{"rendered":"http:\/\/topfastpcbb.ru\/?p=2334"},"modified":"2025-05-06T14:46:44","modified_gmt":"2025-05-06T06:16:44","slug":"8-layer-pcb-stackup","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/it\/blog\/8-layer-pcb-stackup\/","title":{"rendered":"Blocco PCB a 8 strati"},"content":{"rendered":"<p>La struttura a 8 strati stratificata con PCB comprende di norma lo strato di segnale, lo strato di potenza e lo strato di suolo; la disposizione specifica e i principi di progettazione sono i seguenti<\/p><p>Livello del segnale: di solito include il livello superiore (superiore), il livello inferiore (inferiore) e il livello del segnale al centro (ad esempio signala2, Signal3, ecc.). Lo strato di segnale \u00e8 utilizzato principalmente per cablare e trasmettere segnali elettrici.<\/p><p>Strato di potenza: comprende generalmente uno o pi\u00f9 strati di potenza (ad esempio, Power1, Power2, ecc.) utilizzati per fornire un alimentatore stabile. Lo strato di alimentazione \u00e8 adiacente allo strato di suolo per realizzare meglio l\u2019accoppiamento tra l\u2019alimentazione e il suolo e per ridurre l\u2019impedenza tra il piano di potenza e il piano di massa.<\/p><p>Strato di suolo: comprende uno o pi\u00f9 strati di suolo (ad esempio suolo 1, suolo 2, ecc.) utilizzati principalmente per fornire un piano di riferimento al suolo stabile e ridurre le interferenze elettromagnetiche. Il piano di massa \u00e8 adiacente al piano di potenza per assicurare una migliore integrit\u00e0 del segnale.<\/p><h2><a href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-design-principles\/\">Principi di progettazione<\/a> E disposizioni comuni<\/h2><p>Lo strato adiacente al chip principale \u00e8 il piano di massa: fornisce un piano di riferimento stabile per il chip principale e riduce le interferenze.<br>Tutti gli strati di segnale sono il pi\u00f9 possibile adiacenti al piano di terra: garantiscono una migliore integrit\u00e0 del segnale.<br>Evitare per quanto possibile due strati di segnale adiacenti: ridurre l\u2019interferenza del segnale.<br>L\u2019alimentazione principale \u00e8 il pi\u00f9 possibile vicina al corrispondente piano di massa: ridurre l\u2019impedenza tra il piano di potenza e il piano di massa.<br>Struttura simmetrica: lo spessore e il tipo di strato dielettrico, lo spessore dei fogli di rame e il tipo di distribuzione grafica devono essere simmetrici per minimizzare l\u2019impatto dell\u2019asimmetria.<br><\/p><h2>Esempi comuni di progettazione e uso degli strumenti<\/h2><p>Progetto comune di livello impilato: come il fondo superiore gnd-signal-gnd-signal-gnd-top, ecc. Questo progetto pu\u00f2 garantire una migliore integrit\u00e0 dei segnali e una migliore compatibilit\u00e0 elettromagnetica.<br>Usando lo strumento DFM di Huaqiu: questo strumento aiuta a calcolare l\u2019impedenza, selezionare la larghezza e la spaziatura corrette della linea e garantire l\u2019accuratezza del progetto.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"591\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1.jpg\" alt=\"\" class=\"wp-image-2363\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1-300x296.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/8-Layer-PCB-1-100x100.jpg 100w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Indice per materie<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/8-layer-pcb-stackup\/#8-Layer_PCB_Stackup_Design_Analysis\" >Analisi del progetto su 8 strati di PCB<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/8-layer-pcb-stackup\/#Option_1_Six_Signal_Layer_Design_Not_Recommended\" >Opzione 1: progetto di livello di sei segnali (non raccomandato)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/8-layer-pcb-stackup\/#Option_2_Four_Signal_Layer_Design_Recommended\" >Opzione 2: progettazione di quattro livelli di segnale (raccomandata)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/8-layer-pcb-stackup\/#Option_3_Optimal_Four_Signal_Layer_Design_Highly_Recommended\" >Opzione 3: progetto ottimale di livello di quattro segnali (altamente raccomandato)<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"8-Layer_PCB_Stackup_Design_Analysis\"><\/span>Analisi del progetto su 8 strati di PCB<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_1_Six_Signal_Layer_Design_Not_Recommended\"><\/span>Opzione 1: progetto di livello di sei segnali (non raccomandato)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Caratteristiche strutturali<\/strong>:<\/p><ol class=\"wp-block-list\"><li><strong>Livello superiore<\/strong>: segnale 1 (lato componente\/livello di instradamento microstriscia)<\/li>\n\n<li><strong>Strato interno<\/strong>: segnale 2 (microstriscia di direzione x, strato di routing premium)<\/li>\n\n<li><strong>Strato interno<\/strong>: terreno (piano terreno)<\/li>\n\n<li><strong>Strato interno<\/strong>: segnale 3 (stripline di direzione y, strato di routing premium)<\/li>\n\n<li><strong>Strato interno<\/strong>: segnale 4 (strato di routing Stripline)<\/li>\n\n<li><strong>Strato interno<\/strong>: potenza (piano di potenza)<\/li>\n\n<li><strong>Strato interno<\/strong>: segnale 5 (livello di routing dei micronastri)<\/li>\n\n<li><strong>Livello inferiore<\/strong>: segnale 6 (livello di routing dei micronastri)<\/li><\/ol><p><strong>Analisi della restituzione<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Scarso assorbimento elettromagnetico<\/li>\n\n<li>Impedenza di alta potenza<\/li>\n\n<li>Percorsi di ritorno dei segnali incompleti<\/li>\n\n<li>Prestazioni inferiori dell\u2019ime<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_2_Four_Signal_Layer_Design_Recommended\"><\/span>Opzione 2: progettazione di quattro livelli di segnale (raccomandata)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Caratteristiche migliorate<\/strong>:<\/p><ol class=\"wp-block-list\"><li><strong>Livello superiore<\/strong>: segnale 1 (lato componente\/microstriscia, livello di istradamento superiore)<\/li>\n\n<li><strong>Strato interno<\/strong>: terreno (basso impedenza, ottimo assorbimento di EM)<\/li>\n\n<li><strong>Strato interno<\/strong>: segnale 2 (Stripline, strato di routing premium)<\/li>\n\n<li><strong>Strato interno<\/strong>: potenza (accoppiamento capacitivo formante il piano di potenza con terreno adiacente)<\/li>\n\n<li><strong>Strato interno<\/strong>: terreno (piano terreno)<\/li>\n\n<li><strong>Strato interno<\/strong>: segnale 3 (Stripline, strato di routing premium)<\/li>\n\n<li><strong>Strato interno<\/strong>: potenza (piano di potenza)<\/li>\n\n<li><strong>Livello inferiore<\/strong>: segnale 4 (microstriscia, strato di routing premium)<\/li><\/ol><p><strong>vantaggi<\/strong>:<br>? Piano di riferimento dedicato per ciascun livello di segnale<br>? Controllo preciso dell\u2019impedenza (10%)<br>? Voci sovrapposte ridotte (instradamento ortogonale tra strati adiacenti)<br>? 40% miglioramento dell\u2019integrit\u00e0 del potere<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_3_Optimal_Four_Signal_Layer_Design_Highly_Recommended\"><\/span>Opzione 3: progetto ottimale di livello di quattro segnali (altamente raccomandato)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Struttura della regola d\u2019oro<\/strong>:<\/p><ol class=\"wp-block-list\"><li><strong>Livello superiore<\/strong>: segnale 1 (lato componente\/microstriscia)<\/li>\n\n<li><strong>Strato interno<\/strong>: suolo (piano terreno solido)<\/li>\n\n<li><strong>Strato interno<\/strong>: segnale 2 (Stripline)<\/li>\n\n<li><strong>Strato interno<\/strong>: potenza (piano di potenza)<\/li>\n\n<li><strong>Strato interno<\/strong>: suolo (piano terra centrale)<\/li>\n\n<li><strong>Strato interno<\/strong>: segnale 3 (Stripline)<\/li>\n\n<li><strong>Strato interno<\/strong>: suolo (schermo al suolo)<\/li>\n\n<li><strong>Livello inferiore<\/strong>: segnale 4 (microstriscia)<\/li><\/ol><p><strong>Prestazioni eccezionali<\/strong>:<br>Cinque piani terrestri offrono una perfetta schermatura<br>Intervallo di potenza &lt; 3 milioni per un disaccoppiamento ottimale<br>La distribuzione asimmetrica dei livelli impedisce la warpage<br>Il sistema supporta segnali ad alta velocit\u00e0 di 20Gbps<\/p><p><strong>Progettazione raccomandata<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Prima i segnali critici di rotta sugli strati stripline S2\/S3<\/li>\n\n<li>Attuare la progettazione del piano a potenza ripartita<\/li>\n\n<li>Limita le tracce di livello superiore\/inferiore a &lt; 5mm<\/li>\n\n<li>Mantenere un percorso ortogonale tra livelli di segnale adiacenti<\/li><\/ol><h2><strong>Riferimento dello spessore di stivaggio<\/strong><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>livello<\/th><th>materiale<\/th><th>Spessore (mil)<\/th><\/tr><\/thead><tbody><tr><td>1-2<\/td><td>FR4<\/td><td>3.2<\/td><\/tr><tr><td>2-3<\/td><td>1080PP<\/td><td>4.5<\/td><\/tr><tr><td>4-5<\/td><td>centrale<\/td><td>8.0<\/td><\/tr><tr><td>6-7<\/td><td>2116PP<\/td><td>5.2<\/td><\/tr><tr><td>7-8<\/td><td>FR4<\/td><td>3.2<\/td><\/tr><\/tbody><\/table><\/figure><p>Nota: tutte le progettazioni devono prevedere vias cieche\/interrate per un utilizzo ottimale dello spazio di tracciamento.<\/p>","protected":false},"excerpt":{"rendered":"<p>Uno stack PCB a 8 strati \u00e8 tipicamente costituito da strati di segnale, alimentazione e terra.<\/p>","protected":false},"author":1,"featured_media":2364,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[216,215],"class_list":["post-2334","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-8-layer-pcb","tag-8-layer-pcb-stackup"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - 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