{"id":4672,"date":"2025-11-22T08:13:00","date_gmt":"2025-11-22T00:13:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4672"},"modified":"2025-11-21T20:35:13","modified_gmt":"2025-11-21T12:35:13","slug":"pcb-substrate-selection-guide","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-substrate-selection-guide\/","title":{"rendered":"Guida alla scelta del substrato per PCB: Come prendere la decisione migliore tra FR-4, PTFE e ceramica?"},"content":{"rendered":"<p>Una delle maggiori sfide nella progettazione dell'hardware per il 2025 \u00e8 trovare un equilibrio ottimale tra prestazioni, affidabilit\u00e0 e costi. Il substrato, che funge da scheletro e mezzo isolante del PCB, determina direttamente l'integrit\u00e0 del segnale, l'efficienza energetica e la competitivit\u00e0 del prodotto finale attraverso la sua <strong>Costante dielettrica (Dk)<\/strong> nonch\u00e9 <strong>Fattore di dissipazione (Df)<\/strong>. Una scelta inadeguata pu\u00f2 portare a problemi che vanno dalla distorsione del segnale e dal mancato raggiungimento degli obiettivi di prestazione a problemi gravi come il surriscaldamento e i guasti di affidabilit\u00e0, con conseguenti costi di rilavorazione significativi e danni al marchio.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/PCB-substrate-1.jpg\" alt=\"Substrato PCB\" class=\"wp-image-4675\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/PCB-substrate-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/PCB-substrate-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/PCB-substrate-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Indice per materie<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-substrate-selection-guide\/#Comprehensive_Analysis_of_the_Three_Key_Substrates\" >Analisi completa dei tre substrati chiave<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-substrate-selection-guide\/#1_FR-4_The_Evolving_%E2%80%9CAll-Rounder%E2%80%9D\" >1. FR-4: il \"tuttofare\" in evoluzione<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-substrate-selection-guide\/#2_PTFE_The_%E2%80%9CGold_Standard%E2%80%9D_for_High-Speed_RF_Signals\" >2. PTFE: il \"Gold Standard\" per i segnali RF ad alta velocit\u00e0<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-substrate-selection-guide\/#3_Ceramic_Substrates_The_%E2%80%9CUltimate_Solution%E2%80%9D_for_High_Power_and_Harsh_Environments\" >3. Substrati ceramici: La \"soluzione definitiva\" per le alte potenze e gli ambienti difficili<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-substrate-selection-guide\/#The_2025_Decision_Framework\" >Il quadro decisionale del 2025<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-substrate-selection-guide\/#Handling_Hybrid_Structures_and_Atypical_Scenarios\" >Gestione di strutture ibride e scenari atipici<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-substrate-selection-guide\/#Conclusion\" >conclusioni<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-substrate-selection-guide\/#Frequently_Asked_Questions_on_PCB_Substrate\" >Domande frequenti sul substrato per PCB<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Comprehensive_Analysis_of_the_Three_Key_Substrates\"><\/span>Analisi completa dei tre substrati chiave<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_FR-4_The_Evolving_%E2%80%9CAll-Rounder%E2%80%9D\"><\/span>1. <a href=\"https:\/\/www.topfastpcb.com\/it\/products\/fr-4-pcb\/\">FR-4<\/a>: Il \"tuttofare\" in evoluzione<span class=\"ez-toc-section-end\"><\/span><\/h3><p>L'FR-4 non \u00e8 un singolo materiale, ma una famiglia di materiali. Entro il 2025, questa famiglia si amplier\u00e0 notevolmente.<\/p><ul class=\"wp-block-list\"><li><strong>Profilo delle prestazioni<\/strong><ul class=\"wp-block-list\"><li><strong>Standard Dk\/Df:<\/strong> Dk ~ 4,2-4,8, Df ~ 0,015-0,025<\/li>\n\n<li><strong>Varianti a media perdita \/ bassa perdita:<\/strong> Attraverso resine epossidiche modificate, <strong>FR-4 a bassa perdita<\/strong> pu\u00f2 raggiungere una Df di ~0,008, <strong>si avvicina ad alcuni materiali in PTFE a basso costo<\/strong>.<\/li>\n\n<li><strong>Affidabilit\u00e0 termica:<\/strong> Le varianti ad alta Tg (temperatura di transizione vetrosa &gt; 170\u00b0C) e prive di alogeni sono diventate lo standard per l'elettronica automobilistica e il controllo industriale.<\/li><\/ul><\/li>\n\n<li><strong>Scenari applicativi principali:<\/strong><ul class=\"wp-block-list\"><li>Elettronica di consumo (schede madri per smartphone, computer portatili)<\/li>\n\n<li>Controllo industriale, moduli di potenza (utilizzando FR-4 ad alta Tg)<\/li>\n\n<li>Sistemi di infotainment per autoveicoli e alcune unit\u00e0 di controllo della carrozzeria<\/li>\n\n<li><strong>Circuiti digitali sensibili ai costi in cui le velocit\u00e0 di segnale sono tipicamente &lt; 5 Gbps<\/strong><\/li><\/ul><\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_PTFE_The_%E2%80%9CGold_Standard%E2%80%9D_for_High-Speed_RF_Signals\"><\/span>2. PTFE: il \"Gold Standard\" per i segnali RF ad alta velocit\u00e0<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Il politetrafluoroetilene (PTFE) offre le migliori prestazioni ad alta frequenza tra i substrati organici, ma il suo costo elevato e i requisiti di lavorazione specializzati spesso scoraggiano i progettisti.<\/p><ul class=\"wp-block-list\"><li><strong>Profilo delle prestazioni:<\/strong><ul class=\"wp-block-list\"><li><strong>Df estremamente bassa:<\/strong> Pu\u00f2 essere inferiore a 0,0005 - 0,002, ovvero da 1\/10 a 1\/50 rispetto a FR-4, riducendo drasticamente la perdita dielettrica nei segnali ad alta velocit\u00e0.<\/li>\n\n<li><strong>Stabile Dk:<\/strong> In genere tra 2,0-3,0, con variazioni minime sulla frequenza, fondamentali per mantenere stabile l'impedenza.<\/li>\n\n<li><strong>Sfide di elaborazione:<\/strong> Il PTFE \u00e8 morbido e ha un elevato coefficiente di espansione termica (CTE), il che richiede attrezzature e processi specializzati per <strong>foratura, laminazione e metallizzazione dei fori<\/strong>, aumentando i costi di lavorazione di circa 30%-100%.<\/li><\/ul><\/li>\n\n<li><strong>Scenari applicativi principali:<\/strong><ul class=\"wp-block-list\"><li>Radar a onde millimetriche (per il settore automobilistico, stazioni base 5G)<\/li>\n\n<li>Antenne ad alta frequenza (ad esempio, comunicazioni satellitari, aerospaziali)<\/li>\n\n<li>Apparecchiature di rete ad altissima velocit\u00e0 (ad esempio, moduli ottici 400G\/800G, canali SerDes superiori a 112 Gbps)<\/li><\/ul><\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Ceramic_Substrates_The_%E2%80%9CUltimate_Solution%E2%80%9D_for_High_Power_and_Harsh_Environments\"><\/span>3. <a href=\"https:\/\/www.topfastpcb.com\/it\/products\/category\/ceramic-pcb\/\">Substrati ceramici<\/a>: La \"soluzione definitiva\" per potenze elevate e ambienti gravosi<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Le ceramiche (ad esempio, Al\u2082O\u2083, AlN, BeO) offrono una conducibilit\u00e0 termica e una stabilit\u00e0 ambientale senza pari.<\/p><ul class=\"wp-block-list\"><li><strong>Profilo delle prestazioni:<\/strong><ul class=\"wp-block-list\"><li><strong>Eccezionale conduttivit\u00e0 termica (TC):<\/strong> Allumina (Al\u2082O\u2083) ~20-30 W\/mK, Nitruro di alluminio (AlN) <strong>~150-200 W\/mK<\/strong> (centinaia di volte superiore a quello dell'FR-4).<\/li>\n\n<li><strong>Coefficiente di espansione termica (CTE) abbinato:<\/strong> Si avvicina al CTE dei chip di silicio, migliorando in modo significativo l'affidabilit\u00e0 dei moduli di potenza in caso di cicli termici.<\/li>\n\n<li><strong>Fragilit\u00e0 intrinseca e costi elevati:<\/strong> Le tavole sono fragili, le dimensioni sono limitate e i costi di lavorazione sono molto elevati.<\/li><\/ul><\/li>\n\n<li><strong>Scenari applicativi principali:<\/strong><ul class=\"wp-block-list\"><li>Illuminazione a LED e laser ad alta potenza (LD)<\/li>\n\n<li>Moduli di potenza per veicoli elettrici (IGBT, SiC, GaN)<\/li>\n\n<li>Componenti RF ad alta potenza nell'elettronica aerospaziale e militare<\/li><\/ul><\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/PCB-substrate-3.jpg\" alt=\"Substrato PCB\" class=\"wp-image-4676\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/PCB-substrate-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/PCB-substrate-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/PCB-substrate-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"The_2025_Decision_Framework\"><\/span>Il quadro decisionale del 2025<span class=\"ez-toc-section-end\"><\/span><\/h2><p><strong>Al momento della decisione, rispondete a queste tre domande in sequenza:<\/strong><\/p><ol class=\"wp-block-list\"><li><strong>Quanto sono esigenti i requisiti di integrit\u00e0 del segnale (SI)?<\/strong><ul class=\"wp-block-list\"><li><strong>Chiedetevi:<\/strong> Qual \u00e8 la velocit\u00e0\/frequenza del mio segnale? Qual \u00e8 la perdita di segnale accettabile (perdita di inserzione)?<\/li>\n\n<li><strong>Percorso decisionale:<\/strong><ul class=\"wp-block-list\"><li><strong>&lt; 5 Gbps<\/strong> o sensibile alle perdite \u2192 <strong>Preferire FR-4<\/strong>.<\/li>\n\n<li><strong>5 - 20 Gbps<\/strong> \u2192 Valutare prima <strong>FR-4 a bassa perdita \/ a bassissima perdita<\/strong>. Se il budget lo consente o i margini di rendimento sono ristretti, si pu\u00f2 prendere in considerazione <strong>materiali ibridi di PTFE a basso costo<\/strong>.<\/li>\n\n<li><strong>&gt; 20 Gbps o bande a onde millimetriche<\/strong> \u2192 <strong>PTFE o altri materiali ad alta frequenza di alto livello (ad es., idrocarburi)<\/strong> sono obbligatori.<\/li><\/ul><\/li><\/ul><\/li>\n\n<li><strong>Qual \u00e8 la pressione di gestione termica?<\/strong><ul class=\"wp-block-list\"><li><strong>Chiedetevi:<\/strong> Qual \u00e8 il consumo di energia dei miei chip\/componenti? Quanto sono rigidi i requisiti di temperatura di giunzione? Qual \u00e8 la temperatura ambiente di funzionamento?<\/li>\n\n<li><strong>Percorso decisionale:<\/strong><ul class=\"wp-block-list\"><li>Densit\u00e0 di potenza moderata, gestibile con i dissipatori di calore \u2192 <strong>FR-4<\/strong>.<\/li>\n\n<li>Chip ad alta densit\u00e0 di potenza o sensibili al calore (ad esempio, GaN) \u2192 Richiede <strong>PCB con nucleo in metallo (ad esempio, alluminio)<\/strong> o <strong>Substrati ceramici (preferibilmente AlN)<\/strong>.<\/li><\/ul><\/li><\/ul><\/li>\n\n<li><strong>Qual \u00e8 il vostro budget e la vostra tolleranza di produzione?<\/strong><ul class=\"wp-block-list\"><li><strong>Chiedetevi:<\/strong> Qual \u00e8 il mio obiettivo di costo della distinta base? Il mio produttore \u00e8 in grado di lavorare materiali specializzati?<\/li>\n\n<li><strong>Percorso decisionale:<\/strong><ul class=\"wp-block-list\"><li>Sensibile ai costi, utilizza linee SMT standard \u2192 <strong>FR-4<\/strong>.<\/li>\n\n<li>Budget sufficiente e conferma del produttore <strong>Capacit\u00e0 di lavorazione del PTFE<\/strong> (ad esempio, trattamento al plasma) \u2192 <strong>PTFE<\/strong>.<\/li>\n\n<li>Le applicazioni sono ad altissima potenza o ad alta frequenza, con priorit\u00e0 alle prestazioni e all'affidabilit\u00e0 rispetto ai costi \u2192 <strong>Substrato ceramico<\/strong>.<\/li><\/ul><\/li><\/ul><\/li><\/ol><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Handling_Hybrid_Structures_and_Atypical_Scenarios\"><\/span>Gestione di strutture ibride e scenari atipici<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Nei progetti all'avanguardia del 2025, spesso un unico materiale non \u00e8 in grado di soddisfare tutti i requisiti. <strong>Strutture ibride<\/strong> la soluzione ottimale.<\/p><ul class=\"wp-block-list\"><li><strong>Scenario 1: necessit\u00e0 di gestire segnali ad alta velocit\u00e0 e alta potenza<\/strong><ul class=\"wp-block-list\"><li><strong>Soluzione:<\/strong> Impiegati <strong>Strutture ibride FR-4\/PTFE-Ceramica<\/strong>. Ad esempio, l'inserimento di un chip ceramico all'interno di una scheda in PTFE consente di montare i dispositivi di alimentazione direttamente sulla ceramica per la dissipazione del calore, mentre i segnali ad alta velocit\u00e0 viaggiano senza perdite attraverso il PTFE.<\/li><\/ul><\/li>\n\n<li><strong>Scenario 2: il compromesso definitivo tra costi e prestazioni<\/strong><ul class=\"wp-block-list\"><li><strong>Soluzione:<\/strong> uso <strong>Laminati ibridi di PTFE e FR-4<\/strong>. Gli strati critici che richiedono un'estrema integrit\u00e0 del segnale (ad esempio, gli strati esterni) utilizzano il PTFE, mentre gli strati di potenza e di segnale a bassa velocit\u00e0 utilizzano l'FR-4, ottenendo un perfetto equilibrio tra prestazioni e costi.<\/li><\/ul><\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p><strong>Consigli pratici:<\/strong> Prima di finalizzare il substrato, <strong>\u00e8 fondamentale condurre una Joint Design Review (JDM) con un produttore esperto in materiali specializzati, come TopFastPCB.<\/strong> Possono fornire una consulenza esperta su <strong>disponibilit\u00e0 di materiali, resa di lavorazione e soluzioni di struttura ibrida pi\u00f9 economiche<\/strong>che \u00e8 un passo fondamentale per garantire il successo del lancio del vostro progetto 2025.<\/p><\/blockquote><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/PCB-substrate-2.jpg\" alt=\"Substrato PCB\" class=\"wp-image-4678\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/PCB-substrate-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/PCB-substrate-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/PCB-substrate-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>conclusioni<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Nel 2025 non esiste un unico substrato \"migliore\", ma solo la scelta \"pi\u00f9 appropriata\". I confini dell'FR-4 si stanno espandendo, il costo del PTFE si sta gradualmente ottimizzando e le applicazioni della ceramica si stanno ampliando. Ci auguriamo che questa guida vi aiuti a superare la complessit\u00e0 e a trovare l'intersezione ottimale tra prestazioni e costi per il vostro prossimo prodotto.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Frequently_Asked_Questions_on_PCB_Substrate\"><\/span>Domande frequenti sul substrato per PCB<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1763727385767\"><strong class=\"schema-faq-question\"><strong>D: Ho sentito parlare di \"FR-4 a bassa perdita\". Le sue prestazioni sono sufficienti per sostituire il PTFE? \u00c8 la soluzione pi\u00f9 conveniente?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong>\u00a0Si tratta di una domanda critica. L'FR-4 a bassa perdita rappresenta un progresso significativo all'interno della famiglia dell'FR-4, colmando efficacemente il divario di prestazioni tra l'FR-4 standard e il PTFE.<br\/><strong>Pu\u00f2 sostituire il PTFE?<\/strong>\u00a0La risposta \u00e8\u00a0<strong>\"Dipende dall'applicazione\".<\/strong>\u00a0Per velocit\u00e0 di segnale nell'intervallo 5-20 Gbps con requisiti di perdita moderati, ma non estremi (ad esempio, canali a media velocit\u00e0 in switch di fascia alta), l'FR-4 a bassa perdita \u00e8 una scelta altamente conveniente. Tuttavia, per\u00a0<strong>frequenze a onde millimetriche<\/strong>\u00a0o\u00a0<strong>canali SerDes ad altissima velocit\u00e0 di 112 Gbps e oltre<\/strong>Il Df\/Dk estremamente basso e stabile del PTFE \u00e8 fondamentale per l'integrit\u00e0 del segnale e rimane ineguagliato dall'FR-4 a bassa perdita.<br\/><strong>Consigli per le decisioni:<\/strong>\u00a0Non concentratevi solo sul valore della Df. \u00c8 essenziale eseguire\u00a0<strong>simulazioni di canale<\/strong>\u00a0per valutarne l'idoneit\u00e0 rispetto agli obiettivi di budget e perdita del collegamento. Nel 2025, l'uso di FR-4 a bassa perdita per gli strati di segnale meno sensibili in un progetto ibrido con PTFE sta diventando una strategia di ottimizzazione dei costi molto diffusa.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1763727394831\"><strong class=\"schema-faq-question\"><strong>D: Il mio progetto ha requisiti termici elevati, ma i substrati ceramici sono troppo costosi. Esistono soluzioni intermedie?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong>\u00a0Assolutamente s\u00ec. Tra \"Standard FR-4\" e \"Premium Ceramic\", c'\u00e8 una serie di soluzioni ampiamente adottate:<br\/><strong>Soluzione primaria: PCB con anima in metallo (ad esempio, IMS in alluminio).<\/strong>\u00a0Questi dispositivi raggiungono un'efficiente conduzione termica laminando un'anima metallica (in genere alluminio) sotto lo strato del circuito FR-4. Il costo \u00e8 significativamente inferiore a quello della ceramica. Il costo \u00e8 significativamente inferiore a quello della ceramica, il che lo rende la scelta pi\u00f9 diffusa per l'illuminazione a LED ad alta potenza e per i moduli di potenza per autoveicoli.<br\/><strong>Soluzione avanzata: Dielettrici ad alta conducibilit\u00e0 termica.<\/strong>\u00a0Alcuni substrati speciali (ad esempio, alcune epossidiche o poliimmidi caricate con ceramica) offrono una conducibilit\u00e0 termica di 1-3 W\/mK. Anche se non \u00e8 elevata come quella della ceramica, si tratta di un netto miglioramento rispetto all'FR-4 standard (~0,3 W\/mK), pur mantenendo la lavorabilit\u00e0 e i vantaggi economici dei materiali organici.<br\/><strong>La soluzione definitiva: Intarsi in ceramica localizzati.<\/strong>\u00a0Una piccola piastrella di ceramica viene incorporata appena sotto il componente che genera pi\u00f9 calore (ad esempio, un transistor GaN) in una scheda FR-4 o PTFE. In questo modo si ottengono prestazioni termiche \"on-demand\", controllando efficacemente il costo complessivo.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1763727409666\"><strong class=\"schema-faq-question\"><strong>D: Ho deciso di utilizzare il PTFE. Perch\u00e9 il produttore di PCB continua a chiedere dettagli sul progetto e a sottolineare le sfide del processo?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong>\u00a0La cautela del fabbricante \u00e8 un segno di professionalit\u00e0, che deriva dalle propriet\u00e0 fisico-chimiche molto diverse del PTFE rispetto all'FR4. Le sfide principali sono:<br\/><strong>Forza di adesione della laminazione:<\/strong>\u00a0Il PTFE \u00e8 intrinsecamente non appiccicoso e richiede una speciale\u00a0<strong>trattamento al plasma<\/strong>\u00a0per irruvidire la superficie e ottenere una forte adesione al foglio di rame e agli altri strati.<br\/><strong>Qualit\u00e0 della perforazione:<\/strong>\u00a0Il PTFE \u00e8 relativamente morbido e duttile, il che lo rende incline a\u00a0<strong>striscio di trapano<\/strong>\u00a0e bave durante la foratura, che influiscono sulla qualit\u00e0 della parete del foro e pongono problemi per la successiva placcatura.<br\/><strong>Stabilit\u00e0 dimensionale:<\/strong>\u00a0Il PTFE ha un elevato coefficiente di espansione termica (CTE). Il suo diverso tasso di ritiro rispetto all'FR-4 durante i cicli di laminazione multipli richiede un'accuratezza di registrazione estremamente elevata per\u00a0<strong>schede multistrato ad alto numero di strati<\/strong>.<br\/>Per questo motivo, la comunicazione pre-produzione con un produttore esperto nella lavorazione del PTFE (come TopFastPCB) per adattare il suo processo al vostro progetto \u00e8 fondamentale per il successo del progetto.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1763727430067\"><strong class=\"schema-faq-question\"><strong>D: La costante dielettrica (Dk) \u00e8 un valore fisso? Cambia a frequenze diverse?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong>\u00a0No, Dk \u00e8\u00a0<strong>non un valore fisso<\/strong>. La costante dielettrica di quasi tutti i materiali varia con la frequenza, una propriet\u00e0 nota come \"dispersione Dk\".<br\/><strong>FR-4:<\/strong>\u00a0Il suo valore Dk diminuisce sensibilmente con l'aumentare della frequenza; ad esempio, pu\u00f2 scendere da 4,5 a 1GHz a 4,2 a 10GHz. Questa instabilit\u00e0 introduce incertezza nel controllo dell'impedenza alle alte frequenze.<br\/><strong>PTFE\/Ceramica:<\/strong>\u00a0I loro valori Dk variano pochissimo con la frequenza, dimostrando un'elevata stabilit\u00e0. Proprio per questo motivo sono indispensabili nelle applicazioni esigenti ad alta frequenza\/alta velocit\u00e0.<br\/><strong>2025 Implicazioni per la progettazione:<\/strong>\u00a0Per le simulazioni, utilizzare sempre il valore Dk fornito dal produttore, misurato nell'intervallo di frequenza desiderato, e non solo il valore a bassa frequenza o nominale.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1763727448655\"><strong class=\"schema-faq-question\"><strong>D: Con un occhio al futuro, dovrei scegliere direttamente un substrato pi\u00f9 avanzato per \"essere a prova di futuro\"?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>A:<\/strong>\u00a0Si tratta di un classico dilemma di sovraingegneria. Il nostro consiglio \u00e8:\u00a0<strong>Evitare l'eccessiva ingegnerizzazione; attenersi al principio \"design-for-need\".<\/strong><br\/><strong>Trappola dei costi:<\/strong>\u00a0L'uso di un substrato che supera di gran lunga le attuali esigenze di prestazioni porta direttamente a un'impennata dei costi della distinta base e pu\u00f2 introdurre un'inutile complessit\u00e0 di produzione, sacrificando la competitivit\u00e0 del prezzo del prodotto.<br\/><strong>Rischio di iterazione della tecnologia:<\/strong>\u00a0La tecnologia elettronica si evolve rapidamente. Il materiale di alto livello scelto oggi per \"essere a prova di futuro\" potrebbe essere sostituito da una tecnologia pi\u00f9 economica l'anno prossimo.<br\/><strong>La giusta strategia:<\/strong>\u00a0Un approccio pi\u00f9 saggio \u00e8 quello di incorporare la possibilit\u00e0 di aggiornamento nel progetto iniziale.\u00a0<strong>layout, instradamento, selezione dei connettori e architettura del sistema<\/strong>\u00a0livelli. Ad esempio, anche se inizialmente si utilizza l'FR-4, \u00e8 possibile pianificare i futuri cambiamenti tecnologici ottimizzando lo stack-up e riservando spazio per la schermatura. Investite il vostro budget dove crea il valore pi\u00f9 diretto.<\/p> <\/div> <\/div>","protected":false},"excerpt":{"rendered":"<p>Questa guida fornisce un'analisi approfondita delle caratteristiche tecniche dei tre principali materiali di substrato: FR-4, PTFE e ceramica, offrendo un processo decisionale sistematico che comprende la velocit\u00e0 del segnale, i requisiti di gestione termica e il controllo dei costi. L'articolo non si limita a descrivere i limiti delle prestazioni dell'FR-4 e del PTFE a bassa perdita e i vantaggi della gestione termica dei substrati ceramici, ma introduce anche soluzioni all'avanguardia come i progetti di strutture ibride. Include diagrammi dettagliati della matrice di selezione e risposte a cinque domande comuni, fornendo agli ingegneri un quadro di riferimento pratico per affrontare scenari applicativi digitali ad alta velocit\u00e0, RF ad alta frequenza e ad alta potenza.<\/p>","protected":false},"author":1,"featured_media":4677,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[108],"tags":[409],"class_list":["post-4672","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb-substrate"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB Substrate Selection Guide: How to Make the Best Decision Between FR-4, PTFE, and Ceramic? - Topfastpcb<\/title>\n<meta name=\"description\" content=\"\u30102025 Authoritative Guide\u3011In-Depth Analysis of Core Differences Between FR-4, PTFE, and Ceramic PCB Substrates. 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Is it the most cost-effective solution?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"<strong>A:<\/strong>\u00a0This is a critical boundary question. Low-Loss FR-4 is indeed a significant advancement within the FR-4 family, effectively bridging the performance gap between standard FR-4 and PTFE.<br\/><strong>Can it replace PTFE?<\/strong>\u00a0The answer is\u00a0<strong>\\\"It depends on the application.\\\"<\/strong>\u00a0For signal rates in the 5-20 Gbps range with moderate, but not extreme, loss requirements (e.g., mid-speed channels in high-end switches), Low-Loss FR-4 is a highly cost-effective choice. However, for\u00a0<strong>millimeter-wave frequencies<\/strong>\u00a0or\u00a0<strong>ultra-high-speed SerDes channels of 112 Gbps and beyond<\/strong>, PTFE's extremely low and stable Df\/Dk is fundamental for signal integrity and remains unmatched by Low-Loss FR-4.<br\/><strong>Decision Advice:<\/strong>\u00a0Don't focus solely on the Df value. It's essential to perform\u00a0<strong>channel simulations<\/strong>\u00a0to evaluate its suitability against your link budget and loss targets. In 2025, using Low-Loss FR-4 for less sensitive signal layers in a hybrid design with PTFE is becoming a popular cost-optimization strategy.\",\"inLanguage\":\"it-IT\"},\"inLanguage\":\"it-IT\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727394831\",\"position\":2,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727394831\",\"name\":\"Q: My project has high thermal requirements, but ceramic substrates are too expensive. Are there any intermediate solutions?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"<strong>A:<\/strong>\u00a0Absolutely. Between \\\"Standard FR-4\\\" and \\\"Premium Ceramic,\\\" there is a\u9636\u68af of widely adopted solutions:<br\/><strong>Primary Solution: Metal Core PCBs (e.g., Aluminum IMS).<\/strong>\u00a0These achieve efficient thermal conduction by laminating a metal core (typically aluminum) beneath the FR-4 circuit layer. The cost is significantly lower than ceramic, making it the mainstream choice for high-power LED lighting and automotive power modules.<br\/><strong>Advanced Solution: High Thermal Conductivity Dielectrics.<\/strong>\u00a0Some specialty substrates (e.g., certain ceramic-filled epoxies or polyimides) offer thermal conductivity of 1-3 W\/mK. While not as high as ceramic, this is a marked improvement over standard FR-4 (~0.3 W\/mK), while maintaining the processability and cost advantages of organic materials.<br\/><strong>Ultimate Solution: Localized Ceramic Inlays.<\/strong>\u00a0A small ceramic tile is embedded just beneath the most heat-generating component (e.g., a GaN transistor) in an otherwise FR-4 or PTFE board. This provides \\\"on-demand\\\" thermal performance, effectively controlling the overall cost.\",\"inLanguage\":\"it-IT\"},\"inLanguage\":\"it-IT\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727409666\",\"position\":3,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727409666\",\"name\":\"Q: I've decided to use PTFE. Why does the PCB fabricator keep asking for design details and emphasizing process challenges?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"<strong>A:<\/strong>\u00a0The fabricator's caution is a sign of professionalism, stemming from the vastly different physicochemical properties of PTFE compared to FR-4. The core challenges are:<br\/><strong>Lamination Bonding Strength:<\/strong>\u00a0PTFE is inherently non-sticky and requires special\u00a0<strong>plasma treatment<\/strong>\u00a0to roughen its surface for strong adhesion to copper foil and other layers.<br\/><strong>Drilling Quality:<\/strong>\u00a0PTFE is relatively soft and ductile, making it prone to\u00a0<strong>drill smear<\/strong>\u00a0and burrs during drilling, which affects hole wall quality and poses challenges for subsequent plating.<br\/><strong>Dimensional Stability:<\/strong>\u00a0PTFE has a high Coefficient of Thermal Expansion (CTE). Its different shrinkage rate compared to FR-4 during multiple lamination cycles demands extremely high registration accuracy for\u00a0<strong>high-layer-count multilayer boards<\/strong>.<br\/>Therefore, engaging in pre-production communication with a manufacturer experienced in PTFE processing (like TopFastPCB) to adapt their process to your design is crucial for project success.\",\"inLanguage\":\"it-IT\"},\"inLanguage\":\"it-IT\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727430067\",\"position\":4,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727430067\",\"name\":\"Q: Is the Dielectric Constant (Dk) a fixed value? Does it change at different frequencies?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"<strong>A:<\/strong>\u00a0No, Dk is\u00a0<strong>not a fixed value<\/strong>. The dielectric constant of almost all materials varies with frequency, a property known as \\\"Dk dispersion.\\\"<br\/><strong>FR-4:<\/strong>\u00a0Its Dk value decreases noticeably as frequency increases; for example, it might drop from 4.5 at 1GHz to 4.2 at 10GHz. This instability introduces uncertainty in impedance control at high frequencies.<br\/><strong>PTFE\/Ceramic:<\/strong>\u00a0Their Dk values change very little with frequency, exhibiting high stability. This is precisely why they are indispensable in demanding high-frequency\/high-speed applications.<br\/><strong>2025 Design Implication:<\/strong>\u00a0Always use the Dk value provided by the manufacturer, measured within your target frequency range, for simulations\u2014not just the low-frequency or nominal value.\",\"inLanguage\":\"it-IT\"},\"inLanguage\":\"it-IT\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727448655\",\"position\":5,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727448655\",\"name\":\"Q: With an eye on the future, should I choose a more advanced substrate directly for \\\"future-proofing\\\"?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"<strong>A:<\/strong>\u00a0This is a classic over-engineering dilemma. Our advice is:\u00a0<strong>Avoid over-engineering; adhere to the \\\"design-for-need\\\" principle.<\/strong><br\/><strong>Cost Trap:<\/strong>\u00a0Using a substrate that far exceeds current performance needs directly leads to soaring BOM costs and may introduce unnecessary manufacturing complexity, sacrificing your product's price competitiveness.<br\/><strong>Technology Iteration Risk:<\/strong>\u00a0Electronics technology iterates rapidly. The top-tier material chosen today for \\\"future-proofing\\\" might be superseded by a more cost-effective technology next year.<br\/><strong>The Right Strategy:<\/strong>\u00a0A wiser approach is to build upgradeability into the initial design at the\u00a0<strong>layout, routing, connector selection, and system architecture<\/strong>\u00a0levels. For instance, even when using FR-4 initially, you can plan for future technology shifts by optimizing the stack-up and reserving space for shielding. 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Is it the most cost-effective solution?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"<strong>A:<\/strong>\u00a0This is a critical boundary question. Low-Loss FR-4 is indeed a significant advancement within the FR-4 family, effectively bridging the performance gap between standard FR-4 and PTFE.<br\/><strong>Can it replace PTFE?<\/strong>\u00a0The answer is\u00a0<strong>\"It depends on the application.\"<\/strong>\u00a0For signal rates in the 5-20 Gbps range with moderate, but not extreme, loss requirements (e.g., mid-speed channels in high-end switches), Low-Loss FR-4 is a highly cost-effective choice. However, for\u00a0<strong>millimeter-wave frequencies<\/strong>\u00a0or\u00a0<strong>ultra-high-speed SerDes channels of 112 Gbps and beyond<\/strong>, PTFE's extremely low and stable Df\/Dk is fundamental for signal integrity and remains unmatched by Low-Loss FR-4.<br\/><strong>Decision Advice:<\/strong>\u00a0Don't focus solely on the Df value. It's essential to perform\u00a0<strong>channel simulations<\/strong>\u00a0to evaluate its suitability against your link budget and loss targets. In 2025, using Low-Loss FR-4 for less sensitive signal layers in a hybrid design with PTFE is becoming a popular cost-optimization strategy.","inLanguage":"it-IT"},"inLanguage":"it-IT"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727394831","position":2,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727394831","name":"Q: My project has high thermal requirements, but ceramic substrates are too expensive. Are there any intermediate solutions?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"<strong>A:<\/strong>\u00a0Absolutely. Between \"Standard FR-4\" and \"Premium Ceramic,\" there is a\u9636\u68af of widely adopted solutions:<br\/><strong>Primary Solution: Metal Core PCBs (e.g., Aluminum IMS).<\/strong>\u00a0These achieve efficient thermal conduction by laminating a metal core (typically aluminum) beneath the FR-4 circuit layer. The cost is significantly lower than ceramic, making it the mainstream choice for high-power LED lighting and automotive power modules.<br\/><strong>Advanced Solution: High Thermal Conductivity Dielectrics.<\/strong>\u00a0Some specialty substrates (e.g., certain ceramic-filled epoxies or polyimides) offer thermal conductivity of 1-3 W\/mK. While not as high as ceramic, this is a marked improvement over standard FR-4 (~0.3 W\/mK), while maintaining the processability and cost advantages of organic materials.<br\/><strong>Ultimate Solution: Localized Ceramic Inlays.<\/strong>\u00a0A small ceramic tile is embedded just beneath the most heat-generating component (e.g., a GaN transistor) in an otherwise FR-4 or PTFE board. This provides \"on-demand\" thermal performance, effectively controlling the overall cost.","inLanguage":"it-IT"},"inLanguage":"it-IT"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727409666","position":3,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727409666","name":"Q: I've decided to use PTFE. Why does the PCB fabricator keep asking for design details and emphasizing process challenges?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"<strong>A:<\/strong>\u00a0The fabricator's caution is a sign of professionalism, stemming from the vastly different physicochemical properties of PTFE compared to FR-4. The core challenges are:<br\/><strong>Lamination Bonding Strength:<\/strong>\u00a0PTFE is inherently non-sticky and requires special\u00a0<strong>plasma treatment<\/strong>\u00a0to roughen its surface for strong adhesion to copper foil and other layers.<br\/><strong>Drilling Quality:<\/strong>\u00a0PTFE is relatively soft and ductile, making it prone to\u00a0<strong>drill smear<\/strong>\u00a0and burrs during drilling, which affects hole wall quality and poses challenges for subsequent plating.<br\/><strong>Dimensional Stability:<\/strong>\u00a0PTFE has a high Coefficient of Thermal Expansion (CTE). Its different shrinkage rate compared to FR-4 during multiple lamination cycles demands extremely high registration accuracy for\u00a0<strong>high-layer-count multilayer boards<\/strong>.<br\/>Therefore, engaging in pre-production communication with a manufacturer experienced in PTFE processing (like TopFastPCB) to adapt their process to your design is crucial for project success.","inLanguage":"it-IT"},"inLanguage":"it-IT"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727430067","position":4,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727430067","name":"Q: Is the Dielectric Constant (Dk) a fixed value? Does it change at different frequencies?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"<strong>A:<\/strong>\u00a0No, Dk is\u00a0<strong>not a fixed value<\/strong>. The dielectric constant of almost all materials varies with frequency, a property known as \"Dk dispersion.\"<br\/><strong>FR-4:<\/strong>\u00a0Its Dk value decreases noticeably as frequency increases; for example, it might drop from 4.5 at 1GHz to 4.2 at 10GHz. This instability introduces uncertainty in impedance control at high frequencies.<br\/><strong>PTFE\/Ceramic:<\/strong>\u00a0Their Dk values change very little with frequency, exhibiting high stability. This is precisely why they are indispensable in demanding high-frequency\/high-speed applications.<br\/><strong>2025 Design Implication:<\/strong>\u00a0Always use the Dk value provided by the manufacturer, measured within your target frequency range, for simulations\u2014not just the low-frequency or nominal value.","inLanguage":"it-IT"},"inLanguage":"it-IT"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727448655","position":5,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-substrate-selection-guide\/#faq-question-1763727448655","name":"Q: With an eye on the future, should I choose a more advanced substrate directly for \"future-proofing\"?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"<strong>A:<\/strong>\u00a0This is a classic over-engineering dilemma. Our advice is:\u00a0<strong>Avoid over-engineering; adhere to the \"design-for-need\" principle.<\/strong><br\/><strong>Cost Trap:<\/strong>\u00a0Using a substrate that far exceeds current performance needs directly leads to soaring BOM costs and may introduce unnecessary manufacturing complexity, sacrificing your product's price competitiveness.<br\/><strong>Technology Iteration Risk:<\/strong>\u00a0Electronics technology iterates rapidly. The top-tier material chosen today for \"future-proofing\" might be superseded by a more cost-effective technology next year.<br\/><strong>The Right Strategy:<\/strong>\u00a0A wiser approach is to build upgradeability into the initial design at the\u00a0<strong>layout, routing, connector selection, and system architecture<\/strong>\u00a0levels. For instance, even when using FR-4 initially, you can plan for future technology shifts by optimizing the stack-up and reserving space for shielding. Invest your budget where it creates the most direct value.","inLanguage":"it-IT"},"inLanguage":"it-IT"}]}},"_links":{"self":[{"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/posts\/4672","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/comments?post=4672"}],"version-history":[{"count":1,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/posts\/4672\/revisions"}],"predecessor-version":[{"id":4679,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/posts\/4672\/revisions\/4679"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/media\/4677"}],"wp:attachment":[{"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/media?parent=4672"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/categories?post=4672"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/tags?post=4672"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}