{"id":5054,"date":"2026-01-31T08:14:00","date_gmt":"2026-01-31T00:14:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=5054"},"modified":"2026-01-21T15:56:43","modified_gmt":"2026-01-21T07:56:43","slug":"cracked-vias-and-barrel-cracks-in-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/","title":{"rendered":"Vias incrinati e crepe a barile nei PCB"},"content":{"rendered":"<p>Le fessure dei vias e le fessure dei barili sono tra le pi\u00f9 critiche. <strong>guasti latenti dell'affidabilit\u00e0<\/strong> nella produzione di PCB.<\/p><p>Questi difetti spesso superano i test elettrici iniziali ma si guastano successivamente sotto stress termico o meccanico, rendendoli particolarmente pericolosi nelle applicazioni ad alta affidabilit\u00e0.<\/p><p>Questo articolo spiega:<\/p><ul class=\"wp-block-list\"><li>Che cosa sono le fessure di via e le fessure di botte?<\/li>\n\n<li>Perch\u00e9 si verificano<\/li>\n\n<li>Come vengono rilevati<\/li>\n\n<li>Come i produttori riducono la loro incidenza<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"337\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures.jpg\" alt=\"Guasti ai PCB\" class=\"wp-image-5055\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-300x169.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-18x10.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Indice per materie<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#What_Are_Via_Cracks_and_Barrel_Cracks\" >Che cosa sono le fessure di via e le fessure a botte?<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Via_Crack\" >Via Crack<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Barrel_Crack\" >Barile crack<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Why_Via_Cracks_Are_a_Serious_Reliability_Issue\" >Perch\u00e9 le fessure della via sono un grave problema di affidabilit\u00e0<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Primary_Causes_of_Via_and_Barrel_Cracks\" >Cause primarie delle fessurazioni di vie e barili<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Z-Axis_Expansion_Mismatch\" >Disadattamento dell'espansione dell'asse Z<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Thin_or_Non-Uniform_Copper_Plating\" >Placcatura di rame sottile o non uniforme<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#High_Aspect_Ratio_Vias\" >Vias ad alto rapporto d'aspetto<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Excessive_Thermal_Cycling\" >Ciclo termico eccessivo<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Design_Factors_That_Increase_Via_Crack_Risk\" >Fattori di progettazione che aumentano il rischio di fessurazione<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#High-Risk_Design_Choices\" >Scelte progettuali ad alto rischio<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Manufacturing_Factors_Contributing_to_Via_Cracks\" >Fattori di produzione che contribuiscono alle fessure della via<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Drilling_Quality\" >Qualit\u00e0 della perforazione<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Inadequate_Desmear_Process\" >Processo di desmear inadeguato<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Plating_Stress_Control\" >Controllo delle sollecitazioni di placcatura<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#How_Via_Cracks_Are_Detected\" >Come vengono rilevate le fessure<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Common_Detection_Methods\" >Metodi di rilevamento comuni<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Preventing_Cracked_Vias_and_Barrel_Cracks\" >Prevenzione delle fessurazioni e delle crepe del barile<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Design-Level_Prevention\" >Prevenzione a livello di progettazione<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Process-Level_Prevention\" >Prevenzione a livello di processo<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Material_Selection\" >Selezione materiale<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Relationship_to_Other_PCB_Failure_Modes\" >Relazione con altre modalit\u00e0 di guasto dei PCB<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Conclusion\" >conclusioni<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-24\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#Via_Cracks_in_PCB_FAQ\" >FAQ Crepe nei circuiti stampati<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Are_Via_Cracks_and_Barrel_Cracks\"><\/span>Che cosa sono le fessure di via e le fessure a botte?<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Via_Crack\"><\/span>Via Crack<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Una cricca di via \u00e8 una frattura nella placcatura di rame di una via, in genere in corrispondenza di una delle due:<\/p><ul class=\"wp-block-list\"><li>Il ginocchio della via<\/li>\n\n<li>L'interfaccia tra rame e dielettrico<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Barrel_Crack\"><\/span>Barile crack<span class=\"ez-toc-section-end\"><\/span><\/h3><p>La fessura del barile si riferisce in particolare a una <strong>fessura circonferenziale<\/strong> nella canna placcata.<\/p><p>Entrambi interrompono la continuit\u00e0 elettrica nel tempo.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Why_Via_Cracks_Are_a_Serious_Reliability_Issue\"><\/span>Perch\u00e9 le fessure della via sono un grave problema di affidabilit\u00e0<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Le fessure sono pericolose perch\u00e9:<\/p><ul class=\"wp-block-list\"><li>Sono spesso intermittenti<\/li>\n\n<li>Peggiora con i cicli termici<\/li>\n\n<li>Sono difficili da individuare visivamente<\/li><\/ul><p>Spesso compaiono solo dopo l'uso sul campo o dopo un test di stress.<\/p><p><em>Panoramica del fallimento:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/it\/blog\/common-pcb-failures-causes-solutions\/\">Spiegazione dei guasti pi\u00f9 comuni dei circuiti stampati<\/a><\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Primary_Causes_of_Via_and_Barrel_Cracks\"><\/span>Cause primarie delle fessurazioni di vie e barili<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Z-Axis_Expansion_Mismatch\"><\/span>Disadattamento dell'espansione dell'asse Z<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Durante il riscaldamento, i materiali dielettrici si espandono maggiormente rispetto al rame nell'asse Z.<\/p><p>Le ripetute espansioni e contrazioni creano tensioni nella canna della via.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Thin_or_Non-Uniform_Copper_Plating\"><\/span>Placcatura di rame sottile o non uniforme<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Uno spessore di placcatura insufficiente riduce la capacit\u00e0 della via di assorbire le sollecitazioni meccaniche.<\/p><p> <em>Dettaglio del processo:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/it\/blog\/copper-plating-process-in-pcb-manufacturing-explained\/\">Processo di ramatura nella produzione di PCB<\/a><\/strong><\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High_Aspect_Ratio_Vias\"><\/span>Vias ad alto rapporto d'aspetto<span class=\"ez-toc-section-end\"><\/span><\/h3><p>I vias ad alto rapporto di aspetto sono pi\u00f9 difficili da placcare in modo uniforme e subiscono maggiori sollecitazioni.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Excessive_Thermal_Cycling\"><\/span>Ciclo termico eccessivo<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Esposizione ripetuta a:<\/p><ul class=\"wp-block-list\"><li>Saldatura a riflusso<\/li>\n\n<li>Cicli di alimentazione<\/li>\n\n<li>Cambiamenti di temperatura ambientale<\/li><\/ul><p>Accelera la formazione di crepe.<\/p><p><em>Test di affidabilit\u00e0:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-reliability-testing-standards\/\">Test di affidabilit\u00e0 termica dei PCB<\/a><\/strong><\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"337\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-1.jpg\" alt=\"Guasti ai PCB\" class=\"wp-image-5056\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-1-300x169.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-1-18x10.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Design_Factors_That_Increase_Via_Crack_Risk\"><\/span>Fattori di progettazione che aumentano il rischio di fessurazione<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Alcune decisioni progettuali aumentano significativamente il rischio.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High-Risk_Design_Choices\"><\/span>Scelte progettuali ad alto rischio<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Diametri di passaggio molto piccoli<\/li>\n\n<li>Spessore sottile del PCB con vias profondi<\/li>\n\n<li>Piani di rame di grandi dimensioni senza rilievo<\/li>\n\n<li>Strutture dense via-in-pad<\/li><\/ul><p>La revisione della progettazione per l'affidabilit\u00e0 \u00e8 fondamentale.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Factors_Contributing_to_Via_Cracks\"><\/span>Fattori di produzione che contribuiscono alle fessure della via<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Drilling_Quality\"><\/span>Qualit\u00e0 della perforazione<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Le sbavature da trapano, le pareti ruvide dei fori o l'estrazione delle fibre indeboliscono l'adesione del rame.<\/p><p><em>Confronto:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-drilling-vs-laser-drilling\/\">Foratura di PCB vs foratura laser<\/a><\/strong><\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Inadequate_Desmear_Process\"><\/span>Processo di desmear inadeguato<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Una scarsa desmear impedisce il corretto legame del rame con il dielettrico.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Plating_Stress_Control\"><\/span>Controllo delle sollecitazioni di placcatura<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Una chimica di placcatura non corretta pu\u00f2 introdurre tensioni interne nei depositi di rame.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_Via_Cracks_Are_Detected\"><\/span>Come vengono rilevate le fessure<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Raramente le cricche da via vengono rilevate solo con l'ispezione della superficie.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_Detection_Methods\"><\/span>Metodi di rilevamento comuni<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Test di stress termico<\/li>\n\n<li>Analisi della microsezione<\/li>\n\n<li>Test elettrico dopo il ciclo<\/li>\n\n<li>Ispezione a raggi X (efficacia limitata)<\/li><\/ul><p><em>Panoramica delle ispezioni:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-inspection-and-testing\/\">Spiegazione dell'ispezione e del test dei PCB<\/a><\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Preventing_Cracked_Vias_and_Barrel_Cracks\"><\/span>Prevenzione delle fessurazioni e delle crepe del barile<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Design-Level_Prevention\"><\/span>Prevenzione a livello di progettazione<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Diametro adeguato della via<\/li>\n\n<li>Rapporto d'aspetto controllato<\/li>\n\n<li>Schemi di rilievo termico<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Process-Level_Prevention\"><\/span>Prevenzione a livello di processo<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Parametri di perforazione ottimizzati<\/li>\n\n<li>Spessore uniforme della ramatura<\/li>\n\n<li>Chimica di placcatura a stress controllato<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Material_Selection\"><\/span>Selezione materiale<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Materiali a bassa espansione sull'asse Z<\/li>\n\n<li>Laminati ad alto Tg per la stabilit\u00e0 termica<\/li><\/ul><p>Produttori come TOPFAST integrano le considerazioni sull'affidabilit\u00e0 gi\u00e0 nella pianificazione del processo.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"337\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-2.jpg\" alt=\"Guasti ai PCB\" class=\"wp-image-5057\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-2-300x169.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-2-18x10.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Relationship_to_Other_PCB_Failure_Modes\"><\/span>Relazione con altre modalit\u00e0 di guasto dei PCB<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Le fessure di via spesso coesistono con:<\/p><ul class=\"wp-block-list\"><li>Delaminazione<\/li>\n\n<li>Formazione di CAF<\/li>\n\n<li>Circuiti aperti intermittenti<\/li><\/ul><p><em>Argomento correlato:<\/em><br><strong><a href=\"https:\/\/www.topfastpcb.com\/it\/blog\/pcb-delamination-causes-prevention\/\">Cause e prevenzione della delaminazione dei PCB<\/a><\/strong><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>conclusioni<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Le fessure dei vias e le fessure dei barili non sono difetti casuali, ma risultati prevedibili di <strong>stress termico, decisioni di progettazione e limitazioni di processo<\/strong>.<\/p><p>Attraverso:<\/p><ul class=\"wp-block-list\"><li>Pratiche di progettazione corrette<\/li>\n\n<li>Processi di produzione controllati<\/li>\n\n<li>Selezione appropriata del materiale<\/li><\/ul><p>La loro presenza pu\u00f2 essere ridotta in modo significativo.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Via_Cracks_in_PCB_FAQ\"><\/span>FAQ Crepe nei circuiti stampati<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1768981138484\"><strong class=\"schema-faq-question\">D: \u00c8 possibile riparare le fessure?<\/strong> <p class=\"schema-faq-answer\">R: No. Una volta incrinati, i vias non possono essere riparati in modo affidabile.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1768981208332\"><strong class=\"schema-faq-question\">Q: <strong>Tutte le fessure passanti causano un guasto immediato?<\/strong><\/strong> <p class=\"schema-faq-answer\">R: No. Molti sono latenti e intermittenti.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1768981226138\"><strong class=\"schema-faq-question\">Q: <strong>Il rame pi\u00f9 spesso \u00e8 sempre meglio?<\/strong><\/strong> <p class=\"schema-faq-answer\">R: Non sempre, ma uno spessore sufficiente e uniforme \u00e8 fondamentale.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1768981244482\"><strong class=\"schema-faq-question\">Q: <strong>Le cricche da via sono pi\u00f9 comuni negli assemblaggi senza piombo?<\/strong><\/strong> <p class=\"schema-faq-answer\">R: S\u00ec, a causa delle temperature di rifusione pi\u00f9 elevate.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1768981259852\"><strong class=\"schema-faq-question\">Q: <strong>I raggi X possono rilevare le fessure?<\/strong><\/strong> <p class=\"schema-faq-answer\">R: Di solito no, a meno che le crepe non siano gravi.<\/p> <\/div> <\/div>","protected":false},"excerpt":{"rendered":"<p>I vias e i barrel crack sono guasti frequenti sui circuiti stampati. Questo articolo ne esplora le cause principali, le tecniche di rilevamento e le misure preventive adottate dai produttori per garantire l'affidabilit\u00e0.<\/p>","protected":false},"author":1,"featured_media":5058,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[108],"tags":[438],"class_list":["post-5054","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb-failures"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Cracked Vias and Barrel Cracks in PCB: Causes, Detection, and Prevention<\/title>\n<meta name=\"description\" content=\"Cracked vias and barrel cracks are common PCB reliability failures. Learn their root causes, detection methods, and how manufacturers prevent them.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/\" \/>\n<meta property=\"og:locale\" content=\"it_IT\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Cracked Vias and Barrel Cracks in PCB: Causes, Detection, and Prevention\" \/>\n<meta property=\"og:description\" content=\"Cracked vias and barrel cracks are common PCB reliability failures. Learn their root causes, detection methods, and how manufacturers prevent them.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/\" \/>\n<meta property=\"og:site_name\" content=\"Topfastpcb\" \/>\n<meta property=\"article:published_time\" content=\"2026-01-31T00:14:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-3.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"337\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"\u6258\u666e\u6cd5\u65af\u7279\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Scritto da\" \/>\n\t<meta name=\"twitter:data1\" content=\"\u6258\u666e\u6cd5\u65af\u7279\" \/>\n\t<meta name=\"twitter:label2\" content=\"Tempo di lettura stimato\" \/>\n\t<meta name=\"twitter:data2\" content=\"4 minuti\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/\"},\"author\":{\"name\":\"\u6258\u666e\u6cd5\u65af\u7279\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a\"},\"headline\":\"Cracked Vias and Barrel Cracks in PCB\",\"datePublished\":\"2026-01-31T00:14:00+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/\"},\"wordCount\":580,\"publisher\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-3.jpg\",\"keywords\":[\"PCB Failures\"],\"articleSection\":[\"News\"],\"inLanguage\":\"it-IT\"},{\"@type\":[\"WebPage\",\"FAQPage\"],\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/\",\"url\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/\",\"name\":\"Cracked Vias and Barrel Cracks in PCB: Causes, Detection, and Prevention\",\"isPartOf\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-3.jpg\",\"datePublished\":\"2026-01-31T00:14:00+00:00\",\"description\":\"Cracked vias and barrel cracks are common PCB reliability failures. Learn their root causes, detection methods, and how manufacturers prevent them.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#breadcrumb\"},\"mainEntity\":[{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981138484\"},{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981208332\"},{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981226138\"},{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981244482\"},{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981259852\"}],\"inLanguage\":\"it-IT\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"it-IT\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#primaryimage\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-3.jpg\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-3.jpg\",\"width\":600,\"height\":337,\"caption\":\"PCB Failures\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"\u9996\u9875\",\"item\":\"https:\/\/www.topfastpcb.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Cracked Vias and Barrel Cracks in PCB\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.topfastpcb.com\/#website\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"name\":\"Topfastpcb\",\"description\":\"Topfast Prime Choice for Global Electronics Manufacturing\",\"publisher\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.topfastpcb.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"it-IT\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\",\"name\":\"Topfastpcb\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"it-IT\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"width\":144,\"height\":56,\"caption\":\"Topfastpcb\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a\",\"name\":\"\u6258\u666e\u6cd5\u65af\u7279\",\"sameAs\":[\"http:\/\/www.topfastpcb.com\"],\"url\":\"https:\/\/www.topfastpcb.com\/it\/blog\/author\/admin\/\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981138484\",\"position\":1,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981138484\",\"name\":\"Q: Can via cracks be repaired?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: No. Once cracked, vias cannot be reliably repaired.\",\"inLanguage\":\"it-IT\"},\"inLanguage\":\"it-IT\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981208332\",\"position\":2,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981208332\",\"name\":\"Q: Do all via cracks cause immediate failure?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: No. Many are latent and intermittent.\",\"inLanguage\":\"it-IT\"},\"inLanguage\":\"it-IT\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981226138\",\"position\":3,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981226138\",\"name\":\"Q: Is thicker copper always better?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Not always, but sufficient and uniform thickness is critical.\",\"inLanguage\":\"it-IT\"},\"inLanguage\":\"it-IT\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981244482\",\"position\":4,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981244482\",\"name\":\"Q: Are via cracks more common in lead-free assembly?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Yes, due to higher reflow temperatures.\",\"inLanguage\":\"it-IT\"},\"inLanguage\":\"it-IT\"},{\"@type\":\"Question\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981259852\",\"position\":5,\"url\":\"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981259852\",\"name\":\"Q: Can X-ray detect via cracks?\",\"answerCount\":1,\"acceptedAnswer\":{\"@type\":\"Answer\",\"text\":\"A: Usually not unless cracks are severe.\",\"inLanguage\":\"it-IT\"},\"inLanguage\":\"it-IT\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Cracked Vias and Barrel Cracks in PCB: Causes, Detection, and Prevention","description":"Cracked vias and barrel cracks are common PCB reliability failures. Learn their root causes, detection methods, and how manufacturers prevent them.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/","og_locale":"it_IT","og_type":"article","og_title":"Cracked Vias and Barrel Cracks in PCB: Causes, Detection, and Prevention","og_description":"Cracked vias and barrel cracks are common PCB reliability failures. Learn their root causes, detection methods, and how manufacturers prevent them.","og_url":"https:\/\/www.topfastpcb.com\/it\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/","og_site_name":"Topfastpcb","article_published_time":"2026-01-31T00:14:00+00:00","og_image":[{"width":600,"height":337,"url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-3.jpg","type":"image\/jpeg"}],"author":"\u6258\u666e\u6cd5\u65af\u7279","twitter_card":"summary_large_image","twitter_misc":{"Scritto da":"\u6258\u666e\u6cd5\u65af\u7279","Tempo di lettura stimato":"4 minuti"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#article","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/"},"author":{"name":"\u6258\u666e\u6cd5\u65af\u7279","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a"},"headline":"Cracked Vias and Barrel Cracks in PCB","datePublished":"2026-01-31T00:14:00+00:00","mainEntityOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/"},"wordCount":580,"publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-3.jpg","keywords":["PCB Failures"],"articleSection":["News"],"inLanguage":"it-IT"},{"@type":["WebPage","FAQPage"],"@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/","url":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/","name":"Cracked Vias and Barrel Cracks in PCB: Causes, Detection, and Prevention","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#primaryimage"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-3.jpg","datePublished":"2026-01-31T00:14:00+00:00","description":"Cracked vias and barrel cracks are common PCB reliability failures. Learn their root causes, detection methods, and how manufacturers prevent them.","breadcrumb":{"@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#breadcrumb"},"mainEntity":[{"@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981138484"},{"@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981208332"},{"@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981226138"},{"@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981244482"},{"@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981259852"}],"inLanguage":"it-IT","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/"]}]},{"@type":"ImageObject","inLanguage":"it-IT","@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#primaryimage","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-3.jpg","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/01\/PCB-Failures-3.jpg","width":600,"height":337,"caption":"PCB Failures"},{"@type":"BreadcrumbList","@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"\u9996\u9875","item":"https:\/\/www.topfastpcb.com\/"},{"@type":"ListItem","position":2,"name":"Cracked Vias and Barrel Cracks in PCB"}]},{"@type":"WebSite","@id":"https:\/\/www.topfastpcb.com\/#website","url":"https:\/\/www.topfastpcb.com\/","name":"Topfastpcb","description":"Topfast Prime Choice for Global Electronics Manufacturing","publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.topfastpcb.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"it-IT"},{"@type":"Organization","@id":"https:\/\/www.topfastpcb.com\/#organization","name":"Topfastpcb","url":"https:\/\/www.topfastpcb.com\/","logo":{"@type":"ImageObject","inLanguage":"it-IT","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","width":144,"height":56,"caption":"Topfastpcb"},"image":{"@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a","name":"\u6258\u666e\u6cd5\u65af\u7279","sameAs":["http:\/\/www.topfastpcb.com"],"url":"https:\/\/www.topfastpcb.com\/it\/blog\/author\/admin\/"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981138484","position":1,"url":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981138484","name":"Q: Can via cracks be repaired?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: No. Once cracked, vias cannot be reliably repaired.","inLanguage":"it-IT"},"inLanguage":"it-IT"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981208332","position":2,"url":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981208332","name":"Q: Do all via cracks cause immediate failure?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: No. Many are latent and intermittent.","inLanguage":"it-IT"},"inLanguage":"it-IT"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981226138","position":3,"url":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981226138","name":"Q: Is thicker copper always better?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Not always, but sufficient and uniform thickness is critical.","inLanguage":"it-IT"},"inLanguage":"it-IT"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981244482","position":4,"url":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981244482","name":"Q: Are via cracks more common in lead-free assembly?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Yes, due to higher reflow temperatures.","inLanguage":"it-IT"},"inLanguage":"it-IT"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981259852","position":5,"url":"https:\/\/www.topfastpcb.com\/blog\/cracked-vias-and-barrel-cracks-in-pcb\/#faq-question-1768981259852","name":"Q: Can X-ray detect via cracks?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Usually not unless cracks are severe.","inLanguage":"it-IT"},"inLanguage":"it-IT"}]}},"_links":{"self":[{"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/posts\/5054","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/comments?post=5054"}],"version-history":[{"count":1,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/posts\/5054\/revisions"}],"predecessor-version":[{"id":5059,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/posts\/5054\/revisions\/5059"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/media\/5058"}],"wp:attachment":[{"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/media?parent=5054"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/categories?post=5054"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/it\/wp-json\/wp\/v2\/tags?post=5054"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}