{"id":2945,"date":"2025-06-01T08:32:00","date_gmt":"2025-06-01T00:32:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=2945"},"modified":"2025-05-28T18:34:39","modified_gmt":"2025-05-28T10:34:39","slug":"what-is-pcb-surface-finishes","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/","title":{"rendered":"Wat is PCB oppervlakteafwerking?"},"content":{"rendered":"<p>PCB oppervlaktebehandeling verwijst naar het blootgestelde koperfolie gebied van de printplaat (zoals pads, geleidende paden) bedekt met een laag metaal of legering coating, als het koperoppervlak van de \"beschermende barri\u00e8re\" en \"lasmedium\".<\/p><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhoudsopgave<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#PCB_Surface_Finishing_Core_Functions\" >Kernfuncties van PCB oppervlakteafwerking<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#The_importance_of_PCB_surface_treatment\" >Het belang van PCB-oppervlaktebehandeling<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#Core_purpose_to_solve_the_%E2%80%9Coxidation_problem%E2%80%9D_of_the_copper_surface\" >Hoofddoel: het \"oxidatieprobleem\" van het koperoppervlak oplossen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#Industry_Importance_a_critical_process_throughout_the_PCB_life_cycle\" >Industrieel belang: een kritisch proces gedurende de hele levenscyclus van PCB's<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#In-Depth_Comparison_of_7_PCB_Surface_Finishes\" >Diepgaande vergelijking van 7 PCB oppervlakteafwerkingen<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#1_Hot_Air_Solder_Leveling_HASL\" >1. Hete lucht soldeer nivellering (HASL)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#2_Electroless_Nickel_Immersion_Gold_ENIG\" >2.Nikkel ondergedompeld goud (ENIG)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#3_Organic_Solderability_Preservative_OSP\" >3.Organisch soldeerbaarheidsbewaarmiddel (OSP)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#4_Immersion_Tin_ImSn\" >4.Onderdompeltin (ImSn)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#5_Immersion_Silver_ImAg\" >5.Onderdompelingszilver (ImAg)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#6_Electroless_Nickel_Electroless_Palladium_Immersion_Gold_ENEPIG\" >6.Nikkel Elektrolytisch Palladium Onderdompelingsgoud (ENEPIG)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#7_Electrolytic_Hard_Gold\" >7.Elektrolytisch Hard Goud<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#Selection_Decision_Tree\" >Selectie Beslisboom<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#5_Common_Failure_Clinics\" >5 veelvoorkomende faalklinieken<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#Pro_Tips_from_PCB_Manufacturers\" >Pro-tips van PCB-fabrikanten<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#Cost-Performance_Tradeoff_Analysis\" >Kosten-prestatie afweging<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/#Future_Trends_in_Surface_Finishes\" >Toekomstige trends in oppervlakteafwerkingen<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCB_Surface_Finishing_Core_Functions\"><\/span>Kernfuncties van PCB oppervlakteafwerking<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Fysieke bescherming: Isoleert koper tegen contact met lucht en vocht, waardoor oxidatie, sulfidering en andere corrosieve reacties worden voorkomen;<br>Soldeerbaarheid optimaliseren:Zorg voor een vlakke en stabiele soldeerinterface voor een betrouwbare verbinding tussen het soldeer (bijvoorbeeld soldeerpasta) en de koperlaag;<br>Gegarandeerde elektrische prestaties: om de stabiliteit van de circuitgeleiding te handhaven, om impedantieafwijkingen of kortsluitingsrisico's als gevolg van de aantasting van het koperoppervlak te voorkomen.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes-1.jpg\" alt=\"PCB oppervlakteafwerkingen\" class=\"wp-image-2948\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"The_importance_of_PCB_surface_treatment\"><\/span>Het belang van PCB-oppervlaktebehandeling<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Core_purpose_to_solve_the_%E2%80%9Coxidation_problem%E2%80%9D_of_the_copper_surface\"><\/span>Hoofddoel: het \"oxidatieprobleem\" van het koperoppervlak oplossen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Koper op kamertemperatuur met zuurstof in de lucht, contact met waterdamp zal koperoxide (CuO) of alkalisch kopercarbonaat (kopergroen) genereren, deze geoxideerde lagen zullen de bevochtigbaarheid van het solderen aanzienlijk verminderen &#8212; specifiek gemanifesteerd als soldeer \"weigert te solderen\", soldeerverbindingen vals of gebarsten. Oppervlaktevoorbereiding zorgt ervoor dat het koperoppervlak actief is tijdens het solderen door het te bedekken met een coating die het contactpad van het koper met het oxidatiemiddel radicaal blokkeert.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Industry_Importance_a_critical_process_throughout_the_PCB_life_cycle\"><\/span>Industrieel belang: een kritisch proces gedurende de hele levenscyclus van PCB's<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>1.Productie<\/strong><br>Verzeker SMT (Surface Mount Technology) opbrengsten en verminder herbewerkingskosten als gevolg van slechte soldeerbaarheid;<br>De uniformiteit van de coating heeft een directe invloed op de mechanische sterkte van componenten na het solderen (bijv. soldeerverbinding spanning, afschuifkracht).<\/p><p><strong>2.Opslag en transport<br><\/strong>Bij langdurige opslag kan de coating bestand zijn tegen vocht, zoutnevel en andere omgevingsfactoren erosie (zoals kustgebieden met apparatuur, PCB's moeten speciale aandacht besteden aan het vermogen om roest te voorkomen);<br>Voorkom beschadiging van het koperoppervlak door wrijving en botsingen tijdens transport.<\/p><p><strong>3.Aanpassing aan het gebruik van sc\u00e8nes<br><\/strong>Omgevingen met hoge temperaturen (zoals auto-elektronica, industri\u00eble besturing) vereisen dat de coating verouderingsbestendig is om ontleding of oxidatie van de coating bij hoge temperaturen te voorkomen;<br>In hoogfrequente schakelingen is de vlakheid van de coating van invloed op het signaaloverdrachtsverlies (zo wordt het immersie-goudproces vaak gebruikt in RF-PCB's vanwege de goede uniformiteit van de coating).<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"In-Depth_Comparison_of_7_PCB_Surface_Finishes\"><\/span>Diepgaande vergelijking van 7 PCB oppervlakteafwerkingen<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Hot_Air_Solder_Leveling_HASL\"><\/span>1. Hete lucht soldeer nivellering (HASL)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Procesprincipe<\/strong>:<br>Het onderdompelen van PCB's in 260\u00b0C gesmolten soldeer (Sn63Pb37 of SAC305), gevolgd door het onder hoge druk met hete lucht (400\u00b0C) verwijderen van overtollig soldeer, cre\u00ebert ongelijke &#8220;heuvel&#8221; oppervlakken.<\/p><p><strong>Ideaal voor<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Consumentenelektronica (opladers, LED-drivers)<\/li>\n\n<li>Kostengevoelige orders met hoge volumes<\/li><\/ul><p><strong>Harde les<\/strong>:<br>Een routerfabrikant ervoer wijdverspreide BGA-leemtes bij het gebruik van loodvrije HASL en voegde uiteindelijk een &#8220;pad pre-tinning&#8221; stap toe die de kosten met $0,17\/board verhoogde.<\/p><p><strong>Kritische controles<\/strong>:<\/p><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Parameter<\/th><th>Doel<\/th><th>Afwijkingsrisico<\/th><\/tr><\/thead><tbody><tr><td>Soldeer Cu-gehalte<\/td><td>&lt;0.7%<\/td><td>Broze soldeerverbindingen<\/td><\/tr><tr><td>Hoek luchtmes<\/td><td>75\u00b0\u00b12\u00b0<\/td><td>Ongelijke dikte<\/td><\/tr><tr><td>Koeling<\/td><td>4\u00b0C\/s<\/td><td>Overmatige ruwheid<\/td><\/tr><\/tbody><\/table><\/figure><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Electroless_Nickel_Immersion_Gold_ENIG\"><\/span>2.Nikkel ondergedompeld goud (ENIG)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Laagstructuur<\/strong>:<br>&#8220;Sandwich&#8221; deposition: Elektroless Ni (3-5\u03bcm) \u2192 Verplaatsing Au (0,05-0,1\u03bcm). Ni fungeert als koper &#8220;firewall,&#8221; Au als &#8220;soldeerinterface.&#8221;<\/p><p><strong>Casestudie Hoogfrequent<\/strong>:<br>Een mmWave radarboard verkoos ENIG boven OSP omdat Au&#8217;s skin effect loss 23% lager was (@77GHz).<\/p><p><strong>Zwarte Pad Analyse<\/strong>:<br>Wanneer het nikkelbad 91\u00b0C overschrijdt, vormt de fosforsegregatie brosse Ni3P-fasen (SEM toont &#8220;gebarsten&#8221; morfologie). Preventie:<\/p><ul class=\"wp-block-list\"><li>Voeg citroenzuurbuffer toe<\/li>\n\n<li>Impulsplateren implementeren<\/li>\n\n<li>Inclusief micro-etch voor Au afzetting<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Organic_Solderability_Preservative_OSP\"><\/span>3.Organisch soldeerbaarheidsbewaarmiddel (OSP)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Moleculaire bescherming<\/strong>:<br>Benzimidazool-koperchelaten vormen 0,2-0,5 \u03bcm films die bestand zijn tegen 6 maanden natuurlijke oxidatie.<\/p><p><strong>5G voorkeurskeuze<\/strong>:<br>Een AAU-bord voor een basisstation dat OSP+LDI gebruikt, bespaarde $4,2\/m\u00b2 in vergelijking met ENIG met 0,3dB\/cm lagere insertie (@28 GHz).<\/p><p><strong>Don&amp;#8217s voor opslag<\/strong>:<\/p><ul class=\"wp-block-list\"><li>RH&gt;60% veroorzaakt hydrolyse van de film<\/li>\n\n<li>Zwavelhoudende verpakking cre\u00ebert Cu2S zwarte vlekken<\/li>\n\n<li>Moet SMT binnen 24 uur na uitpakken<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Immersion_Tin_ImSn\"><\/span>4.Onderdompeltin (ImSn)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Microstructuur<\/strong>:<br>Cu6Sn5 intermetallische dikte (ideaal: 1,2-1,8 \u03bcm via EDX) bepaalt de betrouwbaarheid.<\/p><p><strong>Succes in de auto-industrie<\/strong>:<br>Een ECU-module doorstond 3000x -40\u00b0C~125\u00b0C cycli met ImSn tegenover 2400x met ENIG&amp;#8217.<\/p><p><strong>Procesrisico's<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Tingroei (onderdrukt door reflow pre-aging)<\/li>\n\n<li>Kruisbesmetting in dubbelzijdige borden<\/li>\n\n<li>Niet compatibel met Al-draadverbinding<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes-2.jpg\" alt=\"PCB oppervlakteafwerkingen\" class=\"wp-image-2949\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Immersion_Silver_ImAg\"><\/span>5.Onderdompelingszilver (ImAg)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Signaalintegriteit Rand<\/strong>:<br>10 GHz insertieverlies is 15% lager dan ENIG (volgens IPC-6012B).<\/p><p><strong>Tegenmaatregelen voor migratie<\/strong>:<br>&#8220;Nanodeeltjes doping&#8221; verhoogt de migratiedrempel van 3,1V naar 5,6V voor 48V voedingsmodules.<\/p><p><strong>Diktecontrole<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Natriumthiosulfaat als remmer<\/li>\n\n<li>Spuittank voor beplating<\/li>\n\n<li>Chromaat passivering nabehandeling<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"6_Electroless_Nickel_Electroless_Palladium_Immersion_Gold_ENEPIG\"><\/span>6.Nikkel Elektrolytisch Palladium Onderdompelingsgoud (ENEPIG)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Laaginnovatie<\/strong>:<br>0,1-0,2 \u03bcm Pd tussen Ni (3-4 \u03bcm) en Au (0,03-0,05 \u03bcm) voorkomt Au-diffusie.<\/p><p><strong>SiP-toepassing<\/strong>:<br>Een 3D-pakket met gemengde Au-draad\/SnAgCu-soldering met ENEPIG.<\/p><p><strong>Kostenoptimalisatie<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Gradi\u00ebntdikte Pd (0,15 \u03bcm rand\/0,08 \u03bcm centrum)<\/li>\n\n<li>Pd-Co-legering in plaats van zuiver Pd<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"7_Electrolytic_Hard_Gold\"><\/span>7.Elektrolytisch Hard Goud<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Militaire bescherming<\/strong>:<br>Co-gedoteerd Au (1-3\u03bcm) bij een hardheid van 180HV weerstaat 50x meer slijtage dan ENIG.<\/p><p><strong>Specificaties aansluitingen<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Gouden vingerafschuining: 30\u00b0\u00b11\u00b0<\/li>\n\n<li>Ni dikte \u22655\u03bcm<\/li>\n\n<li>3 mm overgangszones vereist<\/li><\/ul><p><strong>Kosten val<\/strong>:<br>Een backplane&#8217;s onjuist platinggebied verhoogde de afwerkingskosten van 8% tot 34% van het totaal.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Selection_Decision_Tree\"><\/span>Selectie Beslisboom<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"723\" height=\"549\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/Selection-Decision-Tree.jpg\" alt=\"Selectie Beslisboom\" class=\"wp-image-2946\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/Selection-Decision-Tree.jpg 723w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/Selection-Decision-Tree-300x228.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/Selection-Decision-Tree-16x12.jpg 16w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/Selection-Decision-Tree-600x456.jpg 600w\" sizes=\"auto, (max-width: 723px) 100vw, 723px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Common_Failure_Clinics\"><\/span>5 veelvoorkomende faalklinieken<span class=\"ez-toc-section-end\"><\/span><\/h2><p><strong>V1: Zwarte resten op ENIG-pads na reflow?<\/strong><br>\u2192 &#8220;Goudverbrossing&#8221;! Onmiddellijk controleren:<\/p><ol class=\"wp-block-list\"><li>Ni-P gehalte (7-9% optimaal)<\/li>\n\n<li>Au dikte &gt;0.08\u03bcm?<\/li>\n\n<li>Soldeerpasta Bi gehalte<\/li><\/ol><p><strong>V2: Tin whiskers op ImSn na 3 maanden opslag?<\/strong><br>\u2192 Voer &#8220;reddingstrio&#8221; uit:<\/p><ol class=\"wp-block-list\"><li>150\u00b0C bakken gedurende 2 uur<\/li>\n\n<li>Anti-diffusie nano-coating aanbrengen<\/li>\n\n<li>Overschakelen naar het matte tinnen proces<\/li><\/ol><p><strong>V3: OSP-platen vertonen een slechte bevochtigbaarheid na meerdere reflows?<\/strong><br>\u2192 De organische film degradeert! Neem deze stappen:<\/p><ol class=\"wp-block-list\"><li>Controleer of de reflow-piektemperatuur niet hoger was dan 245\u00b0C<\/li>\n\n<li>Controleer de bewaartijd &#8211; OSP degradeert na 6 maanden<\/li>\n\n<li>Overweeg het toevoegen van een stikstofatmosfeer tijdens reflow<\/li><\/ol><p><strong>V4: ENEPIG-printplaten mislukken bij draadverbindingstests?<\/strong><br>\u2192 Gewoonlijk een kwestie van palladiumlagen:<\/p><ol class=\"wp-block-list\"><li>Pd-dikte meten (0,15-0,25 \u03bcm ideaal)<\/li>\n\n<li>Controleren op Pd-oxidatie (XPS-analyse aanbevolen)<\/li>\n\n<li>Stel de pH van het PD-bad in op 8,2-8,6.<\/li><\/ol><p><strong>V5: Heb je HASL-platen met ongelijke soldeerdikte?<\/strong><br>\u2192 Luchtmeskalibratie nodig:<\/p><ol class=\"wp-block-list\"><li>Controleer de mesdruk (normaal 25-35 psi).<\/li>\n\n<li>Controleer de nivelleertijd (3-5 seconden optimaal)<\/li>\n\n<li>Controleer de printplaatsteunen op kromtrekken<\/li><\/ol><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Pro_Tips_from_PCB_Manufacturers\"><\/span>Pro-tips van <a href=\"https:\/\/www.topfastpcb.com\/nl\/\">PCB-fabrikanten<\/a><span class=\"ez-toc-section-end\"><\/span><\/h2><ol class=\"wp-block-list\"><li><strong>HASL<\/strong> &#8211; Voor dubbelzijdige raad, vraag &#8220;dual dip&#8221; verwerking om het schaduweffect te verhinderen<\/li>\n\n<li><strong>ENIG<\/strong> &#8211; Specificeer altijd &#8220;midden-fosfor&#8221; nikkel (6-9% P) voor de beste betrouwbaarheid.<\/li>\n\n<li><strong>OSP<\/strong> &#8211; Kies &#8220;Type 3&#8221; OSP-formuleringen voor toepassingen met hoge betrouwbaarheid<\/li>\n\n<li><strong>ImSn<\/strong> &#8211; Opslag in stikstofkasten verlengt de houdbaarheid van 6 tot 12 maanden<\/li>\n\n<li><strong>ImAg<\/strong> &#8211; voeg een antitarnish behandeling toe als de platen meerdere thermische cycli ondergaan<\/li>\n\n<li><strong>ENEPIG<\/strong> &#8211; Specificeer &#8220;nikkel met lage spanning&#8221; voor flexibele PCB-toepassingen<\/li>\n\n<li><strong>Hard goud<\/strong> &#8211; Kobaltgehalte moet 0,1-0,3% zijn voor optimale slijtvastheid<\/li><\/ol><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Cost-Performance_Tradeoff_Analysis\"><\/span>Kosten-prestatie afweging<span class=\"ez-toc-section-end\"><\/span><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Afwerking<\/th><th>Relatieve kosten<\/th><th>Soldeerbaarheid<\/th><th>Houdbaarheid<\/th><th>Signaalverlies<\/th><\/tr><\/thead><tbody><tr><td>HASL<\/td><td>$<\/td><td>\u2605\u2605\u2605\u2605\u2606<\/td><td>12 maanden<\/td><td>Hoog<\/td><\/tr><tr><td>ENIG<\/td><td>$$$$<\/td><td>\u2605\u2605\u2605\u2606\u2606<\/td><td>12 maanden<\/td><td>Medium<\/td><\/tr><tr><td>OSP<\/td><td>$<\/td><td>\u2605\u2605\u2605\u2605\u2606<\/td><td>6 maanden<\/td><td>Laagste<\/td><\/tr><tr><td>ImSn<\/td><td>$$<\/td><td>\u2605\u2605\u2605\u2605\u2605<\/td><td>6 maanden<\/td><td>Medium<\/td><\/tr><tr><td>ImAg<\/td><td>$$$<\/td><td>\u2605\u2605\u2605\u2605\u2606<\/td><td>9 maanden<\/td><td>Laag<\/td><\/tr><tr><td>ENEPIG<\/td><td>$$$$$<\/td><td>\u2605\u2605\u2605\u2606\u2606<\/td><td>12 maanden<\/td><td>Medium<\/td><\/tr><tr><td>Hard goud<\/td><td>$$$$$$<\/td><td>\u2605\u2605\u2606\u2606\u2606<\/td><td>24 maanden<\/td><td>Hoog<\/td><\/tr><\/tbody><\/table><\/figure><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes-4.jpg\" alt=\"PCB oppervlakteafwerkingen\" class=\"wp-image-2950\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes-4.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes-4-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes-4-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Future_Trends_in_Surface_Finishes\"><\/span>Toekomstige trends in oppervlakteafwerkingen<span class=\"ez-toc-section-end\"><\/span><\/h2><ol class=\"wp-block-list\"><li><strong>Nanocomposiet OSP<\/strong> &#8211; Door grafeen verbeterde formuleringen tonen 2x langere houdbaarheid in proeven<\/li>\n\n<li><strong>ENIG voor lage temperaturen<\/strong> &#8211; Nieuwe chemicali\u00ebn maken verwerking bij 65\u00b0C mogelijk in plaats van de traditionele 85\u00b0C<\/li>\n\n<li><strong>Selectieve afwerkingen<\/strong> &#8211; Combineren van verschillende afwerkingen op \u00e9\u00e9n printplaat (bijv. ENIG + OSP)<\/li>\n\n<li><strong>Zelfhelende films<\/strong> &#8211; Experimentele OSP die kleine krasjes herstelt tijdens reflow<\/li>\n\n<li><strong>Halogeenvrije processen<\/strong> &#8211; Voldoen aan komende EU-milieuwetgeving<\/li><\/ol><p>Onthoud bij het evalueren van oppervlakteafwerkingen: er is geen universele &#8220;beste&#8221; optie &#8211; alleen de meest geschikte oplossing voor uw specifieke ontwerpeisen, budgetbeperkingen en productiemogelijkheden. De duurste afwerking is niet noodzakelijk de juiste keuze, net zoals de voordeligste optie tot defecten in het veld kan leiden. Voer altijd praktijktests uit met uw werkelijke PCB-ontwerp en componenten voordat u uw keuze definitief maakt.<\/p>","protected":false},"excerpt":{"rendered":"<p>Van consumentenelektronica tot ruimtevaartapparatuur, de oppervlakteafwerking van PCB's heeft een cruciale invloed op de betrouwbaarheid van het product.Deze gids onderzoekt 7 mainstreamprocessen op microstructureel niveau, vergelijkt kosten\/prestaties, onthult faalmechanismen zoals ENIG black pad en OSP carbonisatie en biedt optimale selectiestrategie\u00ebn voor verschillende budgetten\/eisen.<\/p>","protected":false},"author":1,"featured_media":2947,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[109],"tags":[266],"class_list":["post-2945","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-faq","tag-pcb-surface-finishes"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>What is PCB Surface Finishes? - Topfastpcb<\/title>\n<meta name=\"description\" content=\"In-depth comparison of 7 PCB surface finish processes (HASL\/ENIG\/OSP\/Immersion Tin\/Immersion Silver\/ENEPIG\/Electrolytic Hard Gold), including their pros\/cons, selection criteria, and solutions to 5 common soldering failures.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/\" \/>\n<meta property=\"og:locale\" content=\"nl_NL\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"What is PCB Surface Finishes? - Topfastpcb\" \/>\n<meta property=\"og:description\" content=\"In-depth comparison of 7 PCB surface finish processes (HASL\/ENIG\/OSP\/Immersion Tin\/Immersion Silver\/ENEPIG\/Electrolytic Hard Gold), including their pros\/cons, selection criteria, and solutions to 5 common soldering failures.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/\" \/>\n<meta property=\"og:site_name\" content=\"Topfastpcb\" \/>\n<meta property=\"article:published_time\" content=\"2025-06-01T00:32:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"402\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"\u6258\u666e\u6cd5\u65af\u7279\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Geschreven door\" \/>\n\t<meta name=\"twitter:data1\" content=\"\u6258\u666e\u6cd5\u65af\u7279\" \/>\n\t<meta name=\"twitter:label2\" content=\"Geschatte leestijd\" \/>\n\t<meta name=\"twitter:data2\" content=\"7 minuten\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/\"},\"author\":{\"name\":\"\u6258\u666e\u6cd5\u65af\u7279\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a\"},\"headline\":\"What is PCB Surface Finishes?\",\"datePublished\":\"2025-06-01T00:32:00+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/\"},\"wordCount\":1180,\"publisher\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes.jpg\",\"keywords\":[\"PCB Surface Finishes\"],\"articleSection\":[\"FAQ\"],\"inLanguage\":\"nl-NL\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/\",\"url\":\"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/\",\"name\":\"What is PCB Surface Finishes? - Topfastpcb\",\"isPartOf\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes.jpg\",\"datePublished\":\"2025-06-01T00:32:00+00:00\",\"description\":\"In-depth comparison of 7 PCB surface finish processes (HASL\/ENIG\/OSP\/Immersion Tin\/Immersion Silver\/ENEPIG\/Electrolytic Hard Gold), including their pros\/cons, selection criteria, and solutions to 5 common soldering failures.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#breadcrumb\"},\"inLanguage\":\"nl-NL\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"nl-NL\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#primaryimage\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes.jpg\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes.jpg\",\"width\":600,\"height\":402,\"caption\":\"PCB Surface Finishes\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"\u9996\u9875\",\"item\":\"https:\/\/www.topfastpcb.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"What is PCB Surface Finishes?\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.topfastpcb.com\/#website\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"name\":\"Topfastpcb\",\"description\":\"Topfast Prime Choice for Global Electronics Manufacturing\",\"publisher\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.topfastpcb.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"nl-NL\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\",\"name\":\"Topfastpcb\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"nl-NL\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"width\":144,\"height\":56,\"caption\":\"Topfastpcb\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a\",\"name\":\"\u6258\u666e\u6cd5\u65af\u7279\",\"sameAs\":[\"http:\/\/www.topfastpcb.com\"],\"url\":\"https:\/\/www.topfastpcb.com\/nl\/blog\/author\/admin\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"What is PCB Surface Finishes? - Topfastpcb","description":"In-depth comparison of 7 PCB surface finish processes (HASL\/ENIG\/OSP\/Immersion Tin\/Immersion Silver\/ENEPIG\/Electrolytic Hard Gold), including their pros\/cons, selection criteria, and solutions to 5 common soldering failures.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/","og_locale":"nl_NL","og_type":"article","og_title":"What is PCB Surface Finishes? - Topfastpcb","og_description":"In-depth comparison of 7 PCB surface finish processes (HASL\/ENIG\/OSP\/Immersion Tin\/Immersion Silver\/ENEPIG\/Electrolytic Hard Gold), including their pros\/cons, selection criteria, and solutions to 5 common soldering failures.","og_url":"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-pcb-surface-finishes\/","og_site_name":"Topfastpcb","article_published_time":"2025-06-01T00:32:00+00:00","og_image":[{"width":600,"height":402,"url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes.jpg","type":"image\/jpeg"}],"author":"\u6258\u666e\u6cd5\u65af\u7279","twitter_card":"summary_large_image","twitter_misc":{"Geschreven door":"\u6258\u666e\u6cd5\u65af\u7279","Geschatte leestijd":"7 minuten"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#article","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/"},"author":{"name":"\u6258\u666e\u6cd5\u65af\u7279","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a"},"headline":"What is PCB Surface Finishes?","datePublished":"2025-06-01T00:32:00+00:00","mainEntityOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/"},"wordCount":1180,"publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes.jpg","keywords":["PCB Surface Finishes"],"articleSection":["FAQ"],"inLanguage":"nl-NL"},{"@type":"WebPage","@id":"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/","url":"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/","name":"What is PCB Surface Finishes? - Topfastpcb","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#primaryimage"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes.jpg","datePublished":"2025-06-01T00:32:00+00:00","description":"In-depth comparison of 7 PCB surface finish processes (HASL\/ENIG\/OSP\/Immersion Tin\/Immersion Silver\/ENEPIG\/Electrolytic Hard Gold), including their pros\/cons, selection criteria, and solutions to 5 common soldering failures.","breadcrumb":{"@id":"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#breadcrumb"},"inLanguage":"nl-NL","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/"]}]},{"@type":"ImageObject","inLanguage":"nl-NL","@id":"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#primaryimage","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes.jpg","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/PCB-Surface-Finishes.jpg","width":600,"height":402,"caption":"PCB Surface Finishes"},{"@type":"BreadcrumbList","@id":"https:\/\/www.topfastpcb.com\/blog\/what-is-pcb-surface-finishes\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"\u9996\u9875","item":"https:\/\/www.topfastpcb.com\/"},{"@type":"ListItem","position":2,"name":"What is PCB Surface Finishes?"}]},{"@type":"WebSite","@id":"https:\/\/www.topfastpcb.com\/#website","url":"https:\/\/www.topfastpcb.com\/","name":"Topfastpcb","description":"Topfast Prime Choice for Global Electronics Manufacturing","publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.topfastpcb.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"nl-NL"},{"@type":"Organization","@id":"https:\/\/www.topfastpcb.com\/#organization","name":"Topfastpcb","url":"https:\/\/www.topfastpcb.com\/","logo":{"@type":"ImageObject","inLanguage":"nl-NL","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","width":144,"height":56,"caption":"Topfastpcb"},"image":{"@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a","name":"\u6258\u666e\u6cd5\u65af\u7279","sameAs":["http:\/\/www.topfastpcb.com"],"url":"https:\/\/www.topfastpcb.com\/nl\/blog\/author\/admin\/"}]}},"_links":{"self":[{"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/posts\/2945","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/comments?post=2945"}],"version-history":[{"count":3,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/posts\/2945\/revisions"}],"predecessor-version":[{"id":2953,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/posts\/2945\/revisions\/2953"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/media\/2947"}],"wp:attachment":[{"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/media?parent=2945"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/categories?post=2945"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/tags?post=2945"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}