{"id":3560,"date":"2025-07-09T08:22:00","date_gmt":"2025-07-09T00:22:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=3560"},"modified":"2025-07-08T15:56:17","modified_gmt":"2025-07-08T07:56:17","slug":"how-to-perform-reflow-soldering-on-double-sided-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/nl\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/","title":{"rendered":"Hoe reflow solderen op dubbelzijdige PCB?"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhoudsopgave<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Why_is_Double-Sided_PCB_Reflow_Soldering_a_Challenge_in_Electronics_Manufacturing\" >Waarom is dubbelzijdig PCB Reflow Solderen een uitdaging bij de productie van elektronica?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#In-Depth_Comparison_of_Two_Main_Soldering_Processes\" >Diepgaande vergelijking van twee belangrijke soldeerprocessen<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Option_A_Double-Sided_Solder_Paste_Process_Ideal_for_High-Density_Components\" >Optie A: dubbelzijdig soldeerpasta-proces (ideaal voor componenten met hoge dichtheid)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Option_B_Solder_Paste_Red_Glue_Hybrid_Process_Solution_for_Large_Components\" >Optie B: Soldeerpasta + roodlijm hybride proces (oplossing voor grote componenten)<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#5_Golden_Rules_for_Soldering_Quality_Control\" >5 gouden regels voor kwaliteitscontrole bij het solderen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Common_Issues_and_Engineering_Solutions\" >Veelvoorkomende problemen en technische oplossingen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Future_Process_Trends\" >Toekomstige procestrends<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Why_is_Double-Sided_PCB_Reflow_Soldering_a_Challenge_in_Electronics_Manufacturing\"><\/span>Waarom is dubbelzijdig PCB Reflow Solderen een uitdaging bij de productie van elektronica?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>In hoogwaardige elektronische producten, zoals smartphones en industri\u00eble regelapparaten, <a href=\"https:\/\/www.topfastpcb.com\/nl\/products\/double-sided-flexible-pcb\/\">dubbelzijdige PCB<\/a> ontwerpen zijn de standaard geworden. Dubbelzijdig solderen brengt echter twee grote uitdagingen met zich mee:<\/p><ol class=\"wp-block-list\"><li><strong>Thermisch beheer Complexiteit<\/strong> - Tijdens het solderen aan de tweede zijde wordt de eerste zijde opnieuw verhit, wat kan leiden tot losgeraakte onderdelen of defecte soldeerverbindingen.<\/li>\n\n<li><strong>Proces Selectie Dilemma<\/strong> - Soldeerpasta en rode lijm hebben elk hun voor- en nadelen en vereisen een zorgvuldige afweging op basis van de componentenlayout.<\/li><\/ol><p><a href=\"https:\/\/www.topfastpcb.com\/nl\/contact\/\" target=\"_blank\" rel=\"noreferrer noopener\">Raadpleeg onze procesingenieurs<\/a>\u00a0voor oplossingen op maat<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb.jpg\" alt=\"PCB reflow solderen\" class=\"wp-image-3561\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"In-Depth_Comparison_of_Two_Main_Soldering_Processes\"><\/span>Diepgaande vergelijking van twee belangrijke soldeerprocessen<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_A_Double-Sided_Solder_Paste_Process_Ideal_for_High-Density_Components\"><\/span>Optie A: dubbelzijdig soldeerpasta-proces (ideaal voor componenten met hoge dichtheid)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Geschikt voor<\/strong>:<\/p><ul class=\"wp-block-list\"><li>PCB's met BGA's, QFN's of andere precisie-IC's aan beide zijden<\/li>\n\n<li>Lichtgewicht onderdelen<\/li><\/ul><p><strong>Belangrijkste stappen<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Zijde A: Print soldeerpasta \u2192 Plaats componenten \u2192 Reflow soldeer (piektemperatuur 245\u00b0C)<\/li>\n\n<li>Laat afkoelen tot kamertemperatuur en draai dan de printplaat om<\/li>\n\n<li>Zijde B: soldeerpasta afdrukken \u2192 componenten plaatsen \u2192 getrapt temperatuurprofiel gebruiken (piektemperatuur met 5-10\u00b0C verlagen)<\/li><\/ol><p><strong>Voordelen<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Hoge betrouwbaarheid van soldeerverbindingen<\/li>\n\n<li>Geschikt voor geautomatiseerde massaproductie<\/li><\/ul><p><strong>Risico's<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Grote onderdelen kunnen loskomen tijdens de tweede reflow<\/li>\n\n<li>Nauwkeurige temperatuurregeling is vereist voor solderen aan de tweede zijde<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_B_Solder_Paste_Red_Glue_Hybrid_Process_Solution_for_Large_Components\"><\/span>Optie B: Soldeerpasta + roodlijm hybride proces (oplossing voor grote componenten)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>Geschikt voor<\/strong>:<\/p><ul class=\"wp-block-list\"><li>E\u00e9n kant heeft grote connectoren\/elektrolytische condensatoren<\/li>\n\n<li>Gemengde indelingen met aanzienlijke gewichtsverschillen<\/li><\/ul><p><strong>Innovatief proces<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Soldeerpasta-zijde (zijde A): Standaard reflow solderen<\/li>\n\n<li>Rode lijmzijde (zijde B): &#8220;Print-Place-Cure&#8221; driestapsmethode:<\/li><\/ol><ul class=\"wp-block-list\"><li>Nauwkeurigheid rode lijm afdrukken: \u00b10,1mm<\/li>\n\n<li>Uithardingstemperatuur: 120-150\u00b0C (veel lager dan het smeltpunt van soldeerpasta)<\/li>\n\n<li>Optioneel golfsolderen voor verbeterde betrouwbaarheid<\/li><\/ul><p><strong>Technische opmerkingen<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Rode lijm moet minstens 0,3 mm verwijderd zijn van de soldeerpads<\/li>\n\n<li>Verleng de uithardingstijd met 30% om zwakke hechting te voorkomen<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-1.jpg\" alt=\"PCB reflow solderen\" class=\"wp-image-3562\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><p><a href=\"https:\/\/www.topfastpcb.com\/nl\/contact\/\">Ontvang gratis handwerkgidsen voor experts<\/a><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Golden_Rules_for_Soldering_Quality_Control\"><\/span>5 gouden regels voor kwaliteitscontrole bij het solderen<span class=\"ez-toc-section-end\"><\/span><\/h2><ul class=\"wp-block-list\"><li><strong>Temperatuurprofiel optimaliseren<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>Eerste zijde: Standaard Ramp-Soak-Spike (RSS) curve (2-3\u00b0C\/s opwarmsnelheid)<\/li>\n\n<li>Tweede zijde:Gebruik Ramp-to-Spike (RTS) curve (verlengde voorverwarmingstijd)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Richtlijnen voor componentlay-out<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>Plaats zware onderdelen aan dezelfde kant<\/li>\n\n<li>Stagger dubbelzijdige BGA's om thermische spanningsconcentratie te voorkomen<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Soldeerpasta selectiecriteria<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>Tweede zijde: Gebruik soldeerpasta voor lage temperaturen (bijvoorbeeld Sn42\/Bi58).<\/li>\n\n<li>Viscositeit rode lijm:&gt;50.000 cps<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Kritische apparatuurparameters<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>Kantelen van de Reflow-oventransportband: 5-7\u00b0<\/li>\n\n<li>Koelsnelheid: 4-6\u00b0C\/s<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Inspectietechnologie-upgrades<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>3D SPI gebruiken voor inspectie van soldeerpastadikte<\/li>\n\n<li>Verplichte akoestische microscopie na de tweede reflow<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_Issues_and_Engineering_Solutions\"><\/span>Veelvoorkomende problemen en technische oplossingen<span class=\"ez-toc-section-end\"><\/span><\/h2><p><strong>Probleem 1: verschuiven van QFN-onderdelen tijdens tweede terugvloeiing<\/strong><\/p><ul class=\"wp-block-list\"><li>Oplossing: Lijm van hoge temperatuur aanbrengen na solderen aan de eerste zijde<\/li>\n\n<li>Parameters:Gebruik lijm met &gt;200\u00b0C uithardingstolerantie<\/li><\/ul><p><strong>Probleem 2: loslaten van onderdelen tijdens golfsolderen (rode lijmzijde)<\/strong><\/p><ul class=\"wp-block-list\"><li>Verbeteringen:<\/li><\/ul><ol class=\"wp-block-list\"><li>Uitharden met UV na het aanbrengen van rode lijm<\/li>\n\n<li>Voorverwarmen tot 100\u00b0C voor golfsolderen<\/li><\/ol><p><strong>Probleem 3: Overmatige voiding in BGA-verbindingen<\/strong><\/p><ul class=\"wp-block-list\"><li>Procesoptimalisatie:<\/li>\n\n<li>Verleng de ontdooitijd van soldeerpasta tot 8 uur<\/li>\n\n<li>Gebruik stikstofondersteunde reflow (O\u2082 &lt;500ppm)<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-2.jpg\" alt=\"PCB reflow solderen\" class=\"wp-image-3563\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Future_Process_Trends\"><\/span>Toekomstige procestrends<span class=\"ez-toc-section-end\"><\/span><\/h2><ol class=\"wp-block-list\"><li><strong>Solderen bij lage temperatuur<\/strong>: Sn-Bi soldeerlegeringen met gepulseerde verwarming<\/li>\n\n<li><strong>Slimme temperatuurregeling<\/strong>: Op machine learning gebaseerde realtime profieloptimalisatie<\/li>\n\n<li><strong>Hybride verbinding<\/strong>: Gecombineerde soldeerpasta + geleidende lijmoplossingen<\/li><\/ol><p>Door deze belangrijke technieken systematisch toe te passen, kunnen technici een first-pass rendement behalen van meer dan 99,5%.We raden aan om procesvenstercontrolesystemen te implementeren voor continue optimalisatie in productieomgevingen.<\/p>","protected":false},"excerpt":{"rendered":"<p>Het dubbelzijdige reflow solderen van PCB's is een kernproces in de elektronicafabricage en omvat de selectie van soldeerpasta- en rode-lijmprocessen, temperatuurcurvecontrole en dubbelzijdige soldeerstrategie\u00ebn. Dit artikel analyseert het soldeerproces voor dubbelzijdige PCB's, biedt oplossingen voor veelvoorkomende problemen en geeft tips voor procesoptimalisatie om het soldeerrendement en de productie-effici\u00ebntie te verbeteren.<\/p>","protected":false},"author":1,"featured_media":3564,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[109],"tags":[111,320],"class_list":["post-3560","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-faq","tag-pcb","tag-pcb-reflow-soldering"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>How to perform reflow soldering on double-sided PCB? - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Master the key steps of double-sided PCB reflow soldering, from solder paste and red glue process selection to temperature control techniques, providing a complete soldering solution to solve common problems such as cold soldering and component loss.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/\" \/>\n<meta property=\"og:locale\" content=\"nl_NL\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"How to perform reflow soldering on double-sided PCB? 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