{"id":4135,"date":"2025-08-20T08:34:00","date_gmt":"2025-08-20T00:34:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4135"},"modified":"2025-08-19T15:47:31","modified_gmt":"2025-08-19T07:47:31","slug":"pcb-hasl-and-lead-free-hasl-processes","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/","title":{"rendered":"PCB HASL en loodvrije HASL-processen"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhoudsopgave<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#HASL_process\" >HASL-proces<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#11_Differences_between_HASL_and_lead-free_HASL\" >1.1 Verschillen tussen HASL en loodvrij HASL<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#12_Core_HASL_Process_Flow\" >1.2 Kern HASL-processtroom<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#121_Pre-Treatment_Stage\" >1.2.1 Voorbehandelingsfase<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#122_Flux_Application\" >1.2.2 Toepassing van flux<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#123_Hot_Air_Leveling_Key_Steps\" >1.2.3 Hete lucht nivelleren belangrijkste stappen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#124_Quality_Inspection\" >1.2.4 Kwaliteitsinspectie<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#13_Process_Advantages_and_Limitations\" >1.3 Procesvoordelen en -beperkingen<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Advantages\" >Voordelen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Limitations\" >Beperkingen<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#ENIG_Electroless_Nickel_Immersion_Gold_Process\" >ENIG (elektrolytisch nikkel-immersie-goud) proces<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#21_Process_Principles\" >2.1 Procesprincipes<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#22_Advantages\" >2.2 Voordelen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#23_Challenges\" >2.3 Uitdagingen<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#OSP_Organic_Solderability_Preservative\" >OSP (organisch soldeerbaarheidsbewaarmiddel)<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#31_Process_Principles\" >3.1 Procesprincipes<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#32_Advantages\" >3.2 Voordelen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#33_Limitations\" >3.3 Beperkingen<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#Process_Selection_Guide\" >Gids voor proceskeuze<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#41_Comparison\" >4.1 Vergelijking<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#42_Recommendations\" >4.2 Aanbevelingen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-hasl-and-lead-free-hasl-processes\/#43_Topfast_Capabilities\" >4.3 Topfast-mogelijkheden<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"HASL_process\"><\/span>HASL-proces<span class=\"ez-toc-section-end\"><\/span><\/h2><p>HASL (Hot Air Solder Leveling) is een van de meest klassieke en kosteneffectieve oppervlaktebehandelingsprocessen bij de productie van PCB's en speelt een belangrijke rol in de elektronica-industrie. Bij dit proces wordt het koperoppervlak bedekt met een tin-loodlegeringslaag om PCB's betrouwbare soldeerprestaties en oxidatiebescherming te bieden.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1.jpg\" alt=\"HASL-proces\" class=\"wp-image-4137\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"11_Differences_between_HASL_and_lead-free_HASL\"><\/span>1.1 Verschillen tussen HASL en loodvrij HASL<span class=\"ez-toc-section-end\"><\/span><\/h3><p>HASL (Hot Air Solder Leveling) is een van de meest klassieke en kosteneffectieve oppervlaktebehandelingstechnologie\u00ebn in de industrie. <a href=\"https:\/\/www.topfastpcb.com\/nl\/\">PCB-productie<\/a>. Dit proces bedekt koperen oppervlakken met een tin-loodlegeringslaag om betrouwbare soldeerbaarheid en oxidatieweerstand te bieden. Met de toenemende milieueisen is loodvrije HASL de industrienorm geworden.<\/p><p><strong>Verschillen in materiaalsamenstelling<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Traditionele HASL maakt gebruik van een Sn63\/Pb37-legering (63% tin + 37% lood), smeltpunt: 183 \u00b0C.<\/li>\n\n<li>Loodvrije HASL wordt voornamelijk gebruikt:<\/li>\n\n<li>SAC305 (96,5% tin + 3% zilver + 0,5% koper), smeltpunt: 217-220 \u00b0C<\/li>\n\n<li>SnCu0,7 (99,3% tin + 0,7% koper), smeltpunt: 227 \u00b0C<\/li>\n\n<li>Zuiver tin (Sn100), smeltpunt: 232 \u00b0C<\/li><\/ul><p><strong>Vergelijking van proceseigenschappen<\/strong>:<\/p><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Eigendom<\/th><th>Loodhoudend HASL<\/th><th>Loodvrij HASL<\/th><\/tr><\/thead><tbody><tr><td>Smeltpunt<\/td><td>183 \u00b0C<\/td><td>217-232 \u00b0C<\/td><\/tr><tr><td>Soldeerpot Temp<\/td><td>200-210 \u00b0C<\/td><td>240-255 \u00b0C<\/td><\/tr><tr><td>Afwerking oppervlak<\/td><td>Helder<\/td><td>Relatief saai<\/td><\/tr><tr><td>Mechanische sterkte<\/td><td>Goede vervormbaarheid (hoge schokbestendigheid)<\/td><td>Hard maar bros<\/td><\/tr><tr><td>Bevochtigbaarheid<\/td><td>Uitstekend (contacthoek &lt;30\u00b0)<\/td><td>Goed (contacthoek 35-45\u00b0)<\/td><\/tr><tr><td>Naleving van milieuwetgeving<\/td><td>Bevat lood (37%)<\/td><td>Loodgehalte &lt;0,1% (Volgzame RoHS)<\/td><\/tr><tr><td>Kosten<\/td><td>Onder<\/td><td>15-20% Hoger<\/td><\/tr><tr><td>Toepasselijkheid<\/td><td>Algemeen doel<\/td><td>Vereist hogere soldeertemperaturen<\/td><\/tr><\/tbody><\/table><\/figure><p><strong>Praktische prestatieverschillen<\/strong>:<\/p><ul class=\"wp-block-list\"><li><strong>Soldeerbaarheid<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Loodhoudend HASL biedt betere soldeeractiviteit met een kortere bevochtigingstijd (1-2 sec)<\/li>\n\n<li>Loodvrije HASL vereist sterkere flux en strengere temperatuurregeling<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Betrouwbaarheid<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Gelode soldeerverbindingen hebben een betere thermische vermoeiingsweerstand (meer temperatuurcycli)<\/li>\n\n<li>Loodvrije soldeerverbindingen behouden een hogere mechanische sterkte na langdurige veroudering<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Procesvenster<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Loodhoudende HASL heeft een breder procesvenster (\u00b110 \u00b0C)<\/li>\n\n<li>Loodvrij HASL vereist een strengere temperatuurregeling (\u00b13 \u00b0C).<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Professionele tip: Topfast optimaliseert de loodvrije HASL-parameters om &gt;99,5% soldeerrendement te behalen en tegelijkertijd te voldoen aan de IPC-6012 klasse 3 normen.<\/p><\/blockquote><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"12_Core_HASL_Process_Flow\"><\/span>1.2 Kern HASL-processtroom<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Als professionele PCB-fabrikant maakt Topfast gebruik van volledig geautomatiseerde HASL-productielijnen met strikte gestandaardiseerde processen:<\/p><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"121_Pre-Treatment_Stage\"><\/span>1.2.1 Voorbehandelingsfase<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Chemisch reinigen<\/strong>:<\/li>\n\n<li>Zure reiniger (pH 2-3) verwijdert koperoxiden<\/li>\n\n<li>Temperatuurregeling: 40-50 \u00b0C, duur: 2-3 min.<\/li>\n\n<li>Micro-etsen zorgt voor een oppervlakteruwheid van Ra 0,3-0,5 \u03bcm.<\/li>\n\n<li><strong>Spoelen<\/strong>:<\/li>\n\n<li>Drietraps tegenstroomspoeling (DI-waterweerstand &gt;15M\u03a9\u00b7cm)<\/li>\n\n<li>Drogen met hete lucht (60-80 \u00b0C)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"122_Flux_Application\"><\/span>1.2.2 Toepassing van flux<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>Toepassingsmethoden:<\/li>\n\n<li>Schuimen (traditioneel): Vloeistofdikte 0,01-0,03mm<\/li>\n\n<li>Spuiten (geavanceerd):Meer uniform, 30% minder vloeimiddelverbruik<\/li>\n\n<li>Soorten vloeimiddelen:<\/li>\n\n<li>No-clean op harsbasis (ROH)<\/li>\n\n<li>Vastestofgehalte: 8-12%, zuurgraad: 35-45mgKOH\/g<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"123_Hot_Air_Leveling_Key_Steps\"><\/span>1.2.3 Hete lucht nivelleren belangrijkste stappen<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Voorverwarmen<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Loodhoudend: 130-140 \u00b0C<\/li>\n\n<li>Loodvrij: 150-160 \u00b0C<\/li>\n\n<li>Duur: 60-90 sec<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Soldeer dompelen<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Temperatuur soldeerpot:<ul class=\"wp-block-list\"><li>Loodhoudend: 210\u00b15\u00b0C<\/li>\n\n<li>Loodvrij: 250\u00b15\u00b0C<\/li><\/ul><\/li>\n\n<li>Verblijftijd: 2-4 sec (\u00b10,5 sec nauwkeurigheid)<\/li>\n\n<li>Onderdompelingsdiepte: 3-5 mm<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Hete lucht nivellering<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Luchtmesparameters:<ul class=\"wp-block-list\"><li>Druk: 0,3-0,5MPa<\/li>\n\n<li>Temperatuur: 300-350 \u00b0C<\/li>\n\n<li>Hoek: 4\u00b0 naar beneden gekanteld<\/li>\n\n<li>Luchtsnelheid: 20-30m\/s<\/li><\/ul><\/li>\n\n<li>Verwerkingstijd: 1-2 sec<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Koeling<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Geforceerde luchtkoeling (snelheid: 2-3 \u00b0C\/sec)<\/li>\n\n<li>Eindtemperatuur &lt;60 \u00b0C<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"124_Quality_Inspection\"><\/span>1.2.4 Kwaliteitsinspectie<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li>Online AOI (100% dekking):<\/li>\n\n<li>Inspectie van soldeerdikte (1-40 \u03bcm)<\/li>\n\n<li>Detectie van oppervlaktedefecten (soldeerbolletjes, blootliggend koper, enz.)<\/li>\n\n<li>Steekproeven:<\/li>\n\n<li>Soldeerbaarheidstest (245 \u00b0C, 3 sec)<\/li>\n\n<li>Hechtingstest (tapemethode)<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Technologische doorbraak: Topfast&#8217;s met stikstof beschermde loodvrije HASL-proces vermindert soldeeroxidatie van 5% tot &lt;1,5%, waardoor het soldeerrendement aanzienlijk wordt verbeterd.<\/p><\/blockquote><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"13_Process_Advantages_and_Limitations\"><\/span>1.3 Procesvoordelen en -beperkingen<span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advantages\"><\/span>Voordelen<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Kosteneffici\u00ebntie<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Lage investering in apparatuur (~1\/3 van ENIG)<\/li>\n\n<li>Aanzienlijke besparing op materiaalkosten (40-60% goedkoper dan ENIG)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Soldeerbetrouwbaarheid<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Bestand tegen &gt;3 reflowcycli (piek 260 \u00b0C)<\/li>\n\n<li>Hoge gezamenlijke treksterkte (loodhoudend: 50-60MPa; loodvrij: 55-65MPa)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Breed toepasbaar<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Geschikt voor verschillende padafmetingen (min. 0,5 mm steek)<\/li>\n\n<li>Compatibel met doorvoer- en SMT-processen<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Opslagprestaties<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>12 maanden houdbaar (RH &lt;60%)<\/li>\n\n<li>Uitstekende weerstand tegen oxidatie (zoutsproeitest van 48 uur)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Limitations\"><\/span>Beperkingen<span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Beperkingen voor fijne velden<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Niet geschikt voor &lt;0,4 mm BGA\/QFN componenten<\/li>\n\n<li>Risico op soldeerbruggen bij ontwerpen met fijne steek<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Planariteitskwesties<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Oneffenheden in het oppervlak: 15-25 \u03bcm (be\u00efnvloedt HDI-assemblage)<\/li>\n\n<li>Dikteverschil tot 20 \u03bcm tussen grote\/kleine pads<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Thermische spanning<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Processen bij hoge temperaturen (vooral loodvrij) kunnen materialen met een hoge Tg be\u00efnvloeden<\/li>\n\n<li>Hoger risico op kromtrekken bij dunne platen (&lt;0,8mm)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Milieu-overwegingen<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Niet-RoHS-conform loodhoudend HASL<\/li>\n\n<li>Loodvrij HASL verbruikt meer energie (30-50 \u00b0C hogere temperaturen)<\/li><\/ul><p>Heb je professionele HASL-ondersteuning nodig? <a href=\"https:\/\/www.topfastpcb.com\/nl\/contact\/\">Contact opnemen met technici van Topfast<\/a> voor oplossingen op maat<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3.jpg\" alt=\"HASL-proces\" class=\"wp-image-4139\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"ENIG_Electroless_Nickel_Immersion_Gold_Process\"><\/span>ENIG (elektrolytisch nikkel-immersie-goud) proces<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"21_Process_Principles\"><\/span>2.1 Procesprincipes<span class=\"ez-toc-section-end\"><\/span><\/h3><p>ENIG vormt een samengestelde beschermlaag door elektrolytisch vernikkelen en goud onderdompelen:<\/p><ul class=\"wp-block-list\"><li>Nikellaag: 3-6 \u03bcm (7-9% fosfor)<\/li>\n\n<li>Goudlaag: 0,05-0,1 \u03bcm<\/li><\/ul><p><strong>Belangrijkste parameters<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Temperatuur van het nikkelbad: 85-90 \u00b0C<\/li>\n\n<li>Plateringssnelheid: 15-20 \u03bcm\/u<\/li>\n\n<li>Temperatuur goudbad: 80-85 \u00b0C<\/li>\n\n<li>pH: Nikkelbad 4,5-5,0, goudbad 5,5-6,5<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"22_Advantages\"><\/span>2.2 Voordelen<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Uitstekende vlakheid<\/strong> (Ra&lt;0,1 \u03bcm):<\/li><\/ul><ul class=\"wp-block-list\"><li>Ideaal voor &lt;0,3mm pitch BGA\/CSP<\/li>\n\n<li>Coplanariteit van de pad &lt;5 \u03bcm\/m<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Weerstand tegen oxidatie<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>18 maanden houdbaar<\/li>\n\n<li>J-STD-003B klasse 3 gecertificeerd<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Elektrische geleidbaarheid<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Goudweerstand: 2,44 \u03bc\u03a9\u00b7cm<\/li>\n\n<li>Contactweerstand &lt;10 m\u03a9<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"23_Challenges\"><\/span>2.3 Uitdagingen<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Zwarte pad kwestie<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Oorzaken: Nikkel over-etsen of abnormaal fosforgehalte<\/li>\n\n<li>Oplossing:Topfast&#8217;s gepatenteerde passivering verlaagt het percentage zwarte vlekken tot &lt;0,1%.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Kostenfactoren<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Hoge materiaalkosten (volatiliteit goudprijs)<\/li>\n\n<li>Complex proces (8-10 stappen)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Sterkte soldeerverbinding<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Brosse Ni-Au IMC-laag<\/li>\n\n<li>Treksterkte ~40-45MPa<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Topfast's ENIG bereikt een dikte-uniformiteit van \u00b110%, waarmee het de industrienorm van \u00b115% overtreft.<\/p><\/blockquote><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"OSP_Organic_Solderability_Preservative\"><\/span>OSP (organisch soldeerbaarheidsbewaarmiddel) <span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"31_Process_Principles\"><\/span>3.1 Procesprincipes<span class=\"ez-toc-section-end\"><\/span><\/h3><p>OSP vormt een organische beschermlaag van 0,2-0,5 \u03bcm op blank koper, die het volgende bevat:<\/p><ul class=\"wp-block-list\"><li>Benzotriazoolverbindingen<\/li>\n\n<li>Imidazoolverbindingen<\/li>\n\n<li>Carboxylzuren<\/li><\/ul><p><strong>Processtroom<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Reinigen met zuur (5% H2SO4, 2min)<\/li>\n\n<li>Micro-ets (Na2S2O8, verwijder 1-2 \u03bcm koper)<\/li>\n\n<li>OSP-behandeling (40-50 \u00b0C, 1-2 min)<\/li>\n\n<li>Drogen (60-80 \u00b0C hete lucht)<\/li><\/ol><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"32_Advantages\"><\/span>3.2 Voordelen<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Kosteneffectief<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>60% goedkoper dan HASL<\/li>\n\n<li>Lage investering in apparatuur (~1\/5 van ENIG)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Signaalintegriteit<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Stabiele di\u00eblektrische constante (\u0394Dk &lt;0,02)<\/li>\n\n<li>Ideaal voor hoogfrequente toepassingen (&gt;10 GHz)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Milieuvriendelijk<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Geen zware metalen<\/li>\n\n<li>Vereenvoudigde afvalwaterbehandeling<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"33_Limitations\"><\/span>3.3 Beperkingen<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Soldeerbaarheid Venster<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Binnen 24 uur na opening gebruiken<\/li>\n\n<li>Alleen geschikt voor 1 reflow-cyclus (opbrengst daalt 30% voor tweede reflow)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Inspectie problemen<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Moeilijk om filmdikte optisch te meten<\/li>\n\n<li>Vereist speciale ICT-behandeling<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Opslagomstandigheden<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Vacu\u00fcmverpakking vereist (RH &lt;30%)<\/li>\n\n<li>Opslagtemperatuur: 15-30 \u00b0C<\/li><\/ul><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Topfast&#8217;s verbeterde OSP verlengt de houdbaarheid van 3 tot 6 maanden en is bestand tegen 2 reflowcycli.<\/p><\/blockquote><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2.jpg\" alt=\"HASL-proces\" class=\"wp-image-4138\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/08\/HASL-process-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Process_Selection_Guide\"><\/span>Gids voor proceskeuze<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"41_Comparison\"><\/span>4.1 Vergelijking<span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Parameter<\/th><th>HASL<\/th><th>ENIG<\/th><th>OSP<\/th><\/tr><\/thead><tbody><tr><td>Kosten<\/td><td>$<\/td><td>$$$<\/td><td>$<\/td><\/tr><tr><td>Vlakheid<\/td><td>\u25b3 (15-25 \u03bcm)<\/td><td>\u25ce (&lt;5 \u03bcm)<\/td><td>\u25cb (&lt;10 \u03bcm)<\/td><\/tr><tr><td>Soldeerbaarheid<\/td><td>\u25ce (3 reflows)<\/td><td>\u25cb (5 reflows)<\/td><td>\u25b3 (1-2 reflows)<\/td><\/tr><tr><td>Houdbaarheid<\/td><td>12mo<\/td><td>18mo<\/td><td>6mo<\/td><\/tr><tr><td>Min. Steek<\/td><td>0,5 mm<\/td><td>&gt;0,3mm<\/td><td>&gt;0,4mm<\/td><\/tr><tr><td>Milieuvriendelijk<\/td><td>Loodvrij OK<\/td><td>Uitstekend<\/td><td>Uitstekend<\/td><\/tr><tr><td>Toepassingen<\/td><td>Consumentenelektronica<\/td><td>IC's met hoge dichtheid<\/td><td>Snel draaien<\/td><\/tr><\/tbody><\/table><\/figure><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"42_Recommendations\"><\/span>4.2 Aanbevelingen<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Consumentenelektronica<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>Loodvrije HASL (beste kosten-prestaties)<\/li>\n\n<li>Volume soldeerpasta regelen voor componenten met fijne steek<\/li><\/ul><ul class=\"wp-block-list\"><li><strong><a href=\"https:\/\/www.topfastpcb.com\/nl\/products\/hdi-pcb\/\">HDI-borden<\/a><\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>ENIG (superieure vlakheid)<\/li>\n\n<li>Strenge kwaliteitscontrole op nikkel<\/li><\/ul><ul class=\"wp-block-list\"><li><strong><a href=\"https:\/\/www.topfastpcb.com\/nl\/products\/high-speed-pcb\/\">PCB's met hoge snelheid<\/a><\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>OSP\/ENIG (betere signaalintegriteit)<\/li>\n\n<li>Vermijd HASL&amp;#8217s ongelijkmatige oppervlak<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Prototyping<\/strong>:<\/li><\/ul><ul class=\"wp-block-list\"><li>OSP (snelste doorlooptijd)<\/li>\n\n<li>Zorg voor tijdige montage<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"43_Topfast_Capabilities\"><\/span>4.3 Topfast-mogelijkheden<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Complete oplossingen voor oppervlakteafwerking:<\/p><ul class=\"wp-block-list\"><li>20 geautomatiseerde HASL-lijnen (500.000 m\u00b2\/maand)<\/li>\n\n<li>10 ENIG-lijnen (\u00b18% dikte-uniformiteit)<\/li>\n\n<li>5 OSP-lijnen (nano-versterking beschikbaar)<\/li>\n\n<li>100% inline inspectie (AOI+SPI)<\/li><\/ul><p><a href=\"https:\/\/www.topfastpcb.com\/nl\/contact\/\">PCB Selectiegids voor oppervlakteafwerking downloaden<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>HASL hetelucht nivelleringsproces, inclusief de samenstelling van de legering, procesverloop en prestatieverschillen tussen loodhoudende en loodvrije HASL. Een gedetailleerde analyse van de kenmerken en toepassingsscenario's van ENIG-elektrolytische en OSP-antioxidatieprocessen. Als professionele PCB-fabrikant beschikt Topfast over uitgebreide mogelijkheden voor oppervlaktebehandelingsprocessen en een robuust kwaliteitscontrolesysteem, waardoor we optimale oplossingen voor oppervlaktebehandeling kunnen bieden voor verschillende elektronische producten.<\/p>","protected":false},"author":1,"featured_media":4136,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[351,260],"class_list":["post-4135","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-hasl-processes","tag-pcb-manufacturing-process"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB HASL and Lead-Free HASL Processes - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Topfast provides professional and reliable PCB manufacturing services. 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