{"id":4555,"date":"2025-11-04T08:17:00","date_gmt":"2025-11-04T00:17:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4555"},"modified":"2025-11-03T20:20:03","modified_gmt":"2025-11-03T12:20:03","slug":"technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/","title":{"rendered":"Technologische evolutie van PCB's in het tijdperk van kunstmatige intelligentie"},"content":{"rendered":"<p>De technologische verschuiving van traditionele montage met doorlopende gaten naar interconnecties met hoge dichtheid, in combinatie met de explosieve groei van kunstmatige intelligentie, verandert het technologische traject, de productstructuur en de waardeverdeling van de PCB-industrie fundamenteel.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB.jpg\" alt=\"AI PRINTPLAAT\" class=\"wp-image-4556\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhoudsopgave<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Technological_Requirements_Upgrade_of_AI_Computing_Hardware_for_PCBs\" >Technologische vereisten Upgrade van AI-computerhardware voor PCB's<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Demand_for_High_Layer_Count_and_High-Density_Interconnects\" >Vraag naar interconnecties met een hoog aantal lagen en een hoge dichtheid<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Signal_Integrity_Challenges_and_Solutions\" >Uitdagingen en oplossingen voor signaalintegriteit<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Innovations_in_Thermal_Management_Technology\" >Innovaties in warmtebeheertechnologie<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Technological_Breakthroughs_and_Localization_Progress_of_Key_Materials\" >Technologische doorbraken en vooruitgang bij de lokalisatie van belangrijke materialen<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Advances_in_High-Frequency_and_High-Speed_Copper-Clad_Laminates\" >Vooruitgang in koperplaten met hoge frequentie en hoge snelheid<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Specialty_Chemical_Materials\" >Speciale chemische materialen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Technical_Bottlenecks_and_Breakthroughs_in_Manufacturing_Processes\" >Technische knelpunten en doorbraken in productieprocessen<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Laser_Drilling_Technology\" >Laserboortechnologie<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Innovations_in_Lamination_Processes\" >Innovaties in lamineerprocessen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Upgrades_in_Inspection_Technology\" >Upgrades in inspectietechnologie<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Industrial_Chain_Restructuring_and_Business_Model_Transformation\" >Herstructurering industri\u00eble keten en transformatie bedrijfsmodel<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Reshaping_of_Supply_Chain_Relationships\" >Hervorming van de relaties binnen de toeleveringsketen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Increased_Concentration_Due_to_Higher_Technical_Barriers\" >Verhoogde concentratie door hogere technische barri\u00e8res<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Changes_in_Value_Distribution\" >Veranderingen in waardeverdeling<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Future_Technological_Development_Trends\" >Toekomstige technologische ontwikkelingstrends<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Integration_of_Advanced_Packaging_and_PCBs\" >Integratie van geavanceerde verpakking en PCB's<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Silicon_Photonics_Co-Packaging_Technology\" >Co-verpakkingstechnologie voor silicium fotonica<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Sustainability_Requirements\" >Duurzaamheidseisen<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Recommendations_for_Technical_Teams\" >Aanbevelingen voor technische teams<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Transformation_of_Talent_Structure\" >Transformatie van talentstructuur<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Focus_of_R_D_Investment\" >Focus van R&amp;D-investeringen<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/technological-evolution-of-pcbs-in-the-era-of-artificial-intelligence\/#Patent_Layout_Strategy\" >Octrooi lay-out strategie<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technological_Requirements_Upgrade_of_AI_Computing_Hardware_for_PCBs\"><\/span>Technologische vereisten Upgrade van AI-computerhardware voor PCB's<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Demand_for_High_Layer_Count_and_High-Density_Interconnects\"><\/span>Vraag naar interconnecties met een hoog aantal lagen en een hoge dichtheid<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Traditionele server moederborden hebben meestal 12-16 lagen, terwijl de huidige mainstream AI training servers (zoals de NVIDIA DGX H100 serie) PCB lagen van 20-30 lagen vereisen. Vooral voor GPU-substraten zijn interconnectiedichtheden van meer dan 5.000 BGA-soldeerpunten nodig, waarbij de spoorbreedte\/afstand wordt teruggebracht van de conventionele 4\/4 mil tot 2\/2 mil of zelfs 1,5\/1,5 mil. Deze ontwerpbehoefte is de directe aanleiding voor het gebruik van mSAP (Modified Semi-Additive Process), aangezien traditionele subtractieve processen niet langer kunnen voldoen aan de precisievereisten.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Signal_Integrity_Challenges_and_Solutions\"><\/span>Uitdagingen en oplossingen voor signaalintegriteit<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Bij 112 Gbps PAM4 transmissiesnelheden moet het insertieverlies binnen -0,6 dB\/inch worden gehouden. Door simulatieanalyse hebben we ontdekt dat de dissipatiefactor (Df) verlaagd moet worden van 0,02 voor conventioneel FR-4 tot minder dan 0,005. De huidige toonaangevende industri\u00eble oplossing bestaat uit het gebruik van een koolwaterstofhars\/keramisch vulstofcomposietsysteem (zoals Rogers RO4835\u2122), dat een stabiele Dk-waarde van 3,5\u00b10,05 behoudt en goede di\u00eblektrische eigenschappen vertoont, zelfs bij 77 GHz.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Innovations_in_Thermal_Management_Technology\"><\/span>Innovaties in warmtebeheertechnologie<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Als we de NVIDIA H100 als voorbeeld nemen, bereikt het piekverbruik van de chip 700 W, waardoor traditionele thermische ontwerpoplossingen volledig ontoereikend zijn. Onze ontwikkelde embedded copper block + thermal via array technologie kan de thermische weerstand terugbrengen tot 0,8\u00b0C\/W. Wat betreft de keuze van het substraatmateriaal zijn een hoge Tg (\u2265170\u00b0C) en een hoge thermische geleidbaarheid (\u22650,8 W\/m-K) basisvereisten geworden, waarbij sommige high-end toepassingen al gebruikmaken van hybride structuren van metalen substraten en organische materialen.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technological_Breakthroughs_and_Localization_Progress_of_Key_Materials\"><\/span>Technologische doorbraken en vooruitgang bij de lokalisatie van belangrijke materialen<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Advances_in_High-Frequency_and_High-Speed_Copper-Clad_Laminates\"><\/span>Vooruitgang in <a href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/high-frequency-pcb-design-and-layout-guide\/\">Hoogfrequent<\/a> en <a href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-a-high-speed-pcb\/\">Hoge snelheid<\/a> Koper-Clad laminaat<span class=\"ez-toc-section-end\"><\/span><\/h3><p>De S7439-serie van Shengyi Technology is gecertificeerd door grote OEM's en bereikt een Df-waarde van 0,0058 bij 10 GHz, waarmee de internationaal toonaangevende normen worden benaderd. Sinoma Science &amp; Technology's ontwikkeling van elektronisch glasweefsel met een laag Dk-gehalte (Dk=4,2) doorbreekt het technologische monopolie van Nittobo, met een verwachte massaproductie in 2025.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Specialty_Chemical_Materials\"><\/span>Speciale chemische materialen<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Voor soldeerstopinkten ondersteunt de SR-7200G serie van Taiyo Ink laser direct imaging met resoluties tot 20 \u03bcm. Voor plateringsadditieven maakt de Circuposit 8800-serie van MacDermid Enthone uniform plating mogelijk met aspectratio's van 1:1, waarmee het probleem van uniform koperplating in doorvoeropeningen voor PCB's met een hoog aantal lagen wordt aangepakt.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3.jpg\" alt=\"AI PRINTPLAAT\" class=\"wp-image-4557\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technical_Bottlenecks_and_Breakthroughs_in_Manufacturing_Processes\"><\/span>Technische knelpunten en doorbraken in productieprocessen<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Laser_Drilling_Technology\"><\/span>Laserboortechnologie<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Voor microvia verwerking onder 0,1 mm naderen CO2 lasers de fysieke grenzen. We hebben UV-laserbewerkingssystemen ge\u00efntroduceerd in combinatie met straalvormingstechnologie om de bewerkingsprecisie te verhogen tot 35 \u03bcm. De UV-laserboormachines van Han's Laser, die een golflengte van 355 nm gebruiken, bereiken een minimale gatdiameter van 50 \u03bcm met een positienauwkeurigheid van \u00b115 \u03bcm.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Innovations_in_Lamination_Processes\"><\/span>Innovaties in lamineerprocessen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Voor ultrahoge printplaten met meer dan 30 lagen hebben we een lamineerproces met gesegmenteerde verwarming en druk ontwikkeld. Door de harsstroom nauwkeurig te regelen, wordt de vulsnelheid tussen de lagen verhoogd tot meer dan 95%, terwijl de uitlijningsnauwkeurigheid tussen de lagen binnen \u00b125 \u03bcm blijft.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Upgrades_in_Inspection_Technology\"><\/span>Upgrades in inspectietechnologie<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Een allesomvattende oplossing die het volgende combineert <a href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/what-is-aoi-automated-optical-inspection\/\">Geautomatiseerde optische inspectie<\/a> (AOI) en elektrisch testen wordt toegepast. PathWave ADS software van Keysight ondersteunt 3D elektromagnetische veldsimulatie, waardoor problemen met signaalintegriteit vroegtijdig kunnen worden ge\u00efdentificeerd. Voor in-circuit testen ondersteunt de Teradyne TestStation architectuur bit error rate testen voor 112 Gbps interfaces.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Industrial_Chain_Restructuring_and_Business_Model_Transformation\"><\/span>Herstructurering industri\u00eble keten en transformatie bedrijfsmodel<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Reshaping_of_Supply_Chain_Relationships\"><\/span>Hervorming van de relaties binnen de toeleveringsketen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>De toeleveringsketen voor AI-serverprintplaten is verdeeld in drie niveaus: GPU-boardsets worden geleid door chipfabrikanten (bijv. de aangewezen toeleveringsketen van NVIDIA); CPU-moederborden volgen de traditionele toeleveringsketen voor servers; en modulefabrikanten kopen onafhankelijk accessoiremodules in. Deze differentiatie vereist dat printplaatfabrikanten over gedifferentieerde mogelijkheden beschikken om klanten aan te spreken.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Increased_Concentration_Due_to_Higher_Technical_Barriers\"><\/span><strong>Verhoogde concentratie door hogere technische barri\u00e8res<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p>De kapitaalinvestering voor 18-laagse of meer PCB's is 3-5 keer hoger dan die van traditionele producten, met R&amp;D-cycli die 12-18 maanden duren. Dit heeft geleid tot een concentratie van marktaandelen onder toonaangevende bedrijven, waarbij de top drie fabrikanten goed zijn voor meer dan 60% van de binnenlandse AI-server PCB-markt in 2024.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Changes_in_Value_Distribution\"><\/span>Veranderingen in waardeverdeling<span class=\"ez-toc-section-end\"><\/span><\/h3><p>In de Bill of Materials (BOM) kosten van AI-servers is het aandeel van PCB's gestegen van 2-3% in traditionele servers naar 6-8%. Met name voor GPU-substraten kunnen de brutomarges vanwege hun hoge technische complexiteit oplopen tot 35-40%, aanzienlijk hoger dan de 15-20% voor traditionele producten.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2.jpg\" alt=\"AI PRINTPLAAT\" class=\"wp-image-4558\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/11\/AI-PCB-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Future_Technological_Development_Trends\"><\/span>Toekomstige technologische ontwikkelingstrends<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Integration_of_Advanced_Packaging_and_PCBs\"><\/span>Integratie van geavanceerde verpakking en PCB's<span class=\"ez-toc-section-end\"><\/span><\/h3><p>De Chiplet-architectuur vereist dat PCB's een aantal interposer-functies vervullen, waardoor de Substrate-Like PCB (SLP)-technologie een spoorbreedte\/afstand van 10\/10 \u03bcm krijgt. De door Shennan Circuits ontwikkelde eSLP-technologie heeft een procesbreedte van 8\/8 \u03bcm bereikt en wordt momenteel gevalideerd door grote chipfabrikanten.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Silicon_Photonics_Co-Packaging_Technology\"><\/span>Co-verpakkingstechnologie voor silicium fotonica<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Voor optische modules van meer dan 1,6 ton is Co-Packaged Optics (CPO) een onvermijdelijke keuze geworden. Hiervoor zijn PCB's nodig die fotonische golfgeleiders integreren, en we ontwikkelen een hybride substraattechnologie op basis van siliciumdioxidegolfgeleiders, die naar verwachting in 2026 technische toepassingen zal bereiken.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Sustainability_Requirements\"><\/span>Duurzaamheidseisen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>De CE-RED-richtlijn van de EU stelt nieuwe milieueisen aan printplaten, waaronder halogeenvrije materialen en loodvrije processen. Ons ontwikkelde biogebaseerde epoxyharssysteem verlaagt de koolstofvoetafdruk met 40% en heeft de UL-certificering verkregen.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Recommendations_for_Technical_Teams\"><\/span>Aanbevelingen voor technische teams<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Transformation_of_Talent_Structure\"><\/span>Transformatie van talentstructuur<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Er is een verschuiving nodig van traditionele procesingenieurs naar \"materiaal-processysteem\" compositietalenten. In ons team is het aandeel ingenieurs met een materiaalwetenschappelijke achtergrond gestegen van 10% tien jaar geleden naar 35% nu.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Focus_of_R_D_Investment\"><\/span>Focus van R&amp;D-investeringen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Aanbevolen wordt om 60% aan O&amp;O-middelen toe te wijzen aan HDI met een hoge laagdikte, 30% aan geavanceerde verpakking en 10% aan technologie\u00ebn voor duurzame ontwikkeling. Bijzondere nadruk moet worden gelegd op vroegtijdige samenwerking met chipfabrikanten en deelname aan front-endontwerp.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Patent_Layout_Strategy\"><\/span>Octrooi lay-out strategie<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Focus op patent lay-outs in drie richtingen: high-speed materialen, structuren voor thermische dissipatie en interconnecties met hoge dichtheid. 40% van onze belangrijkste patenten die de afgelopen jaren zijn aangevraagd, heeft betrekking op speciale structuren voor warmtedissipatie, wat een toekomstige technologische barri\u00e8re zal worden.<\/p><p>Kunstmatige intelligentie verheft PCB's van hulpcomponenten tot kernonderdelen van computersystemen. Deze verandering in status vereist dat we productontwikkelingsprocessen herdefini\u00ebren met een systeemgerichte denkwijze, waarbij we overgaan van pure leveranciers van productiediensten naar leveranciers van technische oplossingen. De toekomstige concurrentie in de industrie zal een uitgebreide wedstrijd zijn tussen materiaalsystemen, procesmogelijkheden en systeemontwerpvaardigheden.<\/p><p><\/p>","protected":false},"excerpt":{"rendered":"<p>Analyse van de ingrijpende transformatie die AI met zich meebrengt voor de PCB-industrie vanuit een technisch perspectief. 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