{"id":5924,"date":"2026-07-14T08:27:00","date_gmt":"2026-07-14T00:27:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=5924"},"modified":"2026-06-25T15:27:53","modified_gmt":"2026-06-25T07:27:53","slug":"pcb-core-and-prepreg","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/","title":{"rendered":"PCB-kern- en prepreg-materialen"},"content":{"rendered":"<p>Elke meerlaagse printplaat is opgebouwd uit twee basismaterialen: de kern en het prepreg. Hoewel deze in het eindproduct zelden zichtbaar zijn, spelen ze een cruciale rol bij het bepalen van de dikte van de printplaat, de afstand tussen de lagen, de impedantiecontrole, de mechanische stabiliteit en de betrouwbaarheid van het productieproces.<\/p><p>Of het nu gaat om de productie van een eenvoudige printplaat met vier lagen of een complexe backplane met een groot aantal lagen: inzicht in de wisselwerking tussen kern- en prepregmaterialen is essentieel voor het ontwerp van de laagopbouw en de fabricage van printplaten.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/PCB-Core-and-Prepreg-Materials.jpg\" alt=\"PCB-kern- en prepreg-materialen\" class=\"wp-image-5925\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/PCB-Core-and-Prepreg-Materials.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/PCB-Core-and-Prepreg-Materials-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/PCB-Core-and-Prepreg-Materials-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inhoudsopgave<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#What_Is_PCB_Core_Material\" >Wat is het kernmateriaal van een printplaat?<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Functions_of_Core_Material\" >Functies van het kernmateriaal<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#What_Is_PCB_Prepreg\" >Wat is PCB-prepreg?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#How_Core_and_Prepreg_Work_Together\" >Hoe Core en Prepreg samenwerken<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Common_Core_Materials\" >Leermiddelen voor de Common Core<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Standard_FR4_Core\" >Standaard FR4-kern<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#High_TG_Core_Materials\" >Kernmaterialen met een hoge TG-waarde<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#High-Speed_Core_Materials\" >Materialen voor hogesnelheidskernen<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Common_Prepreg_Types\" >Veelvoorkomende soorten prepregs<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Low_Resin_Prepreg\" >Prepreg met laag harsgehalte<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#High_Resin_Prepreg\" >Prepreg met hoog harsgehalte<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Core_and_Prepreg_in_Impedance_Control\" >Kernmateriaal en prepreg bij impedantieregeling<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Material_Selection_for_Multilayer_PCBs\" >Materiaalkeuze voor meerlaagse printplaten<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Electrical_Performance\" >Elektrische prestaties<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Thermal_Requirements\" >Thermische vereisten<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Board_Thickness\" >Dikte printplaat<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Manufacturing_Capability\" >Productiecapaciteit<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Cost_Considerations\" >Kostenoverwegingen<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Common_Challenges_During_Lamination\" >Veelvoorkomende uitdagingen bij het lamineren<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Resin_Starvation\" >Harstekort<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Excessive_Resin_Flow\" >Overmatige harsstroom<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Delamination\" >Delaminatie<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Thickness_Variation\" >Dikteschommelingen<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-24\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#Why_Material_Compatibility_Matters\" >Waarom materiaalcompatibiliteit belangrijk is<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-25\" href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-core-and-prepreg\/#FAQ\" >FAQ<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Is_PCB_Core_Material\"><\/span>Wat is het kernmateriaal van een printplaat?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Het kernmateriaal bestaat uit een volledig uitgehard laminaat waarop aan beide zijden koperfolie is aangebracht.<\/p><p>Het vormt de structurele basis van een meerlaagse printplaat en zorgt voor stevigheid tijdens de fabricage.<\/p><p>Een typische kern bestaat uit:<\/p><ul class=\"wp-block-list\"><li>Glasvezelversterking<\/li>\n\n<li>Harssysteem<\/li>\n\n<li>Koperfolie aan beide zijden<\/li><\/ul><p>De constructie is vergelijkbaar met de standaard laminaatmaterialen die worden besproken in <strong><a href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/pcb-laminate-materials\/\">Uitleg over PCB-laminaatmaterialen<\/a><\/strong>, behalve dat de hars het uithardingsproces al heeft doorlopen.<\/p><p>De kernmaterialen zijn verkrijgbaar in een breed scala aan diktes om aan verschillende stapelconfiguraties te voldoen.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Functions_of_Core_Material\"><\/span>Functies van het kernmateriaal<span class=\"ez-toc-section-end\"><\/span><\/h3><p>De kernlagen bieden:<\/p><ul class=\"wp-block-list\"><li>Mechanische sterkte<\/li>\n\n<li>Elektrische isolatie<\/li>\n\n<li>Koperen steun<\/li>\n\n<li>Dimensionale stabiliteit<\/li><\/ul><p>Zonder kernen zouden meerlaagse printplaten hun structurele integriteit tijdens het lamineren en de assemblage niet behouden.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_Is_PCB_Prepreg\"><\/span>Wat is PCB-prepreg?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Prepreg staat voor \u201evooraf ge\u00efmpregneerd\u201c materiaal.<\/p><p>Het bestaat uit glasvezeldoek dat is ge\u00efmpregneerd met gedeeltelijk uitgeharde hars.<\/p><p>In tegenstelling tot kernmateriaal blijft prepreg v\u00f3\u00f3r het lamineren in een halfuitgeharde toestand.<\/p><p>Tijdens het lamineerproces van printplaten zorgen warmte en druk ervoor dat de hars gaat vloeien en volledig uithardt, waardoor aangrenzende lagen aan elkaar worden gehecht.<\/p><p>Een prepreg-laag bestaat doorgaans uit:<\/p><ul class=\"wp-block-list\"><li>Glasvezeldoek<\/li>\n\n<li>Gedeeltelijk uitgeharde epoxyhars<\/li>\n\n<li>Geen koperfolie<\/li><\/ul><p>Het belangrijkste doel ervan is om hechting tussen de kernlagen te bewerkstelligen.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_Core_and_Prepreg_Work_Together\"><\/span>Hoe Core en Prepreg samenwerken<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Een meerlaagse printplaat bestaat in wezen uit een stapeling van koperen lagen, gescheiden door kernen en prepregs.<\/p><p>Een typische opbouw met vier lagen zou er bijvoorbeeld als volgt uit kunnen zien:<\/p><pre class=\"wp-block-code\"><code>Koper\nKern\nKoper\nPrepreg\nKoper\nKern\nKoper<\/code><\/pre><p>Tijdens het lamineren:<\/p><ol start=\"1\" class=\"wp-block-list\"><li>Het prepreg wordt zachter.<\/li>\n\n<li>Hars sijpelt in de spleten.<\/li>\n\n<li>De lagen zijn met elkaar verlijmd.<\/li>\n\n<li>De hars hardt volledig uit.<\/li>\n\n<li>Er wordt \u00e9\u00e9n enkele stijve structuur gevormd.<\/li><\/ol><p>Dit proces zorgt voor de meerlaagse printplaatstructuur die in moderne elektronica wordt gebruikt.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_Core_Materials\"><\/span>Leermiddelen voor de Common Core<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Standard_FR4_Core\"><\/span>Standaard FR4-kern<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Bij de meeste meerlaagse printplaten wordt FR4 als kernmateriaal gebruikt.<\/p><p>De voordelen zijn onder andere:<\/p><ul class=\"wp-block-list\"><li>Lage kosten<\/li>\n\n<li>Goede mechanische sterkte<\/li>\n\n<li>Stabiele verwerkingseigenschappen<\/li>\n\n<li>Ruime beschikbaarheid<\/li><\/ul><p>Voor algemene elektronische toepassingen blijft FR4 de meest gebruikte optie.<\/p><p>Ingenieurs die niet bekend zijn met de eigenschappen van FR4, kunnen terecht bij <strong><a href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/fr4-pcb-material\/\">Uitleg over FR4-printplaatmateriaal<\/a><\/strong> voor meer achtergrondinformatie.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High_TG_Core_Materials\"><\/span>Kernmaterialen met een hoge TG-waarde<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Bij toepassingen waarbij hogere temperaturen een rol spelen, wordt vaak gebruikgemaakt van kernen met een hoge TG-waarde.<\/p><p>Voordelen zijn onder andere:<\/p><ul class=\"wp-block-list\"><li>Verbeterde thermische stabiliteit<\/li>\n\n<li>Verminderde uitzetting langs de Z-as<\/li>\n\n<li>Grotere betrouwbaarheid bij loodvrije assemblage<\/li><\/ul><p>Deze materialen komen vaak voor in:<\/p><ul class=\"wp-block-list\"><li>Automobielelektronica<\/li>\n\n<li>Industri\u00eble besturingen<\/li>\n\n<li>Stroomomzettingssystemen<\/li>\n\n<li>Servers<\/li><\/ul><p>Zoals besproken in <strong><a href=\"https:\/\/www.topfastpcb.com\/nl\/blog\/high-tg-fr4-pcb\/\">FR4-printplaat met hoge TG-waarde<\/a><\/strong>, hogere TG-waarden kunnen de betrouwbaarheid op lange termijn aanzienlijk verbeteren.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High-Speed_Core_Materials\"><\/span>Materialen voor hogesnelheidskernen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>In moderne communicatieapparatuur wordt vaak gebruikgemaakt van speciale kernen met een lage signaalverlies.<\/p><p>Voorbeelden zijn:<\/p><ul class=\"wp-block-list\"><li>Megtron-serie<\/li>\n\n<li>Isola-materialen voor hoge snelheden<\/li>\n\n<li>I-Speed-laminaten<\/li>\n\n<li>FR4-systemen met lage signaalverliezen<\/li><\/ul><p>Deze materialen dragen bij aan het behoud van de signaalintegriteit bij hoge datasnelheden.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/PCB-Core-and-Prepreg-Materials-1.jpg\" alt=\"PCB-kern- en prepreg-materialen\" class=\"wp-image-5926\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/PCB-Core-and-Prepreg-Materials-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/PCB-Core-and-Prepreg-Materials-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/PCB-Core-and-Prepreg-Materials-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_Prepreg_Types\"><\/span>Veelvoorkomende soorten prepregs<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Prepregs worden doorgaans ingedeeld op basis van het type glasvezel en het harsgehalte.<\/p><p>Veelvoorkomende glasvezelmodellen zijn onder meer:<\/p><ul class=\"wp-block-list\"><li>106<\/li>\n\n<li>1080<\/li>\n\n<li>2113<\/li>\n\n<li>2116<\/li>\n\n<li>7628<\/li><\/ul><p>Elke uitvoering heeft een andere dikte en andere eigenschappen van de hars.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Low_Resin_Prepreg\"><\/span>Prepreg met laag harsgehalte<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Aanbiedingen:<\/p><ul class=\"wp-block-list\"><li>Verbeterde diktebeheersing<\/li>\n\n<li>Verminderde harsstroom<\/li>\n\n<li>Betere maatvastheid<\/li><\/ul><p>Wordt vaak gebruikt in printplaten met een groot aantal lagen.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"High_Resin_Prepreg\"><\/span>Prepreg met hoog harsgehalte<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Bevat:<\/p><ul class=\"wp-block-list\"><li>Betere vulcapaciteit<\/li>\n\n<li>Verbeterde hechting<\/li>\n\n<li>Vergrote di\u00eblektrische afstand<\/li><\/ul><p>Wordt doorgaans gebruikt wanneer er grotere koperen elementen aanwezig zijn.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Core_and_Prepreg_in_Impedance_Control\"><\/span>Kernmateriaal en prepreg bij impedantieregeling<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Een van de belangrijkste functies van kern- en prepregmaterialen is impedantieregeling.<\/p><p>De signaalimpedantie hangt af van:<\/p><ul class=\"wp-block-list\"><li>Di\u00eblektrische constante (Dk)<\/li>\n\n<li>Afstand tussen lagen<\/li>\n\n<li>Koperdikte<\/li>\n\n<li>Geometrie van de spoorlijn<\/li><\/ul><p>De dikte van de kern of het prepreg heeft een directe invloed op de afstand tussen de signaallagen en de referentievlakken.<\/p><p>Zelfs kleine veranderingen kunnen een aanzienlijke invloed hebben op de waarden van de geregelde impedantie.<\/p><p>Om deze reden moeten het ontwerp van de opbouw en de materiaalkeuze vanaf het begin van het project op elkaar worden afgestemd.<\/p><p>Toekomstige besprekingen over di\u00eblektrische eigenschappen zullen aan bod komen in <strong>Dk- en Df-waarden in PCB-materialen<\/strong>.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Material_Selection_for_Multilayer_PCBs\"><\/span>Materiaalkeuze voor meerlaagse printplaten<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Bij de keuze van kern- en prepregmaterialen moet rekening worden gehouden met verschillende factoren.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Electrical_Performance\"><\/span>Elektrische prestaties<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Toepassingen waarbij signalen met hoge snelheid worden gebruikt, vereisen stabiele di\u00eblektrische eigenschappen.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Thermal_Requirements\"><\/span>Thermische vereisten<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Bij hogere bedrijfstemperaturen kunnen systemen met een hoge TG nodig zijn.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Board_Thickness\"><\/span>Dikte printplaat<span class=\"ez-toc-section-end\"><\/span><\/h3><p>De combinatie van kernmateriaal en prepreg bepaalt de uiteindelijke dikte van de printplaat.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Capability\"><\/span>Productiecapaciteit<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Voor bepaalde materialen zijn speciale lamineerprofielen en bewerkingsinstellingen vereist.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Cost_Considerations\"><\/span>Kostenoverwegingen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Bij de materiaalkeuze moet rekening worden gehouden met de prestatie-eisen, in plaats van de hoogst mogelijke specificatie te hanteren.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_Challenges_During_Lamination\"><\/span>Veelvoorkomende uitdagingen bij het lamineren<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Een verkeerde materiaalkeuze kan tot diverse productieproblemen leiden.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Resin_Starvation\"><\/span>Harstekort<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Een onvoldoende harsdoorstroming kan leiden tot holtes of een zwakke hechting.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Excessive_Resin_Flow\"><\/span>Overmatige harsstroom<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Te veel beweging van de hars kan de di\u00eblektrische afstand veranderen en de impedantie be\u00efnvloeden.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Delamination\"><\/span>Delaminatie<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Een slechte materiaalcompatibiliteit kan leiden tot het loslaten van lagen tijdens thermische cycli.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Thickness_Variation\"><\/span>Dikteschommelingen<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Een verkeerde keuze van het prepreg kan leiden tot een ongelijkmatige dikte van de afgewerkte plaat.<\/p><p>Ervaren PCB-fabrikanten houden bij de ontwikkeling van de laagopbouw rekening met deze factoren om productierisico\u2019s tot een minimum te beperken.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/PCB-Core-and-Prepreg-Materials-2.jpg\" alt=\"PCB-kern- en prepreg-materialen\" class=\"wp-image-5927\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/PCB-Core-and-Prepreg-Materials-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/PCB-Core-and-Prepreg-Materials-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/06\/PCB-Core-and-Prepreg-Materials-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Why_Material_Compatibility_Matters\"><\/span>Waarom materiaalcompatibiliteit belangrijk is<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Kern- en prepreg-materialen worden vaak bij dezelfde laminaatfabrikant ingekocht.<\/p><p>Door materiaalsystemen op elkaar af te stemmen, wordt onder meer het volgende gewaarborgd:<\/p><ul class=\"wp-block-list\"><li>Constante thermische uitzetting<\/li>\n\n<li>Betrouwbare hechting<\/li>\n\n<li>Stabiele di\u00eblektrische eigenschappen<\/li>\n\n<li>Verbeterde productieopbrengst<\/li><\/ul><p>Het gebruik van onderling onverenigbare materialen kan leiden tot twijfels over de betrouwbaarheid gedurende de levensduur van het product.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"FAQ\"><\/span>FAQ<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1782354527137\"><strong class=\"schema-faq-question\">V: Wat is het verschil tussen kernmateriaal en prepreg?<\/strong> <p class=\"schema-faq-answer\">A: Het kernmateriaal is volledig uitgehard en is aan beide zijden voorzien van koperfolie. Prepreg is gedeeltelijk uitgehard en fungeert tijdens het lamineren als hechtlaag.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1782354537620\"><strong class=\"schema-faq-question\">V: Heeft prepreg invloed op de impedantie?<\/strong> <p class=\"schema-faq-answer\">A: Ja. De dikte van het prepreg en de di\u00eblektrische eigenschappen hebben een directe invloed op de impedantiewaarden en de signaalprestaties.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1782354549057\"><strong class=\"schema-faq-question\">V: Kunnen er verschillende prepregs in dezelfde printplaat worden gebruikt?<\/strong> <p class=\"schema-faq-answer\">A: Ja. Bij veel meerlaagse opbouwen worden verschillende soorten prepregs gebruikt om aan specifieke eisen op het gebied van dikte en elektrische eigenschappen te voldoen.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1782354561082\"><strong class=\"schema-faq-question\">V: Waarom is de vloei van prepreg-hars belangrijk?<\/strong> <p class=\"schema-faq-answer\">A: Een goede harsstroom zorgt voor een volledige hechting tussen de lagen en helpt holtes of delaminatie te voorkomen.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1782354575228\"><strong class=\"schema-faq-question\">V: Is prepreg nodig voor alle meerlaagse printplaten?<\/strong> <p class=\"schema-faq-answer\">A: Ja. Prepreg is onmisbaar om de kernlagen tijdens het lamineerproces aan elkaar te hechten.<\/p> <\/div> <\/div><p><\/p>","protected":false},"excerpt":{"rendered":"<p>Core and prepreg materials are the building blocks of multilayer PCBs. Core materials provide structural support and electrical insulation, while prepregs bond layers together during lamination. Their thickness, dielectric properties, and resin characteristics directly affect impedance control, board reliability, manufacturing yield, and overall PCB performance.<\/p>","protected":false},"author":1,"featured_media":5928,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[108],"tags":[486,484],"class_list":["post-5924","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb-core","tag-pcb-material"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>PCB Core and Prepreg Materials<\/title>\n<meta name=\"description\" content=\"PCB core and prepreg materials, their role in multilayer PCB construction, impedance control, lamination, and material selection for reliable PCB manufacturing.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, 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What is the difference between core and prepreg?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Core material is fully cured and contains copper foil on both sides. Prepreg is partially cured and acts as the bonding layer during lamination.","inLanguage":"nl-NL"},"inLanguage":"nl-NL"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-core-and-prepreg\/#faq-question-1782354537620","position":2,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-core-and-prepreg\/#faq-question-1782354537620","name":"Q: Does prepreg affect impedance?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Yes. Prepreg thickness and dielectric properties directly influence impedance values and signal performance.","inLanguage":"nl-NL"},"inLanguage":"nl-NL"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-core-and-prepreg\/#faq-question-1782354549057","position":3,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-core-and-prepreg\/#faq-question-1782354549057","name":"Q: Can different prepregs be used in the same PCB?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Yes. Many multilayer stackups use multiple prepreg styles to achieve specific thickness and electrical requirements.","inLanguage":"nl-NL"},"inLanguage":"nl-NL"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-core-and-prepreg\/#faq-question-1782354561082","position":4,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-core-and-prepreg\/#faq-question-1782354561082","name":"Q: Why is prepreg resin flow important?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Proper resin flow ensures complete bonding between layers and helps prevent voids or delamination.","inLanguage":"nl-NL"},"inLanguage":"nl-NL"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/pcb-core-and-prepreg\/#faq-question-1782354575228","position":5,"url":"https:\/\/www.topfastpcb.com\/blog\/pcb-core-and-prepreg\/#faq-question-1782354575228","name":"Q: Do all multilayer PCBs require prepreg?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: Yes. Prepreg is essential for bonding core layers together during the lamination process.","inLanguage":"nl-NL"},"inLanguage":"nl-NL"}]}},"_links":{"self":[{"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/posts\/5924","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/comments?post=5924"}],"version-history":[{"count":2,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/posts\/5924\/revisions"}],"predecessor-version":[{"id":5931,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/posts\/5924\/revisions\/5931"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/media\/5928"}],"wp:attachment":[{"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/media?parent=5924"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/categories?post=5924"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/nl\/wp-json\/wp\/v2\/tags?post=5924"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}