{"id":3727,"date":"2025-07-30T17:42:23","date_gmt":"2025-07-30T09:42:23","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=3727"},"modified":"2025-07-30T17:45:43","modified_gmt":"2025-07-30T09:45:43","slug":"minimum-line-width-and-line-spacing-for-pcb-circuit-boards","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/","title":{"rendered":"Largura m\u00ednima da linha e espa\u00e7amento entre linhas para PCB"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">\u00cdndice<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#What_are_PCB_trace_width_and_trace_spacing\" >O que \u00e9 a largura e o espa\u00e7amento dos tra\u00e7os da placa de circuito impresso?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#1_Industry_Standard_Minimum_Trace_Width_and_Spacing\" >1. Largura e espa\u00e7amento m\u00ednimos do tra\u00e7o normalizados pela ind\u00fastria<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#11_Conventional_Process_Capabilities\" >1.1 Capacidades de processo convencionais<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#12_Advanced_Processes_HDI\" >1.2 Processos avan\u00e7ados (HDI)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#13_Extreme_Challenges\" >1.3 Desafios extremos<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#2_Four_Key_Factors_Influencing_Trace_WidthSpacing_Selection\" >2. Quatro factores-chave que influenciam a sele\u00e7\u00e3o da largura\/espa\u00e7amento do tra\u00e7o<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#21_Current_Carrying_Capacity_and_Temperature_Rise\" >2.1 Capacidade de carga atual e aumento da temperatura<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#22_Signal_Integrity\" >2.2 Integridade do sinal<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#23_Manufacturing_Process_and_Cost\" >2.3 Processo e custo de fabrico<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#24_Layout_Density_and_BGA_Design\" >2.4 Densidade de disposi\u00e7\u00e3o e conce\u00e7\u00e3o de BGA<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#3_PCB_Design_Optimization_Strategies\" >3. Estrat\u00e9gias de otimiza\u00e7\u00e3o do design de PCB<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#31_Layer_Strategy\" >3.1 Estrat\u00e9gia de camadas<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#32_Avoid_Common_Mistakes\" >3.2 Evitar erros comuns<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#33_Cost_Balancing\" >3.3 Equil\u00edbrio de custos<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#4_PCB_Design_Spacing_Specifications\" >4. Especifica\u00e7\u00f5es de espa\u00e7amento da conce\u00e7\u00e3o da placa de circuito impresso<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#1_Traces\" >1. Tra\u00e7os<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#2_Vias\" >2. Vias<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#3_PTH_Pads_Plated_Through-Holes\" >3. Almofadas PTH (Plated Through-Holes)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#4_Solder_Mask\" >4. M\u00e1scara de solda<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#5_Silkscreen_Text\" >5. Serigrafia (Texto)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#6_Non-Plated_Slots\" >6. Ranhuras n\u00e3o revestidas<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/#7_Panelization\" >7. Paneliza\u00e7\u00e3o<\/a><\/li><\/ul><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_are_PCB_trace_width_and_trace_spacing\"><\/span>O que \u00e9 a largura e o espa\u00e7amento dos tra\u00e7os da placa de circuito impresso?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Em <a href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/pcb-design-principles\/\">conce\u00e7\u00e3o de placas de circuitos impressos (PCB),<\/a> <strong>largura do tra\u00e7o<\/strong> e <strong>espa\u00e7amento entre tra\u00e7os<\/strong> s\u00e3o dois par\u00e2metros fundamentais, mas cr\u00edticos:<\/p><ul class=\"wp-block-list\"><li><strong>Largura do tra\u00e7o<\/strong>: A largura da folha de cobre condutora, que determina a capacidade de transporte de corrente e a subida de temperatura.<\/li>\n\n<li><strong>Espa\u00e7amento do tra\u00e7o<\/strong>: A dist\u00e2ncia entre tra\u00e7os adjacentes, que afecta o isolamento do sinal e os riscos de curto-circuito.<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width.jpg\" alt=\"Largura da linha de PCB\" class=\"wp-image-3728\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Industry_Standard_Minimum_Trace_Width_and_Spacing\"><\/span>1. Largura e espa\u00e7amento m\u00ednimos do tra\u00e7o normalizados pela ind\u00fastria<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"11_Conventional_Process_Capabilities\"><\/span>1.1 Capacidades de processo convencionais<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Principais fabricantes<\/strong>: Mais de 80% podem produzir de forma est\u00e1vel desenhos com <strong>6 mil\/6 mil<\/strong> (0,15 mm\/0,15 mm) a custos mais baixos.<\/li>\n\n<li><strong>Fabricantes de alta precis\u00e3o<\/strong>: Suporte 70% <strong>4 mil\/4 mil<\/strong> (0,1 mm\/0,1 mm), adequado para a maioria dos projectos de alta densidade.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"12_Advanced_Processes_HDI\"><\/span>1.2 Processos avan\u00e7ados (HDI)<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Tecnologia Microvia de perfura\u00e7\u00e3o a laser<\/strong>: Apoios <strong>2 mil\/2 mil<\/strong> (0,05 mm\/0,05 mm), utilizados em aplica\u00e7\u00f5es ultrafinas e de alta densidade, como smartphones e m\u00f3dulos RF, mas os custos aumentam significativamente.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"13_Extreme_Challenges\"><\/span>1.3 Desafios extremos<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>3,5 mil\/3,5 mil<\/strong> (0,09 mm\/0,09 mm) est\u00e1 limitada a alguns fabricantes e requer testes de rendimento rigorosos.<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Four_Key_Factors_Influencing_Trace_WidthSpacing_Selection\"><\/span>2. Quatro factores-chave que influenciam a sele\u00e7\u00e3o da largura\/espa\u00e7amento do tra\u00e7o<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"21_Current_Carrying_Capacity_and_Temperature_Rise\"><\/span>2.1 Capacidade de carga atual e aumento da temperatura<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Refer\u00eancia da f\u00f3rmula<\/strong>: De acordo com a norma IPC-2221, a largura do tra\u00e7o deve cumprir os requisitos de corrente. Por exemplo, com 1 oz de espessura de cobre, uma corrente de 1 A requer pelo menos <strong>40 mil (1 mm)<\/strong> largura do tra\u00e7o (para um aumento de temperatura de 10\u00b0C).<\/li>\n\n<li><strong>Assist\u00eancia para ferramentas<\/strong>: Utilize calculadoras online de largura de tra\u00e7o de PCB (por exemplo, Saturn PCB Toolkit) introduzindo a corrente, a espessura do cobre e os limites de aumento de temperatura para obter rapidamente os valores recomendados.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"22_Signal_Integrity\"><\/span>2.2 Integridade do sinal<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Sinais de alta velocidade<\/strong>: Exigir uma correspond\u00eancia de imped\u00e2ncia, em que a largura do tra\u00e7o est\u00e1 relacionada com a espessura e a permissividade da camada diel\u00e9ctrica. Por exemplo, uma linha microstrip de 50 \u03a9 numa placa FR4 tem normalmente uma largura de tra\u00e7o de <strong>8-12 milh\u00f5es<\/strong>.<\/li>\n\n<li><strong>Pares diferenciais<\/strong>: Mantenha a largura e o espa\u00e7amento iguais (por exemplo, 5 mil\/5 mil) para reduzir a diafonia.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"23_Manufacturing_Process_and_Cost\"><\/span>2.3 Processo e custo de fabrico<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Limiar de custos<\/strong>: Quando a largura\/espa\u00e7amento do tra\u00e7o \u00e9 inferior a 5 mil, os pre\u00e7os podem duplicar (devido a rendimentos inferiores e aos requisitos do processo laser).<\/li>\n\n<li><strong>Sele\u00e7\u00e3o da espessura do cobre<\/strong>: As camadas exteriores utilizam normalmente 1 oz (35 \u03bcm), as camadas interiores 0,5 oz; para cen\u00e1rios de corrente elevada, pode ser utilizada uma espessura de cobre de 2 oz, mas requer tra\u00e7os mais largos.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"24_Layout_Density_and_BGA_Design\"><\/span>2.4 Densidade de disposi\u00e7\u00e3o e conce\u00e7\u00e3o de BGA<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Encaminhamento de fuga BGA<\/strong>: Para BGAs com passo de 1 mm, use 6 mil\/6 mil se estiver a encaminhar um tra\u00e7o entre dois pinos; use 4 mil\/4 mil se estiver a encaminhar dois tra\u00e7os.<\/li>\n\n<li><strong>Evitar estrangulamentos<\/strong>: Planear antecipadamente as larguras de tra\u00e7o em \u00e1reas de alta densidade para evitar retrabalho posterior.<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-2.jpg\" alt=\"Largura da linha de PCB\" class=\"wp-image-3729\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_PCB_Design_Optimization_Strategies\"><\/span>3. Estrat\u00e9gias de otimiza\u00e7\u00e3o do design de PCB<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"31_Layer_Strategy\"><\/span>3.1 Estrat\u00e9gia de camadas<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Camadas de energia<\/strong>: Utilize tra\u00e7os largos ou camadas de cobre (por exemplo, 50 mil+) para reduzir a imped\u00e2ncia e a gera\u00e7\u00e3o de calor.<\/li>\n\n<li><strong>Camadas de sinal<\/strong>: Dar prioridade aos sinais de alta frequ\u00eancia nas camadas interiores (estrutura em stripline) para minimizar a interfer\u00eancia da radia\u00e7\u00e3o.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"32_Avoid_Common_Mistakes\"><\/span>3.2 Evitar erros comuns<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Tra\u00e7os de \u00e2ngulo agudo<\/strong>: Substituir por cantos curvos ou de 45\u00b0 para reduzir as descontinuidades de imped\u00e2ncia.<\/li>\n\n<li><strong>Ignorar o feedback do fabricante<\/strong>: Confirmar os documentos de capacidade do processo (por exemplo, abertura m\u00ednima, toler\u00e2ncias de largura de tra\u00e7o) antes de finalizar os projectos.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"33_Cost_Balancing\"><\/span>3.3 Equil\u00edbrio de custos<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Dar prioridade ao relaxamento de sinais n\u00e3o cr\u00edticos<\/strong>: Utilize larguras de tra\u00e7o de 8-10 mil para sinais de E\/S gerais para poupar espa\u00e7o para percursos cr\u00edticos.<\/li><\/ul><p>A otimiza\u00e7\u00e3o da largura e do espa\u00e7amento dos tra\u00e7os de PCB requer um equil\u00edbrio entre o desempenho el\u00e9trico, as limita\u00e7\u00f5es do processo e o custo. <strong>4 mil\/4 mil<\/strong> \u00e9 o ponto ideal para a maioria dos projectos de alta densidade, enquanto <strong>2 mil\/2 mil<\/strong> est\u00e1 reservado para aplica\u00e7\u00f5es HDI topo de gama. A conce\u00e7\u00e3o na fase inicial deve utilizar ferramentas de c\u00e1lculo para verificar os requisitos actuais e comunicar com os fabricantes para garantir a produtibilidade.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-1.jpg\" alt=\"Largura da linha de PCB\" class=\"wp-image-3730\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/PCB-line-width-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_PCB_Design_Spacing_Specifications\"><\/span>4. Especifica\u00e7\u00f5es de espa\u00e7amento da conce\u00e7\u00e3o da placa de circuito impresso<span class=\"ez-toc-section-end\"><\/span><\/h2><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Traces\"><\/span><strong>1. Tra\u00e7os<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Min. Largura<\/strong>: 5mil (0,127mm)<\/li>\n\n<li><strong>M\u00edn. Espa\u00e7amento<\/strong>: 5mil (0,127mm)<\/li>\n\n<li><strong>Tra\u00e7o para a borda da placa<\/strong>: \u22650,3mm (20mil)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Vias\"><\/span><strong>2. Vias<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>M\u00edn. Tamanho do furo<\/strong>: 0,3mm (12mil)<\/li>\n\n<li><strong>Largura do anel da almofada<\/strong>: \u22656mil (0,153mm)<\/li>\n\n<li><strong>Espa\u00e7amento de via a via<\/strong>\u22656mil (borda a borda)<\/li>\n\n<li><strong>Via para o bordo da placa<\/strong>: \u22650,508mm (20mil)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_PTH_Pads_Plated_Through-Holes\"><\/span><strong>3. Almofadas PTH (Plated Through-Holes)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>M\u00edn. Tamanho do furo<\/strong>\u22650,2 mm maior do que o cabo do componente<\/li>\n\n<li><strong>Largura do anel da almofada<\/strong>: \u22650,2mm (8mil)<\/li>\n\n<li><strong>Espa\u00e7amento entre furos<\/strong>\u22650,3 mm (margem a margem)<\/li>\n\n<li><strong>Almofada at\u00e9 \u00e0 extremidade da placa<\/strong>: \u22650,508mm (20mil)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Solder_Mask\"><\/span><strong>4. M\u00e1scara de solda<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Abertura PTH\/SMD<\/strong>: \u22650,1mm (4mil) de folga<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Silkscreen_Text\"><\/span><strong>5. Serigrafia (Texto)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>M\u00edn. Largura da linha<\/strong>: 6mil (0,153mm)<\/li>\n\n<li><strong>M\u00ednimo. Altura<\/strong>: 32mil (0,811mm)<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"6_Non-Plated_Slots\"><\/span><strong>6. Ranhuras n\u00e3o revestidas<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>M\u00edn. Espa\u00e7amento<\/strong>: \u22651,6mm<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"7_Panelization\"><\/span><strong>7. Paneliza\u00e7\u00e3o<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Espa\u00e7amento (placa de 1,6 mm)<\/strong>: \u22651,6mm<\/li>\n\n<li><strong>Corte em V\/N\u00e3o espa\u00e7amento<\/strong>: ~0,5mm<\/li>\n\n<li><strong>Borda do processo<\/strong>: \u22655mm<\/li><\/ul><p><\/p>","protected":false},"excerpt":{"rendered":"<p>O que s\u00e3o a largura e o espa\u00e7amento dos tra\u00e7os de uma placa de circuito impresso? Na conce\u00e7\u00e3o de placas de circuito impresso (PCB), a largura e o espa\u00e7amento dos tra\u00e7os s\u00e3o dois par\u00e2metros fundamentais, mas cr\u00edticos: 1. Largura e espa\u00e7amento m\u00ednimos do tra\u00e7o padr\u00e3o da ind\u00fastria 1.1 Capacidades de processo convencionais 1.2 Processos avan\u00e7ados (HDI) 1.3 Desafios extremos 2. Quatro factores-chave que influenciam a sele\u00e7\u00e3o da largura\/espa\u00e7amento do tra\u00e7o 2.1 Corrente de transporte [&hellip;]<\/p>","protected":false},"author":1,"featured_media":3731,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[110,332],"class_list":["post-3727","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-pcb-design","tag-pcb-line-width"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Minimum line width and line spacing for PCB - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Design specifications for minimum line width and line spacing on PCB circuit boards, including manufacturing process limitations, current carrying capacity, signal integrity optimization, and cost considerations, to ensure high-performance circuit board design.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/pt\/blog\/minimum-line-width-and-line-spacing-for-pcb-circuit-boards\/\" \/>\n<meta property=\"og:locale\" content=\"pt_PT\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Minimum line width and line spacing for PCB - 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