{"id":3247,"date":"2025-06-11T08:32:00","date_gmt":"2025-06-11T00:32:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=3247"},"modified":"2025-06-10T11:32:13","modified_gmt":"2025-06-10T03:32:13","slug":"high-density-interconnector-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/","title":{"rendered":"PCB f\u00f6r h\u00f6gdensitetsinterkonnektor"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">Inneh\u00e5llsf\u00f6rteckning<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#What_is_HDI\" >Vad \u00e4r HDI?<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#Core_Features\" >Centrala funktioner<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#Core_features_of_HDI_boards_vs_conventional_PCB\" >Huvudfunktioner hos HDI-kretsar (j\u00e4mf\u00f6rt med konventionella kretskort)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#1_Microvia_design_laser_drilling_dominated\" >1. Microvia-design (laserborrning dominerar)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#2_Microvia_and_Hole_Ring_Designs_Via_Diameter_%E2%89%A4150%C2%B5m\" >2.Mikrovia- och h\u00e5lringskonstruktioner med diameter \u2264150\u00b5m<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#3_High_Solder_Joint_Density_%3E130_jointsin%C2%B2\" >3.H\u00f6g l\u00f6dfogst\u00e4thet (&gt;130 fogar\/in\u00b2)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#4_High_wiring_density_%3E117_wiresin%C2%B2\" >4. H\u00f6g ledningsdensitet (117 ledningar\/in\u00b2)<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#5_Fine_line_line_widthspace_%E2%89%A4_3_mil75%C2%B5m\" >5.Fin linje (linjebredd\/avst\u00e5nd \u2264 3 mil\/75\u00b5m)<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#Core_Benefits_of_HDI\" >De viktigaste f\u00f6rdelarna med HDI<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#HDI_PCB_Technical_Specification_Sheet\" >Tekniskt specifikationsblad f\u00f6r HDI PCB<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#Applications_and_Core_Advantages_of_HDI_Boards\" >Till\u00e4mpningar och f\u00f6rdelar med HDI-kretsar<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#I_Key_Application_Areas_of_HDI_Boards\" >I. Viktiga anv\u00e4ndningsomr\u00e5den f\u00f6r HDI-kort<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#II_The_%E2%80%9CFour_Highs_and_One_Low%E2%80%9D_Advantages_of_HDI_Technology\" >II.F\u00f6rdelarna med HDI-tekniken: \"Fyra h\u00f6ga och en l\u00e5g\" (&#8220;Four Highs and One Low&amp;#8221)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#III_Market_Outlook_and_Supporting_Data\" >III.Marknadsutsikter och st\u00f6djande data<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#Classification_of_HDI_Boards\" >Klassificering av HDI-kort<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#1_1N1_Type\" >(1) 1+N+1 Typ<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#2_iNi_i%E2%89%A52_Type\" >(2) i+N+i (i\u22652) Typ<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#3_Any-Layer_Interconnect_ELIC_Type\" >(3) ELIC-typ (Any-Layer Interconnect)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#Technical_Comparison\" >Teknisk j\u00e4mf\u00f6relse<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#HDIBUM_PCB_Material_Performance_Requirements\" >Krav p\u00e5 prestanda f\u00f6r HDI\/BUM PCB-material<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#1_Prepreg_PP_Materials\" >1. Prepreg (PP)-material<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#2_Resin_Coated_Copper_RCC_Materials\" >2.Material av hartsbelagd koppar (RCC)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#3_Laser_Drillable_Prepreg_LDP_Materials\" >3.Laserborrbara prepregmaterial (LDP)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-24\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#4_Liquid_Crystal_Polymer_LCP_Materials\" >4.Material av flytande kristallpolymer (LCP)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-25\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#Material_Selection_Guide\" >Material Selection Guide och de senaste offerterna!<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-26\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#Difference_in_PCB_manufacturing_process_between_core-containing_boards_and_coreless_boards\" >Skillnad i tillverkningsprocessen f\u00f6r kretskort mellan kretskort med k\u00e4rna och kretskort utan k\u00e4rna<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-27\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#I_Core-Based_HDI_Manufacturing_Process\" >I. Tillverkningsprocess f\u00f6r k\u00e4rnbaserad HDI<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-28\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#II_Breakthrough_Coreless_HDI_Technology\" >II.Banbrytande HDI-teknik utan k\u00e4rna<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-29\" href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/high-density-interconnector-pcb\/#Concluding_Remarks\" >Avslutande kommentarer<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_is_HDI\"><\/span>Vad \u00e4r HDI?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>HDI, som inneb\u00e4r en h\u00f6gre kabeldensitet per ytenhet \u00e4n konventionella kretskort, \u00e4r en avancerad <a href=\"https:\/\/www.topfastpcb.com\/sv\/blog\/printed-circuit-board-pcb\/\">tryckt kretskort<\/a> (PCB) som uppn\u00e5r h\u00f6gre niv\u00e5er av integration av elektroniska komponenter genom mikrofina ledningar, mikroskopiska via-strukturer och t\u00e4ta ledningar. Dessa kort anv\u00e4nder finare tr\u00e5dar och mellanrum (\u2264 100 \u00b5m\/0,10 mm), mindre vias (150 \u00b5m) och pads (400 \u00b5m\/0,40 mm) och h\u00f6gre paddensitet (20 pads\/cm2) \u00e4n konventionell PCB-teknik.ts\/in\u00b2)4. H\u00f6g kabeldensitet (117 tr\u00e5dar\/in\u00b2)<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Core_Features\"><\/span><strong>Centrala funktioner<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Finare linjebredd\/avst\u00e5nd<\/strong>: typiskt \u2264100 \u00b5m (0,10 mm), vilket \u00e4r mycket l\u00e4gre \u00e4n f\u00f6r konventionella m\u00f6nsterkort (typiskt 150 \u00b5m+).<\/li>\n\n<li><strong>Liten via h\u00e5l<\/strong>:<\/li>\n\n<li><strong>Vias med inb\u00e4ddad laserblindhet<\/strong>: &lt;150 \u00b5m i diameter, laserborrade f\u00f6r h\u00f6gdensitetsanslutningar mellan skikten.<\/li>\n\n<li><strong>Staplade\/f\u00f6rskjutna h\u00e5l<\/strong>: F\u00f6rb\u00e4ttra utnyttjandet av vertikalt utrymme och minska behovet av lager.<\/li>\n\n<li><strong>H\u00f6g paddensitet<\/strong>: &gt;20 pads\/cm\u00b2 f\u00f6r att st\u00f6dja chip med flera stift (t.ex. BGA- och CSP-paket).<\/li>\n\n<li><strong>Tunna material (&gt;117 tr\u00e5dar\/in\u00b2) 4. H\u00f6g ledningsdensitet (&gt;117 tr\u00e5dar\/in\u00b2)<\/strong>: Anv\u00e4ndning av substrat med l\u00e5g dielektricitetskonstant och h\u00f6g stabilitet (t.ex. FR4, polyimid).<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB.jpg\" alt=\"HDI-KRETSKORT\" class=\"wp-image-3248\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Core_features_of_HDI_boards_vs_conventional_PCB\"><\/span><strong>Huvudfunktioner hos HDI-kretsar (j\u00e4mf\u00f6rt med konventionella kretskort)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Microvia_design_laser_drilling_dominated\"><\/span><strong>1. Microvia-design (laserborrning dominerar)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Val av teknik<\/strong>: HDI-kort anv\u00e4nder vanligtvis <strong>Laserborrning<\/strong> (h\u00e5ldiameter typiskt \u2264150\u00b5m) i st\u00e4llet f\u00f6r mekanisk borrning. Sk\u00e4len \u00e4r bland annat:<\/li>\n\n<li><strong>Begr\u00e4nsningar f\u00f6r mekanisk borrning (&gt;117 tr\u00e5dar\/in\u00b2) 4. H\u00f6g ledningsdensitet (&gt;117 tr\u00e5dar\/in\u00b2)<\/strong>: 0,15 mm borrn\u00e5lar \u00e4r l\u00e4tta att bryta, har h\u00f6ga RPM-krav och l\u00e5g effektivitet, och of\u00f6rm\u00e5ga att f\u00f6rverkliga djupkontrollen avts \/ in\u00b2) 4. H\u00f6g ledningsdensitet (&gt; 117 ledningar \/ in\u00b2) <strong>blinda begravda h\u00e5l<\/strong>.<\/li>\n\n<li><strong>Laserf\u00f6rdel<\/strong>: Kan bearbeta sm\u00e5 h\u00e5l (t.ex. 50 \u00b5m), st\u00f6djer <strong>HDI i alla skikt<\/strong>och har ingen fysisk kontakt och h\u00f6g avkastning.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Microvia_and_Hole_Ring_Designs_Via_Diameter_%E2%89%A4150%C2%B5m\"><\/span><strong>2. Mikrovia- och h\u00e5lringskonstruktioner<\/strong> Via diameter \u2264150\u00b5m<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Vior \u2264150\u00b5m<\/strong> och vias (pads) \u2264250\u00b5m, vilket frig\u00f6r layoututrymme genom att vian blir smalare.<\/li>\n\n<li><strong>Exempel<\/strong>: Om aperturdiametern minskas fr\u00e5n 0,30 mm till 0,10 mm (laservias) kan paddiametern minskas fr\u00e5n 0,60 mm till 0,35 mm, <strong>sparar 67% yta<\/strong>.<\/li>\n\n<li><strong>Direkt stansning i pad (Via-in-Pad)<\/strong>: optimerar ytterligare BGA\/SMD-komponentlayouten och \u00f6kar densiteten.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_High_Solder_Joint_Density_%3E130_jointsin%C2%B2\"><\/span><strong>3.H\u00f6g l\u00f6dfogst\u00e4thet (&gt;130 fogar\/in\u00b2)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Densiteten hos l\u00f6dplattorna avg\u00f6r komponentintegrationen. HDI f\u00f6rverkligar <strong>multifunktionell modul<\/strong> h\u00f6gdensitetsmontering (t.ex. moderkort f\u00f6r mobiltelefoner) genom mikrominiatyrh\u00e5l\/tr\u00e5dar.ts\/in\u00b2)4. H\u00f6g kablingsdensitet (&gt;117 tr\u00e5dar\/in\u00b2)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_High_wiring_density_%3E117_wiresin%C2%B2\"><\/span><strong>4. H\u00f6g ledningsdensitet (117 ledningar\/in\u00b2)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>F\u00f6r att kunna matcha \u00f6kningen av antalet komponenter m\u00e5ste linjet\u00e4theten \u00f6kas samtidigt. HDI \u00e5stadkommer komplex kabeldragning genom <strong>fin ledningsdragning<\/strong> (linjebredd\/avst\u00e5nd \u2264100\u00b5m) och <strong>stapling av flera lager<\/strong>.<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Fine_line_line_widthspace_%E2%89%A4_3_mil75%C2%B5m\"><\/span><strong>5.Fin linje (linjebredd\/avst\u00e5nd \u2264 3 mil\/75\u00b5m)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Teoretiska standardtr\u00e5dar\/in\u00b2)4. H\u00f6g ledningsdensitet (&gt;117 tr\u00e5dar\/in\u00b2)<\/strong>: 75\u00b5m\/75\u00b5m, men i praktiken anv\u00e4nds vanligen 100\u00b5m\/100\u00b5m. Anledning:<\/li>\n\n<li><strong>Processkostnad<\/strong>: 75\u00b5m-processen \u00e4r kr\u00e4vande vad g\u00e4ller utrustning\/material, l\u00e5gt utbyte, f\u00e5 leverant\u00f6rer och h\u00f6ga kostnader.<\/li>\n\n<li><strong>Balans mellan pris och prestanda<\/strong>: 100 \u00b5m-l\u00f6sningen ger en balans mellan densitet och kostnad och \u00e4r l\u00e4mplig f\u00f6r de flesta behov inom konsumentelektronik.<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Core_Benefits_of_HDI\"><\/span>De viktigaste f\u00f6rdelarna med HDI<span class=\"ez-toc-section-end\"><\/span><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Dimension<\/strong><\/th><th><strong>HDI:s styrelse<\/strong><\/th><th><strong>Traditionellt kretskort<\/strong><\/th><\/tr><\/thead><tbody><tr><td><strong>Borrningsteknik<\/strong><\/td><td>Laserborrning (blinda h\u00e5l, godtyckliga skikt)<\/td><td>Mekanisk borrning (baserad p\u00e5 genomg\u00e5ende h\u00e5l)<\/td><\/tr><tr><td><strong>H\u00e5ldiameter\/H\u00e5lring<\/strong><\/td><td>\u2264150\u00b5m\/\u2264250\u00b5m<\/td><td>\u2265200\u00b5m\/\u2265400\u00b5m<\/td><\/tr><tr><td><strong>Ledningarnas t\u00e4thet<\/strong><\/td><td>117 tr\u00e5dar\/in\u00b2<\/td><td>&lt;50 tr\u00e5dar\/in\u00b2<\/td><\/tr><tr><td><strong>Tr\u00e5dbredd\/Pitch<\/strong><\/td><td>\u2264100\u00b5m (Mainstream)<\/td><td>\u2265150\u00b5m<\/td><\/tr><\/tbody><\/table><\/figure><p>HDI fr\u00e4mjar miniatyrisering och h\u00f6g prestanda hos elektroniska produkter genom <strong>mikrovia-, finlinje- och h\u00f6gdensitetsinterkonnektorer<\/strong>och \u00e4r en nyckelteknik f\u00f6r 5G, AI och b\u00e4rbara enheter.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-1.jpg\" alt=\"HDI-KRETSKORT\" class=\"wp-image-3249\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"HDI_PCB_Technical_Specification_Sheet\"><\/span>Tekniskt specifikationsblad f\u00f6r HDI PCB<span class=\"ez-toc-section-end\"><\/span><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Funktion<\/strong><\/th><th><strong>Tekniska specifikationer f\u00f6r HDI PCB<\/strong><\/th><\/tr><\/thead><tbody><tr><td><strong>Skikt<\/strong><\/td><td><strong>Standard<\/strong>: 4-22 lager<br><strong>Avancerad<\/strong>: Upp till 30 lager<\/td><\/tr><tr><td><strong>Viktiga h\u00f6jdpunkter<\/strong><\/td><td>&#8211; H\u00f6gre bel\u00e4ggningsgrad<br>&#8211; Finare sp\u00e5r\/utrymme (\u226475\u00b5m)<br>&#8211; Microvias (blind\/begravd, sammankoppling i alla lager)<br>&#8211; Via-in-Pad-design<\/td><\/tr><tr><td><strong>Uppbyggnad av HDI<\/strong><\/td><td>1+N+1, 2+N+2, 3+N+3, 4+N+4, valfritt lager (ELIC), Ultra HDI (R&amp;D)<\/td><\/tr><tr><td><strong>Material<\/strong><\/td><td>FR4 (Standard\/H\u00f6gprestanda), Halogenfri FR4, Rogers (f\u00f6r h\u00f6gfrekvenstill\u00e4mpningar)<\/td><\/tr><tr><td><strong>Kopparvikt (f\u00e4rdigbearbetad)<\/strong><\/td><td>18\u03bcm - 70\u03bcm<\/td><\/tr><tr><td><strong>Min. Sp\u00e5r\/utrymme<\/strong><\/td><td><strong>0,075 mm \/ 0,075 mm<\/strong> (75\u00b5m\/75\u00b5m)<\/td><\/tr><tr><td><strong>PCB-tjocklek<\/strong><\/td><td>0,40 mm - 3,20 mm<\/td><\/tr><tr><td><strong>Max. Storlek p\u00e5 kort<\/strong><\/td><td>610 mm \u00d7 450 mm (begr\u00e4nsad av laserborrningskapacitet)<\/td><\/tr><tr><td><strong>Ytfinish<\/strong><\/td><td>OSP, ENIG, neds\u00e4nkt tenn, neds\u00e4nkt silver, elektrolytiskt guld, guldfingrar<\/td><\/tr><tr><td><strong>Min. Storlek p\u00e5 h\u00e5l<\/strong><\/td><td><strong>Mekanisk borrning<\/strong>: 0,15 mm<br><strong>Laserborrning<\/strong>:<br>&#8211; Standard: 0,10 mm (100 \u00b5m)<br>&#8211; Avancerad: 0,075 mm (75 \u00b5m)<\/td><\/tr><\/tbody><\/table><\/figure><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Applications_and_Core_Advantages_of_HDI_Boards\"><\/span><strong>Till\u00e4mpningar och f\u00f6rdelar med HDI-kretsar<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"I_Key_Application_Areas_of_HDI_Boards\"><\/span><strong>I. Viktiga anv\u00e4ndningsomr\u00e5den f\u00f6r HDI-kort<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><p>I takt med att halvledartekniken utvecklas mot miniatyrisering och h\u00f6g prestanda har HDI-tekniken blivit en viktig m\u00f6jligg\u00f6rare f\u00f6r modern elektronik, och den dominerar s\u00e4rskilt inom f\u00f6ljande omr\u00e5den:<\/p><ul class=\"wp-block-list\"><li><strong>Mobil kommunikation<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Smarta telefoner (4G\/5G)<\/strong>: Routning med h\u00f6g densitet st\u00f6der moduler med flera kameror, 5G-antenner och h\u00f6ghastighetsprocessorer (t.ex. BGA-f\u00f6rpackade chip).<\/li>\n\n<li><strong>Utrustning f\u00f6r basstationer<\/strong>: H\u00f6gfrekvent signal\u00f6verf\u00f6ring (t.ex. millimeterv\u00e5gsband) \u00e4r beroende av HDI&#8217;s l\u00e5gf\u00f6rlustmaterial (t.ex. Rogers).<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Konsumentelektronik<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li><strong>B\u00e4rbara enheter<\/strong>: Ultratunna konstruktioner (t.ex. moderkort f\u00f6r vikbara smartphones, TWS-\u00f6ronsn\u00e4ckor) kr\u00e4ver HDI&amp;#8217:s tunnskiktsstackning (1+N+1-struktur).<\/li>\n\n<li><strong>Digitalkameror\/AR\/VR<\/strong>: H\u00f6guppl\u00f6sta sensorer och miniatyriserade moduler \u00e4r beroende av mikrovias (&lt;75\u00b5m) och Via-in-Pad-teknik.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Elektronik f\u00f6r fordonsindustrin<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Avancerade system f\u00f6r f\u00f6rarassistans (ADAS)<\/strong>: Radar- och infotainmentsystem kr\u00e4ver HDI&amp;#8217s h\u00f6ga tillf\u00f6rlitlighet (v\u00e4rmebest\u00e4ndighet, vibrationsbest\u00e4ndighet).<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>H\u00f6gpresterande databehandling<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li><strong>AI-servrar\/GPU:er<\/strong>: H\u00f6g ledningsf\u00f6rm\u00e5ga och termisk design st\u00f6der \u00f6verf\u00f6ring av h\u00f6g str\u00f6m (koppartjocklek \u226570 \u00b5m).<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"II_The_%E2%80%9CFour_Highs_and_One_Low%E2%80%9D_Advantages_of_HDI_Technology\"><\/span><strong>II.F\u00f6rdelarna med HDI-tekniken: \"Fyra h\u00f6ga och en l\u00e5g\" (&#8220;Four Highs and One Low&amp;#8221)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>F\u00f6rdel<\/strong><\/th><th><strong>Teknisk implementering<\/strong><\/th><th><strong>Till\u00e4mpningsv\u00e4rde<\/strong><\/th><\/tr><\/thead><tbody><tr><td><strong>Routning med h\u00f6g densitet<\/strong><\/td><td>Sp\u00e5r\/utrymme \u226475\u00b5m, mikrovias (laserborrning)<\/td><td>Minskar PCB-ytan med 30 % och krymper slutproduktens storlek<\/td><\/tr><tr><td><strong>H\u00f6gfrekvent &amp; H\u00f6ghastighet<\/strong><\/td><td>Material med l\u00e5g Dk (t.ex. PTFE), impedansreglering (\u00b15%)<\/td><td>St\u00f6djer 5G\/6G mmWave och h\u00f6ghastighets SerDes-signalintegritet<\/td><\/tr><tr><td><strong>H\u00f6g konduktivitet<\/strong><\/td><td>ELIC (Any-Layer Interconnect), pl\u00e4teringsteknik f\u00f6r via-fyllning<\/td><td>Minskar signalf\u00f6rdr\u00f6jningen mellan skikten, f\u00f6rb\u00e4ttrar datahastigheterna<\/td><\/tr><tr><td><strong>H\u00f6g isoleringstillf\u00f6rlitlighet<\/strong><\/td><td>Halogenfria substrat, precisionslaminering (\u22643% expansionshastighet)<\/td><td>Uppfyller AEC-Q200-certifiering f\u00f6r fordonsindustrin och f\u00f6rl\u00e4nger livsl\u00e4ngden med 50%.<\/td><\/tr><tr><td><strong>L\u00e5g kostnad<\/strong><\/td><td>F\u00e4rre lager (t.ex. genom att ers\u00e4tta 8-lagers h\u00e5lkretskort med 4-lagers HDI), automatiserad laserborrning (utbyte &gt;98%)<\/td><td>Minskar totalkostnaden med 15-20%.<\/td><\/tr><\/tbody><\/table><\/figure><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"III_Market_Outlook_and_Supporting_Data\"><\/span><strong>III.Marknadsutsikter och st\u00f6djande data<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Tillv\u00e4xt Trend<\/strong>: Under perioden 2000-2008 \u00f6kade den globala produktionen av HDI-kort med en genomsnittlig \u00e5rlig tillv\u00e4xttakt p\u00e5 14% (Prismark-data). \u00c5r 2023 \u00f6versteg marknadsstorleken 12 miljarder USD, med en ber\u00e4knad CAGR f\u00f6r 2030 p\u00e5 8,3%.<\/li>\n\n<li><strong>Teknisk utveckling<\/strong>: Ultra HDI (sp\u00e5r\/utrymme \u226440\u00b5m) och teknik f\u00f6r inbyggda komponenter kommer att driva p\u00e5 utvecklingen av AIoT och b\u00e4rbara enheter ytterligare.<\/li><\/ul><p>Med sina \"fyra h\u00f6ga och en l\u00e5g\"-egenskaper \u00e4r HDI-tekniken en viktig drivkraft f\u00f6r utvecklingen inom elektronikindustrin och har en enorm potential inom 6G-kommunikation, sj\u00e4lvk\u00f6rande fordon och kvantdatorer.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Classification_of_HDI_Boards\"><\/span><strong>Klassificering av HDI-kort<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2><p>HDI-kort kategoriseras i tre huvudtyper baserat p\u00e5 staplingsmetod och lamineringsantal av blinda vior:<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_1N1_Type\"><\/span><strong>(1) 1+N+1 Typ<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Struktur<\/strong>: Har ett enda lamineringslager f\u00f6r sammankopplingar med h\u00f6g densitet.<\/li>\n\n<li><strong>Egenskaper<\/strong>:<\/li>\n\n<li>Den mest kostnadseffektiva HDI-l\u00f6sningen<\/li>\n\n<li>L\u00e4mplig f\u00f6r konstruktioner med m\u00e5ttlig komplexitet<\/li>\n\n<li>Typiska anv\u00e4ndningsomr\u00e5den: Smartphones i nyb\u00f6rjarsegmentet, konsumentelektronik<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_iNi_i%E2%89%A52_Type\"><\/span><strong>(2) i+N+i (i\u22652) Typ<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Struktur<\/strong>:Inneh\u00e5ller tv\u00e5 eller flera lamineringslager f\u00f6r sammankopplingar med h\u00f6g densitet.<\/li>\n\n<li><strong>Viktiga funktioner<\/strong>:<\/li>\n\n<li>St\u00f6der f\u00f6rskjutna eller staplade mikrovia-konfigurationer<\/li>\n\n<li>Avancerade konstruktioner anv\u00e4nder ofta kopparfyllda staplade mikrovias<\/li>\n\n<li>Ger f\u00f6rb\u00e4ttrad routingdensitet och signalintegritet<\/li>\n\n<li><strong>Till\u00e4mpningar<\/strong>:<\/li>\n\n<li>Mobila enheter i mellan- och h\u00f6gprissegmentet<\/li>\n\n<li>N\u00e4tverksutrustning<\/li>\n\n<li>Elektronik f\u00f6r fordonsindustrin<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Any-Layer_Interconnect_ELIC_Type\"><\/span><strong>(3) ELIC-typ (Any-Layer Interconnect)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Struktur<\/strong>: Alla lager anv\u00e4nder h\u00f6gdensitetsf\u00f6rbindelser med staplade kopparfyllda mikrovias.<\/li>\n\n<li><strong>F\u00f6rdelar<\/strong>:<\/li>\n\n<li>M\u00f6jligg\u00f6r fullst\u00e4ndig designfrihet f\u00f6r anslutningar mellan skikten<\/li>\n\n<li>Optimal l\u00f6sning f\u00f6r komponenter med extremt h\u00f6gt stiftantal (t.ex. CPU:er, GPU:er)<\/li>\n\n<li>Maximerar utrymmesutnyttjandet i kompakta konstruktioner<\/li>\n\n<li><strong>Typiska anv\u00e4ndningsfall<\/strong>:<\/li>\n\n<li>Flaggskeppssmartphones<\/li>\n\n<li>H\u00f6gpresterande datorsystem<\/li>\n\n<li>Avancerade b\u00e4rbara enheter<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technical_Comparison\"><\/span><strong>Teknisk j\u00e4mf\u00f6relse<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Typ<\/strong><\/th><th><strong>Laminering Antal<\/strong><\/th><th><strong>Via struktur<\/strong><\/th><th><strong>Kostnadsfaktor<\/strong><\/th><th><strong>Typiska till\u00e4mpningar<\/strong><\/th><\/tr><\/thead><tbody><tr><td>1+N+1<\/td><td>Enkel laminering<\/td><td>Grundl\u00e4ggande mikrovias<\/td><td>L\u00e4gst antal tr\u00e5dar\/in\u00b2)4. H\u00f6g ledningsdensitet (&gt;117 tr\u00e5dar\/in\u00b2)<\/td><td>Konsumentelektronik f\u00f6r nyb\u00f6rjare<\/td><\/tr><tr><td>i+N+i (i\u22652)<\/td><td>Flera lamineringar<\/td><td>Staplade\/f\u00f6rskjutna mikrovias<\/td><td>M\u00e5ttlig<\/td><td>Mellanklass mobil\/n\u00e4tverk<\/td><\/tr><tr><td>ELIC<\/td><td>Alla lager<\/td><td>Kopparfyllda staplade vior<\/td><td>H\u00f6gsta<\/td><td>Avancerad databehandling\/mobil<\/td><\/tr><\/tbody><\/table><\/figure><p>Detta klassificeringssystem hj\u00e4lper konstrukt\u00f6rer att v\u00e4lja l\u00e4mplig HDI-teknik utifr\u00e5n prestandakrav, komplexitet och kostnad. Utvecklingen fr\u00e5n 1+N+1 till ELIC representerar \u00f6kande kapacitet f\u00f6r att st\u00f6dja mer avancerade elektroniska applikationer.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-2.jpg\" alt=\"HDI-KRETSKORT\" class=\"wp-image-3250\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"HDIBUM_PCB_Material_Performance_Requirements\"><\/span><strong>Krav p\u00e5 prestanda f\u00f6r HDI\/BUM PCB-material<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2><p>Utvecklingen av material f\u00f6r HDI-kretskort har alltid fokuserat p\u00e5 att uppfylla kraven p\u00e5 \"fyra h\u00f6ga och en l\u00e5g\" (h\u00f6g densitet, h\u00f6g frekvens, h\u00f6g ledningsf\u00f6rm\u00e5ga, h\u00f6g tillf\u00f6rlitlighet och l\u00e5g kostnad).De \u00f6kande kraven p\u00e5 miniatyrisering och prestanda hos kretskort tillgodoses genom att f\u00f6rb\u00e4ttra egenskaper som motst\u00e5ndskraft mot elektromigration och dimensionsstabilitet.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Prepreg_PP_Materials\"><\/span><strong>1. Prepreg (PP)-material<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Sammans\u00e4ttning<\/strong>: Resin + f\u00f6rst\u00e4rkta material (vanligtvis glasfiber)<\/li>\n\n<li><strong>F\u00f6rdelar<\/strong>:<\/li>\n\n<li>L\u00e5g kostnad<\/li>\n\n<li>God mekanisk styvhet<\/li>\n\n<li>Bred till\u00e4mpbarhet<\/li>\n\n<li><strong>Begr\u00e4nsningar<\/strong>:<\/li>\n\n<li>M\u00e5ttlig tillf\u00f6rlitlighet (svagare CAF-motst\u00e5nd)<\/li>\n\n<li>L\u00e4gre avskalningsh\u00e5llfasthet (inte l\u00e4mplig f\u00f6r kr\u00e4vande applikationer med dropptest)<\/li>\n\n<li><strong>Typiska till\u00e4mpningar<\/strong>: Konsumentelektronik i mellan- och l\u00e5gprissegmentet (t.ex. billiga smartphones)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Resin_Coated_Copper_RCC_Materials\"><\/span><strong>2.Material av hartsbelagd koppar (RCC)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Typer<\/strong>:<\/li><\/ul><ol class=\"wp-block-list\"><li>Metalliserad PI-film<\/li>\n\n<li>PI-film + kopparfolie laminerad med lim (&#8220;Pure PI&#8221;)<\/li>\n\n<li>Gjuten PI-film (flytande PI h\u00e4rdad p\u00e5 kopparfolie)<\/li><\/ol><ul class=\"wp-block-list\"><li><strong>F\u00f6rdelar<\/strong>:<\/li>\n\n<li>Utm\u00e4rkt tillverkningsbarhet<\/li>\n\n<li>H\u00f6g tillf\u00f6rlitlighet<\/li>\n\n<li>\u00d6verl\u00e4gsen avskalningsh\u00e5llfasthet (idealisk f\u00f6r applikationer med falltest)<\/li>\n\n<li>M\u00f6jliggjorde mikrovia laserborrningsteknik<\/li>\n\n<li><strong>Begr\u00e4nsningar<\/strong>:<\/li>\n\n<li>H\u00f6gre kostnad<\/li>\n\n<li>L\u00e4gre total styvhet (potentiella problem med skevhet)<\/li>\n\n<li><strong>P\u00e5verkan<\/strong>: Banade v\u00e4g f\u00f6r \u00f6verg\u00e5ngen fr\u00e5n SMT- till CSP-f\u00f6rpackning<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Laser_Drillable_Prepreg_LDP_Materials\"><\/span><strong>3.Laserborrbara prepregmaterial (LDP)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Positionering<\/strong>: Balans mellan kostnad och prestanda f\u00f6r PP och RCC<\/li>\n\n<li><strong>F\u00f6rdelar<\/strong>:<\/li>\n\n<li>B\u00e4ttre CAF-motst\u00e5nd \u00e4n PP<\/li>\n\n<li>F\u00f6rb\u00e4ttrad enhetlighet i det dielektriska skiktet<\/li>\n\n<li>Uppfyller\/\u00f6verstiger internationella standarder f\u00f6r pad peel-styrka<\/li>\n\n<li><strong>Till\u00e4mpningar<\/strong>: Mobila enheter och elektronik i mellan- till h\u00f6gprissegmentet<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Liquid_Crystal_Polymer_LCP_Materials\"><\/span><strong>4.Material av flytande kristallpolymer (LCP)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Viktiga egenskaper<\/strong>:<\/li>\n\n<li>Ultral\u00e5g dielektricitetskonstant (Dk=2,8 @1GHz)<\/li>\n\n<li>Minimal f\u00f6rlust tangent (0,0025)<\/li>\n\n<li>Inbyggt flamskydd (halogenfritt)<\/li>\n\n<li>\u00d6verl\u00e4gsen dimensionell stabilitet<\/li>\n\n<li><strong>F\u00f6rdelar<\/strong>:<\/li>\n\n<li>Idealisk f\u00f6r h\u00f6gfrekventa\/h\u00f6ghastighetskonstruktioner<\/li>\n\n<li>Milj\u00f6v\u00e4nlig<\/li>\n\n<li>Utmanar traditionell PI-dominans<\/li>\n\n<li><strong>Till\u00e4mpningar<\/strong>: Avancerade RF\/mikrov\u00e5gskretsar, avancerad paketering<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Material_Selection_Guide\"><\/span><strong>Material Selection Guide och de senaste offerterna!<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Material<\/strong><\/th><th><strong>Kostnad<\/strong><\/th><th><strong>Tillf\u00f6rlitlighet<\/strong><\/th><th><strong>H\u00f6gfrekvent<\/strong><\/th><th><strong>Styvhet<\/strong><\/th><th><strong>B\u00e4st f\u00f6r<\/strong><\/th><\/tr><\/thead><tbody><tr><td><strong>PP<\/strong><\/td><td>L\u00e5g<\/td><td>M\u00e5ttlig<\/td><td>Nej<\/td><td>H\u00f6g<\/td><td>Budgetutrustning f\u00f6r konsumenter<\/td><\/tr><tr><td><strong>RCC<\/strong><\/td><td>H\u00f6g<\/td><td>Utm\u00e4rkt<\/td><td>M\u00e5ttlig<\/td><td>L\u00e5g<\/td><td>Drop-test av k\u00e4nsliga appar<\/td><\/tr><tr><td><strong>LDP<\/strong><\/td><td>Medium<\/td><td>Bra<\/td><td>Begr\u00e4nsad<\/td><td>H\u00f6g<\/td><td>Premium mobila enheter<\/td><\/tr><tr><td><strong>LCP<\/strong><\/td><td>Mycket h\u00f6g<\/td><td>Exceptionell<\/td><td>Ja<\/td><td>Medium<\/td><td>5G\/RF\/avancerad f\u00f6rpackning<\/td><\/tr><\/tbody><\/table><\/figure><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Difference_in_PCB_manufacturing_process_between_core-containing_boards_and_coreless_boards\"><\/span>Skillnad i tillverkningsprocessen f\u00f6r kretskort mellan kretskort med k\u00e4rna och kretskort utan k\u00e4rna<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"I_Core-Based_HDI_Manufacturing_Process\"><\/span><strong>I. Tillverkningsprocess f\u00f6r k\u00e4rnbaserad HDI<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>1. Styrelsens grundl\u00e4ggande egenskaper<\/strong><\/p><ul class=\"wp-block-list\"><li><strong>Strukturell design<\/strong>:<\/li>\n\n<li>Anv\u00e4nder genomg\u00e5ende h\u00e5l eller hybridstrukturer med nedgr\u00e4vda\/blinda\/genomg\u00e5ende h\u00e5l (typiskt 4-6 lager)<\/li>\n\n<li>Valfri metallk\u00e4rnkonstruktion (f\u00f6rb\u00e4ttrad v\u00e4rmeavledning)<\/li><\/ul><p><strong>Tekniska parametrar<\/strong>:<\/p><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Parameter<\/strong><\/th><th><strong>Styrelse<\/strong><\/th><th><strong>Uppbyggnadsskikt<\/strong><\/th><\/tr><\/thead><tbody><tr><td>Diameter p\u00e5 genomg\u00e5ende h\u00e5l<\/td><td>\u22650,2 mm<\/td><td>\u22640,15 mm (mikrovias)<\/td><\/tr><tr><td>Sp\u00e5r\/utrymmesbredd<\/td><td>\u22650,08 mm<\/td><td>\u22640,08 mm<\/td><\/tr><tr><td>F\u00f6rbindelset\u00e4thet<\/td><td>L\u00e5g<\/td><td>Ultrah\u00f6g densitet<\/td><\/tr><\/tbody><\/table><\/figure><p><strong>2. K\u00e4rnkortets funktioner (117 tr\u00e5dar\/in\u00b2) 4. H\u00f6g ledningsdensitet (117 tr\u00e5dar\/in\u00b2)<\/strong><\/p><ul class=\"wp-block-list\"><li>Mekaniskt st\u00f6d (s\u00e4kerst\u00e4ller styvhet)<\/li>\n\n<li>Elektrisk sammankopplingsbrygga mellan uppbyggnadsskikten<\/li>\n\n<li>V\u00e4rmehantering (s\u00e4rskilt f\u00f6r metallk\u00e4rnor)<\/li><\/ul><p><strong>3. Viktiga f\u00f6rbehandlingsprocesser<\/strong><\/p><ul class=\"wp-block-list\"><li><strong>Via behandling<\/strong>: Via fyllning + ytplanarisering<\/li>\n\n<li><strong>Ytbehandling<\/strong>: Elektrol\u00f6s kopparpl\u00e4tering + elektropl\u00e4tering (1-3 \u00b5m tjocklek)<\/li>\n\n<li><strong>M\u00f6nster\u00f6verf\u00f6ring<\/strong>: LDI laser direct imaging (\u00b15\u00b5m precision)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"II_Breakthrough_Coreless_HDI_Technology\"><\/span><strong>II.Banbrytande HDI-teknik utan k\u00e4rna<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>1.Representativa tekniker<\/strong><\/p><ul class=\"wp-block-list\"><li><strong>ALIVH<\/strong> (Alla lager Interstitiellt Via-h\u00e5l)<\/li>\n\n<li><strong>B\u00b2IT<\/strong> (Teknik f\u00f6r sammanl\u00e4nkning av begravda bultar)<\/li><\/ul><p><strong>2. Revolution\u00e4ra f\u00f6rdelar<\/strong><\/p><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>J\u00e4mf\u00f6relse<\/strong><\/th><th><strong>Revolutionerande f\u00f6rdelarK\u00e4rnbaserad HDI<\/strong><\/th><th><strong>F\u00f6rdelar med HDI utan k\u00e4rnaK\u00e4rnbaserad HDI<\/strong><\/th><\/tr><\/thead><tbody><tr><td><strong>Struktur<\/strong><\/td><td>K\u00e4rn- + uppbyggnadszoner f\u00f6rdelarK\u00e4rnbaserad HDI<\/td><td>Homogena lager F\u00f6rdelarK\u00e4rnbaserat HDI<\/td><\/tr><tr><td><strong>F\u00f6rdelar med t\u00e4thet i samtrafikenK\u00e4rnbaserad HDI<\/strong><\/td><td>Betydande lagervariation F\u00f6rdelarK\u00e4rnbaserat HDI<\/td><td>Enhetlig ultrah\u00f6g densitet (+40% j\u00e4mf\u00f6rt med k\u00e4rna)ry F\u00f6rdelarK\u00e4rnbaserat HDI<\/td><\/tr><tr><td><strong>F\u00f6rdelar med signal\u00f6verf\u00f6ringK\u00e4rnbaserad HDI<\/strong><\/td><td>L\u00e4ngre v\u00e4gar (f\u00f6rdr\u00f6jning orsakad av k\u00e4rnan)ry F\u00f6rdelarK\u00e4rnbaserad HDI<\/td><td>Kortast m\u00f6jliga v\u00e4gar F\u00f6rdelarK\u00e4rnbaserad HDI<\/td><\/tr><tr><td><strong>Tjocklekskontroll F\u00f6rdelarK\u00e4rnbaserad HDI<\/strong><\/td><td>Begr\u00e4nsad av k\u00e4rnan (\u22650,4 mm)ry F\u00f6rdelarK\u00e4rnbaserad HDI<\/td><td>Kan uppn\u00e5 0,2 mm f\u00f6rdelarK\u00e4rnbaserat HDI<\/td><\/tr><\/tbody><\/table><\/figure><p><strong>3. F\u00f6rdelar med innovationer i k\u00e4rnprocesserK\u00e4rnbaserad HDI<\/strong><\/p><ul class=\"wp-block-list\"><li><strong>Sammankoppling av lager F\u00f6rdelarK\u00e4rnbaserad HDI<\/strong>:<\/li>\n\n<li>Ers\u00e4tter elektrol\u00f6s koppar med ledande pasta eller kopparbumpry F\u00f6rdelarK\u00e4rnbaserat HDI<\/li>\n\n<li>Laserablation f\u00f6r mikrovias i alla skikt (\u226450 \u00b5m diameter)ry F\u00f6rdelarK\u00e4rnbaserad HDI<\/li>\n\n<li><strong>Tillf\u00f6rlitlighet F\u00f6rdelarK\u00e4rnbaserad HDI<\/strong>:<\/li>\n\n<li>Ytuppruggning i nanoskala (Ra\u22640,5\u00b5m)ry F\u00f6rdelarK\u00e4rnbaserad HDI<\/li>\n\n<li>L\u00e5gh\u00e4rdande dielektriska material (Tg\u2265200\u2103)ry F\u00f6rdelarK\u00e4rnbaserad HDI<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Concluding_Remarks\"><\/span>Avslutande kommentarer<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Tack vare framsteg inom laserborrning, materialvetenskap och stapling av flera lager utg\u00f6r HDI-kretskort en spjutspets inom miniatyrisering och h\u00f6gpresterande elektronik. HDI-tekniken kommer att forts\u00e4tta att utvecklas i takt med att enheterna kr\u00e4ver h\u00f6gre hastigheter, l\u00e4gre latenstid och h\u00f6gre tillf\u00f6rlitlighet, vilket pressar gr\u00e4nserna f\u00f6r PCB-tillverkning.ry F\u00f6rdelarK\u00e4rnbaserad HDI<\/p>","protected":false},"excerpt":{"rendered":"<p>HDI-kretskort (High Density Interconnect) revolutionerar modern elektronik genom att m\u00f6jligg\u00f6ra mindre, snabbare och mer tillf\u00f6rlitliga kretsdesigner. Oavsett om det handlar om att optimera signalintegritet, termisk hantering eller miniatyrisering \u00e4r det avg\u00f6rande f\u00f6r n\u00e4sta generations m\u00f6nsterkortsdesign att f\u00f6rst\u00e5 HDI-tekniken.<\/p>","protected":false},"author":1,"featured_media":3251,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[281,280,111],"class_list":["post-3247","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-hdi-pcb","tag-high-density-interconnector","tag-pcb"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>High Density Interconnector PCB - Topfastpcb<\/title>\n<meta name=\"description\" content=\"The essential differences between core and coreless HDI circuit boards, manufacturing processes, material requirements, and applications in 5G, automotive, and consumer electronics. 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