Kenar \u0130\u015flemi<\/strong>: Kesilen kenarlar, p\u00fcr\u00fczl\u00fc kenarlar\u0131n sonraki i\u015flemleri etkilemesini \u00f6nlemek i\u00e7in \u00e7apak alma gerektirir<\/li><\/ul>\u00d6nemli Hususlar<\/strong>:<\/p>Kesmeden \u00f6nce malzeme t\u00fcr\u00fcn\u00fc, kal\u0131nl\u0131\u011f\u0131n\u0131 ve bak\u0131r a\u011f\u0131rl\u0131\u011f\u0131n\u0131 do\u011frulay\u0131n<\/li>\n\n Panel boyutunu belirlerken sonraki s\u00fcre\u00e7lerde malzeme genle\u015fmesini\/b\u00fcz\u00fclmesini hesaba kat\u0131n<\/li>\n\n Y\u00fczey kontaminasyonunu \u00f6nlemek i\u00e7in temiz bir \u00e7al\u0131\u015fma ortam\u0131 sa\u011flay\u0131n<\/li>\n\n Kar\u0131\u015fmay\u0131 \u00f6nlemek i\u00e7in farkl\u0131 malzemeleri ayr\u0131 ayr\u0131 saklay\u0131n<\/li><\/ul><\/span>2. \u0130\u00e7 Katman Kuru Film G\u00f6r\u00fcnt\u00fcleme: Hassas Devre Desenleri Olu\u015fturma<\/span><\/h3>\u0130\u00e7 katman kuru film i\u015flemi, tasar\u0131m desenlerinin PCB alt tabakalar\u0131na do\u011fru bir \u015fekilde aktar\u0131lmas\u0131 i\u00e7in \u00e7ok \u00f6nemlidir ve birka\u00e7 alt i\u015flemden olu\u015fur:<\/p>
<\/span>Y\u00fczey Haz\u0131rlama (Panel F\u0131r\u00e7alama)<\/span><\/h4>Kimyasal temizli\u011fi mekanik a\u015f\u0131nd\u0131rma ile birle\u015ftirir<\/li>\n\n Oksidasyonu giderir ve daha iyi kuru film yap\u0131\u015fmas\u0131 i\u00e7in mikro p\u00fcr\u00fczl\u00fcl\u00fck olu\u015fturur<\/li>\n\n Tipik parametreler: 5-10mm ovma izleri, Ra 0.3-0.5\u03bcm p\u00fcr\u00fczl\u00fcl\u00fck<\/li><\/ul><\/span>Kuru Film Laminasyon<\/span><\/h4>I\u015f\u0131\u011fa duyarl\u0131 kuru filmi bak\u0131r y\u00fczeye termal olarak ba\u011flar<\/li>\n\n S\u0131cakl\u0131k kontrol\u00fc:Tipik olarak 100-120\u00b0C<\/li>\n\n Bas\u0131n\u00e7 kontrol\u00fc: Yakla\u015f\u0131k 0,4-0,6MPa<\/li>\n\n H\u0131z kontrol\u00fc: 1.0-1.5m\/dak<\/li><\/ul><\/span>Maruz kalma<\/span><\/h4>Kuru filmi fototool arac\u0131l\u0131\u011f\u0131yla se\u00e7ici olarak k\u00fcrlemek i\u00e7in UV \u0131\u015f\u0131\u011f\u0131 (365nm dalga boyu) kullan\u0131r<\/li>\n\n Enerji kontrol\u00fc: 5-10mJ\/cm\u00b2<\/li>\n\n Kay\u0131t do\u011frulu\u011fu: 25\u03bcm i\u00e7inde<\/li><\/ul><\/span>Geli\u015ftirme<\/span><\/h4>K\u00fcrlenmemi\u015f kuru filmi \u00e7\u00f6zmek i\u00e7in %1 sodyum karbonat \u00e7\u00f6zeltisi kullan\u0131r<\/li>\n\n S\u0131cakl\u0131k kontrol\u00fc: 28-32\u00b0C<\/li>\n\n P\u00fcsk\u00fcrtme bas\u0131nc\u0131: 1,5- 2,5 bar<\/li><\/ul><\/span>Da\u011flama<\/span><\/h4>A\u00e7\u0131kta kalan bak\u0131r\u0131 \u00e7\u00f6zmek i\u00e7in asidik bak\u0131r klor\u00fcr \u00e7\u00f6zeltisi (CuCl2+HCl) kullan\u0131r<\/li>\n\n A\u015f\u0131nd\u0131rma fakt\u00f6r\u00fc (yan a\u015f\u0131nd\u0131rma kontrol\u00fc) >3,0<\/li>\n\n Bak\u0131r kal\u0131nl\u0131\u011f\u0131 \u00b1 i\u00e7inde homojenlik<\/li><\/ul><\/span>\u015eerit<\/span><\/h4>Koruyucu kuru filmi \u00e7\u0131karmak i\u00e7in %3-5 sodyum hidroksit \u00e7\u00f6zeltisi kullan\u0131r<\/li>\n\n S\u0131cakl\u0131k kontrol\u00fc: 45-55\u00b0C<\/li>\n\n Zaman kontrol\u00fc: 60-90 saniye<\/li><\/ul>Tasar\u0131m \u00d6nerileri<\/strong>:<\/p>Minimum i\u00e7 katman izi\/bo\u015flu\u011fu \u2265 3 mil (0,075 mm)<\/li>\n\n A\u015f\u0131r\u0131 a\u015f\u0131nd\u0131rmay\u0131 \u00f6nlemek i\u00e7in izole bak\u0131r \u00f6zelliklerinden ka\u00e7\u0131n\u0131n<\/li>\n\n Laminasyon \u00e7arp\u0131lmas\u0131n\u0131 \u00f6nlemek i\u00e7in bak\u0131r\u0131 e\u015fit olarak da\u011f\u0131t\u0131n<\/li>\n\n Kritik sinyal izleri i\u00e7in tasar\u0131m marj\u0131 ekleyin<\/li><\/ul><\/span>3.Kahverengi Oksit \u0130\u015flemi:Katmanlar Aras\u0131 Ba\u011flanman\u0131n Art\u0131r\u0131lmas\u0131<\/span><\/h3>Kahverengi oksit i\u015flemi, \u00f6ncelikle i\u00e7 katman bak\u0131r ve prepreg (PP) aras\u0131ndaki yap\u0131\u015fmay\u0131 iyile\u015ftirerek \u00e7ok katmanl\u0131 PCB \u00fcretimi i\u00e7in kritik \u00f6neme sahiptir:<\/p>
Kimyasal Reaksiyon<\/strong>: Bak\u0131r y\u00fczeyinde mikro-kaba bir organik-metalik kompleks tabaka olu\u015fturur<\/li>\n\nS\u00fcre\u00e7 Kontrol\u00fc<\/strong>:<\/li>\n\nS\u0131cakl\u0131k: 30-40\u00b0C<\/li>\n\n S\u00fcre: 1,5-3 dakika<\/li>\n\n Bak\u0131r kal\u0131nl\u0131\u011f\u0131 art\u0131\u015f\u0131: 0.3-0.8\u03bcm<\/li>\n\n Kalite Do\u011frulama<\/strong>:<\/li>\n\nRenk b\u00fct\u00fcnl\u00fc\u011f\u00fc<\/li>\n\n Su temas a\u00e7\u0131s\u0131 testi (\u226530\u00b0 olmal\u0131d\u0131r)<\/li>\n\n Soyulma mukavemeti testi (\u22651.0N\/mm)<\/li><\/ul>Ortak Sorunlar<\/strong>:<\/p>Yetersiz i\u015flem laminasyondan sonra delaminasyona neden olabilir<\/li>\n\n A\u015f\u0131r\u0131 i\u015flem a\u015f\u0131r\u0131 p\u00fcr\u00fczl\u00fcl\u00fck yaratarak sinyal b\u00fct\u00fcnl\u00fc\u011f\u00fcn\u00fc etkiler<\/li>\n\n \u0130\u015flenmi\u015f paneller 8 saat i\u00e7inde lamine edilmelidir<\/li><\/ul><\/span>4.Laminasyon:\u00c7ok Katmanl\u0131 Yap\u0131lar Olu\u015fturma<\/span><\/h3>Laminasyon, \u00e7ok katmanl\u0131 yap\u0131lar olu\u015fturmak i\u00e7in \u00e7oklu i\u00e7 katman \u00e7ekirdeklerini \u0131s\u0131 ve bas\u0131n\u00e7 alt\u0131nda prepreg (PP) ile ba\u011flar:<\/p>
Malzeme Haz\u0131rlama<\/strong>:<\/li>\n\nBak\u0131r folyo (tipik olarak 1\/3oz veya 1\/2oz)<\/li>\n\n Prepreg (\u00f6rn. 1080, 2116, 7628 kaliteleri)<\/li>\n\n Paslanmaz \u00e7elik plakalar, kraft ka\u011f\u0131t ve di\u011fer yard\u0131mc\u0131 malzemeler<\/li>\n\n S\u00fcre\u00e7 Parametreleri<\/strong>:<\/li>\n\nS\u0131cakl\u0131k: 170-190\u00b0C<\/li>\n\n Bas\u0131n\u00e7: 15-25kg\/cm\u00b2<\/li>\n\n S\u00fcre: 90-180 dakika (levha kal\u0131nl\u0131\u011f\u0131na ve yap\u0131s\u0131na ba\u011fl\u0131 olarak)<\/li>\n\n Kritik Kontroller<\/strong>:<\/li>\n\nIs\u0131tma h\u0131z\u0131: 2-3\u00b0C\/dak<\/li>\n\n So\u011futma h\u0131z\u0131: 1-2\u00b0C\/dk<\/li>\n\n Vakum seviyesi: \u2264100mbar<\/li><\/ul>Tasar\u0131m Hususlar\u0131<\/strong>:<\/p>Simetrik istiflemeyi koruyun (\u00f6rne\u011fin, 8 katmanl\u0131 pano: 1-2-3-4-4-3-2-1)<\/li>\n\n Biti\u015fik katman izlerini dik olarak y\u00f6nlendirin (\u00f6rne\u011fin, bir katmanda yatay, biti\u015fikte dikey)<\/li>\n\n A\u011f\u0131r bak\u0131r levhalar i\u00e7in y\u00fcksek re\u00e7ine i\u00e7erikli PP kullan\u0131n<\/li>\n\n K\u00f6r \/ g\u00f6m\u00fcl\u00fc via tasar\u0131mlar\u0131 i\u00e7in laminasyon s\u0131ras\u0131nda malzeme ak\u0131\u015f\u0131n\u0131 g\u00f6z \u00f6n\u00fcnde bulundurun<\/li><\/ul><\/span>5.Sondaj:Hassas Ara Ba\u011flant\u0131lar Olu\u015fturma<\/span><\/h3>Delme, modern teknoloji ile ola\u011fan\u00fcst\u00fc do\u011fruluk elde ederek PCB katmanlar\u0131 aras\u0131nda dikey ara ba\u011flant\u0131lar olu\u015fturur:<\/p>
Matkap \u00c7e\u015fitleri<\/strong>:<\/li>\n\nMekanik delme (\u22650,15 mm delikler i\u00e7in)<\/li>\n\n Lazer delme (mikrovialar ve k\u00f6r vialar i\u00e7in)<\/li>\n\n Tipik Parametreler<\/strong>:<\/li>\n\n\u0130\u015f mili h\u0131z\u0131: 80.000-150.000 RPM<\/li>\n\n Besleme h\u0131z\u0131:1.5-4.0m\/dak<\/li>\n\n Geri \u00e7ekme h\u0131z\u0131: 10-20m \/ dak<\/li>\n\n Kalite Standartlar\u0131<\/strong>:<\/li>\n\nDelik duvar\u0131 p\u00fcr\u00fczl\u00fcl\u00fc\u011f\u00fc \u226425\u03bcm<\/li>\n\n Delik konumu hassasiyeti \u00b10,05 mm<\/li>\n\n \u00c7ivi ba\u015f\u0131 veya \u00e7apak yok<\/li><\/ul>S\u0131k Kar\u015f\u0131la\u015f\u0131lan Sorunlar\u0131n Giderilmesi<\/strong>:<\/p>Kaba delik duvarlar\u0131<\/strong>: Sondaj parametrelerini optimize edin, uygun giri\u015f\/yedekleme malzemeleri kullan\u0131n<\/li>\n\nT\u0131kal\u0131 delikler<\/strong>: Tala\u015f tahliyesini iyile\u015ftirin, delme s\u0131ras\u0131n\u0131 ayarlay\u0131n<\/li>\n\nK\u0131r\u0131k matkaplar<\/strong>: Matkap kalitesini do\u011frulay\u0131n, besleme h\u0131zlar\u0131n\u0131 optimize edin<\/li><\/ul><\/span>6. Ak\u0131ms\u0131z Bak\u0131r Biriktirme (PTH): Kritik Delik Metalizasyonu<\/span><\/h3>Ak\u0131ms\u0131z bak\u0131r biriktirme, PCB g\u00fcvenilirli\u011fi i\u00e7in \u00e7ok \u00f6nemli olan iletken olmayan delik duvarlar\u0131nda iletken katmanlar olu\u015fturur:<\/p>
<\/span>PTH S\u00fcre\u00e7 Ak\u0131\u015f\u0131<\/span><\/h4>Desmear<\/strong>: Delme i\u015fleminden kalan re\u00e7ine kal\u0131nt\u0131lar\u0131n\u0131 temizler<\/li>\n\nAk\u0131ms\u0131z Bak\u0131r<\/strong>:<\/li><\/ol>\u0130ndirgeyici ajan olarak formaldehit kullanan bir alkali \u00e7\u00f6zelti<\/li>\n\n S\u0131cakl\u0131k: 25-32\u00b0C<\/li>\n\n S\u00fcre: 15-25 dakika<\/li>\n\n Bak\u0131r kal\u0131nl\u0131\u011f\u0131: 0,3-0,8\u03bcm<\/li><\/ul>Panel Kaplama<\/strong>:<\/li><\/ol>Asit bak\u0131r s\u00fclfat \u00e7\u00f6zeltisi<\/li>\n\n Ak\u0131m yo\u011funlu\u011fu: 1,5- 2,5ASD<\/li>\n\n S\u00fcre: 30-45 dakika<\/li>\n\n Bak\u0131r kal\u0131nl\u0131\u011f\u0131: 5-8\u03bcm<\/li><\/ul>Kalite Gereklilikleri<\/strong>:<\/p>Arka \u0131\u015f\u0131k testi \u22659 seviye (\u2265 delik duvar kapsam\u0131)<\/li>\n\n Delaminasyon veya kabarma olmadan termal stres testi (288\u00b0C, 10 saniye)<\/li>\n\n Delik direnci \u2264300\u03bc\u03a9\/cm<\/li><\/ul><\/span>7.D\u0131\u015f Katman Desen Transferi<\/span><\/h3>\u0130\u00e7 katman g\u00f6r\u00fcnt\u00fclemeye benzer ancak ek kaplama ad\u0131mlar\u0131 vard\u0131r:<\/p>
Y\u00fczey Haz\u0131rl\u0131\u011f\u0131<\/strong>Temizleme, mikro-etch (0,5-1\u03bcm bak\u0131r \u00e7\u0131kar\u0131r)<\/li>\n\nKuru Film Laminasyon<\/strong>Kaplamaya dayan\u0131kl\u0131 kuru film kullan\u0131r<\/li>\n\nMaruz kalma<\/strong>LDI (Laser Direct Imaging) veya geleneksel fototool kullan\u0131r<\/li>\n\nGeli\u015ftirme<\/strong>: Bir kaplama deseni olu\u015fturur<\/li>\n\nDesen Kaplama<\/strong>:<\/li><\/ol>Bak\u0131r kal\u0131nl\u0131\u011f\u0131: 20-25\u03bcm (toplam)<\/li>\n\n Kalay kal\u0131nl\u0131\u011f\u0131:3-5\u03bcm (a\u015f\u0131nd\u0131rma direnci olarak)<\/li><\/ul>\u015eerit<\/strong>Kaplama direncini giderir<\/li>\n\nDa\u011flama<\/strong>: \u0130stenmeyen bak\u0131rlar\u0131 temizler<\/li><\/ol>Teknik \u00d6nemli Noktalar<\/strong>:<\/p>\u0130z geni\u015fli\u011fi telafisi:Tasar\u0131m geni\u015fli\u011fini bak\u0131r kal\u0131nl\u0131\u011f\u0131na g\u00f6re ayarlay\u0131n (tipik olarak -20 ekleyin)<\/li>\n\n Kaplama homojenli\u011fi:Y\u00fcksek atma g\u00fcc\u00fc \u00e7\u00f6zeltisi ve uygun bir anot konfig\u00fcrasyonu kullan\u0131n<\/li>\n\n Yan a\u015f\u0131nd\u0131rma kontrol\u00fc: \u0130z geni\u015fli\u011fi do\u011frulu\u011funu korumak i\u00e7in a\u015f\u0131nd\u0131rma parametrelerini optimize edin<\/li><\/ul><\/span>8.Lehim Maskesi: Devre Koruma Katman\u0131<\/span><\/h3>Lehim maskesi devreleri korur ve lehim kalitesini ve g\u00f6r\u00fcn\u00fcm\u00fcn\u00fc etkiler:<\/p>
Uygulama Y\u00f6ntemleri<\/strong>:<\/li>\n\nSerigrafi bask\u0131:D\u00fc\u015f\u00fck hassasiyetli gereksinimler i\u00e7in<\/li>\n\n Sprey kaplama:D\u00fczensiz levha \u015fekilleri i\u00e7in<\/li>\n\n Perde kaplamas\u0131: Y\u00fcksek verimlilik, m\u00fckemmel homojenlik<\/li>\n\n S\u00fcre\u00e7 Ak\u0131\u015f\u0131<\/strong>:<\/li><\/ul>Y\u00fczey haz\u0131rl\u0131\u011f\u0131 (temizleme, p\u00fcr\u00fczlendirme)<\/li>\n\n Lehim maskesi uygulamas\u0131<\/li>\n\n \u00d6n pi\u015firme (75\u00b0C, 20-30 dakika)<\/li>\n\n Maruziyet (300-500mJ\/cm\u00b2)<\/li>\n\n Geli\u015ftirme (%1 sodyum karbonat \u00e7\u00f6zeltisi)<\/li>\n\n Son k\u00fcrlenme (150\u00b0C, 30-60 dakika)<\/li><\/ol>Kalite Standartlar\u0131<\/strong>:<\/li>\n\nSertlik \u22656H (kur\u015fun kalem sertli\u011fi)<\/li>\n\n Yap\u0131\u015fma: 3M bant testi ile 0 ge\u00e7i\u015f<\/li>\n\n Lehim direnci: 288\u00b0C, 10 saniye, hatas\u0131z 3 d\u00f6ng\u00fc<\/li><\/ul>Tasar\u0131m K\u0131lavuzlar\u0131<\/strong>:<\/p>Minimum lehim maskesi k\u00f6pr\u00fcs\u00fc \u22650,1 mm<\/li>\n\n BGA alan a\u00e7\u0131kl\u0131klar\u0131: Her bir taraf i\u00e7in pedlerden 0,05 mm daha b\u00fcy\u00fck<\/li>\n\n Alt\u0131n parmaklar lehim maskesi kaplamas\u0131 gerektirir<\/li><\/ul><\/span>9.Y\u00fczey \u0130\u015flemi: Lehimlenebilirlik ve Dayan\u0131kl\u0131l\u0131\u011f\u0131n Dengelenmesi<\/span><\/h3>Farkl\u0131 y\u00fczeyler farkl\u0131 uygulamalara uygundur:<\/p>Biti\u015f Tipi<\/th> Kal\u0131nl\u0131k Aral\u0131\u011f\u0131<\/th> Avantajlar 2025<\/th> Dezavantajlar<\/th> Tipik Uygulamalar<\/th><\/tr><\/thead> HASL<\/td> 1-25\u03bcm<\/td> D\u00fc\u015f\u00fck maliyet, m\u00fckemmel lehimlenebilirlik<\/td> Zay\u0131f d\u00fczl\u00fck, ince hatve i\u00e7in de\u011fil<\/td> T\u00fcketici elektroni\u011fi<\/td><\/tr> ENIG<\/td> Ni3-5\u03bcm\/Au0.05-0.1\u03bcm<\/td> M\u00fckemmel d\u00fczl\u00fck, uzun raf \u00f6mr\u00fc<\/td> Y\u00fcksek maliyet, kara yast\u0131k riski<\/td> Y\u00fcksek g\u00fcvenilirlikli \u00fcr\u00fcnler<\/td><\/tr> OSP<\/td> 0,2-0,5\u03bcm<\/td> D\u00fc\u015f\u00fck maliyetli, basit s\u00fcre\u00e7<\/td> K\u0131sa raf \u00f6mr\u00fc (6 ay)<\/td> Y\u00fcksek hacimli t\u00fcketici elektroni\u011fi<\/td><\/tr> Imm Ag<\/td> 0,1-0,3\u03bcm<\/td> \u0130yi lehimlenebilirlik, orta maliyet<\/td> Kararma e\u011filimi vard\u0131r, \u00f6zel paketleme gereklidir<\/td> RF\/y\u00fcksek frekans devreleri<\/td><\/tr> ENEPIG<\/td> Ni3-5\u03bcm\/Pd0.05-0.1\u03bcm\/Au0.03-0.05\u03bcm<\/td> \u00c7oklu montaj y\u00f6ntemleri ile uyumlu<\/td> En y\u00fcksek maliyet<\/td> Geli\u015fmi\u015f paketleme<\/td><\/tr><\/tbody><\/table><\/figure>Se\u00e7im Rehberi<\/strong>:<\/p>
![\"PCB](\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/05\/Make-PCB-4.jpg\")
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