{"id":3247,"date":"2025-06-11T08:32:00","date_gmt":"2025-06-11T00:32:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=3247"},"modified":"2025-06-10T11:32:13","modified_gmt":"2025-06-10T03:32:13","slug":"high-density-interconnector-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/","title":{"rendered":"Y\u00fcksek Yo\u011funluklu Ara Ba\u011flant\u0131 PCB"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">\u0130\u00e7indekiler<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#What_is_HDI\" >HDI nedir?<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#Core_Features\" >Temel \u00d6zellikler<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#Core_features_of_HDI_boards_vs_conventional_PCB\" >HDI kartlar\u0131n temel \u00f6zellikleri (geleneksel PCB'ye k\u0131yasla)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#1_Microvia_design_laser_drilling_dominated\" >1.Mikrovia tasar\u0131m\u0131 (lazer delme hakim)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#2_Microvia_and_Hole_Ring_Designs_Via_Diameter_%E2%89%A4150%C2%B5m\" >2.\u00c7ap \u2264150\u00b5m Yoluyla Mikrovia ve Delik Halkas\u0131 Tasar\u0131mlar\u0131<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#3_High_Solder_Joint_Density_%3E130_jointsin%C2%B2\" >3.Y\u00fcksek Lehim Ba\u011flant\u0131 Yo\u011funlu\u011fu (&gt;130 ba\u011flant\u0131\/in\u00b2)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#4_High_wiring_density_%3E117_wiresin%C2%B2\" >4.Y\u00fcksek kablo yo\u011funlu\u011fu (&gt;117 tel\/in\u00b2)<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#5_Fine_line_line_widthspace_%E2%89%A4_3_mil75%C2%B5m\" >5. \u0130nce \u00e7izgi (\u00e7izgi geni\u015fli\u011fi\/bo\u015fluk \u2264 3 mil\/75\u00b5m)<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#Core_Benefits_of_HDI\" >HDI'\u0131n Temel Faydalar\u0131<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#HDI_PCB_Technical_Specification_Sheet\" >HDI PCB Teknik \u00d6zellikler Sayfas\u0131<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#Applications_and_Core_Advantages_of_HDI_Boards\" >HDI Panolar\u0131n Uygulamalar\u0131 ve Temel Avantajlar\u0131<\/a><ul class='ez-toc-list-level-4' ><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#I_Key_Application_Areas_of_HDI_Boards\" >I.HDI Panolar\u0131n\u0131n Temel Uygulama Alanlar\u0131<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#II_The_%E2%80%9CFour_Highs_and_One_Low%E2%80%9D_Advantages_of_HDI_Technology\" >II.HDI Teknolojisinin &#8220;D\u00f6rt Y\u00fcksek ve Bir D\u00fc\u015f\u00fck&#8221; Avantajlar\u0131<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#III_Market_Outlook_and_Supporting_Data\" >III. Pazar G\u00f6r\u00fcn\u00fcm\u00fc ve Destekleyici Veriler<\/a><\/li><\/ul><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#Classification_of_HDI_Boards\" >HDI Panolar\u0131n\u0131n S\u0131n\u0131fland\u0131r\u0131lmas\u0131<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#1_1N1_Type\" >(1) 1+N+1 Tip<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#2_iNi_i%E2%89%A52_Type\" >(2) i+N+i (i\u22652) Tip<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#3_Any-Layer_Interconnect_ELIC_Type\" >(3) Herhangi Katmanl\u0131 Ara Ba\u011flant\u0131 (ELIC) Tipi<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#Technical_Comparison\" >Teknik Kar\u015f\u0131la\u015ft\u0131rma<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-20\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#HDIBUM_PCB_Material_Performance_Requirements\" >HDI\/BUM PCB Malzeme Performans Gereksinimleri<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-21\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#1_Prepreg_PP_Materials\" >1.Prepreg (PP) Malzemeler<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-22\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#2_Resin_Coated_Copper_RCC_Materials\" >2.Re\u00e7ine Kapl\u0131 Bak\u0131r (RCC) Malzemeler<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-23\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#3_Laser_Drillable_Prepreg_LDP_Materials\" >3.Lazerle Delinebilir Prepreg (LDP) Malzemeler<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-24\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#4_Liquid_Crystal_Polymer_LCP_Materials\" >4. S\u0131v\u0131 Kristal Polimer (LCP) Malzemeler<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-25\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#Material_Selection_Guide\" >Malzeme Se\u00e7im K\u0131lavuzu<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-26\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#Difference_in_PCB_manufacturing_process_between_core-containing_boards_and_coreless_boards\" >PCB \u00fcretim s\u00fcrecinde \u00e7ekirdek i\u00e7eren kartlar ile \u00e7ekirdeksiz kartlar aras\u0131ndaki fark<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-27\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#I_Core-Based_HDI_Manufacturing_Process\" >I.\u00c7ekirdek Tabanl\u0131 HDI \u00dcretim S\u00fcreci<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-28\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#II_Breakthrough_Coreless_HDI_Technology\" >II. \u00c7\u0131\u011f\u0131r A\u00e7an \u00c7ekirdeksiz HDI Teknolojisi<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-29\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/#Concluding_Remarks\" >Son S\u00f6zler<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"What_is_HDI\"><\/span>HDI nedir?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Geleneksel bask\u0131l\u0131 devre kartlar\u0131na g\u00f6re birim alan ba\u015f\u0131na daha y\u00fcksek kablo yo\u011funlu\u011fu anlam\u0131na gelen HDI, geli\u015fmi\u015f bir <a href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/printed-circuit-board-pcb\/\">bask\u0131l\u0131 devre kart\u0131<\/a> (PCB) teknolojisi, mikro ince kablolama, mikroskobik ge\u00e7i\u015f yap\u0131lar\u0131 ve yo\u011fun kablolama yoluyla daha y\u00fcksek elektronik bile\u015fen entegrasyonu seviyelerine ula\u015f\u0131r. Bu kartlarda geleneksel PCB teknolojisine k\u0131yasla daha ince teller ve bo\u015fluklar (\u2264 100 \u00b5m\/0,10 mm), daha k\u00fc\u00e7\u00fck yollar (&lt;150 \u00b5m) ve pedler (&lt;400 \u00b5m\/0,40 mm) ve daha y\u00fcksek ped yo\u011funluklar\u0131 (&gt;20 ped\/cm2) kullan\u0131lmaktad\u0131r.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Core_Features\"><\/span><strong>Temel \u00d6zellikler<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Daha ince \u00e7izgi geni\u015fli\u011fi\/aral\u0131\u011f\u0131<\/strong>: tipik olarak \u2264100 \u00b5m (0,10 mm), geleneksel PCB'lerden (tipik olarak 150 \u00b5m+) \u00e7ok daha d\u00fc\u015f\u00fckt\u00fcr.<\/li>\n\n<li><strong>Delikler arac\u0131l\u0131\u011f\u0131yla k\u00fc\u00e7\u00fck<\/strong>:<\/li>\n\n<li><strong>Lazer k\u00f6r g\u00f6m\u00fcl\u00fc vialar<\/strong>: &lt;150 \u00b5m \u00e7ap\u0131nda, katmanlar aras\u0131nda y\u00fcksek yo\u011funluklu ba\u011flant\u0131lar i\u00e7in lazerle delinmi\u015ftir.<\/li>\n\n<li><strong>\u0130stiflenmi\u015f\/kademeli delikler<\/strong>: Dikey alan kullan\u0131m\u0131n\u0131 iyile\u015ftirin ve katman gereksinimlerini azalt\u0131n.<\/li>\n\n<li><strong>Y\u00fcksek ped yo\u011funlu\u011fu<\/strong>: &gt;\u00c7ok pimli \u00e7ipleri (\u00f6rne\u011fin BGA, CSP paketleri) desteklemek i\u00e7in 20 ped\/cm\u00b2.<\/li>\n\n<li><strong>\u0130nce malzemeler<\/strong>: D\u00fc\u015f\u00fck dielektrik sabiti, y\u00fcksek stabilite substratlar\u0131n\u0131n kullan\u0131m\u0131 (\u00f6rn. FR4, poliimid).<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB.jpg\" alt=\"HDI PCB\" class=\"wp-image-3248\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Core_features_of_HDI_boards_vs_conventional_PCB\"><\/span><strong>HDI kartlar\u0131n temel \u00f6zellikleri (geleneksel PCB'ye k\u0131yasla)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Microvia_design_laser_drilling_dominated\"><\/span><strong>1.Mikrovia tasar\u0131m\u0131 (lazer delme hakim)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Teknoloji Se\u00e7imi<\/strong>: HDI kartlar\u0131 yayg\u0131n olarak \u015funlar\u0131 kullan\u0131r <strong>lazer delme<\/strong> (delik \u00e7aplar\u0131 tipik olarak \u2264150\u00b5m) mekanik delme yerine. Bunun nedenleri \u015funlard\u0131r:<\/li>\n\n<li><strong>Mekanik Delme S\u0131n\u0131rlar\u0131<\/strong>: 0.15mm delme i\u011fnelerinin k\u0131r\u0131lmas\u0131 kolayd\u0131r, y\u00fcksek RPM gereksinimleri ve d\u00fc\u015f\u00fck verimlilikleri vard\u0131r ve derinlik kontrol\u00fcn\u00fc ger\u00e7ekle\u015ftiremezler. <strong>k\u00f6r g\u00f6m\u00fcl\u00fc delikler<\/strong>.<\/li>\n\n<li><strong>Lazer Avantaj\u0131<\/strong>: K\u00fc\u00e7\u00fck delikleri (\u00f6rn. 50\u00b5m) i\u015fleyebilir, destekler <strong>Herhangi bir katman HDI<\/strong>ve fiziksel temas\u0131 yoktur ve y\u00fcksek verimlidir.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Microvia_and_Hole_Ring_Designs_Via_Diameter_%E2%89%A4150%C2%B5m\"><\/span><strong>2. Microvia ve Delikli Halka Tasar\u0131mlar\u0131<\/strong> Via \u00c7ap\u0131 \u2264150\u00b5m<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Vias \u2264150\u00b5m<\/strong> ve vialar (pedler) \u2264250\u00b5m, via'y\u0131 daraltarak yerle\u015fim alan\u0131n\u0131 serbest b\u0131rak\u0131r.<\/li>\n\n<li><strong>\u00d6rnek<\/strong>: A\u00e7\u0131kl\u0131k \u00e7ap\u0131 0,30 mm'den 0,10 mm'ye d\u00fc\u015f\u00fcr\u00fcl\u00fcrse (lazer yollar\u0131), ped \u00e7ap\u0131 0,60 mm'den 0,35 mm'ye d\u00fc\u015f\u00fcr\u00fclebilir, <strong>67 alan tasarrufu<\/strong>.<\/li>\n\n<li><strong>Do\u011frudan Tampon Delme (Via-in-Pad)<\/strong>BGA\/SMD bile\u015fen yerle\u015fimini daha da optimize eder ve yo\u011funlu\u011fu art\u0131r\u0131r.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_High_Solder_Joint_Density_%3E130_jointsin%C2%B2\"><\/span><strong>3.Y\u00fcksek Lehim Ba\u011flant\u0131 Yo\u011funlu\u011fu (&gt;130 ba\u011flant\u0131\/in\u00b2)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Lehim pedi yo\u011funlu\u011fu bile\u015fen entegrasyonunu belirler. HDI \u015funlar\u0131 ger\u00e7ekle\u015ftirir <strong>\u00e7ok fonksiyonlu mod\u00fcl<\/strong> mikro minyat\u00fcr delikler\/teller arac\u0131l\u0131\u011f\u0131yla y\u00fcksek yo\u011funluklu montaj (\u00f6rn. cep telefonu anakartlar\u0131).<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_High_wiring_density_%3E117_wiresin%C2%B2\"><\/span><strong>4.Y\u00fcksek kablo yo\u011funlu\u011fu (&gt;117 tel\/in\u00b2)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li>Bile\u015fenlerin art\u0131\u015f\u0131n\u0131 e\u015fle\u015ftirmek i\u00e7in hat yo\u011funlu\u011funun ayn\u0131 anda art\u0131r\u0131lmas\u0131 gerekir. HDI karma\u015f\u0131k kablolamay\u0131 \u015fu yollarla ger\u00e7ekle\u015ftirir <strong>ince kablolama<\/strong> (\u00e7izgi geni\u015fli\u011fi\/aral\u0131\u011f\u0131 \u2264100\u00b5m) ve <strong>\u00e7ok katmanl\u0131 istifleme<\/strong>.<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Fine_line_line_widthspace_%E2%89%A4_3_mil75%C2%B5m\"><\/span><strong>5. \u0130nce \u00e7izgi (\u00e7izgi geni\u015fli\u011fi\/bo\u015fluk \u2264 3 mil\/75\u00b5m)<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>Teorik standart<\/strong>: 75\u00b5m\/75\u00b5m, ancak pratikte yayg\u0131n olarak 100\u00b5m\/100\u00b5m kullan\u0131l\u0131r. Sebep:<\/li>\n\n<li><strong>S\u00fcre\u00e7 maliyeti<\/strong>: 75\u00b5m s\u00fcreci ekipman\/malzeme, d\u00fc\u015f\u00fck verim, az say\u0131da tedarik\u00e7i ve y\u00fcksek maliyet gerektirmektedir.<\/li>\n\n<li><strong>Fiyat\/Performans Dengesi<\/strong>: 100\u00b5m \u00e7\u00f6z\u00fcm\u00fc yo\u011funluk ve maliyet aras\u0131nda bir denge kurar ve \u00e7o\u011fu t\u00fcketici elektroni\u011fi ihtiyac\u0131 i\u00e7in uygundur.<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Core_Benefits_of_HDI\"><\/span>HDI'\u0131n Temel Faydalar\u0131<span class=\"ez-toc-section-end\"><\/span><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Boyut<\/strong><\/th><th><strong>HDI Y\u00f6netim Kurulu<\/strong><\/th><th><strong>Geleneksel PCB<\/strong><\/th><\/tr><\/thead><tbody><tr><td><strong>Sondaj Teknolojisi<\/strong><\/td><td>Lazer Delme (K\u00f6r G\u00f6m\u00fcl\u00fc Delikler, Keyfi Katmanlar)<\/td><td>Mekanik Delme (Delik Tabanl\u0131)<\/td><\/tr><tr><td><strong>Delik \u00c7ap\u0131\/Delik Halkas\u0131<\/strong><\/td><td>\u2264150\u00b5m\/\u2264250\u00b5m<\/td><td>\u2265200\u00b5m\/\u2265400\u00b5m<\/td><\/tr><tr><td><strong>Kablolama Yo\u011funlu\u011fu<\/strong><\/td><td>&gt;117 tel\/in\u00b2<\/td><td>&lt;50 tel\/in\u00b2<\/td><\/tr><tr><td><strong>Tel Geni\u015fli\u011fi\/Aral\u0131\u011f\u0131<\/strong><\/td><td>\u2264100\u00b5m (Ana ak\u0131m)<\/td><td>\u2265150\u00b5m<\/td><\/tr><\/tbody><\/table><\/figure><p>HDI, elektronik \u00fcr\u00fcnlerin minyat\u00fcrle\u015ftirilmesini ve y\u00fcksek performans\u0131n\u0131 \u015fu yollarla te\u015fvik eder <strong>microvia, ince \u00e7izgi ve y\u00fcksek yo\u011funluklu ara ba\u011flant\u0131lar<\/strong>ve 5G, yapay zeka ve ta\u015f\u0131nabilir cihazlar i\u00e7in kilit bir teknolojidir.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-1.jpg\" alt=\"HDI PCB\" class=\"wp-image-3249\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"HDI_PCB_Technical_Specification_Sheet\"><\/span>HDI PCB Teknik \u00d6zellikler Sayfas\u0131<span class=\"ez-toc-section-end\"><\/span><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>\u00d6zellik<\/strong><\/th><th><strong>HDI PCB Teknik \u00d6zellikleri<\/strong><\/th><\/tr><\/thead><tbody><tr><td><strong>Katmanlar 2025<\/strong><\/td><td><strong>Standart<\/strong>: 4-22 katmanlar<br><strong>Geli\u015fmi\u015f<\/strong>: 30 katmana kadar<\/td><\/tr><tr><td><strong>\u00d6nemli Noktalar<\/strong><\/td><td>&#8211; Daha y\u00fcksek ped yo\u011funlu\u011fu<br>&#8211; Daha ince iz\/bo\u015fluk (\u226475\u00b5m)<br>&#8211; Mikroviyalar (k\u00f6r\/g\u00f6m\u00fcl\u00fc, herhangi bir katman ara ba\u011flant\u0131s\u0131)<br>&#8211; Via-in-Pad tasar\u0131m\u0131<\/td><\/tr><tr><td><strong>HDI Olu\u015fturma<\/strong><\/td><td>1+N+1, 2+N+2, 3+N+3, 4+N+4, Herhangi bir katman (ELIC), Ultra HDI (R&amp;D)<\/td><\/tr><tr><td><strong>Malzemeler<\/strong><\/td><td>FR4 (Standart\/Y\u00fcksek performansl\u0131), Halojensiz FR4, Rogers (y\u00fcksek frekansl\u0131 uygulamalar i\u00e7in)<\/td><\/tr><tr><td><strong>Bak\u0131r A\u011f\u0131rl\u0131\u011f\u0131 (Bitmi\u015f)<\/strong><\/td><td>18\u03bcm - 70\u03bcm<\/td><\/tr><tr><td><strong>Min. \u0130z \/ Alan<\/strong><\/td><td><strong>0,075 mm \/ 0,075 mm<\/strong> (75\u00b5m\/75\u00b5m)<\/td><\/tr><tr><td><strong>PCB Kal\u0131nl\u0131\u011f\u0131<\/strong><\/td><td>0.40mm - 3.20mm<\/td><\/tr><tr><td><strong>Maks. Pano Boyutu<\/strong><\/td><td>610mm \u00d7 450mm (lazer delme kapasitesi ile s\u0131n\u0131rl\u0131d\u0131r)<\/td><\/tr><tr><td><strong>Y\u00fczey \u0130\u015flemi<\/strong><\/td><td>OSP, ENIG, Dald\u0131rma Kalay, Dald\u0131rma G\u00fcm\u00fc\u015f, Elektrolitik Alt\u0131n, Alt\u0131n Parmaklar<\/td><\/tr><tr><td><strong>Min. Delik Boyutu<\/strong><\/td><td><strong>Mekanik Sondaj<\/strong>: 0.15mm<br><strong>Lazer Delme<\/strong>:<br>&#8211; Standart: 0,10 mm (100\u00b5m)<br>&#8211; Geli\u015fmi\u015f: 0,075 mm (75\u00b5m)<\/td><\/tr><\/tbody><\/table><\/figure><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Applications_and_Core_Advantages_of_HDI_Boards\"><\/span><strong>HDI Panolar\u0131n Uygulamalar\u0131 ve Temel Avantajlar\u0131<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"I_Key_Application_Areas_of_HDI_Boards\"><\/span><strong>I.HDI Panolar\u0131n\u0131n Temel Uygulama Alanlar\u0131<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><p>Yar\u0131 iletken teknolojisinin minyat\u00fcrle\u015ftirme ve y\u00fcksek performansa do\u011fru ilerlemesiyle, HDI teknolojisi modern elektronik i\u00e7in kritik bir kolayla\u015ft\u0131r\u0131c\u0131 haline gelmi\u015ftir ve \u00f6zellikle a\u015fa\u011f\u0131daki alanlara hakimdir:<\/p><ul class=\"wp-block-list\"><li><strong>Mobil \u0130leti\u015fim<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Ak\u0131ll\u0131 Telefonlar (4G\/5G)<\/strong>: Y\u00fcksek yo\u011funluklu y\u00f6nlendirme, \u00e7oklu kamera mod\u00fcllerini, 5G antenlerini ve y\u00fcksek h\u0131zl\u0131 i\u015flemcileri (\u00f6rn. BGA paketlenmi\u015f \u00e7ipler) destekler.<\/li>\n\n<li><strong>Baz \u0130stasyonu Ekipmanlar\u0131<\/strong>: Y\u00fcksek frekansl\u0131 sinyal iletimi (\u00f6rn. milimetre dalga bantlar\u0131) HDI&#8217;n\u0131n d\u00fc\u015f\u00fck kay\u0131pl\u0131 malzemelerine (\u00f6rn. Rogers) dayan\u0131r.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>T\u00fcketici Elektroni\u011fi<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Ta\u015f\u0131nabilir Cihazlar<\/strong>: Ultra ince tasar\u0131mlar (\u00f6rne\u011fin, katlanabilir ak\u0131ll\u0131 telefon anakartlar\u0131, TWS kulakl\u0131klar) HDI&#8217;n\u0131n ince katman istiflemesini (1+N+1 yap\u0131s\u0131) gerektirir.<\/li>\n\n<li><strong>Dijital Kameralar\/AR\/VR<\/strong>: Y\u00fcksek \u00e7\u00f6z\u00fcn\u00fcrl\u00fckl\u00fc sens\u00f6rler ve minyat\u00fcr mod\u00fcller mikrovias (&lt;75\u00b5m) ve Via-in-Pad teknolojisine ba\u011fl\u0131d\u0131r.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Otomotiv Elektroni\u011fi<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Geli\u015fmi\u015f S\u00fcr\u00fcc\u00fc Destek Sistemleri (ADAS)<\/strong>: Radar ve bilgi-e\u011flence sistemleri HDI&#8217;n\u0131n y\u00fcksek g\u00fcvenilirli\u011fini (\u0131s\u0131 direnci, titre\u015fim direnci) talep eder.<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Y\u00fcksek Performansl\u0131 Hesaplama<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Yapay Zeka Sunucular\u0131\/GPU'lar\u0131<\/strong>: Y\u00fcksek iletkenlik ve termal tasar\u0131m y\u00fcksek ak\u0131m iletimini destekler (bak\u0131r kal\u0131nl\u0131\u011f\u0131 \u226570\u00b5m).<\/li><\/ul><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"II_The_%E2%80%9CFour_Highs_and_One_Low%E2%80%9D_Advantages_of_HDI_Technology\"><\/span><strong>II.HDI Teknolojisinin &#8220;D\u00f6rt Y\u00fcksek ve Bir D\u00fc\u015f\u00fck&#8221; Avantajlar\u0131<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Avantaj<\/strong><\/th><th><strong>Teknik Uygulama<\/strong><\/th><th><strong>Uygulama De\u011feri<\/strong><\/th><\/tr><\/thead><tbody><tr><td><strong>Y\u00fcksek Yo\u011funluklu Y\u00f6nlendirme<\/strong><\/td><td>\u0130z\/bo\u015fluk \u226475\u00b5m, mikrovias (lazer sondaj)<\/td><td>PCB alan\u0131n\u0131 &gt; oran\u0131nda azaltarak son \u00fcr\u00fcn boyutunu k\u00fc\u00e7\u00fclt\u00fcr<\/td><\/tr><tr><td><strong>Y\u00fcksek Frekansl\u0131 &amp; Y\u00fcksek H\u0131zl\u0131<\/strong><\/td><td>D\u00fc\u015f\u00fck Dk malzemeler (\u00f6rn. PTFE), empedans kontrol\u00fc (\u00b1%5)<\/td><td>5G\/6G mmWave ve y\u00fcksek h\u0131zl\u0131 SerDes sinyal b\u00fct\u00fcnl\u00fc\u011f\u00fcn\u00fc destekler<\/td><\/tr><tr><td><strong>Y\u00fcksek \u0130letkenlik<\/strong><\/td><td>Herhangi bir katman ara ba\u011flant\u0131s\u0131 (ELIC), via-dolgu kaplama teknolojisi<\/td><td>Katmanlar aras\u0131 sinyal gecikmesini azalt\u0131r, veri h\u0131zlar\u0131n\u0131 art\u0131r\u0131r<\/td><\/tr><tr><td><strong>Y\u00fcksek \u0130zolasyon G\u00fcvenilirli\u011fi<\/strong><\/td><td>Halojen i\u00e7ermeyen alt tabakalar, hassas laminasyon (\u2264%3 genle\u015fme oran\u0131)<\/td><td>Otomotiv AEC-Q200 sertifikas\u0131n\u0131 kar\u015f\u0131lar, kullan\u0131m \u00f6mr\u00fcn\u00fc uzat\u0131r<\/td><\/tr><tr><td><strong>D\u00fc\u015f\u00fck Maliyetli<\/strong><\/td><td>Daha az katman (\u00f6rne\u011fin, 8 katmanl\u0131 delikli PCB'lerin 4 katmanl\u0131 HDI ile de\u011fi\u015ftirilmesi), otomatik lazer delme (verim &gt;)<\/td><td>Toplam maliyeti - oran\u0131nda azalt\u0131r<\/td><\/tr><\/tbody><\/table><\/figure><h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"III_Market_Outlook_and_Supporting_Data\"><\/span><strong>III. Pazar G\u00f6r\u00fcn\u00fcm\u00fc ve Destekleyici Veriler<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h4><ul class=\"wp-block-list\"><li><strong>B\u00fcy\u00fcme Trendi<\/strong>: 2000-2008 y\u0131llar\u0131 aras\u0131nda k\u00fcresel HDI levha \u00fcretimi &gt;'l\u00fck bir YBBO ile b\u00fcy\u00fcm\u00fc\u015ft\u00fcr (Prismark verileri). 2023 y\u0131l\u0131na gelindi\u011finde pazar b\u00fcy\u00fckl\u00fc\u011f\u00fc 12 milyar dolar\u0131 a\u015fm\u0131\u015f ve 2030 YBBO'su %8,3 olarak \u00f6ng\u00f6r\u00fclm\u00fc\u015ft\u00fcr.<\/li>\n\n<li><strong>Teknoloji Evrimi<\/strong>: Ultra HDI (iz\/uzay \u226440\u00b5m) ve g\u00f6m\u00fcl\u00fc bile\u015fen teknolojisi, AIoT ve giyilebilir cihaz geli\u015fimini daha da ileriye ta\u015f\u0131yacakt\u0131r.<\/li><\/ul><p>HDI teknolojisi, &#8220;D\u00f6rt Y\u00fcksek ve Bir D\u00fc\u015f\u00fck&#8221; \u00f6zellikleriyle, 6G ileti\u015fim, otonom ara\u00e7lar ve kuantum bili\u015fim alanlar\u0131nda muazzam bir potansiyele sahip olarak elektronik end\u00fcstrisinin ilerlemesinde temel bir itici g\u00fc\u00e7 g\u00f6revi g\u00f6rmektedir.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Classification_of_HDI_Boards\"><\/span><strong>HDI Panolar\u0131n\u0131n S\u0131n\u0131fland\u0131r\u0131lmas\u0131<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2><p>HDI levhalar, istifleme y\u00f6ntemine ve k\u00f6r yollar\u0131n laminasyon say\u0131s\u0131na g\u00f6re \u00fc\u00e7 ana tipe ayr\u0131l\u0131r:<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_1N1_Type\"><\/span><strong>(1) 1+N+1 Tip<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Yap\u0131<\/strong>: Y\u00fcksek yo\u011funluklu ara ba\u011flant\u0131lar i\u00e7in tek bir laminasyon katman\u0131na sahiptir.<\/li>\n\n<li><strong>\u00d6zellikler<\/strong>:<\/li>\n\n<li>En uygun maliyetli HDI \u00e7\u00f6z\u00fcm\u00fc<\/li>\n\n<li>Orta d\u00fczeyde karma\u015f\u0131kl\u0131\u011fa sahip tasar\u0131mlar i\u00e7in uygundur<\/li>\n\n<li>Tipik uygulamalar:Giri\u015f seviyesi ak\u0131ll\u0131 telefonlar, t\u00fcketici elektroni\u011fi<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_iNi_i%E2%89%A52_Type\"><\/span><strong>(2) i+N+i (i\u22652) Tip<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Yap\u0131<\/strong>: Y\u00fcksek yo\u011funluklu ara ba\u011flant\u0131lar i\u00e7in iki veya daha fazla laminasyon katman\u0131 i\u00e7erir.<\/li>\n\n<li><strong>Temel \u00d6zellikler<\/strong>:<\/li>\n\n<li>Kademeli veya istiflenmi\u015f mikrovia konfig\u00fcrasyonlar\u0131n\u0131 destekler<\/li>\n\n<li>Geli\u015fmi\u015f tasar\u0131mlarda genellikle bak\u0131r dolgulu istiflenmi\u015f mikroviyalar kullan\u0131l\u0131r<\/li>\n\n<li>Geli\u015fmi\u015f y\u00f6nlendirme yo\u011funlu\u011fu ve sinyal b\u00fct\u00fcnl\u00fc\u011f\u00fc sa\u011flar<\/li>\n\n<li><strong>Uygulamalar<\/strong>:<\/li>\n\n<li>Orta ila y\u00fcksek seviye mobil cihazlar<\/li>\n\n<li>A\u011f ekipmanlar\u0131<\/li>\n\n<li>Otomotiv elektroni\u011fi<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Any-Layer_Interconnect_ELIC_Type\"><\/span><strong>(3) Herhangi Katmanl\u0131 Ara Ba\u011flant\u0131 (ELIC) Tipi<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Yap\u0131<\/strong>: T\u00fcm katmanlar, istiflenmi\u015f bak\u0131r dolgulu mikroviyalar ile y\u00fcksek yo\u011funluklu ara ba\u011flant\u0131lar kullan\u0131r.<\/li>\n\n<li><strong>Avantajlar 2025<\/strong>:<\/li>\n\n<li>Katmanlar aras\u0131 ba\u011flant\u0131lar i\u00e7in tam tasar\u0131m \u00f6zg\u00fcrl\u00fc\u011f\u00fc sa\u011flar<\/li>\n\n<li>Ultra y\u00fcksek pin say\u0131l\u0131 bile\u015fenler (\u00f6rn. CPU'lar, GPU'lar) i\u00e7in optimum \u00e7\u00f6z\u00fcm<\/li>\n\n<li>Kompakt tasar\u0131mlarda alan kullan\u0131m\u0131n\u0131 en \u00fcst d\u00fczeye \u00e7\u0131kar\u0131r<\/li>\n\n<li><strong>Tipik Kullan\u0131m \u00d6rnekleri<\/strong>:<\/li>\n\n<li>Amiral gemisi ak\u0131ll\u0131 telefonlar<\/li>\n\n<li>Y\u00fcksek performansl\u0131 hesaplama<\/li>\n\n<li>Geli\u015fmi\u015f giyilebilir cihazlar<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technical_Comparison\"><\/span><strong>Teknik Kar\u015f\u0131la\u015ft\u0131rma<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Tip<\/strong><\/th><th><strong>Laminasyon Say\u0131s\u0131<\/strong><\/th><th><strong>Yap\u0131 \u00dczerinden<\/strong><\/th><th><strong>Maliyet Fakt\u00f6r\u00fc<\/strong><\/th><th><strong>Tipik Uygulamalar<\/strong><\/th><\/tr><\/thead><tbody><tr><td>1+N+1<\/td><td>Tek laminasyon<\/td><td>Temel mikrovialar<\/td><td>En d\u00fc\u015f\u00fck<\/td><td>Giri\u015f seviyesi t\u00fcketici elektroni\u011fi<\/td><\/tr><tr><td>i+N+i (i\u22652)<\/td><td>\u00c7oklu laminasyonlar<\/td><td>Y\u0131\u011f\u0131lm\u0131\u015f\/kademeli mikroviyalar<\/td><td>Orta d\u00fczeyde<\/td><td>Orta s\u0131n\u0131f mobil\/a\u011f<\/td><\/tr><tr><td>ELIC<\/td><td>T\u00fcm katmanlar<\/td><td>Bak\u0131r dolgulu istiflenmi\u015f vialar<\/td><td>En y\u00fcksek<\/td><td>\u00dcst d\u00fczey bilgisayar\/mobil<\/td><\/tr><\/tbody><\/table><\/figure><p>Bu s\u0131n\u0131fland\u0131rma sistemi, tasar\u0131mc\u0131lar\u0131n performans gereksinimleri, karma\u015f\u0131kl\u0131k ve maliyet hususlar\u0131na g\u00f6re uygun HDI teknolojisini se\u00e7melerine yard\u0131mc\u0131 olur.1+N+1'den ELIC'e evrim, daha geli\u015fmi\u015f elektronik uygulamalar\u0131 desteklemek i\u00e7in artan yetenekleri temsil eder.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-2.jpg\" alt=\"HDI PCB\" class=\"wp-image-3250\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"HDIBUM_PCB_Material_Performance_Requirements\"><\/span><strong>HDI\/BUM PCB Malzeme Performans Gereksinimleri<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2><p>HDI bask\u0131l\u0131 devre kartlar\u0131 i\u00e7in malzemelerin geli\u015ftirilmesi her zaman \"d\u00f6rt y\u00fcksek ve bir d\u00fc\u015f\u00fck\" gereksinimlerini (y\u00fcksek yo\u011funluk, y\u00fcksek frekans, y\u00fcksek iletkenlik, y\u00fcksek g\u00fcvenilirlik ve d\u00fc\u015f\u00fck maliyet) kar\u015f\u0131lamaya odaklanm\u0131\u015ft\u0131r. Bask\u0131l\u0131 devre kartlar\u0131n\u0131n artan minyat\u00fcrle\u015ftirme ve performans ihtiya\u00e7lar\u0131, elektromigrasyona kar\u015f\u0131 diren\u00e7 ve boyutsal kararl\u0131l\u0131k gibi \u00f6zelliklerin iyile\u015ftirilmesiyle kar\u015f\u0131lanmaktad\u0131r.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"1_Prepreg_PP_Materials\"><\/span><strong>1.Prepreg (PP) Malzemeler<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Kompozisyon<\/strong>: Re\u00e7ine + g\u00fc\u00e7lendirilmi\u015f malzemeler (tipik olarak fiberglas)<\/li>\n\n<li><strong>Avantajlar 2025<\/strong>:<\/li>\n\n<li>D\u00fc\u015f\u00fck maliyetli<\/li>\n\n<li>\u0130yi mekanik sertlik<\/li>\n\n<li>Geni\u015f uygulanabilirlik<\/li>\n\n<li><strong>S\u0131n\u0131rlamalar<\/strong>:<\/li>\n\n<li>Orta d\u00fczeyde g\u00fcvenilirlik (daha zay\u0131f CAF direnci)<\/li>\n\n<li>Daha d\u00fc\u015f\u00fck ped soyulma mukavemeti (d\u00fc\u015fme testi gerektiren uygulamalar i\u00e7in uygun de\u011fildir)<\/li>\n\n<li><strong>Tipik Uygulamalar<\/strong>: Orta-alt seviye t\u00fcketici elektroni\u011fi (\u00f6rn. ekonomik ak\u0131ll\u0131 telefonlar)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"2_Resin_Coated_Copper_RCC_Materials\"><\/span><strong>2.Re\u00e7ine Kapl\u0131 Bak\u0131r (RCC) Malzemeler<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>T\u00fcrleri<\/strong>:<\/li><\/ul><ol class=\"wp-block-list\"><li>Metalize PI film<\/li>\n\n<li>PI film + yap\u0131\u015ft\u0131r\u0131c\u0131 ile lamine edilmi\u015f bak\u0131r folyo (&#8220;Saf PI&#8221;)<\/li>\n\n<li>D\u00f6kme PI film (bak\u0131r folyo \u00fczerine k\u00fcrlenmi\u015f s\u0131v\u0131 PI)<\/li><\/ol><ul class=\"wp-block-list\"><li><strong>Avantajlar 2025<\/strong>:<\/li>\n\n<li>M\u00fckemmel \u00fcretilebilirlik<\/li>\n\n<li>Y\u00fcksek g\u00fcvenilirlik<\/li>\n\n<li>\u00dcst\u00fcn ped soyulma mukavemeti (d\u00fc\u015fme testi uygulamalar\u0131 i\u00e7in ideal)<\/li>\n\n<li>Etkinle\u015ftirilmi\u015f mikrovia lazer delme teknolojisi<\/li>\n\n<li><strong>S\u0131n\u0131rlamalar<\/strong>:<\/li>\n\n<li>Daha y\u00fcksek maliyet<\/li>\n\n<li>Daha d\u00fc\u015f\u00fck genel sertlik (potansiyel e\u011frilme sorunlar\u0131)<\/li>\n\n<li><strong>Etki<\/strong>: SMT'den CSP paketlemeye ge\u00e7i\u015fe \u00f6nc\u00fcl\u00fck etti<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"3_Laser_Drillable_Prepreg_LDP_Materials\"><\/span><strong>3.Lazerle Delinebilir Prepreg (LDP) Malzemeler<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Konumland\u0131rma<\/strong>: PP ve RCC aras\u0131nda maliyet-performans dengesi<\/li>\n\n<li><strong>Avantajlar 2025<\/strong>:<\/li>\n\n<li>PP'ye g\u00f6re daha iyi CAF direnci<\/li>\n\n<li>Geli\u015ftirilmi\u015f dielektrik katman homojenli\u011fi<\/li>\n\n<li>Ped soyulma mukavemeti i\u00e7in uluslararas\u0131 standartlar\u0131 kar\u015f\u0131lar\/a\u015far<\/li>\n\n<li><strong>Uygulamalar<\/strong>: Orta-\u00fcst seviye mobil cihazlar ve elektronik cihazlar<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"4_Liquid_Crystal_Polymer_LCP_Materials\"><\/span><strong>4. S\u0131v\u0131 Kristal Polimer (LCP) Malzemeler<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Anahtar \u00d6zellikler<\/strong>:<\/li>\n\n<li>Ultra d\u00fc\u015f\u00fck dielektrik sabiti (Dk=2,8 @1GHz)<\/li>\n\n<li>Minimum kay\u0131p tanjant\u0131 (0,0025)<\/li>\n\n<li>Do\u011fal alev geciktirici (halojensiz)<\/li>\n\n<li>\u00dcst\u00fcn boyutsal kararl\u0131l\u0131k<\/li>\n\n<li><strong>Avantajlar 2025<\/strong>:<\/li>\n\n<li>Y\u00fcksek frekansl\u0131\/y\u00fcksek h\u0131zl\u0131 tasar\u0131mlar i\u00e7in ideal<\/li>\n\n<li>\u00c7evre dostu<\/li>\n\n<li>Geleneksel PI hakimiyetine meydan okuma<\/li>\n\n<li><strong>Uygulamalar<\/strong>: \u00dcst d\u00fczey RF\/mikrodalga devreleri, geli\u015fmi\u015f paketleme<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Material_Selection_Guide\"><\/span><strong>Malzeme Se\u00e7im K\u0131lavuzu<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Malzeme<\/strong><\/th><th><strong>Maliyet<\/strong><\/th><th><strong>G\u00fcvenilirlik<\/strong><\/th><th><strong>Y\u00fcksek Frekans<\/strong><\/th><th><strong>Sertlik<\/strong><\/th><th><strong>\u0130\u00e7in En \u0130yisi<\/strong><\/th><\/tr><\/thead><tbody><tr><td><strong>PP<\/strong><\/td><td>D\u00fc\u015f\u00fck<\/td><td>Orta d\u00fczeyde<\/td><td>No<\/td><td>Y\u00fcksek<\/td><td>Ekonomik t\u00fcketici cihazlar\u0131<\/td><\/tr><tr><td><strong>RCC<\/strong><\/td><td>Y\u00fcksek<\/td><td>M\u00fckemmel<\/td><td>Orta d\u00fczeyde<\/td><td>D\u00fc\u015f\u00fck<\/td><td>Hassas uygulamalar\u0131 b\u0131rakarak test edin<\/td><\/tr><tr><td><strong>LDP<\/strong><\/td><td>Orta<\/td><td>\u0130yi<\/td><td>S\u0131n\u0131rl\u0131<\/td><td>Y\u00fcksek<\/td><td>Premium mobil cihazlar<\/td><\/tr><tr><td><strong>LCP<\/strong><\/td><td>\u00c7ok Y\u00fcksek<\/td><td>Ola\u011fan\u00fcst\u00fc<\/td><td>Evet<\/td><td>Orta<\/td><td>5G\/RF\/geli\u015fmi\u015f paketleme<\/td><\/tr><\/tbody><\/table><\/figure><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Difference_in_PCB_manufacturing_process_between_core-containing_boards_and_coreless_boards\"><\/span>PCB \u00fcretim s\u00fcrecinde \u00e7ekirdek i\u00e7eren kartlar ile \u00e7ekirdeksiz kartlar aras\u0131ndaki fark<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"I_Core-Based_HDI_Manufacturing_Process\"><\/span><strong>I.\u00c7ekirdek Tabanl\u0131 HDI \u00dcretim S\u00fcreci<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>1. \u00c7ekirdek Kurul \u00d6zellikleri<\/strong><\/p><ul class=\"wp-block-list\"><li><strong>Yap\u0131sal Tasar\u0131m<\/strong>:<\/li>\n\n<li>Ge\u00e7i\u015f delikleri veya hibrit g\u00f6m\u00fcl\u00fc\/k\u00f6r\/ge\u00e7i\u015f delikli yap\u0131lar kullan\u0131r (tipik olarak 4-6 katman)<\/li>\n\n<li>\u0130ste\u011fe ba\u011fl\u0131 metal \u00e7ekirdekli yap\u0131 (geli\u015fmi\u015f termal da\u011f\u0131l\u0131m)<\/li><\/ul><p><strong>Teknik Parametreler<\/strong>:<\/p><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Parametre<\/strong><\/th><th><strong>\u00c7ekirdek Kurul<\/strong><\/th><th><strong>Biriktirme Katmanlar\u0131<\/strong><\/th><\/tr><\/thead><tbody><tr><td>Delik \u00e7ap\u0131<\/td><td>\u22650,2 mm<\/td><td>\u22640,15 mm (mikrovialar)<\/td><\/tr><tr><td>\u0130z\/bo\u015fluk geni\u015fli\u011fi<\/td><td>\u22650,08 mm<\/td><td>\u22640,08 mm<\/td><\/tr><tr><td>Ara ba\u011flant\u0131 yo\u011funlu\u011fu<\/td><td>D\u00fc\u015f\u00fck<\/td><td>Ultra y\u00fcksek yo\u011funluk<\/td><\/tr><\/tbody><\/table><\/figure><p><strong>2. Temel Kurul \u0130\u015flevleri<\/strong><\/p><ul class=\"wp-block-list\"><li>Mekanik destek (sa\u011flaml\u0131k sa\u011flar)<\/li>\n\n<li>Birikim katmanlar\u0131 aras\u0131nda elektriksel ara ba\u011flant\u0131 k\u00f6pr\u00fcs\u00fc<\/li>\n\n<li>Termal y\u00f6netim (\u00f6zellikle metal \u00e7ekirdekli kartlar i\u00e7in)<\/li><\/ul><p><strong>3. Temel \u00d6n Ar\u0131tma S\u00fcre\u00e7leri<\/strong><\/p><ul class=\"wp-block-list\"><li><strong>Tedavi yoluyla<\/strong>: Dolgu + y\u00fczey d\u00fczle\u015ftirme<\/li>\n\n<li><strong>Y\u00fczey i\u015fleme<\/strong>: Ak\u0131ms\u0131z bak\u0131r kaplama + elektrokaplama (1-3\u00b5m kal\u0131nl\u0131k)<\/li>\n\n<li><strong>Desen aktar\u0131m\u0131<\/strong>:LDI lazer do\u011frudan g\u00f6r\u00fcnt\u00fcleme (\u00b15\u00b5m hassasiyet)<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"II_Breakthrough_Coreless_HDI_Technology\"><\/span><strong>II. \u00c7\u0131\u011f\u0131r A\u00e7an \u00c7ekirdeksiz HDI Teknolojisi<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>1. Temsili Teknolojiler<\/strong><\/p><ul class=\"wp-block-list\"><li><strong>ALIVH<\/strong> (Herhangi Bir Katman Aras\u0131 Ge\u00e7i\u015f Deli\u011fi)<\/li>\n\n<li><strong>B\u00b2IT<\/strong> (G\u00f6m\u00fcl\u00fc Bump Ara Ba\u011flant\u0131 Teknolojisi)<\/li><\/ul><p><strong>2. Devrim Niteli\u011finde Avantajlar<\/strong><\/p><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th><strong>Kar\u015f\u0131la\u015ft\u0131rma<\/strong><\/th><th><strong>\u00c7ekirdek Tabanl\u0131 HDI<\/strong><\/th><th><strong>\u00c7ekirdeksiz HDI<\/strong><\/th><\/tr><\/thead><tbody><tr><td><strong>Yap\u0131<\/strong><\/td><td>\u00c7ekirdek + yap\u0131 b\u00f6lgeleri<\/td><td>Homojen katman tasar\u0131m\u0131<\/td><\/tr><tr><td><strong>Ara Ba\u011flant\u0131 Yo\u011funlu\u011fu<\/strong><\/td><td>\u00d6nemli katman farkl\u0131l\u0131klar\u0131<\/td><td>Tek tip ultra y\u00fcksek yo\u011funluk (\u00e7ekirde\u011fe k\u0131yasla +)<\/td><\/tr><tr><td><strong>Sinyal \u0130letimi<\/strong><\/td><td>Daha uzun yollar (\u00e7ekirdek kaynakl\u0131 gecikme)<\/td><td>M\u00fcmk\u00fcn olan en k\u0131sa yollar<\/td><\/tr><tr><td><strong>Kal\u0131nl\u0131k Kontrol\u00fc<\/strong><\/td><td>\u00c7ekirdek ile s\u0131n\u0131rl\u0131 (\u22650,4 mm)<\/td><td>0,2 mm'ye ula\u015fabilir<\/td><\/tr><\/tbody><\/table><\/figure><p><strong>3. Temel S\u00fcre\u00e7 Yenilikleri<\/strong><\/p><ul class=\"wp-block-list\"><li><strong>Katman ara ba\u011flant\u0131s\u0131<\/strong>:<\/li>\n\n<li>Ak\u0131ms\u0131z bak\u0131r\u0131 iletken macun veya bak\u0131r \u00e7\u0131k\u0131nt\u0131larla de\u011fi\u015ftirir<\/li>\n\n<li>Herhangi bir katman mikrovialar i\u00e7in lazer ablasyonu (\u226450\u00b5m \u00e7ap)<\/li>\n\n<li><strong>G\u00fcvenilirlik g\u00fcvencesi<\/strong>:<\/li>\n\n<li>Nano \u00f6l\u00e7ekli y\u00fczey p\u00fcr\u00fczlendirme (Ra\u22640,5\u00b5m)<\/li>\n\n<li>D\u00fc\u015f\u00fck sertlikte dielektrik malzemeler (Tg\u2265200\u2103)<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Concluding_Remarks\"><\/span>Son S\u00f6zler<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Lazer delme, malzeme bilimi ve \u00e7ok katmanl\u0131 istifleme alanlar\u0131ndaki ilerlemelerden g\u00fc\u00e7 alan HDI PCB'ler, minyat\u00fcrle\u015ftirme ve y\u00fcksek performansl\u0131 elektroni\u011fin en ileri noktas\u0131n\u0131 temsil etmektedir. Cihazlar daha y\u00fcksek h\u0131zlar, daha d\u00fc\u015f\u00fck gecikme s\u00fcresi ve daha y\u00fcksek g\u00fcvenilirlik talep ettik\u00e7e HDI teknolojisi geli\u015fmeye devam edecek ve PCB \u00fcretiminin s\u0131n\u0131rlar\u0131n\u0131 zorlayacakt\u0131r.<\/p>","protected":false},"excerpt":{"rendered":"<p>Y\u00fcksek Yo\u011funluklu Ara Ba\u011flant\u0131 (HDI) bask\u0131l\u0131 devre kartlar\u0131, daha k\u00fc\u00e7\u00fck, daha h\u0131zl\u0131 ve daha g\u00fcvenilir devre tasar\u0131mlar\u0131 sa\u011flayarak modern elektronikte devrim yarat\u0131yor. \u0130ster sinyal b\u00fct\u00fcnl\u00fc\u011f\u00fcn\u00fc, ister termal y\u00f6netimi veya minyat\u00fcrle\u015ftirmeyi optimize ediyor olsun, HDI teknolojisini anlamak yeni nesil PCB tasar\u0131m\u0131 i\u00e7in kritik \u00f6neme sahiptir.<\/p>","protected":false},"author":1,"featured_media":3251,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[112],"tags":[281,280,111],"class_list":["post-3247","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-knowledge","tag-hdi-pcb","tag-high-density-interconnector","tag-pcb"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>High Density Interconnector PCB - Topfastpcb<\/title>\n<meta name=\"description\" content=\"The essential differences between core and coreless HDI circuit boards, manufacturing processes, material requirements, and applications in 5G, automotive, and consumer electronics. Learn how High Density Interconnect (HDI) technology enables smaller, faster, and more reliable boards.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/\" \/>\n<meta property=\"og:locale\" content=\"tr_TR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"High Density Interconnector PCB - Topfastpcb\" \/>\n<meta property=\"og:description\" content=\"The essential differences between core and coreless HDI circuit boards, manufacturing processes, material requirements, and applications in 5G, automotive, and consumer electronics. Learn how High Density Interconnect (HDI) technology enables smaller, faster, and more reliable boards.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/\" \/>\n<meta property=\"og:site_name\" content=\"Topfastpcb\" \/>\n<meta property=\"article:published_time\" content=\"2025-06-11T00:32:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-3.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"402\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"\u6258\u666e\u6cd5\u65af\u7279\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Yazan:\" \/>\n\t<meta name=\"twitter:data1\" content=\"\u6258\u666e\u6cd5\u65af\u7279\" \/>\n\t<meta name=\"twitter:label2\" content=\"Tahmini okuma s\u00fcresi\" \/>\n\t<meta name=\"twitter:data2\" content=\"8 dakika\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/\"},\"author\":{\"name\":\"\u6258\u666e\u6cd5\u65af\u7279\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a\"},\"headline\":\"High Density Interconnector PCB\",\"datePublished\":\"2025-06-11T00:32:00+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/\"},\"wordCount\":1685,\"publisher\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-3.jpg\",\"keywords\":[\"HDI PCB\",\"High Density Interconnector\",\"PCB\"],\"articleSection\":[\"Knowledge\"],\"inLanguage\":\"tr\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/\",\"url\":\"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/\",\"name\":\"High Density Interconnector PCB - Topfastpcb\",\"isPartOf\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-3.jpg\",\"datePublished\":\"2025-06-11T00:32:00+00:00\",\"description\":\"The essential differences between core and coreless HDI circuit boards, manufacturing processes, material requirements, and applications in 5G, automotive, and consumer electronics. Learn how High Density Interconnect (HDI) technology enables smaller, faster, and more reliable boards.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#breadcrumb\"},\"inLanguage\":\"tr\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"tr\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#primaryimage\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-3.jpg\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-3.jpg\",\"width\":600,\"height\":402,\"caption\":\"HDI PCB\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"\u9996\u9875\",\"item\":\"https:\/\/www.topfastpcb.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"High Density Interconnector PCB\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.topfastpcb.com\/#website\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"name\":\"Topfastpcb\",\"description\":\"Topfast Prime Choice for Global Electronics Manufacturing\",\"publisher\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.topfastpcb.com\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"tr\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.topfastpcb.com\/#organization\",\"name\":\"Topfastpcb\",\"url\":\"https:\/\/www.topfastpcb.com\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"tr\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"contentUrl\":\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png\",\"width\":144,\"height\":56,\"caption\":\"Topfastpcb\"},\"image\":{\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a\",\"name\":\"\u6258\u666e\u6cd5\u65af\u7279\",\"sameAs\":[\"http:\/\/www.topfastpcb.com\"],\"url\":\"https:\/\/www.topfastpcb.com\/tr\/blog\/author\/admin\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"High Density Interconnector PCB - Topfastpcb","description":"The essential differences between core and coreless HDI circuit boards, manufacturing processes, material requirements, and applications in 5G, automotive, and consumer electronics. Learn how High Density Interconnect (HDI) technology enables smaller, faster, and more reliable boards.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/","og_locale":"tr_TR","og_type":"article","og_title":"High Density Interconnector PCB - Topfastpcb","og_description":"The essential differences between core and coreless HDI circuit boards, manufacturing processes, material requirements, and applications in 5G, automotive, and consumer electronics. Learn how High Density Interconnect (HDI) technology enables smaller, faster, and more reliable boards.","og_url":"https:\/\/www.topfastpcb.com\/tr\/blog\/high-density-interconnector-pcb\/","og_site_name":"Topfastpcb","article_published_time":"2025-06-11T00:32:00+00:00","og_image":[{"width":600,"height":402,"url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-3.jpg","type":"image\/jpeg"}],"author":"\u6258\u666e\u6cd5\u65af\u7279","twitter_card":"summary_large_image","twitter_misc":{"Yazan:":"\u6258\u666e\u6cd5\u65af\u7279","Tahmini okuma s\u00fcresi":"8 dakika"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#article","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/"},"author":{"name":"\u6258\u666e\u6cd5\u65af\u7279","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a"},"headline":"High Density Interconnector PCB","datePublished":"2025-06-11T00:32:00+00:00","mainEntityOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/"},"wordCount":1685,"publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-3.jpg","keywords":["HDI PCB","High Density Interconnector","PCB"],"articleSection":["Knowledge"],"inLanguage":"tr"},{"@type":"WebPage","@id":"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/","url":"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/","name":"High Density Interconnector PCB - Topfastpcb","isPartOf":{"@id":"https:\/\/www.topfastpcb.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#primaryimage"},"image":{"@id":"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#primaryimage"},"thumbnailUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-3.jpg","datePublished":"2025-06-11T00:32:00+00:00","description":"The essential differences between core and coreless HDI circuit boards, manufacturing processes, material requirements, and applications in 5G, automotive, and consumer electronics. Learn how High Density Interconnect (HDI) technology enables smaller, faster, and more reliable boards.","breadcrumb":{"@id":"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#breadcrumb"},"inLanguage":"tr","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/"]}]},{"@type":"ImageObject","inLanguage":"tr","@id":"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#primaryimage","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-3.jpg","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/06\/HDI-PCB-3.jpg","width":600,"height":402,"caption":"HDI PCB"},{"@type":"BreadcrumbList","@id":"https:\/\/www.topfastpcb.com\/blog\/high-density-interconnector-pcb\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"\u9996\u9875","item":"https:\/\/www.topfastpcb.com\/"},{"@type":"ListItem","position":2,"name":"High Density Interconnector PCB"}]},{"@type":"WebSite","@id":"https:\/\/www.topfastpcb.com\/#website","url":"https:\/\/www.topfastpcb.com\/","name":"Topfastpcb","description":"Topfast Prime Choice for Global Electronics Manufacturing","publisher":{"@id":"https:\/\/www.topfastpcb.com\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.topfastpcb.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"tr"},{"@type":"Organization","@id":"https:\/\/www.topfastpcb.com\/#organization","name":"Topfastpcb","url":"https:\/\/www.topfastpcb.com\/","logo":{"@type":"ImageObject","inLanguage":"tr","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/","url":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","contentUrl":"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/02\/cropped-topfast-logo.png","width":144,"height":56,"caption":"Topfastpcb"},"image":{"@id":"https:\/\/www.topfastpcb.com\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.topfastpcb.com\/#\/schema\/person\/39870874f1c329f3cd3693593dbdce3a","name":"\u6258\u666e\u6cd5\u65af\u7279","sameAs":["http:\/\/www.topfastpcb.com"],"url":"https:\/\/www.topfastpcb.com\/tr\/blog\/author\/admin\/"}]}},"_links":{"self":[{"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/posts\/3247","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/comments?post=3247"}],"version-history":[{"count":2,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/posts\/3247\/revisions"}],"predecessor-version":[{"id":3253,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/posts\/3247\/revisions\/3253"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/media\/3251"}],"wp:attachment":[{"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/media?parent=3247"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/categories?post=3247"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/tags?post=3247"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}