{"id":3560,"date":"2025-07-09T08:22:00","date_gmt":"2025-07-09T00:22:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=3560"},"modified":"2025-07-08T15:56:17","modified_gmt":"2025-07-08T07:56:17","slug":"how-to-perform-reflow-soldering-on-double-sided-pcb","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/tr\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/","title":{"rendered":"\u00c7ift tarafl\u0131 PCB \u00fczerinde reflow lehimleme nas\u0131l yap\u0131l\u0131r?"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">\u0130\u00e7indekiler<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Why_is_Double-Sided_PCB_Reflow_Soldering_a_Challenge_in_Electronics_Manufacturing\" >\u00c7ift Tarafl\u0131 PCB Reflow Lehimleme Elektronik \u00dcretiminde Neden Bir Zorluktur?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#In-Depth_Comparison_of_Two_Main_Soldering_Processes\" >\u0130ki Ana Lehimleme \u0130\u015fleminin Derinlemesine Kar\u015f\u0131la\u015ft\u0131r\u0131lmas\u0131<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Option_A_Double-Sided_Solder_Paste_Process_Ideal_for_High-Density_Components\" >Se\u00e7enek A: \u00c7ift Tarafl\u0131 Lehim Pastas\u0131 \u0130\u015flemi (Y\u00fcksek Yo\u011funluklu Bile\u015fenler i\u00e7in \u0130deal)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Option_B_Solder_Paste_Red_Glue_Hybrid_Process_Solution_for_Large_Components\" >Se\u00e7enek B: Lehim Pastas\u0131 + K\u0131rm\u0131z\u0131 Tutkal Hibrit \u0130\u015flemi (B\u00fcy\u00fck Bile\u015fenler i\u00e7in \u00c7\u00f6z\u00fcm)<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#5_Golden_Rules_for_Soldering_Quality_Control\" >Lehimleme Kalite Kontrol\u00fc i\u00e7in 5 Alt\u0131n Kural<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Common_Issues_and_Engineering_Solutions\" >Yayg\u0131n Sorunlar ve M\u00fchendislik \u00c7\u00f6z\u00fcmleri<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/#Future_Process_Trends\" >Gelecekteki S\u00fcre\u00e7 Trendleri<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Why_is_Double-Sided_PCB_Reflow_Soldering_a_Challenge_in_Electronics_Manufacturing\"><\/span>\u00c7ift Tarafl\u0131 PCB Reflow Lehimleme Elektronik \u00dcretiminde Neden Bir Zorluktur?<span class=\"ez-toc-section-end\"><\/span><\/h2><p>Ak\u0131ll\u0131 telefonlar ve end\u00fcstriyel kontrol cihazlar\u0131 gibi y\u00fcksek performansl\u0131 elektronik \u00fcr\u00fcnlerde, <a href=\"https:\/\/www.topfastpcb.com\/tr\/products\/double-sided-flexible-pcb\/\">\u00e7ift tarafl\u0131 PCB<\/a> tasar\u0131mlar standart haline gelmi\u015ftir. Ancak \u00e7ift tarafl\u0131 lehimleme iki b\u00fcy\u00fck zorlu\u011fu beraberinde getirmektedir:<\/p><ol class=\"wp-block-list\"><li><strong>Termal Y\u00f6netim Karma\u015f\u0131kl\u0131\u011f\u0131<\/strong> - \u0130kinci taraf lehimleme s\u0131ras\u0131nda, birinci taraf yeniden \u0131s\u0131t\u0131l\u0131r, bu da bile\u015fenin ayr\u0131lmas\u0131na veya lehim ba\u011flant\u0131s\u0131n\u0131n bozulmas\u0131na neden olabilir.<\/li>\n\n<li><strong>S\u00fcre\u00e7 Se\u00e7imi \u0130kilemi<\/strong> - Lehim pastas\u0131 ve k\u0131rm\u0131z\u0131 tutkal i\u015flemlerinin her birinin art\u0131lar\u0131 ve eksileri vard\u0131r ve bile\u015fen d\u00fczenine g\u00f6re dikkatli bir de\u011ferlendirme gerektirir.<\/li><\/ol><p><a href=\"https:\/\/www.topfastpcb.com\/tr\/contact\/\" target=\"_blank\" rel=\"noreferrer noopener\">Proses M\u00fchendislerimize dan\u0131\u015f\u0131n<\/a>\u00a0\u00f6zelle\u015ftirilmi\u015f \u00e7\u00f6z\u00fcmler i\u00e7in<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb.jpg\" alt=\"PCB yeniden ak\u0131\u015f lehimleme\" class=\"wp-image-3561\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"In-Depth_Comparison_of_Two_Main_Soldering_Processes\"><\/span>\u0130ki Ana Lehimleme \u0130\u015fleminin Derinlemesine Kar\u015f\u0131la\u015ft\u0131r\u0131lmas\u0131<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_A_Double-Sided_Solder_Paste_Process_Ideal_for_High-Density_Components\"><\/span>Se\u00e7enek A: \u00c7ift Tarafl\u0131 Lehim Pastas\u0131 \u0130\u015flemi (Y\u00fcksek Yo\u011funluklu Bile\u015fenler i\u00e7in \u0130deal)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>\u0130\u00e7in en iyisi<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Her iki taraf\u0131nda BGA'lar, QFN'ler veya di\u011fer hassas IC'ler bulunan PCB'ler<\/li>\n\n<li>Genel olarak hafif bile\u015fenler<\/li><\/ul><p><strong>\u00d6nemli Ad\u0131mlar<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Taraf A: Lehim pastas\u0131 bas \u2192 Bile\u015fenleri yerle\u015ftir \u2192 Lehimi yeniden ak\u0131t (tepe s\u0131cakl\u0131\u011f\u0131 245\u00b0C)<\/li>\n\n<li>Oda s\u0131cakl\u0131\u011f\u0131na kadar so\u011futun, ard\u0131ndan PCB'yi \u00e7evirin<\/li>\n\n<li>B Taraf\u0131: Lehim pastas\u0131n\u0131 yazd\u0131r\u0131n \u2192 Bile\u015fenleri yerle\u015ftirin \u2192 Kademeli s\u0131cakl\u0131k profili kullan\u0131n (tepe s\u0131cakl\u0131\u011f\u0131n\u0131 5-10\u00b0C azalt\u0131n)<\/li><\/ol><p><strong>Avantajlar 2025<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Y\u00fcksek lehim ba\u011flant\u0131 g\u00fcvenilirli\u011fi<\/li>\n\n<li>Otomatik seri \u00fcretim i\u00e7in uygundur<\/li><\/ul><p><strong>Riskler<\/strong>:<\/p><ul class=\"wp-block-list\"><li>B\u00fcy\u00fck bile\u015fenler ikinci yeniden ak\u0131\u015f s\u0131ras\u0131nda ayr\u0131labilir<\/li>\n\n<li>\u0130kinci taraf lehimleme i\u00e7in hassas s\u0131cakl\u0131k kontrol\u00fc gereklidir<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Option_B_Solder_Paste_Red_Glue_Hybrid_Process_Solution_for_Large_Components\"><\/span>Se\u00e7enek B: Lehim Pastas\u0131 + K\u0131rm\u0131z\u0131 Tutkal Hibrit \u0130\u015flemi (B\u00fcy\u00fck Bile\u015fenler i\u00e7in \u00c7\u00f6z\u00fcm)<span class=\"ez-toc-section-end\"><\/span><\/h3><p><strong>\u0130\u00e7in en iyisi<\/strong>:<\/p><ul class=\"wp-block-list\"><li>Bir tarafta b\u00fcy\u00fck konekt\u00f6rler\/elektrolitik kapasit\u00f6rler vard\u0131r<\/li>\n\n<li>\u00d6nemli a\u011f\u0131rl\u0131k farkl\u0131l\u0131klar\u0131na sahip kar\u0131\u015f\u0131k d\u00fczenler<\/li><\/ul><p><strong>Yenilik\u00e7i S\u00fcre\u00e7<\/strong>:<\/p><ol class=\"wp-block-list\"><li>Lehim pastas\u0131 taraf\u0131 (Taraf A): Standart yeniden ak\u0131\u015f lehimleme<\/li>\n\n<li>K\u0131rm\u0131z\u0131 tutkal taraf\u0131 (B Taraf\u0131): &#8220;Yazd\u0131r-Yerle\u015ftir-K\u00fcrle&#8221; \u00fc\u00e7 a\u015famal\u0131 y\u00f6ntem:<\/li><\/ol><ul class=\"wp-block-list\"><li>K\u0131rm\u0131z\u0131 tutkal bask\u0131 hassasiyeti: \u00b10,1 mm<\/li>\n\n<li>K\u00fcrlenme s\u0131cakl\u0131\u011f\u0131: 120-150\u00b0C (lehim pastas\u0131 erime noktas\u0131ndan \u00e7ok daha d\u00fc\u015f\u00fck)<\/li>\n\n<li>Daha fazla g\u00fcvenilirlik i\u00e7in iste\u011fe ba\u011fl\u0131 dalga lehimleme<\/li><\/ul><p><strong>Teknik Notlar<\/strong>:<\/p><ul class=\"wp-block-list\"><li>K\u0131rm\u0131z\u0131 yap\u0131\u015ft\u0131r\u0131c\u0131 lehim pedlerinden en az 0,3 mm uzakta olmal\u0131d\u0131r<\/li>\n\n<li>Zay\u0131f yap\u0131\u015fmay\u0131 \u00f6nlemek i\u00e7in k\u00fcrlenme s\u00fcresini uzat\u0131n<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-1.jpg\" alt=\"PCB yeniden ak\u0131\u015f lehimleme\" class=\"wp-image-3562\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><p><a href=\"https:\/\/www.topfastpcb.com\/tr\/contact\/\">\u00dccretsiz uzman i\u015f\u00e7ili\u011fi k\u0131lavuzlar\u0131 edinin<\/a><\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"5_Golden_Rules_for_Soldering_Quality_Control\"><\/span>Lehimleme Kalite Kontrol\u00fc i\u00e7in 5 Alt\u0131n Kural<span class=\"ez-toc-section-end\"><\/span><\/h2><ul class=\"wp-block-list\"><li><strong>S\u0131cakl\u0131k Profilini Optimize Edin<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>\u0130lk taraf: Standart Ramp-Soak-Spike (RSS) e\u011frisi (2-3\u00b0C\/s \u0131s\u0131tma h\u0131z\u0131)<\/li>\n\n<li>\u0130kinci taraf:Rampadan \u00c7ubu\u011fa (RTS) e\u011frisini kullan\u0131n (uzat\u0131lm\u0131\u015f \u00f6n \u0131s\u0131tma s\u00fcresi)<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Bile\u015fen Yerle\u015fim Y\u00f6nergeleri<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>A\u011f\u0131r bile\u015fenleri ayn\u0131 tarafa yerle\u015ftirin<\/li>\n\n<li>Termal gerilim yo\u011funla\u015fmas\u0131n\u0131 \u00f6nlemek i\u00e7in \u00e7ift tarafl\u0131 BGA'lar\u0131 kademelendirin<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Lehim Pastas\u0131 Se\u00e7im Kriterleri<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>\u0130kinci taraf: D\u00fc\u015f\u00fck s\u0131cakl\u0131kta lehim pastas\u0131 kullan\u0131n (\u00f6rn. Sn42\/Bi58)<\/li>\n\n<li>K\u0131rm\u0131z\u0131 tutkal viskozitesi:&gt;50.000 cps<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Kritik Ekipman Parametreleri<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>Reflow f\u0131r\u0131n konvey\u00f6r e\u011fimi: 5-7\u00b0<\/li>\n\n<li>So\u011futma h\u0131z\u0131: 4-6\u00b0C\/s<\/li><\/ul><ul class=\"wp-block-list\"><li><strong>Denetim Teknolojisi Y\u00fckseltmeleri<\/strong><\/li><\/ul><ul class=\"wp-block-list\"><li>Lehim pastas\u0131 kal\u0131nl\u0131\u011f\u0131 denetimi i\u00e7in 3D SPI kullan\u0131n<\/li>\n\n<li>\u0130kinci yeniden ak\u0131\u015ftan sonra zorunlu akustik mikroskopi<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Common_Issues_and_Engineering_Solutions\"><\/span>Yayg\u0131n Sorunlar ve M\u00fchendislik \u00c7\u00f6z\u00fcmleri<span class=\"ez-toc-section-end\"><\/span><\/h2><p><strong>Sorun 1: \u0130kinci Yeniden Ak\u0131\u015f S\u0131ras\u0131nda QFN Bile\u015feninin Kaymas\u0131<\/strong><\/p><ul class=\"wp-block-list\"><li>\u00c7\u00f6z\u00fcm: Birinci taraf lehimlemeden sonra y\u00fcksek s\u0131cakl\u0131kta yap\u0131\u015ft\u0131r\u0131c\u0131 uygulay\u0131n<\/li>\n\n<li>Parametreler:200\u00b0C'den fazla k\u00fcrlenme tolerans\u0131na sahip yap\u0131\u015ft\u0131r\u0131c\u0131 kullan\u0131n<\/li><\/ul><p><strong>Sorun 2: Dalga Lehimleme S\u0131ras\u0131nda Komponent D\u00fc\u015fmesi (K\u0131rm\u0131z\u0131 Tutkal Taraf\u0131)<\/strong><\/p><ul class=\"wp-block-list\"><li>\u0130yile\u015ftirmeler:<\/li><\/ul><ol class=\"wp-block-list\"><li>K\u0131rm\u0131z\u0131 tutkal uygulamas\u0131ndan sonra UV ile post-cure<\/li>\n\n<li>Dalga lehimlemeden \u00f6nce 100\u00b0C'ye \u0131s\u0131t\u0131n<\/li><\/ol><p><strong>Sorun 3: BGA Ba\u011flant\u0131lar\u0131nda A\u015f\u0131r\u0131 Bo\u015fluk<\/strong><\/p><ul class=\"wp-block-list\"><li>S\u00fcre\u00e7 Optimizasyonu:<\/li>\n\n<li>Lehim pastas\u0131 \u00e7\u00f6z\u00fclme s\u00fcresini 8 saate kadar uzat\u0131n<\/li>\n\n<li>Azot destekli yeniden ak\u0131\u015f kullan\u0131n (O\u2082 &lt;500ppm)<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-2.jpg\" alt=\"PCB yeniden ak\u0131\u015f lehimleme\" class=\"wp-image-3563\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/07\/double-sided-pcb-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Future_Process_Trends\"><\/span>Gelecekteki S\u00fcre\u00e7 Trendleri<span class=\"ez-toc-section-end\"><\/span><\/h2><ol class=\"wp-block-list\"><li><strong>D\u00fc\u015f\u00fck S\u0131cakl\u0131kta Lehimleme<\/strong>: Darbeli \u0131s\u0131tma ile Sn-Bi lehim ala\u015f\u0131mlar\u0131<\/li>\n\n<li><strong>Ak\u0131ll\u0131 S\u0131cakl\u0131k Kontrol\u00fc<\/strong>: Makine \u00f6\u011frenimi tabanl\u0131 ger\u00e7ek zamanl\u0131 profil optimizasyonu<\/li>\n\n<li><strong>Hibrit Birle\u015ftirme<\/strong>: Kombine lehim pastas\u0131 + iletken yap\u0131\u015ft\u0131r\u0131c\u0131 \u00e7\u00f6z\u00fcmleri<\/li><\/ol><p>M\u00fchendisler bu temel teknikleri sistematik olarak uygulayarak ,5'i a\u015fan ilk ge\u00e7i\u015f verimleri elde edebilirler.\u00dcretim ortamlar\u0131nda s\u00fcrekli optimizasyon i\u00e7in proses penceresi izleme sistemlerinin uygulanmas\u0131n\u0131 \u00f6neriyoruz.<\/p>","protected":false},"excerpt":{"rendered":"<p>\u00c7ift tarafl\u0131 PCB yeniden ak\u0131\u015f lehimleme, lehim pastas\u0131 ve k\u0131rm\u0131z\u0131 tutkal i\u015flemlerinin se\u00e7imini, s\u0131cakl\u0131k e\u011frisi kontrol\u00fcn\u00fc ve \u00e7ift tarafl\u0131 lehimleme stratejilerini i\u00e7eren elektronik \u00fcretiminde temel bir s\u00fcre\u00e7tir. Bu makale, \u00e7ift tarafl\u0131 PCB'ler i\u00e7in lehimleme s\u00fcrecini analiz etmekte, yayg\u0131n sorunlara \u00e7\u00f6z\u00fcmler sunmakta ve lehimleme verimini ve \u00fcretim verimlili\u011fini art\u0131rmak i\u00e7in s\u00fcre\u00e7 optimizasyonuna y\u00f6nelik ipu\u00e7lar\u0131 vermektedir.<\/p>","protected":false},"author":1,"featured_media":3564,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[109],"tags":[111,320],"class_list":["post-3560","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-faq","tag-pcb","tag-pcb-reflow-soldering"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>How to perform reflow soldering on double-sided PCB? - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Master the key steps of double-sided PCB reflow soldering, from solder paste and red glue process selection to temperature control techniques, providing a complete soldering solution to solve common problems such as cold soldering and component loss.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/how-to-perform-reflow-soldering-on-double-sided-pcb\/\" \/>\n<meta property=\"og:locale\" content=\"tr_TR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"How to perform reflow soldering on double-sided PCB? 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