{"id":4785,"date":"2025-12-12T22:11:51","date_gmt":"2025-12-12T14:11:51","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=4785"},"modified":"2025-12-12T22:12:03","modified_gmt":"2025-12-12T14:12:03","slug":"ict-test-fixture","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/","title":{"rendered":"ICT Test Fikst\u00fcrleri"},"content":{"rendered":"<p>Modern elektronik \u00fcretiminde, bask\u0131l\u0131 devre kart\u0131 montajlar\u0131n\u0131n (PCBA) kalitesi nihai \u00fcr\u00fcn\u00fcn performans\u0131n\u0131 ve g\u00fcvenilirli\u011fini do\u011frudan belirler. <strong>Bilgi ve \u0130leti\u015fim Teknolojisi (ICT) test fikst\u00fcrleri<\/strong>i\u00e7in kritik bir y\u00fcr\u00fctme arac\u0131 olarak <a href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/what-is-ict\/\">Devre \u0130\u00e7i Test<\/a> (ICT), yaln\u0131zca otomatik denetim ara\u00e7lar\u0131 de\u011fil, ayn\u0131 zamanda y\u00fcksek hassasiyetli, y\u00fcksek verimli montaj do\u011frulamas\u0131 sa\u011flayan temel teknolojik ekipmanlard\u0131r. Hassas elektriksel testler yoluyla bile\u015fenlerin do\u011fru yerle\u015fimini, polaritesini, b\u00fct\u00fcnl\u00fc\u011f\u00fcn\u00fc ve lehim ba\u011flant\u0131 kalitesini sistematik olarak do\u011frularlar ve b\u00f6ylece seri \u00fcretimde hata \u00f6nleme ve kalite kontrol\u00fc sa\u011flarlar.<\/p><p><a href=\"https:\/\/www.topfastpcb.com\/tr\/\">TOPFAST<\/a>profesyonel bir PCB \u00fcreticisi, ICT test fikst\u00fcrlerinin \u00e7al\u0131\u015fma prensipleri, teknik avantajlar\u0131 ve uygulama stratejilerinin derinlemesine bir analizini sa\u011flayacakt\u0131r. Bu kaynak, elektronik \u00fcretim m\u00fchendisleri, kalite kontrol uzmanlar\u0131 ve \u00fcretim y\u00f6neticileri i\u00e7in hem derinlik hem de pratik de\u011fer sunmaktad\u0131r.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/12\/ICT-Test-Fixture-3.jpg\" alt=\"ICT Test Fikst\u00fcr\u00fc\" class=\"wp-image-4786\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/12\/ICT-Test-Fixture-3.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/12\/ICT-Test-Fixture-3-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/12\/ICT-Test-Fixture-3-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">\u0130\u00e7indekiler<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#ICT_Test_Fixtures_Definition_Structure_and_Technical_Significance\" >ICT Test Fikst\u00fcrleri: Tan\u0131m, Yap\u0131 ve Teknik \u00d6nem<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#11_What_is_an_ICT_Test_Fixture\" >1.1 ICT Test Fikst\u00fcr\u00fc nedir?<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#12_Technical_Significance_Early_Defect_Interception_and_Economic_Impact\" >1.2 Teknik \u00d6nem: Erken Kusur Tespiti ve Ekonomik Etki<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#How_ICT_Testing_Achieves_Four_Core_Verification_Functions\" >ICT Testi D\u00f6rt Temel Do\u011frulama \u0130\u015flevini Nas\u0131l Ger\u00e7ekle\u015ftirir?<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#21_Component_Correct_Placement_Verification\" >2.1 Bile\u015fen Do\u011fru Yerle\u015fim Do\u011frulamas\u0131<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#22_Polarity_Checking_Key_to_Mistake-Proofing\" >2.2 Polarite Kontrol\u00fc: Hata Koruman\u0131n Anahtar\u0131<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#23_Missing_Component_Detection_Continuity_Testing_and_Parallel_Detection_Techniques\" >2.3 Eksik Bile\u015fen Tespiti: S\u00fcreklilik Testi ve Paralel Tespit Teknikleri<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#24_Solder_Joint_Quality_Assessment_From_Electrical_Connectivity_to_Reliability_Prediction\" >2.4 Lehim Eklemi Kalite De\u011ferlendirmesi: Elektriksel Ba\u011flant\u0131dan G\u00fcvenilirlik Tahminine<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#Types_of_ICT_Test_Fixtures_and_Selection_Guide\" >ICT Test Fikst\u00fcr\u00fc T\u00fcrleri ve Se\u00e7im K\u0131lavuzu<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#Best_Practices_for_ICT_Testing_Implementation_and_Design_for_Testability_DFT\" >ICT Test Uygulamas\u0131 ve Test Edilebilirlik i\u00e7in Tasar\u0131m (DFT) i\u00e7in En \u0130yi Uygulamalar<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#41_Design_for_Testability_DFT_Principles\" >4.1 Test Edilebilirlik i\u00e7in Tasar\u0131m (DFT) \u0130lkeleri<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#Process_Integration_and_Data_Analysis\" >S\u00fcre\u00e7 Entegrasyonu ve Veri Analizi<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#Technical_Challenges_and_Future_Evolution\" >Teknik Zorluklar ve Gelecekteki Geli\u015fmeler<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#51_Current_Challenges\" >5.1 Mevcut Zorluklar<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#52_Technological_Trends\" >5.2 Teknolojik E\u011filimler<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#Conclusion\" >Sonu\u00e7<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/ict-test-fixture\/#Challenges_and_Countermeasures_for_ICT_Test_Fixtures\" >ICT Test Fikst\u00fcrleri i\u00e7in Zorluklar ve Kar\u015f\u0131 \u00d6nlemler<\/a><\/li><\/ul><\/nav><\/div>\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"ICT_Test_Fixtures_Definition_Structure_and_Technical_Significance\"><\/span>ICT Test Fikst\u00fcrleri: Tan\u0131m, Yap\u0131 ve Teknik \u00d6nem<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"11_What_is_an_ICT_Test_Fixture\"><\/span>1.1 ICT Test Fikst\u00fcr\u00fc nedir?<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Genellikle \"\u00e7ivi yata\u011f\u0131 fikst\u00fcr\u00fc\" olarak adland\u0131r\u0131lan bir ICT test fikst\u00fcr\u00fc, test s\u0131ras\u0131nda bir PCB'yi bir Otomatik Test Ekipman\u0131 (ATE) sistemine g\u00fcvenli bir \u015fekilde fiziksel olarak sabitlemek ve elektriksel olarak ba\u011flamak i\u00e7in kullan\u0131lan y\u00fcksek hassasiyetli bir mekatronik aray\u00fcz cihaz\u0131d\u0131r. \u00c7ekirdek yap\u0131s\u0131 \u015funlar\u0131 i\u00e7erir:<\/p><ul class=\"wp-block-list\"><li><strong>Spring Probe Array:<\/strong> PCB \u00fczerinde \u00f6nceden ayarlanm\u0131\u015f test noktalar\u0131na dayal\u0131 \u00f6zelle\u015ftirilmi\u015f d\u00fczen, \u00e7ok noktal\u0131 senkronize temas sa\u011flar.<\/li>\n\n<li><strong>Fikst\u00fcr Taban Plakas\u0131 ve Hizalama Mekanizmas\u0131:<\/strong> PCB ve problar aras\u0131nda hassas hizalama sa\u011flar.<\/li>\n\n<li><strong>\u00c7al\u0131\u015ft\u0131rma Sistemi:<\/strong> G\u00fcvenilir bir s\u0131k\u0131\u015ft\u0131rma kuvveti sa\u011flayan pn\u00f6matik, vakumlu veya mekanik kilitleme mekanizmalar\u0131 gibi.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"12_Technical_Significance_Early_Defect_Interception_and_Economic_Impact\"><\/span>1.2 Teknik \u00d6nem: Erken Kusur Tespiti ve Ekonomik Etki<span class=\"ez-toc-section-end\"><\/span><\/h3><p>B\u0130T testinin temel de\u011feri, a\u015fa\u011f\u0131daki \u00f6zelliklerinde yatmaktad\u0131r <strong>erken a\u015fama kusur \u00f6nleme kabiliyeti<\/strong>. Ara\u015ft\u0131rmalar, SMT montaj\u0131ndan hemen sonra ICT testi yap\u0131lmas\u0131n\u0131n 98%'ye kadar \u00fcretim hatas\u0131n\u0131 tespit edebilece\u011fini ve sonraki a\u015famalardaki yeniden i\u015fleme maliyetlerini 30-50% oran\u0131nda azaltabilece\u011fini g\u00f6stermektedir. Otomotiv elektroni\u011fi, t\u0131bbi cihazlar ve havac\u0131l\u0131k gibi y\u00fcksek g\u00fcvenilirli\u011fe sahip sekt\u00f6rler i\u00e7in ICT, \"s\u0131f\u0131r hatal\u0131\" \u00fcretim stratejisinin \u00e7ok \u00f6nemli bir bile\u015fenidir.<\/p><blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p><strong>Sekt\u00f6r \u0130\u00e7g\u00f6r\u00fcs\u00fc:<\/strong> PCB montaj yo\u011funlu\u011fu artt\u0131k\u00e7a ve bile\u015fenler minyat\u00fcrle\u015ftik\u00e7e (\u00f6rn. 01005 paketleri), manuel g\u00f6rsel denetim ve AOI elektrik performans\u0131 do\u011frulamas\u0131nda s\u0131n\u0131rlamalara sahiptir. ICT, do\u011frudan elektrik sinyali \u00f6l\u00e7\u00fcm\u00fc yoluyla, yeri doldurulamaz bir do\u011frulama derinli\u011fi sa\u011flar.<\/p><\/blockquote><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"How_ICT_Testing_Achieves_Four_Core_Verification_Functions\"><\/span>ICT Testi D\u00f6rt Temel Do\u011frulama \u0130\u015flevini Nas\u0131l Ger\u00e7ekle\u015ftirir?<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"21_Component_Correct_Placement_Verification\"><\/span>2.1 Bile\u015fen Do\u011fru Yerle\u015fim Do\u011frulamas\u0131<span class=\"ez-toc-section-end\"><\/span><\/h3><p>ICT, bir bile\u015fenin elektriksel parametrelerini (diren\u00e7, kapasitans, end\u00fcktans, vb.) \u00f6l\u00e7erek do\u011fru konumda ve spesifikasyon dahilinde olup olmad\u0131\u011f\u0131n\u0131 belirler. \u00d6rne\u011fin:<\/p><ul class=\"wp-block-list\"><li><strong>Diren\u00e7 Do\u011frulama:<\/strong> Test sistemi, bile\u015fen boyunca bilinen bir ak\u0131m uygular, voltaj d\u00fc\u015f\u00fc\u015f\u00fcn\u00fc \u00f6l\u00e7er ve ger\u00e7ek direnci hesaplar.<\/li>\n\n<li><strong>Kapasitans Do\u011frulamas\u0131:<\/strong> Bir AC sinyali kullanarak kapasitif empedans karakteristi\u011fini \u00f6l\u00e7er.<\/li><\/ul><p>\u00d6l\u00e7\u00fcmler \u00f6nceden ayarlanm\u0131\u015f tolerans aral\u0131klar\u0131n\u0131n d\u0131\u015f\u0131na \u00e7\u0131kt\u0131\u011f\u0131nda, sistem otomatik olarak \"yanl\u0131\u015f yerle\u015ftirme\" veya \"parametre kaymas\u0131\" olarak i\u015faretler, \u00f6zellikle besleyici hatalar\u0131ndan kaynaklanan parti yanl\u0131\u015f yerle\u015ftirme sorunlar\u0131n\u0131 belirlemek i\u00e7in kullan\u0131\u015fl\u0131d\u0131r.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"22_Polarity_Checking_Key_to_Mistake-Proofing\"><\/span>2.2 Polarite Kontrol\u00fc: Hata Koruman\u0131n Anahtar\u0131<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Polariteye duyarl\u0131 bile\u015fenlerin (diyotlar, elektrolitik kapasit\u00f6rler ve IC'ler gibi) yanl\u0131\u015f y\u00f6nlendirilmesi devre k\u0131sa devrelerine, bile\u015fen hasar\u0131na ve hatta yang\u0131n riskine neden olabilir. ICT, karar vermek i\u00e7in y\u00f6nl\u00fc elektrik testi ger\u00e7ekle\u015ftirir:<\/p><ul class=\"wp-block-list\"><li><strong>Diyot Testi:<\/strong> \u0130leri \u00f6ngerilim alt\u0131nda ileri gerilim d\u00fc\u015f\u00fc\u015f\u00fcn\u00fc (~0,6-0,7V) ve ters \u00f6ngerilim alt\u0131nda y\u00fcksek empedans\u0131 do\u011frular.<\/li>\n\n<li><strong>Polarize Kondansat\u00f6r Testi:<\/strong> Kapasitans \u00f6l\u00e7\u00fcm\u00fcn\u00fc ka\u00e7ak ak\u0131m tespiti ile birle\u015ftirerek kurulum y\u00f6n\u00fcne karar verir.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"23_Missing_Component_Detection_Continuity_Testing_and_Parallel_Detection_Techniques\"><\/span>2.3 Eksik Bile\u015fen Tespiti: S\u00fcreklilik Testi ve Paralel Tespit Teknikleri<span class=\"ez-toc-section-end\"><\/span><\/h3><p>ICT, bile\u015fen varl\u0131\u011f\u0131n\u0131 h\u0131zl\u0131 bir \u015fekilde belirlemek i\u00e7in a\u00e7\u0131k\/k\u0131sa testlerini kullan\u0131r. Pasif bile\u015fenler i\u00e7in eksik par\u00e7alar, d\u00fc\u011f\u00fcmler aras\u0131nda anormal derecede y\u00fcksek empedans (a\u00e7\u0131k) \u00f6l\u00e7\u00fclerek tespit edilir. Entegre devreler gibi birden fazla bile\u015fene sahip alanlar i\u00e7in, <strong>S\u0131n\u0131r Taramas\u0131<\/strong> teknolojisi, b\u00fcy\u00fck \u00f6l\u00e7ekli paralel alg\u0131lama sa\u011flayarak test verimlili\u011fini \u00f6nemli \u00f6l\u00e7\u00fcde art\u0131r\u0131r.<\/p><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"24_Solder_Joint_Quality_Assessment_From_Electrical_Connectivity_to_Reliability_Prediction\"><\/span>2.4 Lehim Eklemi Kalite De\u011ferlendirmesi: Elektriksel Ba\u011flant\u0131dan G\u00fcvenilirlik Tahminine<span class=\"ez-toc-section-end\"><\/span><\/h3><p>Lehim ba\u011flant\u0131 kusurlar\u0131 (so\u011fuk lehim ba\u011flant\u0131lar\u0131, yetersiz lehim, k\u00f6pr\u00fcleme, vb.) aral\u0131kl\u0131 ar\u0131zalar\u0131n ba\u015fl\u0131ca nedenidir. ICT, d\u00fc\u015f\u00fck diren\u00e7 \u00f6l\u00e7\u00fcm\u00fc (genellikle 4 telli Kelvin alg\u0131lama y\u00f6ntemi kullan\u0131larak) yoluyla lehim ba\u011flant\u0131lar\u0131n\u0131n elektriksel s\u00fcreklili\u011fini de\u011ferlendirir:<\/p><ul class=\"wp-block-list\"><li><strong>\u0130yi Lehim Eklemi:<\/strong> Tipik olarak 0,1\u03a9'un alt\u0131nda diren\u00e7 g\u00f6sterir.<\/li>\n\n<li><strong>\u015e\u00fcpheli Lehim Eklemi:<\/strong> 0,1-1\u03a9 aras\u0131nda diren\u00e7, potansiyel olarak mikro \u00e7atlaklara veya yetersiz lehime i\u015faret eder.<\/li>\n\n<li><strong>Kusurlu Lehim Eklemi:<\/strong> A\u015f\u0131r\u0131 y\u00fcksek diren\u00e7 veya tam bir a\u00e7\u0131k devre.<\/li><\/ul><p>ICT'nin elektriksel ba\u011flant\u0131 kusurlar\u0131n\u0131 etkili bir \u015fekilde tan\u0131mlarken, lehim ba\u011flant\u0131lar\u0131n\u0131n mekanik mukavemetini veya g\u00f6rsel kusurlar\u0131n\u0131 de\u011ferlendiremedi\u011fini belirtmek \u00f6nemlidir. Bu nedenle, genellikle a\u015fa\u011f\u0131dakilerle birle\u015ftirilir <strong><a href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/what-is-aoi-automated-optical-inspection\/\">Otomatik Optik Muayene<\/a> (AOI)<\/strong> or <strong>Otomatik X-ray Kontrol\u00fc (AXI)<\/strong> tamamlay\u0131c\u0131 bir test stratejisi olu\u015fturmak i\u00e7in.<\/p><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/12\/ICT-Test-Fixture-2.jpg\" alt=\"ICT Test Fikst\u00fcr\u00fc\" class=\"wp-image-4787\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/12\/ICT-Test-Fixture-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/12\/ICT-Test-Fixture-2-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/12\/ICT-Test-Fixture-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Types_of_ICT_Test_Fixtures_and_Selection_Guide\"><\/span>ICT Test Fikst\u00fcr\u00fc T\u00fcrleri ve Se\u00e7im K\u0131lavuzu<span class=\"ez-toc-section-end\"><\/span><\/h2><figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>Fikst\u00fcr Tipi<\/th><th>Uygulanabilir Senaryolar<\/th><th>Avantajlar 2025<\/th><th>S\u0131n\u0131rlamalar<\/th><\/tr><\/thead><tbody><tr><td><strong>Vakum Fikst\u00fcr\u00fc<\/strong><\/td><td>Y\u00fcksek Yo\u011funluklu PCB'ler, Seri \u00dcretim<\/td><td>Y\u00fcksek hizalama hassasiyeti, M\u00fckemmel test tutarl\u0131l\u0131\u011f\u0131<\/td><td>Y\u00fcksek ba\u015flang\u0131\u00e7 maliyeti, vakum sistemi bak\u0131m\u0131 gerektirir<\/td><\/tr><tr><td><strong>Pn\u00f6matik Fikst\u00fcr<\/strong><\/td><td>Orta ila Y\u00fcksek Hacimli, H\u0131zl\u0131 Test D\u00f6ng\u00fcleri<\/td><td>Kararl\u0131 ba\u011flama, H\u0131zl\u0131 \u00e7al\u0131\u015fma h\u0131z\u0131<\/td><td>Hava kayna\u011f\u0131 gerektirir, g\u00fcr\u00fclt\u00fcl\u00fc olabilir<\/td><\/tr><tr><td><strong>Manuel Fikst\u00fcr<\/strong><\/td><td>Prototip Do\u011frulama, D\u00fc\u015f\u00fck Hacimli, Ar-Ge Hata Ay\u0131klama<\/td><td>D\u00fc\u015f\u00fck maliyet, Y\u00fcksek esneklik<\/td><td>D\u00fc\u015f\u00fck test verimlili\u011fi, Operat\u00f6re ba\u011fl\u0131<\/td><\/tr><tr><td><strong>\u00d6zel \u00c7ivi Yata\u011f\u0131 Armat\u00fcr\u00fc<\/strong><\/td><td>Karma\u015f\u0131k Panolar, Y\u00fcksek Pin Say\u0131l\u0131 Cihazlar<\/td><td>Y\u00fcksek test kapsam\u0131, Y\u00fcksek \u00f6l\u00e7eklenebilirlik<\/td><td>Uzun tasar\u0131m teslim s\u00fcresi, Y\u00fcksek \u00f6zelle\u015ftirme maliyeti<\/td><\/tr><\/tbody><\/table><\/figure><p><strong>Se\u00e7im Tavsiyeleri:<\/strong><\/p><ul class=\"wp-block-list\"><li>Otomotiv elektroni\u011fi gibi seri \u00fcretim i\u00e7in <strong>y\u00fcksek yo\u011funluklu problara sahip vakum fikst\u00fcr\u00fc<\/strong> test kararl\u0131l\u0131\u011f\u0131n\u0131 sa\u011flamak i\u00e7in tavsiye edilir.<\/li>\n\n<li>\u00c7ok \u00e7e\u015fitli, d\u00fc\u015f\u00fck hacimli end\u00fcstriyel kontrol panolar\u0131 i\u00e7in <strong>mod\u00fcler pn\u00f6matik fikst\u00fcr<\/strong> yat\u0131r\u0131m ve esnekli\u011fi dengeleyebilir.<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Best_Practices_for_ICT_Testing_Implementation_and_Design_for_Testability_DFT\"><\/span>ICT Test Uygulamas\u0131 ve Test Edilebilirlik i\u00e7in Tasar\u0131m (DFT) i\u00e7in En \u0130yi Uygulamalar<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"41_Design_for_Testability_DFT_Principles\"><\/span>4.1 Test Edilebilirlik i\u00e7in Tasar\u0131m (DFT) \u0130lkeleri<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Test Noktalar\u0131 Sa\u011flay\u0131n:<\/strong> T\u00fcm kritik a\u011f d\u00fc\u011f\u00fcmlerinde \u00e7ap\u0131 \u22650,9 mm olan test pedleri tasarlay\u0131n.<\/li>\n\n<li><strong>Engellemeden Ka\u00e7\u0131n\u0131n:<\/strong> Test noktalar\u0131n\u0131n etraf\u0131nda y\u00fcksek bile\u015fenlerden 5 mm'lik bir bo\u015fluk b\u0131rak\u0131n.<\/li>\n\n<li><strong>G\u00fc\u00e7 ve Topra\u011f\u0131 \u0130zole Edin:<\/strong> Ar\u0131za izolasyon do\u011frulu\u011funu art\u0131rmak i\u00e7in test pinleri arac\u0131l\u0131\u011f\u0131yla g\u00fc\u00e7 a\u011flar\u0131n\u0131n izole testini etkinle\u015ftirin.<\/li>\n\n<li><strong>S\u0131n\u0131r Taramas\u0131n\u0131 Dahil Edin:<\/strong> Kontrol edilebilirli\u011fi ve g\u00f6zlemlenebilirli\u011fi art\u0131rmak i\u00e7in karma\u015f\u0131k IC'ler (\u00f6r. FPGA'lar, i\u015flemciler) i\u00e7in JTAG aray\u00fczlerini entegre edin.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Process_Integration_and_Data_Analysis\"><\/span>S\u00fcre\u00e7 Entegrasyonu ve Veri Analizi<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Test Program\u0131 Olu\u015fturma:<\/strong> Programlama s\u00fcresini azaltmak i\u00e7in CAD verilerinden otomatik olarak test vekt\u00f6rleri olu\u015fturun.<\/li>\n\n<li><strong>Veri \u0130zlenebilirli\u011fi:<\/strong> Kalite izlenebilirli\u011fi i\u00e7in ICT test sonu\u00e7lar\u0131n\u0131 \u00fcretim lotlar\u0131 ve bile\u015fen partileri ile ili\u015fkilendirin.<\/li>\n\n<li><strong>Trend Analizi:<\/strong> S\u00fcre\u00e7 sapmalar\u0131n\u0131 (\u00f6rne\u011fin, lehim pastas\u0131 bask\u0131 sorunlar\u0131, yeniden ak\u0131\u015f profili anormallikleri) belirlemek i\u00e7in \u0130statistiksel S\u00fcre\u00e7 Kontrol\u00fc (SPC) kullan\u0131n.<\/li><\/ul><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Technical_Challenges_and_Future_Evolution\"><\/span>Teknik Zorluklar ve Gelecekteki Geli\u015fmeler<span class=\"ez-toc-section-end\"><\/span><\/h2><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"51_Current_Challenges\"><\/span>5.1 Mevcut Zorluklar<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Minyat\u00fcrle\u015ftirme S\u0131n\u0131rlar\u0131:<\/strong> Paket boyutlar\u0131 0201'in alt\u0131na d\u00fc\u015ft\u00fck\u00e7e fiziksel prob temas\u0131n\u0131n artan zorlu\u011fu.<\/li>\n\n<li><strong>Y\u00fcksek Frekansl\u0131 Test S\u0131n\u0131rlamalar\u0131:<\/strong> RF devrelerinin (&gt;1GHz) elektriksel testi, \u00f6zel empedans e\u015fle\u015ftirme tasar\u0131mlar\u0131 gerektirir.<\/li>\n\n<li><strong>Esnek Kart Testi:<\/strong> Esnek Bask\u0131l\u0131 Devreler (FPC) i\u00e7in daha y\u00fcksek hizalama ve temas kararl\u0131l\u0131\u011f\u0131 talepleri.<\/li><\/ul><h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"52_Technological_Trends\"><\/span>5.2 Teknolojik E\u011filimler<span class=\"ez-toc-section-end\"><\/span><\/h3><ul class=\"wp-block-list\"><li><strong>Temass\u0131z Test Teknolojileri:<\/strong> Y\u00fcksek kar\u0131\u015f\u0131ml\u0131 \u00fcretime uyum sa\u011flamak i\u00e7in Flying Probe testi gibi teknolojileri ICT ile birle\u015ftirmek.<\/li>\n\n<li><strong>Ak\u0131ll\u0131 Armat\u00fcrler:<\/strong> Prob bas\u0131nc\u0131n\u0131n ve temas direncinin ger\u00e7ek zamanl\u0131 izlenmesi i\u00e7in sens\u00f6rlerin entegre edilmesi, kestirimci bak\u0131m sa\u011flar.<\/li>\n\n<li><strong>Veri-F\u00fczyon Testi:<\/strong> Kapsaml\u0131 bir kalite profili i\u00e7in ICT verilerini AOI, AXI ve fonksiyonel test sonu\u00e7lar\u0131yla birle\u015ftirmek i\u00e7in yapay zekay\u0131 kullanma.<\/li><\/ul><div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"402\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/12\/ICT-Test-Fixture-1.jpg\" alt=\"ICT Test Fikst\u00fcr\u00fc\" class=\"wp-image-4788\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/12\/ICT-Test-Fixture-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/12\/ICT-Test-Fixture-1-300x201.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2025\/12\/ICT-Test-Fixture-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure><\/div><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Sonu\u00e7<span class=\"ez-toc-section-end\"><\/span><\/h2><p>ICT test fikst\u00fcrleri yaln\u0131zca denetim ara\u00e7lar\u0131 de\u011fil, tasar\u0131m, \u00fcretim ve kalite y\u00f6netimini kapsayan bir sistem m\u00fchendisli\u011fi yakla\u015f\u0131m\u0131n\u0131n ta\u015f\u0131y\u0131c\u0131lar\u0131d\u0131r. Hassas elektriksel do\u011frulama sayesinde s\u0131f\u0131r yerle\u015ftirme hatas\u0131, s\u0131f\u0131r ters polarite ve s\u0131f\u0131r lehim hatas\u0131 sa\u011flayarak PCBA g\u00fcvenilirli\u011fini temelden art\u0131r\u0131rlar. Ak\u0131ll\u0131 fabrikalar\u0131n ve End\u00fcstri 4.0'\u0131n ilerlemesinin ortas\u0131nda ICT, IoT ve b\u00fcy\u00fck veri analiti\u011fi ile derinlemesine entegre olmakta ve \"hata tespitinden\" \"s\u00fcre\u00e7 optimizasyonu ve tahminine\" do\u011fru evrilmektedir.<\/p><p>\u00dcretimde m\u00fckemmellik pe\u015finde ko\u015fan i\u015fletmeler i\u00e7in geli\u015fmi\u015f ICT test \u00e7\u00f6z\u00fcmlerine yat\u0131r\u0131m yapmak sadece bir kalite g\u00fcvence \u00f6nlemi de\u011fil, ayn\u0131 zamanda pazar rekabet\u00e7ili\u011fini art\u0131rmak ve toplam ya\u015fam d\u00f6ng\u00fcs\u00fc maliyetlerini azaltmak i\u00e7in temel bir stratejidir.<\/p><h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Challenges_and_Countermeasures_for_ICT_Test_Fixtures\"><\/span>ICT Test Fikst\u00fcrleri i\u00e7in Zorluklar ve Kar\u015f\u0131 \u00d6nlemler<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1765547969622\"><strong class=\"schema-faq-question\">Q: <strong>1. Yat\u0131r\u0131m Maliyeti Y\u00fcksek mi?<\/strong><\/strong> <p class=\"schema-faq-answer\"><strong>\u00c7ekirdek \u00c7at\u0131\u015fma:<\/strong>\u00a0Y\u00fcksek ilk yat\u0131r\u0131ma kar\u015f\u0131l\u0131k uzun vadeli getiri.<br\/><strong>\u00c7\u00f6z\u00fcm:<\/strong>\u00a0Y\u00fcr\u00fctmek\u00a0<strong>Toplam Sahip Olma Maliyeti (TCO) analizi<\/strong>erken hata tespiti yoluyla ge\u00e7 a\u015fama yeniden i\u015fleme, hurda ve itibar hasar\u0131n\u0131n \u00f6nlenen maliyetlerini \u00f6l\u00e7mek. ROI'yi verilerle g\u00f6stermek i\u00e7in k\u00fc\u00e7\u00fck bir kritik \u00fcr\u00fcn grubunda pilot uygulamayla ba\u015flay\u0131n.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1765547995824\"><strong class=\"schema-faq-question\">Q: <strong>2. Test Noktas\u0131na Eri\u015fim Zor mu?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: <strong>\u00c7ekirdek \u00c7at\u0131\u015fma:<\/strong>\u00a0Fiziksel prob temas\u0131 ihtiyac\u0131na kar\u015f\u0131 y\u00fcksek yo\u011funluklu, minyat\u00fcr PCB tasar\u0131mlar\u0131.<br\/><strong>\u00c7\u00f6z\u00fcm:<\/strong>\u00a0Entegre edin\u00a0<strong>Test Edilebilirlik i\u00e7in Tasar\u0131m (DFT)<\/strong>\u00a0PCB yerle\u015fim a\u015famas\u0131n\u0131n ba\u015flar\u0131nda, test noktas\u0131 yerle\u015fimini zorunlu k\u0131lar. Kullanmak\u00a0<strong>mikro problar, S\u0131n\u0131r Tarama (JTAG)<\/strong>veya a\u015fa\u011f\u0131dakilerle tamamlay\u0131n\u00a0<strong>U\u00e7an Prob Testi<\/strong>.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1765548014142\"><strong class=\"schema-faq-question\">Q: <strong>3. Yava\u015f Test Program\u0131 Geli\u015ftirme?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: <strong>\u00c7ekirdek \u00c7at\u0131\u015fma:<\/strong>\u00a0Tasar\u0131m de\u011fi\u015fikliklerine h\u0131zl\u0131 adaptasyon ihtiyac\u0131na kar\u015f\u0131 karma\u015f\u0131k, zaman al\u0131c\u0131 programlama.<br\/><strong>\u00c7\u00f6z\u00fcm:<\/strong>\u00a0A\u015fa\u011f\u0131dakiler i\u00e7in yaz\u0131l\u0131mdan yararlan\u0131n\u00a0<strong>otomatik olu\u015ftur<\/strong>\u00a0tasar\u0131m dosyalar\u0131ndan program \u00e7er\u00e7evelerini test etmek, standart bile\u015fen testlerinden olu\u015fan bir k\u00fct\u00fcphane olu\u015fturmak ve programlar i\u00e7in s\u0131k\u0131 s\u00fcr\u00fcm kontrol\u00fc uygulamak.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1765548026480\"><strong class=\"schema-faq-question\">Q: <strong>4. Demirba\u015flar\u0131n Bak\u0131m\u0131 Nas\u0131l Yap\u0131l\u0131r?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: <strong>\u00c7ekirdek \u00c7at\u0131\u015fma:<\/strong>\u00a0Problar, istikrarl\u0131 ve g\u00fcvenilir test sonu\u00e7lar\u0131 gereksinimine kar\u015f\u0131 sarf malzemeleridir.<br\/><strong>\u00c7\u00f6z\u00fcm:<\/strong>\u00a0Bir uygulama\u00a0<strong>\u00d6nleyici Bak\u0131m Program\u0131<\/strong>: g\u00fcnl\u00fck temizlik, d\u00fczenli servis, periyodik kalibrasyon ve kritik yedek par\u00e7a stokunun tutulmas\u0131.<\/p> <\/div> <div class=\"schema-faq-section\" id=\"faq-question-1765548041609\"><strong class=\"schema-faq-question\">Q: <strong>Alg\u0131lama K\u00f6r Noktalar\u0131?<\/strong><\/strong> <p class=\"schema-faq-answer\">A: <strong>\u00c7ekirdek \u00c7at\u0131\u015fma:<\/strong>\u00a0ICT, i\u015flevsel, g\u00f6rsel ve gizli kusurlar\u0131 tespit edememesine kar\u015f\u0131n elektriksel testlerde \u00fcst\u00fcnd\u00fcr.<br\/><strong>\u00c7\u00f6z\u00fcm:<\/strong>\u00a0Bir bina in\u015fa et\u00a0<strong>Kombinatoryal Test Stratejisi<\/strong>B\u0130T ile entegre edilmesi\u00a0<strong>SPI, AOI, AXI ve FCT<\/strong>\u00a0kapsaml\u0131 bir kapsam i\u00e7in tamamlay\u0131c\u0131 bir \"Test Piramidi\" olu\u015fturmak.<\/p> <\/div> <\/div>","protected":false},"excerpt":{"rendered":"<p>Bu k\u0131lavuz, elektronik \u00fcretimi i\u00e7in ICT test fikst\u00fcrleri hakk\u0131nda her \u015feyi kapsar. Bile\u015fen yerle\u015fimini, polariteyi ve lehim kalitesini do\u011frulamak i\u00e7in nas\u0131l \u00e7al\u0131\u015ft\u0131klar\u0131n\u0131 \u00f6\u011frenin. Y\u00fcksek maliyetler, test noktas\u0131 eri\u015fimi, programlama karma\u015f\u0131kl\u0131\u011f\u0131, bak\u0131m ihtiya\u00e7lar\u0131 ve alg\u0131lama limitleri gibi 5 pratik zorlu\u011fu uygulanabilir \u00e7\u00f6z\u00fcmlerle ele al\u0131yoruz. Eksiksiz bir kalite sistemi olu\u015fturmak i\u00e7in fikst\u00fcr se\u00e7im y\u00f6nergeleri, tasar\u0131m ipu\u00e7lar\u0131 ve stratejileri i\u00e7erir. Gelecekteki trendleri ve ICT'nin g\u00fcvenilir \u00fcretim i\u00e7in neden gerekli oldu\u011funu ke\u015ffedin.<\/p>","protected":false},"author":1,"featured_media":4789,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[108],"tags":[416],"class_list":["post-4785","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-ict-test-fixture"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>ICT Test Fixtures - Topfastpcb<\/title>\n<meta name=\"description\" content=\"Master ICT test fixtures for PCB assembly: Solve 5 key challenges (cost, accessibility, programming, maintenance, coverage) to ensure zero-defect manufacturing. 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Difficult Test Point Access?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: <strong>Core Conflict:<\/strong>\u00a0High-density, miniaturized PCB designs vs. the need for physical probe contact.<br\/><strong>Solution:<\/strong>\u00a0Integrate\u00a0<strong>Design for Testability (DFT)<\/strong>\u00a0early in the PCB layout phase, mandating test point placement. Utilize\u00a0<strong>micro-probes, Boundary Scan (JTAG)<\/strong>, or supplement with\u00a0<strong>Flying Probe Testing<\/strong>.","inLanguage":"tr"},"inLanguage":"tr"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/ict-test-fixture\/#faq-question-1765548014142","position":3,"url":"https:\/\/www.topfastpcb.com\/blog\/ict-test-fixture\/#faq-question-1765548014142","name":"Q: 3. Slow Test Program Development?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: <strong>Core Conflict:<\/strong>\u00a0Complex, time-consuming programming vs. the need for rapid adaptation to design changes.<br\/><strong>Solution:<\/strong>\u00a0Leverage software to\u00a0<strong>auto-generate<\/strong>\u00a0test program frameworks from design files, establish a library of standard component tests, and implement strict version control for programs.","inLanguage":"tr"},"inLanguage":"tr"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/ict-test-fixture\/#faq-question-1765548026480","position":4,"url":"https:\/\/www.topfastpcb.com\/blog\/ict-test-fixture\/#faq-question-1765548026480","name":"Q: 4. How to Maintain Fixtures?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: <strong>Core Conflict:<\/strong>\u00a0Probes are consumables vs. the requirement for stable, reliable test results.<br\/><strong>Solution:<\/strong>\u00a0Implement a\u00a0<strong>Preventive Maintenance Schedule<\/strong>: daily cleaning, regular servicing, periodic calibration, and maintaining a stock of critical spare parts.","inLanguage":"tr"},"inLanguage":"tr"},{"@type":"Question","@id":"https:\/\/www.topfastpcb.com\/blog\/ict-test-fixture\/#faq-question-1765548041609","position":5,"url":"https:\/\/www.topfastpcb.com\/blog\/ict-test-fixture\/#faq-question-1765548041609","name":"Q: Detection Blind Spots?","answerCount":1,"acceptedAnswer":{"@type":"Answer","text":"A: <strong>Core Conflict:<\/strong>\u00a0ICT excels at electrical testing vs. its inability to detect functional, visual, and hidden defects.<br\/><strong>Solution:<\/strong>\u00a0Build a\u00a0<strong>Combinatorial Test Strategy<\/strong>, integrating ICT with\u00a0<strong>SPI, AOI, AXI, and FCT<\/strong>\u00a0to form a complementary \"Test Pyramid\" for comprehensive coverage.","inLanguage":"tr"},"inLanguage":"tr"}]}},"_links":{"self":[{"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/posts\/4785","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/comments?post=4785"}],"version-history":[{"count":1,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/posts\/4785\/revisions"}],"predecessor-version":[{"id":4790,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/posts\/4785\/revisions\/4790"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/media\/4789"}],"wp:attachment":[{"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/media?parent=4785"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/categories?post=4785"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.topfastpcb.com\/tr\/wp-json\/wp\/v2\/tags?post=4785"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}