{"id":6187,"date":"2026-08-10T08:00:00","date_gmt":"2026-08-10T00:00:00","guid":{"rendered":"https:\/\/www.topfastpcb.com\/?p=6187"},"modified":"2026-08-04T22:10:13","modified_gmt":"2026-08-04T14:10:13","slug":"vippo-design-guidelines-bga","status":"publish","type":"post","link":"https:\/\/www.topfastpcb.com\/tr\/blog\/vippo-design-guidelines-bga\/","title":{"rendered":"Via-in-Pad Plated Over (VIPPO): \u0130nce Aral\u0131kl\u0131 BGA \u00c7\u0131k\u0131\u015f Tasar\u0131m\u0131 \u0130\u00e7in K\u0131lavuz \u0130lkeler"},"content":{"rendered":"<div style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" alt=\"Via-in-Pad Kaplamal\u0131\" class=\"aligncenter size-full wp-image-6309\" height=\"400\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/08\/Via-in-Pad-Plated-Over.jpg\" width=\"600\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/08\/Via-in-Pad-Plated-Over.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/08\/Via-in-Pad-Plated-Over-300x200.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/08\/Via-in-Pad-Plated-Over-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/div>\n<p>Elektronik cihazlar k\u00fc\u00e7\u00fclmeye devam ederken hesaplama kapasiteleri artmaya devam etti\u011finden, Bask\u0131l\u0131 Devre Kart\u0131 (PCB) tasar\u0131mc\u0131lar\u0131, giderek daha k\u0131s\u0131tl\u0131 alanlar i\u00e7inde son derece karma\u015f\u0131k devrelerin y\u00f6nlendirilmesi konusunda s\u00fcrekli zorluklarla kar\u015f\u0131 kar\u015f\u0131ya kalmaktad\u0131r. Modern Y\u00fcksek Yo\u011funluklu Ba\u011flant\u0131 (HDI) PCB tasar\u0131m\u0131ndaki en \u00f6nemli darbo\u011fazlardan biri, ince aral\u0131kl\u0131 Top Izgara Dizileri'nin (BGA'lar) ayr\u0131lmas\u0131 ve y\u00f6nlendirilmesidir. BGA pin aral\u0131klar\u0131 0,5 mm'nin alt\u0131na d\u00fc\u015ft\u00fc\u011f\u00fcnde, standart dog-bone fanout gibi geleneksel y\u00f6nlendirme teknikleri, fiziksel alan yetersizli\u011fi nedeniyle uygulanamaz hale gelir.<\/p>\n<p>Bu alan k\u0131s\u0131tlamas\u0131n\u0131 gidermek ve sinyal b\u00fct\u00fcnl\u00fc\u011f\u00fcn\u00fc korumak i\u00e7in PCB m\u00fchendisleri, geli\u015fmi\u015f via teknolojilerine ba\u015fvururlar. Bu \u00e7\u00f6z\u00fcmlerin ba\u015f\u0131nda Via-in-Pad Plated Over (VIPPO) gelmektedir. VIPPO, via'y\u0131 do\u011frudan y\u00fczey montaj pedinin i\u00e7ine yerle\u015ftirip \u00fczerine kaplama uygulayarak d\u00fcz ve lehimlenebilir bir y\u00fczey olu\u015fturur ve b\u00f6ylece do\u011frudan dikey y\u00f6nlendirme imkan\u0131 sa\u011flar. Bu kapsaml\u0131 k\u0131lavuz, VIPPO'nun yap\u0131sal mekani\u011fini inceler, geleneksel y\u00f6ntemlerle kar\u015f\u0131la\u015ft\u0131r\u0131r ve ince aral\u0131kl\u0131 BGA \u00e7\u0131k\u0131\u015flar\u0131nda VIPPO'nun ba\u015far\u0131l\u0131 bir \u015fekilde uygulanmas\u0131 i\u00e7in ayr\u0131nt\u0131l\u0131 tasar\u0131m k\u0131lavuzlar\u0131 sunar.<\/p>\n<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_74 counter-hierarchy ez-toc-counter ez-toc-custom ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">\u0130\u00e7indekiler<\/p>\n<span class=\"ez-toc-title-toggle\"><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/vippo-design-guidelines-bga\/#The_Challenge_of_Fine-Pitch_BGA_Breakout\" >Dar Aral\u0131kl\u0131 BGA \u00c7\u0131k\u0131\u015f\u0131n\u0131n Getirdi\u011fi Zorluklar<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/vippo-design-guidelines-bga\/#Understanding_Via-in-Pad_Plated_Over_VIPPO\" >Via-in-Pad Plated Over (VIPPO) Kavram\u0131<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/vippo-design-guidelines-bga\/#VIPPO_vs_Traditional_Dog-Bone_Fanout\" >VIPPO ile Geleneksel Dog-Bone Fanout Kar\u015f\u0131la\u015ft\u0131rmas\u0131<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/vippo-design-guidelines-bga\/#Design_Guidelines_for_VIPPO_Implementation\" >VIPPO Uygulamas\u0131 i\u00e7in Tasar\u0131m K\u0131lavuzlar\u0131<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/vippo-design-guidelines-bga\/#Aspect_Ratio_and_Drill_Sizes\" >En-Boy Oran\u0131 ve Matkap U\u00e7lar\u0131 Boyutlar\u0131<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/vippo-design-guidelines-bga\/#Pad_Size_and_Annular_Ring_Requirements\" >Ped Boyutu ve Halka \u015eeklindeki Y\u00fcz\u00fck Gereksinimleri<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/vippo-design-guidelines-bga\/#Epoxy_Fill_Material_Conductive_vs_Non-Conductive\" >Epoksi Dolgu Malzemesi: \u0130letken ve \u0130letken Olmayan<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/vippo-design-guidelines-bga\/#How_to_Implement_VIPPO_Step-by-Step_Guide\" >VIPPO Nas\u0131l Uygulan\u0131r (Ad\u0131m Ad\u0131m K\u0131lavuz)<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/vippo-design-guidelines-bga\/#Reliability_and_Manufacturing_Considerations\" >G\u00fcvenilirlik ve \u00dcretimle \u0130lgili Hususlar<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/vippo-design-guidelines-bga\/#Conclusion\" >Sonu\u00e7<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/www.topfastpcb.com\/tr\/blog\/vippo-design-guidelines-bga\/#Frequently_Asked_Questions_FAQ\" >S\u0131k\u00e7a Sorulan Sorular (SSS)<\/a><\/li><\/ul><\/nav><\/div>\n<h2><span class=\"ez-toc-section\" id=\"The_Challenge_of_Fine-Pitch_BGA_Breakout\"><\/span>Dar Aral\u0131kl\u0131 BGA \u00c7\u0131k\u0131\u015f\u0131n\u0131n Getirdi\u011fi Zorluklar<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Modern mikroi\u015flemciler, FPGA\u2019lar ve y\u00fcksek h\u0131zl\u0131 ASIC\u2019ler, minimum alanda pin say\u0131s\u0131n\u0131 en \u00fcst d\u00fczeye \u00e7\u0131karmak i\u00e7in genellikle BGA paketleri kullan\u0131r. 1,0 mm ve 0,8 mm aral\u0131kl\u0131 BGA'lar, geleneksel delik i\u00e7i viyalar kullan\u0131larak pedler aras\u0131nda iz y\u00f6nlendirme i\u00e7in yeterli alan sunarken, genellikle 0,5 mm, 0,4 mm veya daha k\u00fc\u00e7\u00fck aral\u0131klara sahip olarak s\u0131n\u0131fland\u0131r\u0131lan ince aral\u0131kl\u0131 BGA'lar, y\u00f6nlendirme a\u00e7\u0131s\u0131ndan b\u00fcy\u00fck bir zorluk te\u015fkil eder. <strong>Hakk\u0131nda daha fazla bilgi edinin <a href=\"\/tr\/blog\/hard-gold-plating-pcb\/\">Sert Alt\u0131n Kaplama: A\u015f\u0131r\u0131 A\u015f\u0131nma Direnci i\u00e7in Kenar Konekt\u00f6rleri ve Anahtar Kontaklar\u0131 Tasar\u0131m\u0131<\/a>.<\/strong><\/p>\n<div style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" alt=\"Via-in-Pad Kaplamal\u0131\" class=\"aligncenter size-full wp-image-6310\" height=\"400\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/08\/Via-in-Pad-Plated-Over-1.jpg\" width=\"600\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/08\/Via-in-Pad-Plated-Over-1.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/08\/Via-in-Pad-Plated-Over-1-300x200.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/08\/Via-in-Pad-Plated-Over-1-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/div>\n<p>As\u0131l sorun geometrik k\u0131s\u0131tlamalarda yatmaktad\u0131r. Geleneksel bir \u201cdog-bone\u201d fanout d\u00fczeninde, BGA pedini biti\u015fi\u011findeki bir via\u2019ya k\u0131sa bir iz ba\u011flar. Ancak, aral\u0131k azald\u0131k\u00e7a BGA pedleri aras\u0131ndaki bo\u015fluk da daral\u0131r. Sonunda, \u00fcreticinin Tasar\u0131m Kural Kontrollerinde (DRC) belirtilen minimum iz-iz veya iz-ped a\u00e7\u0131kl\u0131k gereksinimlerini ihlal etmeden pedler aras\u0131na bir via yerle\u015ftirmek veya aralar\u0131nda bir iz y\u00f6nlendirmek i\u00e7in yeterli alan kalmaz.<\/p>\n<p>Ayr\u0131ca, y\u00fcksek h\u0131zl\u0131 dijital tasar\u0131mlar, sinyal b\u00fct\u00fcnl\u00fc\u011f\u00fc \u00fczerinde s\u0131k\u0131 bir kontrol gerektirir. Dog-bone fanout yap\u0131s\u0131ndaki k\u0131sa iz, parazitik end\u00fcktans ve kapasitans ortaya \u00e7\u0131kar\u0131r; bu da y\u00fcksek frekansl\u0131 sinyalleri bozabilir ve empedans kesintilerine neden olabilir. Bu nedenle, geli\u015fmi\u015f uygulamalar i\u00e7in bu k\u0131sa devreyi ortadan kald\u0131ran, y\u00f6nlendirme alan\u0131n\u0131 en aza indiren ve y\u00fcksek yo\u011funluklu ba\u011flant\u0131 mimarilerini destekleyen bir \u00e7\u00f6z\u00fcm kesinlikle gereklidir. <strong>Hakk\u0131nda daha fazla bilgi edinin <a href=\"\/tr\/blog\/conformal-coating-pcba\/\">Konformal Kaplama: PCBA\u2019y\u0131 Nem, Toz ve A\u015f\u0131nd\u0131r\u0131c\u0131 Ortamlardan Koruma<\/a>.<\/strong><\/p>\n<h2><span class=\"ez-toc-section\" id=\"Understanding_Via-in-Pad_Plated_Over_VIPPO\"><\/span>Via-in-Pad Plated Over (VIPPO) Kavram\u0131<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Via-in-Pad Plated Over (VIPPO), bazen Plated Over Filled Via (POFV) olarak da an\u0131lan, bir via\u2019n\u0131n y\u00fczey montajl\u0131 bir bile\u015fen (genellikle bir BGA) i\u00e7in tasarlanan bak\u0131r pedin i\u00e7ine do\u011frudan delinmesini i\u00e7eren \u00f6zel bir via \u00fcretim s\u00fcrecidir.<\/p>\n<p>Standart \u201cvia-in-pad\u201d i\u015fleminde, pad i\u00e7indeki via deli\u011fi a\u00e7\u0131k b\u0131rak\u0131l\u0131r. Bu, yer tasarrufu sa\u011flasa da, montaj a\u015famas\u0131nda kritik bir \u00fcretim kusuruna yol a\u00e7ar: lehim emilimi. Reflow lehimleme s\u0131ras\u0131nda, a\u00e7\u0131k via deli\u011finin k\u0131lcal etkisi, s\u0131v\u0131 lehimi bile\u015fen padinden uzakla\u015ft\u0131rarak via deli\u011finin i\u00e7ine \u00e7eker. Bu durum, lehim eksikli\u011fi olan ba\u011flant\u0131 noktalar\u0131na, zay\u0131f mekanik yap\u0131\u015fmaya ve elektriksel kopukluk veya g\u00fcvenilmez ba\u011flant\u0131lar\u0131n ortaya \u00e7\u0131kma olas\u0131l\u0131\u011f\u0131n\u0131n artmas\u0131na neden olur.<\/p>\n<div style=\"text-align: center;\"><img loading=\"lazy\" decoding=\"async\" alt=\"Via-in-Pad Kaplamal\u0131\" class=\"aligncenter size-full wp-image-6311\" height=\"400\" src=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/08\/Via-in-Pad-Plated-Over-2.jpg\" width=\"600\" srcset=\"https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/08\/Via-in-Pad-Plated-Over-2.jpg 600w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/08\/Via-in-Pad-Plated-Over-2-300x200.jpg 300w, https:\/\/www.topfastpcb.com\/wp-content\/uploads\/2026\/08\/Via-in-Pad-Plated-Over-2-18x12.jpg 18w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/div>\n<p>VIPPO, \u00e7ok a\u015famal\u0131 bir \u00fcretim s\u00fcreci sayesinde bu sorunu tamamen ortadan kald\u0131rmaktad\u0131r:<br\/>1. <strong>Delme ve Kaplama:<\/strong> Via, katmanlar aras\u0131nda elektriksel ba\u011flant\u0131 sa\u011flamak amac\u0131yla mekanik veya lazerle delinir ve kaplan\u0131r.<br\/>2. <strong>Epoksi Dolgu:<\/strong> Via kanal\u0131, \u00f6zel bir epoksi re\u00e7ine ile tamamen doldurulur. Bu re\u00e7ine, tasar\u0131m\u0131n termal ve elektriksel gereksinimlerine ba\u011fl\u0131 olarak iletken veya iletken olmayan olabilir.<br\/>3. <strong>D\u00fczle\u015ftirme:<\/strong> Via doldurulup sertle\u015ftirildikten sonra, y\u00fczey d\u00fczle\u015ftirilir (z\u0131mparalanarak d\u00fcz hale getirilir) ve fazla re\u00e7ine giderilir.<br\/>4. <strong>Kaplama \u0130\u015flemi:<\/strong> Son olarak, doldurulmu\u015f via'n\u0131n \u00fczerine do\u011frudan bir bak\u0131r tabakas\u0131 kaplan\u0131r; b\u00f6ylece tamamen d\u00fcz, kesintisiz ve lehimlenebilirli\u011fi y\u00fcksek bir ped y\u00fczeyi elde edilir.<\/p>\n<p>Sonu\u00e7ta ortaya \u00e7\u0131kan ped, montaj s\u00fcrecinde standart bir y\u00fczey montaj pediyle tamamen ayn\u0131 g\u00f6r\u00fcn\u00fcme ve davran\u0131\u015fa sahip olmakla birlikte, PCB\u2019nin i\u00e7 katmanlar\u0131na do\u011frudan ve dikey bir ba\u011flant\u0131 i\u00e7ermektedir.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"VIPPO_vs_Traditional_Dog-Bone_Fanout\"><\/span>VIPPO ile Geleneksel Dog-Bone Fanout Kar\u015f\u0131la\u015ft\u0131rmas\u0131<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Geleneksel \u201cdog-bone\u201d fanout, maliyet a\u00e7\u0131s\u0131ndan verimli ve daha geni\u015f aral\u0131kl\u0131 bile\u015fenler i\u00e7in uygun olsa da, HDI tasar\u0131mlar\u0131nda kullan\u0131\u015fl\u0131l\u0131\u011f\u0131 h\u0131zla azalmaktad\u0131r. \u201cDog-bone\u201d yap\u0131s\u0131, de\u011ferli y\u00fczey alan\u0131n\u0131 kaplayarak, kart\u0131n kar\u015f\u0131 taraf\u0131nda, BGA\u2019n\u0131n hemen alt\u0131na yerle\u015ftirilebilecek baypas kondansat\u00f6rlerinin veya di\u011fer pasif bile\u015fenlerin say\u0131s\u0131n\u0131 s\u0131n\u0131rlamaktad\u0131r.<\/p>\n<p>Buna kar\u015f\u0131l\u0131k, VIPPO, pedi ve via\u2019y\u0131 tek bir fiziksel varl\u0131kta birle\u015ftirir. Bu, y\u00fczey katman\u0131nda ayr\u0131lma izlerine olan ihtiyac\u0131 ortadan kald\u0131rarak, y\u00f6nlendirme kanallar\u0131n\u0131 serbest b\u0131rak\u0131r ve BGA fanout\u2019unu b\u00fcy\u00fck \u00f6l\u00e7\u00fcde basitle\u015ftirir. Ayr\u0131ca, VIPPO, bile\u015fen pini ile i\u00e7 y\u00f6nlendirme katman\u0131 aras\u0131nda do\u011frudan dikey bir yol sa\u011flad\u0131\u011f\u0131ndan, parazitik end\u00fcktans\u0131 \u00f6nemli \u00f6l\u00e7\u00fcde azalt\u0131r. Bu do\u011frudan yol, y\u00fcksek h\u0131zl\u0131 sinyal b\u00fct\u00fcnl\u00fc\u011f\u00fc ve g\u00fc\u00e7 da\u011f\u0131t\u0131m a\u011flar\u0131ndaki (PDN'ler) empedans\u0131 en aza indirmek a\u00e7\u0131s\u0131ndan son derece avantajl\u0131d\u0131r; bu sayede, maksimum verimlilik i\u00e7in dekuplaj kapasit\u00f6rlerinin do\u011frudan BGA via's\u0131n\u0131n alt\u0131na yerle\u015ftirilmesine olanak tan\u0131r.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Design_Guidelines_for_VIPPO_Implementation\"><\/span>VIPPO Uygulamas\u0131 i\u00e7in Tasar\u0131m K\u0131lavuzlar\u0131<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>VIPPO\u2019nun bir PCB tasar\u0131m\u0131na ba\u015far\u0131l\u0131 bir \u015fekilde entegre edilmesi, belirli tasar\u0131m parametrelerine titizlikle uyulmas\u0131n\u0131 ve \u00fcretim firmas\u0131yla yak\u0131n bir i\u015fbirli\u011fini gerektirir. A\u015fa\u011f\u0131daki k\u0131lavuzlar, VIPPO uygulamas\u0131n\u0131n kritik teknik \u00f6zelliklerini \u00f6zetlemektedir.<\/p>\n<h3><span class=\"ez-toc-section\" id=\"Aspect_Ratio_and_Drill_Sizes\"><\/span>En-Boy Oran\u0131 ve Matkap U\u00e7lar\u0131 Boyutlar\u0131<span class=\"ez-toc-section-end\"><\/span><\/h3>\n<p>En-boy oran\u0131 \u2014 PCB kal\u0131nl\u0131\u011f\u0131n\u0131n delinmi\u015f delik \u00e7ap\u0131na oran\u0131 \u2014 g\u00fcvenilir via kaplama ve doldurma i\u015flemlerinde hayati bir fakt\u00f6rd\u00fcr. Standart mekanik delme i\u015flemlerinde genellikle maksimum 10:1 en-boy oran\u0131 \u00f6nerilir; ancak via kanal\u0131nda tutarl\u0131 bak\u0131r kaplama sa\u011flamak i\u00e7in 8:1 oran\u0131 daha g\u00fcvenlidir. HDI katmanlamalar\u0131nda VIPPO i\u00e7in lazerle delinmi\u015f mikro-vialar kullan\u0131ld\u0131\u011f\u0131nda, en-boy oran\u0131 genellikle 1:1 veya 0,8:1 ile s\u0131n\u0131rland\u0131r\u0131l\u0131r.<\/p>\n<p>Standart bir 1,6 mm (63 mil) kal\u0131nl\u0131\u011f\u0131ndaki kart i\u00e7in, g\u00fcvenilir bir en-boy oran\u0131n\u0131 korumak ve uygun epoksi dolgusuna olanak sa\u011flamak amac\u0131yla, minimum mekanik delik \u00e7ap\u0131 genellikle 0,15 mm (6 mil) veya 0,2 mm (8 mil) alt\u0131na d\u00fc\u015fmemelidir.<\/p>\n<h3><span class=\"ez-toc-section\" id=\"Pad_Size_and_Annular_Ring_Requirements\"><\/span>Ped Boyutu ve Halka \u015eeklindeki Y\u00fcz\u00fck Gereksinimleri<span class=\"ez-toc-section-end\"><\/span><\/h3>\n<p>BGA pedi boyutu, bile\u015fen \u00fcreticisinin \u00f6nerilerine g\u00f6re belirlenir ve genellikle BGA k\u00fcre \u00e7ap\u0131n\u0131n 80% ile 100% aras\u0131nda de\u011fi\u015fir. VIPPO uygulamas\u0131n\u0131 ger\u00e7ekle\u015ftirirken, pedin delinmi\u015f via\u2019y\u0131 bar\u0131nd\u0131racak kadar b\u00fcy\u00fck olmas\u0131n\u0131 ve ayn\u0131 zamanda yeterli bir dairesel halka b\u0131rak\u0131lmas\u0131n\u0131 sa\u011flamal\u0131s\u0131n\u0131z. \u00dcretim s\u0131ras\u0131nda delme sapmalar\u0131 ve hizalama toleranslar\u0131n\u0131 hesaba katmak i\u00e7in en az 0,1 mm (4 mil) geni\u015fli\u011finde bir dairesel halka b\u0131rak\u0131lmas\u0131 end\u00fcstri standard\u0131d\u0131r. \u00d6rne\u011fin, BGA pedi 0,4 mm (16 mil) ise, via deli\u011finin maksimum boyutu 0,2 mm (8 mil) olmal\u0131d\u0131r.<\/p>\n<h3><span class=\"ez-toc-section\" id=\"Epoxy_Fill_Material_Conductive_vs_Non-Conductive\"><\/span>Epoksi Dolgu Malzemesi: \u0130letken ve \u0130letken Olmayan<span class=\"ez-toc-section-end\"><\/span><\/h3>\n<p>\u0130letken ve iletken olmayan epoksi dolgu malzemesi aras\u0131ndaki se\u00e7im, s\u0131kl\u0131kla kafa kar\u0131\u015f\u0131kl\u0131\u011f\u0131na yol a\u00e7an bir konudur. Uygulamalar\u0131n b\u00fcy\u00fck \u00e7o\u011funlu\u011funda, iletken olmayan epoksi tercih edilen se\u00e7enektir. \u0130letken olmayan epoksinin termal genle\u015fme katsay\u0131s\u0131 (CTE), \u00e7evresindeki FR4 substrat\u0131nkine olduk\u00e7a yak\u0131nd\u0131r; bu da termal d\u00f6ng\u00fc s\u0131ras\u0131nda via g\u00f6vdesinde \u00e7atlama riskini azalt\u0131r. \u0130letken olmayan dolgulu bir via'daki elektriksel ve termal iletkenlik, tamamen via duvarlar\u0131na kaplanm\u0131\u015f bak\u0131r taraf\u0131ndan sa\u011flan\u0131r.<\/p>\n<p>\u0130letken epoksi, genellikle do\u011frudan ge\u00e7i\u015f deli\u011fi yoluyla a\u015f\u0131r\u0131 \u0131s\u0131 da\u011f\u0131l\u0131m\u0131 gerektiren \u00f6zel uygulamalar i\u00e7in ayr\u0131lm\u0131\u015ft\u0131r; zira bu malzemenin termal genle\u015fme katsay\u0131s\u0131 (CTE) uyumsuzlu\u011fu, zamanla g\u00fcvenilirlik sorunlar\u0131na yol a\u00e7abilir. <strong>Hakk\u0131nda daha fazla bilgi edinin <a href=\"\/tr\/blog\/flying-probe-vs-ict-pcba\/\">U\u00e7an Prob ve ICT: \u00dcretim Hacminize Uygun Do\u011fru PCBA Test Stratejisini Se\u00e7mek<\/a>.<\/strong><\/p>\n<h2><span class=\"ez-toc-section\" id=\"How_to_Implement_VIPPO_Step-by-Step_Guide\"><\/span>VIPPO Nas\u0131l Uygulan\u0131r (Ad\u0131m Ad\u0131m K\u0131lavuz)<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-how-to wp-block-yoast-how-to-block\"><p class=\"schema-how-to-description\">A\u015fa\u011f\u0131daki m\u00fchendislik kurallar\u0131na uyun.<\/p> <ol class=\"schema-how-to-steps\"><li class=\"schema-how-to-step\" id=\"how-to-step-1\"><strong class=\"schema-how-to-step-name\">BGA Aral\u0131\u011f\u0131n\u0131 ve Yolland\u0131rma Yo\u011funlu\u011funu De\u011ferlendirme<\/strong> <p class=\"schema-how-to-step-text\">\u00d6ncelikle, se\u00e7ti\u011finiz BGA\u2019n\u0131n pin aral\u0131\u011f\u0131n\u0131 analiz edin. Aral\u0131k 0,5 mm veya daha azsa, VIPPO\u2019nun kullan\u0131lmas\u0131 \u015fiddetle tavsiye edilir; hatta zorunlu say\u0131labilir. Katman say\u0131s\u0131n\u0131 de\u011ferlendirin ve gerekli y\u00f6nlendirme yo\u011funlu\u011funa ula\u015fmak i\u00e7in standart delikli VIPPO\u2019nun yeterli olup olmad\u0131\u011f\u0131n\u0131 ya da VIPPO\u2019lu y\u0131\u011f\u0131lm\u0131\u015f mikro deliklerin (HDI) gerekli olup olmayaca\u011f\u0131n\u0131 belirleyin.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-2\"><strong class=\"schema-how-to-step-name\">Via ve Pad Boyutlar\u0131n\u0131 Tan\u0131mlay\u0131n<\/strong> <p class=\"schema-how-to-step-text\">En uygun ped boyutunu belirlemek i\u00e7in bile\u015fen veri sayfas\u0131na ba\u015fvurun. Ped \u00e7ap\u0131ndan gerekli halka bo\u015flu\u011funu (genellikle her bir taraf i\u00e7in 0,1 mm) \u00e7\u0131kararak izin verilen maksimum delik boyutunu hesaplay\u0131n. Bu delik boyutunun, kart kal\u0131nl\u0131\u011f\u0131na g\u00f6re imalat\u00e7\u0131n\u0131n en-boy oran\u0131 s\u0131n\u0131rlar\u0131n\u0131 kar\u015f\u0131lad\u0131\u011f\u0131ndan emin olun.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-3\"><strong class=\"schema-how-to-step-name\">Uygun Dolgu Malzemesini Se\u00e7in<\/strong> <p class=\"schema-how-to-step-text\">\u0130letken dolgu gerektirecek a\u015f\u0131r\u0131 bir termal gereklilik olmad\u0131\u011f\u0131 s\u00fcrece, viyalar i\u00e7in iletken olmayan epoksi dolgu kullan\u0131lmas\u0131n\u0131 belirtin. \u00dcreticinin varsay\u0131mlarda bulunmas\u0131n\u0131 \u00f6nlemek i\u00e7in bunu \u00fcretim notlar\u0131n\u0131zda a\u00e7\u0131k\u00e7a belirtin.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-4\"><strong class=\"schema-how-to-step-name\">Kaplama ve Y\u00fczey \u0130\u015flemini Belirtin<\/strong> <p class=\"schema-how-to-step-text\">Vialar\u0131n d\u00fczle\u015ftirilmesi ve \u00fczerlerinin bak\u0131rla kaplanmas\u0131 gerekti\u011fini belirtin. Bak\u0131r kaplaman\u0131n ard\u0131ndan, g\u00fcvenilir bir y\u00fczey kaplamas\u0131 belirleyin. M\u00fckemmel d\u00fczl\u00fck ve oksidasyon direnci nedeniyle, ince aral\u0131kl\u0131 BGA'lar i\u00e7in Elektrolizsiz Nikel Dald\u0131rma Alt\u0131n (ENIG) veya Elektrolizsiz Nikel Elektrolizsiz Paladyum Dald\u0131rma Alt\u0131n (ENEPIG) y\u00f6ntemleri \u015fiddetle tavsiye edilir.<\/p> <\/li><li class=\"schema-how-to-step\" id=\"how-to-step-5\"><strong class=\"schema-how-to-step-name\">Tasar\u0131m\u0131n DRC ve \u00dcretici Taraf\u0131ndan Do\u011frulanmas\u0131<\/strong> <p class=\"schema-how-to-step-text\">EDA yaz\u0131l\u0131m\u0131n\u0131z\u0131n Tasar\u0131m Kural\u0131 Kontrol\u00fc (DRC) parametrelerini g\u00fcncelleyerek, viyalar\u0131n y\u00fczey montaj pedleriyle kesi\u015fmesine hata vermeden izin verin. Gerber dosyalar\u0131n\u0131 g\u00f6ndermeden \u00f6nce, PCB \u00fcreticinizle \u00f6n y\u0131\u011f\u0131nlama ve via tan\u0131m\u0131n\u0131 payla\u015farak, ekipmanlar\u0131n\u0131n IPC-4761 Tip VII standartlar\u0131na g\u00f6re belirtilen VIPPO boyutlar\u0131n\u0131 g\u00fcvenilir bir \u015fekilde \u00fcretebilece\u011fini teyit edin.<\/p> <\/li><\/ol><\/div><p>VIPPO y\u00f6nlendirme stratejisine ge\u00e7i\u015f, \u00fcretilebilirli\u011fi ve g\u00fcvenilirli\u011fi sa\u011flamak i\u00e7in sistematik bir yakla\u015f\u0131m gerektirir.  <strong>Hakk\u0131nda daha fazla bilgi edinin <a href=\"\/tr\/blog\/high-temperature-burn-in-boards\/\">Yanma Test Kartlar\u0131 (BIB): Yar\u0131 \u0130letken Testleri i\u00e7in Y\u00fcksek S\u0131cakl\u0131kl\u0131 Yanma Test Kartlar\u0131n\u0131n Tasar\u0131m\u0131<\/a>.<\/strong><\/p>\n<h2><span class=\"ez-toc-section\" id=\"Reliability_and_Manufacturing_Considerations\"><\/span>G\u00fcvenilirlik ve \u00dcretimle \u0130lgili Hususlar<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>VIPPO, karma\u015f\u0131k y\u00f6nlendirme sorunlar\u0131n\u0131 \u00e7\u00f6zerken, \u00fcretim s\u00fcrecine yeni de\u011fi\u015fkenler getirir. En \u00f6nemli endi\u015fe, termal g\u00fcvenilirliktir. Via, farkl\u0131 CTE de\u011ferlerine sahip malzemeler (bak\u0131r, epoksi dolgu ve FR4 alt tabaka) i\u00e7erdi\u011finden, \u00e7al\u0131\u015fma s\u0131ras\u0131nda veya yeniden ak\u0131\u015f i\u015flemi s\u0131ras\u0131nda tekrarlanan termal d\u00f6ng\u00fcler, via g\u00f6vdesi ve kaplamal\u0131 kapak \u00fczerinde gerilime neden olabilir. Zamanla bu gerilim, bak\u0131r kaplamada mikro \u00e7atlaklara veya kapak ile via aras\u0131nda ayr\u0131lmaya yol a\u00e7arak aral\u0131kl\u0131 ar\u0131zalara neden olabilir.<\/p>\n<p>Bu riskleri azaltmak i\u00e7in \u00fcreticiler, d\u00fczle\u015ftirme s\u00fcrecini hassas bir \u015fekilde kontrol etmelidir. Son kaplama i\u015fleminden \u00f6nce epoksi, bak\u0131r ped ile tam olarak ayn\u0131 seviyede de\u011filse, ped y\u00fczeyinde bir \u201c\u00e7ukur\u201d veya \u201c\u00e7\u0131k\u0131nt\u0131\u201d olu\u015fur. Bir \u00e7ukur, yeniden ak\u0131\u015f s\u0131ras\u0131nda ak\u0131 maddesi tutabilir ve gaz sal\u0131n\u0131m\u0131na neden olarak BGA ba\u011flant\u0131s\u0131 i\u00e7inde lehim bo\u015fluklar\u0131na yol a\u00e7abilir. Bir \u00e7\u0131k\u0131nt\u0131 ise BGA'n\u0131n dengesiz oturmas\u0131na neden olarak kom\u015fu pimlerde a\u00e7\u0131k devrelerin olu\u015fmas\u0131na yol a\u00e7abilir. IPC-4761, via korumas\u0131n\u0131n tasar\u0131m\u0131n\u0131 ve s\u0131n\u0131fland\u0131rmas\u0131n\u0131 standartla\u015ft\u0131r\u0131r. Ger\u00e7ek VIPPO i\u00e7in, \u00fcretim notlar\u0131n\u0131zda IPC-4761 Tip VII (Dolgulu ve Kapakl\u0131) \u015fart\u0131n\u0131 kesinlikle belirtmelisiniz.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Sonu\u00e7<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Via-in-Pad Plated Over (VIPPO), y\u00fcksek pin say\u0131s\u0131na sahip, ince aral\u0131kl\u0131 BGA bile\u015fenleriyle \u00e7al\u0131\u015fan modern PCB m\u00fchendisleri i\u00e7in vazge\u00e7ilmez bir teknolojidir. Yer kaplayan dog-bone fanout'lara olan ihtiyac\u0131 ortadan kald\u0131ran VIPPO, y\u00f6nlendirme kanallar\u0131n\u0131 en \u00fcst d\u00fczeye \u00e7\u0131kar\u0131r, sinyal b\u00fct\u00fcnl\u00fc\u011f\u00fcn\u00fc art\u0131r\u0131r ve g\u00fc\u00e7 da\u011f\u0131t\u0131m a\u011flar\u0131n\u0131 optimize eder. S\u0131k\u0131 tasar\u0131m kurallar\u0131na uyulmas\u0131n\u0131 gerektirmesi ve \u00fcretim s\u00fcrecini karma\u015f\u0131kla\u015ft\u0131r\u0131p maliyeti art\u0131rmas\u0131na ra\u011fmen, minyat\u00fcrle\u015ftirme ve performans a\u00e7\u0131s\u0131ndan sa\u011flad\u0131\u011f\u0131 faydalar, bu tekni\u011fi y\u00fcksek yo\u011funluklu ba\u011flant\u0131 tasar\u0131mlar\u0131 i\u00e7in zorunlu hale getirmektedir.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Frequently_Asked_Questions_FAQ\"><\/span>S\u0131k\u00e7a Sorulan Sorular (SSS)<span class=\"ez-toc-section-end\"><\/span><\/h2><div class=\"schema-faq wp-block-yoast-faq-block\"><div class=\"schema-faq-section\" id=\"faq-question-1\"><strong class=\"schema-faq-question\">VIPPO kullanmak, PCB\u2019m\u0131n \u00fcretim maliyetini art\u0131r\u0131r m\u0131?<\/strong><p class=\"schema-faq-answer\">Evet. VIPPO s\u00fcreci, standart viyalara k\u0131yasla dolgu, sertle\u015ftirme, d\u00fczle\u015ftirme ve ikincil kaplama d\u00f6ng\u00fcs\u00fc gibi birka\u00e7 ek \u00fcretim a\u015famas\u0131 gerektirir. Bu durum, \u00fcreticiye ve kart\u0131n karma\u015f\u0131kl\u0131\u011f\u0131na ba\u011fl\u0131 olarak, \u00e7\u0131plak kart \u00fcretim maliyetini genellikle 15% ila 30% aras\u0131nda art\u0131r\u0131r.<\/p><\/div><div class=\"schema-faq-section\" id=\"faq-question-2\"><strong class=\"schema-faq-question\">\u00dczerine kaplama yapmadan standart via-in-pad kullanabilir miyim?<\/strong><p class=\"schema-faq-answer\">BGA pedleri s\u00f6z konusu oldu\u011funda, bu y\u00f6ntem kesinlikle \u00f6nerilmez. Bir pedin i\u00e7inde bir via a\u00e7\u0131k b\u0131rak\u0131lmas\u0131, montaj s\u0131ras\u0131nda lehim emilmesine neden olur; bu durumda BGA ba\u011flant\u0131s\u0131 i\u00e7in ayr\u0131lan lehim, via deli\u011fine do\u011fru akar. Bu durum her zaman zay\u0131f, g\u00fcvenilmez veya tamamen kesik ba\u011flant\u0131lara yol a\u00e7ar. Bu olguyu \u00f6nlemek i\u00e7in VIPPO kullan\u0131lmas\u0131 zorunludur.<\/p><\/div><div class=\"schema-faq-section\" id=\"faq-question-3\"><strong class=\"schema-faq-question\">Vialar\u0131 doldurmak i\u00e7in iletken mi, yoksa iletken olmayan epoksi mi kullanmal\u0131y\u0131m?<\/strong><p class=\"schema-faq-answer\">\u00c7o\u011fu standart ve HDI tasar\u0131m\u0131nda, iletken olmayan epoksinin kullan\u0131lmas\u0131 \u015fiddetle tavsiye edilir. Bu malzeme, iletken epoksiden daha iyi bir \u015fekilde PCB alt tabakas\u0131n\u0131n termal genle\u015fme \u00f6zelliklerine uyum sa\u011flar ve termal d\u00f6ng\u00fcler s\u0131ras\u0131nda via \u00e7atlamas\u0131 riskini azalt\u0131r. Via duvarlar\u0131ndaki bak\u0131r kaplama, yeterli elektriksel ve termal iletkenlik sa\u011flar.<\/p><\/div><div class=\"schema-faq-section\" id=\"faq-question-4\"><strong class=\"schema-faq-question\">VIPPO kullan\u0131lan bir PCB i\u00e7in en uygun y\u00fczey kaplamas\u0131 hangisidir?<\/strong><p class=\"schema-faq-answer\">ENIG (Elektrolizsiz Nikel-Dald\u0131rma Alt\u0131n) ve ENEPIG (Elektrolizsiz Nikel-Elektrolizsiz Paladyum-Dald\u0131rma Alt\u0131n) tercih edilen y\u00fczey kaplamalar\u0131d\u0131r. Bu kaplamalar, ince aral\u0131kl\u0131 BGA bile\u015fenlerinin g\u00fcvenilir bir \u015fekilde yerle\u015ftirilmesi ve lehimlenmesi i\u00e7in hayati \u00f6nem ta\u015f\u0131yan, ola\u011fan\u00fcst\u00fc d\u00fcz ve homojen bir y\u00fczey sa\u011flar.<\/p><\/div><div class=\"schema-faq-section\" id=\"faq-question-5\"><strong class=\"schema-faq-question\">VIPPO, mikroviya ile ayn\u0131 \u015fey midir?<\/strong><p class=\"schema-faq-answer\">Hay\u0131r, ancak HDI tasar\u0131mlar\u0131nda genellikle birlikte kullan\u0131l\u0131rlar. Bir mikrovia, k\u00fc\u00e7\u00fck boyutu (genellikle \u00e7ap\u0131 &lt;= 0,15 mm) ve d\u00fc\u015f\u00fck en-boy oran\u0131yla tan\u0131mlan\u0131r; genellikle sadece bir dielektrik katman\u0131 kapsar. VIPPO, bir via&#039;ya (bu bir mikrovia veya standart delikli via olabilir) uygulanan bir i\u015flemdir; bu i\u015flemde via doldurulur ve kaplan\u0131r, b\u00f6ylece d\u00fcz bir ped y\u00fczeyi olu\u015fturulur.<\/p><\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>Elektronik cihazlar k\u00fc\u00e7\u00fclmeye devam ederken hesaplama kapasiteleri art\u0131yor; bu durum, Bask\u0131l\u0131 Devre Kart\u0131 (PCB) tasar\u0131mc\u0131lar\u0131n\u0131 giderek daha k\u0131s\u0131tl\u0131 alanlar i\u00e7inde son derece karma\u015f\u0131k devrelerin y\u00f6nlendirilmesi konusunda s\u00fcrekli bir zorlukla kar\u015f\u0131 kar\u015f\u0131ya b\u0131rak\u0131yor. Modern Y\u00fcksek Yo\u011funluklu Ba\u011flant\u0131 (HDI) PCB tasar\u0131m\u0131ndaki en \u00f6nemli darbo\u011fazlardan biri, ince aral\u0131kl\u0131 Top Izgara Dizileri\u2019nin (BGA\u2019lar) ayr\u0131lmas\u0131 ve y\u00f6nlendirilmesidir. BGA pini [\u2026]<\/p>","protected":false},"author":1,"featured_media":6312,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_yoast_wpseo_focuskw":"VIPPO design guidelines","_yoast_wpseo_title":"Via-in-Pad Plated Over (VIPPO): Design Guidelines for Fine-Pitch BGA Breakout","_yoast_wpseo_metadesc":"Comprehensive engineering guide on Via-in-Pad Plated Over (VIPPO) for fine-pitch BGA breakout. Learn design guidelines, manufacturing processes, and routing techniques for high-density interconnects.","footnotes":""},"categories":[108],"tags":[552,551,110,550,549],"class_list":["post-6187","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-bga-routing","tag-fine-pitch-bga-breakout","tag-pcb-design","tag-via-in-pad-plated-over","tag-vippo-design-guidelines"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v25.1 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Via-in-Pad Plated Over (VIPPO): Design Guidelines for Fine-Pitch BGA Breakout<\/title>\n<meta name=\"description\" content=\"Comprehensive engineering guide on Via-in-Pad Plated Over (VIPPO) for fine-pitch BGA breakout. 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