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The fundamental difference between wire harnesses and cable assemblies: Wire harnesses represent a cost-optimized wire organization solution suitable for conventional environments; cable assemblies provide high-strength protection specifically designed for extreme environments. This includes detailed technical comparisons, manufacturing process analysis, application scenario analysis, and future development trends.

The 2025 Iran Elecomp Exhibition will take place in September at the Tehran International Exhibition Center, showcasing cutting-edge technologies including electronic components, PCBs, semiconductor packaging, and smart manufacturing equipment. Topfast will participate in the event, presenting its high-performance, diverse range of circuit board products and industry solutions spanning communications, medical, and automotive electronics sectors. The exhibition serves as a vital platform for attendees to explore technical collaborations and market expansion opportunities.

Rigid-flex PCB technology ingeniously combines the stability of rigid boards with the adaptability of flexible boards, creating new possibilities for electronic interconnections. While complex to design and manufacture, this technology offers significant advantages including space savings, enhanced reliability, and simplified assembly. Whether in aerospace, medical devices, or consumer electronics, rigid-flex PCBs are redefining the design boundaries of electronic equipment.

Surface Mount Technology (SMT) is a core process in modern electronics manufacturing. By precisely mounting miniature surface-mount devices (SMDs) onto the surface of printed circuit boards (PCBs), it enables high-density, high-performance circuit assembly. This article also delves into SMT’s technical advantages in miniaturization, electrical performance, and production efficiency, along with its quality control systems and future development trends, providing a comprehensive reference for technological innovation in the electronics manufacturing industry.

High-frequency printed circuit boards (PCBs) are specialized circuit boards designed to handle high-frequency signals exceeding 300MHz. They play a critical role in high-tech fields such as 5G communications, autonomous driving, satellite communications, and radar systems. With extensive application areas, they provide comprehensive technical references for electronic engineers and industry professionals.

This guide introduces the types, structures, and design considerations of flexible PCBs, covering the distinctions and applicable scenarios of single-sided, double-sided, and multilayer flexible circuits. It provides detailed explanations of key technical aspects such as material selection, bend radius calculations, and the role of stiffeners, offering engineers practical design references and manufacturing considerations.

The 2025 FIEE International Power Electronics Exhibition in São Paulo, Brazil, opened on September 9 and will run through September 12. As South America’s largest and longest-running industry event, the exhibition serves as a key platform for global enterprises to connect with the South American market and seize opportunities in infrastructure upgrades and energy transition.

Rigid PCB characteristics, manufacturing processes, and key techniques are outlined, contrasting them with flexible PCBs. The document delves into enhancing reliability through material selection, design optimization, and process control. Specific selection recommendations and reliability design guidelines are provided for diverse application scenarios.

Aluminum-based PCB is a metal-based circuit board specifically designed for high thermal dissipation requirements, offering exceptional thermal conductivity and mechanical stability. It serves diverse applications including LED lighting, automotive electronics, and power supply equipment, providing engineers with comprehensive technical references and design guidelines.

Ceramic PCBs are printed circuit boards with ceramic substrates, offering exceptional thermal conductivity, high-frequency performance, and high-temperature stability. They are primarily categorized into HTCC, LTCC, and thick-film ceramic types, suitable for high-reliability applications such as aerospace, 5G communications, automotive electronics, and medical devices.