🔗Reduced InterconnectsFewer solder joints and connectors increase reliability and reduce failure points in demanding applications.
💲Space & Cost EfficientEliminates cables and connectors, reducing component count and assembly costs significantly.
🧪Tests simplifiésIntegrated design allows comprehensive testing of interconnected sub-circuits with fewer test points.
🏗️High-Density DesignAdvanced hole filling and stacking capabilities enable ultra-compact electronic layouts.
🌡️Enhanced ThermalSuperior heat dissipation compared to traditional wiring methods, ideal for power applications.
🔄3D PackagingEnables complex three-dimensional designs with dynamic flexing for innovative product designs.
À quoi servent les pastilles de soudure non remplies sur un circuit imprimé ? 26 juillet 2025 08:19:00
Problèmes courants liés à l'amélioration de la fiabilité des circuits imprimés 25 juillet 2025 08:49:00