Multilayer Flexible PCB

Multilayer Flexible PCB

Multilayer Flexible Printed Circuit Boards (Multilayer FPCs) are high-performance interconnect components composed of alternating layers of flexible substrates and conductive copper.

Description

Product Overview

Multilayer Flexible Printed Circuit Boards (Multilayer FPCs) are high-performance interconnect components composed of alternating layers of flexible substrates and conductive copper. Compared to single/double-sided FPCs, multilayer FPCs enable more complex circuit designs through interlayer connections (e.g., laser drilling, plated through-holes), making them suitable for high-density, high-reliability electronic devices.

Multilayer FPCs are widely used in consumer electronics, automotive electronics, medical devices, aerospace, and 5G communications, meeting demands for miniaturization, lightweight design, and bendability.

Flexible PCB Parameters

Item Flexible PCB
Max Layer 8L
Inner Layer Min Trace/Space 3/3mil
Out Layer Min Trace/Space 3.5/4mil
Inner Layer Max  Copper 2oz
Out Layer Max Copper 2oz
Min Mechanical Drilling 0.1mm
Min Laser Drilling 0.1mm
Aspect Ratio(Mechanical Drilling) 10:1
Aspect Ratio(Laser Drilling) /
Press Fit Hole Ttolerance ±0.05mm
PTH Tolerance ±0.075mm
NPTH Tolerance ±0.05mm
Countersink Tolerance ±0.15mm
Board Thickness 0.1-0.5mm
Board Thickness Tolerance(<1.0mm) ±0.05mm
Board Thickness Tolerance(≥1.0mm) /
Impedance Tolerance Single-Ended:±5Ω(≤50Ω),±10%(>50Ω)
Differential:±5Ω(≤50Ω),±10%(>50Ω)
Min Board Size 5*10mm
Max Board Size 9*14inch
Contour Tolerance ±0.05mm
Min BGA 7mil
Min SMT 7*10mil
Surface Treatment ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating
Solder Mask Green Solder Mask/Black PI/Yellow PI
Min Solder Mask Clearance 3mil
Min Solder Mask Dam 8mil
Legend White,Black,Red,Yellow
Min Legend Width/Height 4/23mil
Strain Fillet Width 1.5+0.5mil
Bow & Twist /

Flexible PCB

Product Features

  1. High-Density Wiring

    • Utilizes fine-line technology (line width/spacing as low as 30/30μm) and blind/buried vias to enhance circuit integration.

    • Suitable for chip-scale packaging (CSP), high-pin-count BGAs, and other precision components.

  2. Excellent Flexibility

    • Uses polyimide (PI) or liquid crystal polymer (LCP) substrates, allowing repeated bending (dynamic applications can withstand millions of cycles).

    • Supports 3D installation, adapting to complex spatial layouts.

  3. High Reliability and Stability

    • Resistant to high temperatures (PI substrates can withstand reflow soldering above 260°C) and chemical corrosion.

    • Low dielectric loss, ideal for high-frequency and high-speed signal transmission (e.g., 5G mmWave).

  4. Lightweight and Thin Design

    • Thickness can be controlled below 0.1mm, weighing over 70% less than rigid PCBs.

    • Suitable for weight-sensitive applications such as wearables and foldable smartphones.

Product Advantages

Comparison Multilayer FPC Traditional Rigid PCB Single/Double-Sided FPC
Flexibility Excellent (dynamic bending) None Good (static bending)
Wiring Density Very high (multilayer interconnects) High Moderate
Weight Extremely light Heavy Light
High-Frequency Performance Excellent (LCP substrate) Good Average
Cost Higher (complex process) Low Moderate

Manufacturing Process

Multilayer FPC production is more complex than standard PCBs, with critical processes including:

  1. Material Preparation

    • Substrates: PI/PET/LCP films

    • Copper Foil: Rolled copper (high ductility) or electrodeposited copper (low cost)

  2. Inner Layer Patterning

    • Laser drilling (hole diameters as small as 50μm)

    • Chemical etching to form precision circuits

  3. Lamination and Through-Hole Plating

    • Multilayer flexible materials are thermally pressed

    • Copper plating fills vias (ensuring interlayer conductivity)

  4. Surface Treatment

    • ENIG/immersion silver (anti-oxidation)

    • Coverlay (CVL) or solder mask for protection

  5. Testing and Validation

    • Flying probe testing (electrical performance)

    • Bend cycle testing (dynamic applications require ≥100,000 cycles)

Applications

  1. Consumer Electronics

    • Foldable smartphones (hinge-area circuits)

    • TWS earbuds, smartwatches (high-density interconnects)

  2. Automotive Electronics

    • Vehicle camera modules

    • Battery management systems (BMS flexible circuits)

  3. Medical Devices

    • Endoscopes, wearable monitors

    • Implantable medical sensors

  4. Industrial & Communications

    • Industrial robot flexible joint wiring

    • 5G mmWave antennas (LCP-based high-frequency FPCs)

  5. Aerospace

    • Satellite deployable structure circuits

    • UAV lightweight wiring harnesses

Application

Frequently Asked Questions (FAQ)

Q1: What file formats do you accept for PCB manufacturing?
We support all industry-standard formats, including:
– Gerber (RS-274X)
– PROTEL (99SE & DXP)
– CAM350
– ODB++ (.TGZ)
– Eagle
– Altium Designer
– PADS

Q2: How do you protect my design files and intellectual property?
We take data security extremely seriously. Your design files are:
– Stored on encrypted servers
– Only accessible to your dedicated project team
– Never shared with third parties without your explicit written consent
– Automatically purged after project completion (unless otherwise requested)

Q3: What payment methods do you accept?
We offer flexible payment options:
Electronic Payments:
– PayPal
– AliPay
– Credit Cards (Visa/MasterCard/UnionPay)
Bank Transfers:
– T/T (Telegraphic Transfer)
– Western Union
– L/C (Letter of Credit)

Q4: What are your shipping options?
We provide global logistics solutions:
Express Shipping (1-5 days):
– DHL
– FedEx
– UPS
– EMS
Bulk Shipping:
– Air freight (>300kg)
– Sea freight (Full container options)
– Can accommodate your preferred freight forwarder

Q5: What is your minimum order quantity?
We specialize in both:
– Prototype quantities (1 piece available)
– High-volume production
No minimum order value requirements

Q6: Can we visit your manufacturing facilities?
We welcome client visits to our facilities:
Main Facility:
Shenzhen, China (ISO 9001 certified)
Secondary Facility:
Guangdong Province, China
Please contact us to schedule a tour with our engineering team

Q7: How do you guarantee PCB quality?
Our comprehensive quality assurance includes:
Testing:
– 100% Electrical Testing (Flying Probe & E-Test)
– Automated Optical Inspection (AOI)
Certifications:
– IPC Class 2/3 standards
– ISO 9001:2015 certified
– UL certified (upon request)
Additional Services:
– Free DFM analysis
– 3D model verification
– Cross-section analysis available

All PCBs come with our quality guarantee and full traceability documentation.