Multilayer PCB Technology

As PCB circuit boards evolve toward high-frequency, high-layer, and multi-functional applications, the use of multilayer boards is becoming increasingly widespread, spanning industries such as mobile phones, automotive electronics, wearable devices, servers, data centers, autonomous driving, and aerospace. Compared to single-sided and double-sided boards, multilayer boards involve additional processes such as lamination and inner layer routing, resulting in more complex manufacturing workflows and higher technical requirements.

The core of multilayer PCBs

Compared to the limitations of single-layer/double-layer PCBs, multilayer PCBs achieve smaller sizes and higher performance by stacking conductive layers (signal layers/power layers/ground layers), meeting the needs of modern electronic devices (such as 5G and AI hardware).

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6 Major Advantages of Multi-layer PCBs

1. Ultra-High Density: 50%+ size reduction, ideal for wearables.
2. Low EMI Radiation: Planes reduce interference (15dB lower than double-layer boards).
3. Förbättrad termisk hantering: Multi-layer heat dissipation paths prevent overheating.
4. Lightweight: Fewer connectors reduce overall weight.
5. Flexible Design (Optional): Bendable for special applications.
6. Cost-Effective: Lower unit cost in mass production.

Stack-up Design

Manufacturing Workflow

1. Engineering Review: Gerber file validation, DFM analysis.
2. Inner Layer Processing: Copper etching + AOI inspection.
3. Laminering: High-temperature/pressure bonding.
4. Drilling & Plating: Laser drilling + chemical copper deposition.
5. Testning: Impedance testing, flying probe inspection.

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20+ Cost Optimization Techniques for Multilayer PCBs

1. Design Optimization (Core Cost-Saving Strategies)

✅ Reduce Layer Count

• Prioritize 4/6-layer designs over 8+ layers—each 2-layer reduction cuts costs by 15-25%.
• Användning high-density routing (e.g., 3/3 mil trace/space) to minimize layers.

✅ Even-Layer Rule

• Odd-layer designs require extra balancing materials, increasing costs by 5-10%.

✅ Standardize Via Design

• Use through-holes ≥0.2mm (avoid laser drilling, which adds 30% cost).
• Eliminate blind/buried vias (HDI processes double costs).

✅ Simplify Impedance Control

• Standardize critical signal impedance (e.g., all 50Ω) to reduce special layers.

✅ Optimize Panel Utilization

• Design to standard panel sizes (e.g., 18″×24″) to minimize material waste.

2. Material Selection (Save 20-50%)

🔹 Substrate Choice

• Användning FR-4 for consumer electronics (40% cheaper than high-frequency materials).
• For high-speed signals, consider mid-Tg materials (e.g., S1000-2) for cost-performance balance.

🔹 Copper Weight

• Användning 1oz inner layers (15% cheaper than 2oz), with selective outer-layer thickening.

🔹 Ytfinish

• Prefer HASL (60% cheaper than ENIG); use immersion silver for high-frequency needs.

3. Batch Production Strategies

📊 Volume Discounts

• Order 500+ units for 20% off; 1,000+ units for an additional 5% discount.

📊 Panel Sharing

• Combine small orders with other clients (extends lead time by 3-5 days but cuts costs by 30%).

4. Supply Chain Optimization

🛒 Localized Sourcing

• Användning Shengyi Tech instead of Rogers (saves 70% on substrates).
• Source components from LCSC/LCSC Mall for cost-effective alternatives.

🛒 Off-Season Orders

• Place orders in Q1/Q3 för 5% discounts (avoid consumer electronics peak seasons).

5. DFM (Design for Manufacturability) Optimization

⚙️ Relax Tolerances

• Allow ±10% trace width tolerance (saves 8% vs. ±5%).
• Ensure solder mask bridges ≥0.1mm to avoid expensive LDI processes.

⚙️ Avoid Special Processes

• Skip gold fingers (+20% cost), heavy copper (>3oz), and other premium features.

6. Testing & Certification

📉 Sampling Over 100% Inspection

• Användning flying probe testing for prototypes (50% cheaper than AOI).
• Opt for IPC Class 2 instead of Class 3 (saves 25% for industrial applications).

7. Logistics & Delivery

🚚 Choose Ground Shipping

• For orders >100kg, use ocean freight (80% cheaper than air, +7 days lead time).

Cost-Saving Comparison Table

Industry Case Studies

• Medicintekniska produkter: 16L PCBs for MRI control boards (±5% impedance accuracy).
• Elektronik för fordonsindustrin: 8L rigid-flex PCBs for vibration resistance.