Umfassende Inspektionsstandards für HDI-Leiterplatten

In today’s trend toward miniaturization and high performance in electronic products, High-Density-Verbindung (HDI) circuit boards have become the core carrier for high-end electronic devices. Their exceptional performance relies on extremely precise manufacturing processes and rigorous inspection standards to ensure the quality and reliability of HDI boards.

Understanding HDI

Before delving into the inspection standards, it is essential to understand what makes HDI boards unique. The core of HDI technology lies in the use of Build-up Manufacturing, extensively employing microvias, fine linesund thin dielectric layers.

• Core Structure: Typically uses a conventional core as support, alternately laminating build-up layers and copper foils on it, with interlayer connections achieved through microvias.
• Wichtige Terminologie:
  • Microvia: A blind or buried via with a diameter ≤ 0.15mm, key to achieving high-density interconnect.
  • Target Pad & Capture Pad: The connection pads at the bottom and top of a microvia, respectively.
  • Buried Via: A conductive via completely hidden within the board, not extending to the outer surfaces.

To better understand, the following diagram illustrates a typical HDI board stack-up:

+-----------------------------------------------------------------+
| << Outer Solder Mask >> | << Surface Copper >> | << Top Build-up >> |
|-------------------------|----------------------|-------------------|
| << Microvia >> -------> | Connects to | << Capture Pad >>   |
|-------------------------|----------------------|-------------------|
| << Laser Drillable Prepreg >> or << Resin Coated Copper >>       |
|-------------------------|----------------------|-------------------|
| << Target Pad >> | <--- Connects to | << Buried Via >>     |
|-------------------------|----------------------|-------------------|
| << Core >> (Potentially multi-layered, containing buried vias)   |
|-------------------------|----------------------|-------------------|
| << Bottom Build-up >> | << Bottom Copper >> | << Outer Solder Mask >> |
+-----------------------------------------------------------------+

(Schematic: Shows the relationship between core, build-up layers, microvias, buried vias, and target/capture pads in an HDI board.)

The Hierarchy of HDI Inspection Standards

When technical requirement conflicts arise, the following hierarchy (from highest to lowest priority) should be followed to ensure the final product meets design intent:

1. Highest Priority: Customer-provided Design Files und Approved Technical Agreements.
2. Second Priority: Specific HDI Inspection Standards (as described in this document).
3. Foundation Priority: General Rigid PCB Inspection Standards and IPC International Standards.

Key Inspection Points Throughout the HDI Manufacturing Process

1. Material Inspection:

HDI boards have extremely stringent material requirements, forming the basis for all subsequent processes.

2. Structural & Visual Inspection

This phase of inspection focuses on the physical results of manufacturing, typically performed using microscopes, AOI, etc.

• Microvia Quality:
  • Shape: Check for an ideal conical shape, avoiding defects like “nail heading”.
  • Filling: For filled microvias, require sufficient fill with surface depression depth conforming to standards.
  • Registration: Microvias must land completely on the Target Pad below, without pad violation.
• Circuitry & Surface:
  • Linienbreite/Leerstand: Measure deviation from design values to ensure fine line integrity.
  • Oberfläche: Whether ENIG, Immersion Tin, or OSP, inspect for thickness, uniformity, and solderability.
  • Lötmaske: Check for coating uniformity, registration accuracy, ensuring no seepage, poor exposure, etc.

3. Electrical & Reliability Testing

This is the core stage for verifying HDI board functionality and durability.

• Electrical Performance Testing:
  • Continuity/Insulation Test: Use a flying probe or dedicated fixtures for 100% open/short circuit verification.
  • Impedanzkontrolle: For high-speed lines, perform sample testing of characteristic impedance to ensure it falls within design tolerance.
• Reliability Testing (Environmental Stress Screening):
  • Thermischer Belastungstest: Refer to IPC-TM-650 methods for multiple thermal cycles or thermal shock, followed by microsectioning analysis to check for plating cracks, delamination.
  • Interconnect Stress Test: Specifically designed to evaluate the long-term reliability of microvias under current load.
  • Solderability Test: Evaluate the solder wetting ability of pads to prevent cold solder joints, poor wetting.

Overview of Professional Inspection Methods & Tools

Schlussfolgerung

The inspection of HDI circuit boards is far from a simple pass/fail determination; it is a systematic process that spans the entire lifecycle from design and material selection to manufacturing. Only through the rigorous implementation of a multi-level, multi-dimensional inspection system—covering everything from materials to reliability—can we truly ensure that every HDI circuit board delivers stable, enduring, and exceptional performance within the final product.