المدونة

Reliability test methods for HDI printed circuit boards, including core technologies such as temperature cycling test, thermal stress test and high temperature/high humidity bias test. Comparatively analyze the differences in reliability between HDI boards and traditional multilayer boards, and provide professional solutions to three common problems. Professional PCB manufacturer, providing reference for electronic manufacturers on the reliability of HDI boards.

High Density Interconnect (HDI) printed circuit boards are revolutionizing modern electronics by enabling smaller, faster and more reliable circuit designs. Whether it’s optimizing signal integrity, thermal management, or miniaturization, understanding HDI technology is critical to the next generation of PCB design.

PCBA is a key process for mounting electronic components onto printed circuit boards to form functional circuits, including the two main processes of Surface Mount Technology (SMT) and Through Hole Technology (THT). Understanding the production process, industry applications, and future trends of PCBA will help increase understanding of PCBA manufacturing and assembly.

PCB reliability test is the core link to ensure the quality of electronic products, covering electrical performance, mechanical strength, environmental adaptability and other aspects of the assessment. 16 key test methods, including conductivity test, voltage test, thermal stress test, salt spray test, etc., in-depth analysis of the purpose of the various tests, the principle and judging criteria.

PCB manufacturing process must be carried out in 8 categories of test methods, from basic visual inspection to high-end AXI inspection, analyze the advantages and disadvantages of various types of technology and applicable scenarios, for electronic product manufacturers to provide a complete PCB quality control program.

ELECOMP Tehran 2025 is Iran’s premier electronics trade show showcasing printed circuit boards, semiconductors, SMT and IoT solutions.With over 57,000 attendees in 2024, the show connects global suppliers with Iran’s growing ICT industry.

عملية تجميع ثنائي الفينيل متعدد الكلور هي عملية تصنيع منهجية لتركيب المكونات الإلكترونية على لوحات الدوائر المطبوعة.التحكم الدقيق في طباعة معجون اللحام، والوضع عالي السرعة لمكونات SMT، وإدارة ملف تعريف درجة الحرارة لإعادة اللحام بإعادة التدفق، وطرق فحص الجودة المتعددة، وتقنيات تجميع المكونات من خلال الثقب، واستراتيجيات الاختبار الوظيفي الشاملة، وعمليات ما بعد التنظيف. كما تتم مناقشة اتجاهات الصناعة مثل تقنية HDI والإلكترونيات المرنة والتصنيع الذكي.

Comprehensive analysis of core technology methods in PCB assembly, including through-hole mounting (THT), surface mounting (SMT) and hybrid mounting technologies. It introduces the process principles, equipment requirements, comparative advantages and disadvantages, and typical application scenarios of each technology, and analyzes the complete assembly process from solder paste printing to final inspection.

This comprehensive guide explores through-hole PCB assembly (THT), covering key benefits, technical processes, comparisons with SMT, and expert solutions to 5 common problems. As PCB assembly specialists, we examine through-hole technology’s unique value in mechanical strength, power handling, and reliability while providing practical recommendations for selecting the optimal assembly method for your project.

This comprehensive guide explores PCB fundamentals, from basic single-layer boards to advanced HDI designs, covering key materials like FR-4, aluminum, and ceramic substrates. We detail the complete manufacturing workflow, essential certifications (UL, ISO 9001/14001, IATF 16949), and diverse applications in consumer electronics, 5G networks, automotive systems, and aerospace. The article highlights technical specifications, industry standards, and emerging trends like flexible circuits and high-density interconnects, providing engineers and procurement professionals with critical insights for PCB selection and implementation.